CSP焊点焊后残余应力分析与预测

该文建立了芯片尺寸封装(CSP)焊点有限元分析模型并对其进行了再流焊焊后残余应力应变分析.以焊点直径、焊点高度、焊盘直径和焊点间距为输入参数,焊后残余应力为输出参数进行了灵敏度分析.选取灵敏度分析结果中对残余应力影响显著的因子作为输入,建立了带动量项神经网络预测模型,对CSP焊点焊后残余应力进行了预测.结果表明,置信度...     

电子封装中的无铅Sn-3.8Ag-0.5Cu/Cu界面研究

针对钎料与焊盘间形成IMC层的厚度是影响可靠性的一个关键因素．对无铅钎料Sn-3．8Ag-0．5Cu与Cu盘进行了重熔,采用Olympus（光学金相显微镜）,SEM（扫描电镜）和EDX（能谱X射线）界面分析手段,研究了合金Sn-3．8Ag-0．5Cu与Cu焊盘接头的钎焊性和在焊接过程中IMC的形成与长大机理,探讨了IMC厚度与保温时间的变化规律．研究结果表明,无铅钎料合金Sn-3．8Ag-0．5Cu在钎焊务件下与Cu焊盘能够实现良好的连接,其连接层为Cu6Sn5金属间化合物,重熔时的IMC层生长基本上符合抛物线规律．     

基于正交设计的QFN焊点三维形态建模与预测

采用基于最小能量原理和有限元数值分析方法的Surface Evolver软件,建立了四方扁平无引脚器件(QFN)焊点三维形态预测模型;选取焊盘长度、焊盘宽度、焊料体积、间隙高度作为4个关键因素,采用水平正交表设计了9种不同的QFN焊点工艺参数水平组合,建立了这9种焊点的三维形态预测模型,得到了不同工艺参数水平组合下的QFN焊点形态;焊盘长度、焊盘宽度、焊料体积、间隙高度等工艺参数的改变对QFN焊点的三维形态均有影响.     

混合集成电路用Pb-Sn-Sb-Ag钎料的热疲劳

为了解决混合集成电路中环境温度变化引发的焊点可靠性问题,开发了具有高可靠性的新型钎料来满足微型化和高密度化的混合集成电路的焊接需要。对新研发的Pb-Sn-Sb-Ag四元合金钎料进行了DSC熔点测试,热电偶测试了回流焊的温度曲线,对焊点显微组织进行了相分析,并参照IPC-9701A测试方法进行了热循环实验,结果发现热循环前后钎料的显微组织和力学性能发生了明显的变化。研究表明：钎料合金液相点在245益;回流焊峰值温度为267益;显微组织中主要有Pb、Sb2 Sn3和Ag3 Sn三种相;热失配产生的剪切应力导致了微裂纹产生,温度交变使裂纹持续扩展,最终导致焊点出现了整体剥离的断裂失效模式;金属间化合物厚度和剪切强度呈现逐渐递减的近似线性关系;对比已应用的钎料,新研制的Pb-Sn-Sb-Ag钎料显微组织均匀,在-40~150益热循环条件下表现出高的可靠性。     

Automated X-ray recognition of solder bump defects based on ensemble-ELM

Solder bumps realize the mechanical and electrical interconnection between chips and substrates in surface mount components,such as flip chip, wafer level packaging and three-dimensional integration. With the trend to smaller and lighter electronics,solder bumps decrease in dimension and pitch in order to achieve higher I/O density. Automated and nondestructive defect inspection of solder bumps becomes more difficult. Machine learning is a way to recognize the solder bump defects online and overcome the effect caused by the human eye-fatigue. In this paper, we proposed an automated and nondestructive X-ray recognition method for defect inspection of solder bumps. The X-ray system captured the images of the samples and the solder bump images were segmented from the sample images. Seven features including four geometric features, one texture feature and two frequency-domain features were extracted. The ensemble-ELM was established to recognize the defects intelligently. The results demonstrated the high recognition rate compared to the single-ELM. Therefore, this method has high potentiality for automated X-ray recognition of solder bump defects online and reliable.     

Sn-Ag-xCu-Bi-Ni/Cu焊点界面IMC演变

为了研究低银无铅焊点界面金属间化合物(IMC)的形成与演变,以低银无铅焊点Sn-Ag-xCu-Bi-Ni/Cu为研究对象,研究了钎料中Cu质量分数对界面IMC厚度、形貌和成分的影响.实验结果表明,随着钎料中Cu质量分数的增加,回流焊后焊点IMC层厚度变薄,IMC晶粒尺寸增大,IMC晶粒形貌由颗粒状转变为棱柱状以及鹅卵石状,同时界面IMC成分发生由(Cu,Ni)6Sn5向Cu6Sn5的转变.高温时效后,界面IMC层厚度增长.当钎料中Cu质量分数超过1%时,时效后生成较厚的Cu3Sn化合物层,对焊点可靠性不利.钎料中Cu质量分数应控制在1%以下.     

Intelligent diagnosis of the solder bumps defects using fuzzy C-means algorithm with the weighted coefficients

Solder bump technology has been widely used in electronic packaging. With the development of solder bumps towards higher density and finer pitch, it is more difficult to inspect the defects of solder bumps as they are hidden in the package. A nondestructive method using the transient active thermography has been proposed to inspect the defects of a solder bump, and we aim at developing an intelligent diagnosis system to eliminate the influence of emissivity unevenness and non-uniform heating on defects recognition in active infrared testing. An improved fuzzy c-means(FCM) algorithm based on the entropy weights is investigated in this paper. The captured thermograms are preprocessed to enhance the thermal contrast between the defective and good bumps. Hot spots corresponding to 16 solder bumps are segmented from the thermal images. The statistical features are calculated and selected appropriately to characterize the status of solder bumps in FCM clustering. The missing bump is identified in the FCM result, which is also validated by the principle component analysis. The intelligent diagnosis system using FCM algorithm with the entropy weights is effective for defects recognition in electronic packages.     

Defect inspection of flip chip package using SAM technology and fuzzy C-means algorithm

Solder bumps are widely used in surface mount components, which provide electrical and mechanical connection between the chip/package and the substrate. As the solder bump getting smaller in dimension and pitch, it becomes more difficult to inspect the solder defects hidden in the IC package. In this paper, an intelligent inspection method using the scanning acoustic microscopy(SAM) and the fuzzy C-means(FCM) algorithm was investigated. A flip chip package of FA10 was chosen as the test sample. The SAM tests of FA10 were carried out in C-scan mode. The sub-image of every solder bump was segmented from the SAM image. The statistical features were then calculated and adopted for clustering of solder bumps using the FCM algorithm. The recognition results of FCM reached a high accuracy of 94.3%. The intelligent system is effective for defect inspection in high density packages.     

基于最小能量原理的LCCC焊点三维形态建模与预测

基于最小能量原理和焊点形态理论,建立了LCCC器件焊点三维形态预测模型.运用该模型对焊点钎料桥连过程进行了数值模拟.结果表明,钎料体积、间隙高度、焊盘尺寸对LCCC焊点三维形态有显著的影响.在间隙高度为0.03 mm、宽度为0.70 mm、焊盘长度为1.90 mm的条件下,避免焊点产生桥连的临界钎料体积为0.725 mm3.     

高速铁路板式轨道参数与动力特性的研究

运用板式轨道-路基系统半空间垂向耦合的动力计算模型,研究了高速铁路板式轨道的动力特性,探讨了板式轨道的CA砂浆垫层厚度和扣件刚度对系统动力性能的影响规律。扣件、轨下胶垫和CA砂浆层的弹性、阻尼特性对轨道及轨下结构动力性能的影响极大,减少扣件或轨下胶垫的刚度、增加CA砂浆层的厚度,可改善板式轨道的动力学性能。     

EMP瓦在不同温度时局部压缩弹性模量的实验研究

对EMP瓦在不同温度下进行了局部压缩弹性模量的测试,提出了以弹性金属塑料层压弹缩性模量作为EMP瓦压缩弹性模量的概念,所得结果可用于轴瓦结构设计,润滑参数计算及瓦面修型。     

Numerical analysis of bump foil bearings without nominal radial clearance

Bump foil bearings without nominal radial clearance were analyzed. An air film thickness model and a bearing theoretical analytical model were developed accounting for air compressibility and foil deformation. To analyze hydrodynamic characteristics of bump foil bearings with different operating eccentricities, the air film thickness equation and Reynolds equation were coupled through pressure and solved by Newton-Raphson Method （NRM） and Finite Difference Method （FDM）. The characteristics of an bump foil bearing model were discussed including load carrying capacity, film thickness and pressure distributions. The results of simulation show that bump foil bearing without nominal radial clearance can provide better stability and greater load capaci- ty. This numerical analytical method also reveals a good convergence in numerical calculation.     

Effects of particle size on the mechanical properties of particle-reinforced Sn-Ag composite solder joint

Particulate size has significant influenced on the mechanical properties of particle-reinforced composite solder joints. In this current research, Cu or Ni reinforcement particles were mechanically added to the Sn-3.5Ag eutectic solder, and the effects of the particle size on the mechanical properties of particle-reinforced composite solder joint were systematically studied. This investigation touched on how mechanical properties of the solder joints are affected by particles size. A quantitative formula was set up to correlate the mechanical property of the solder joint with particle size in different processing conditions. Besides, the fracture mechanism of the composite solder joint was analyzed.     

大型低速重载径向动压轴承研究

为了开发大型贯流式水轮发电机组径向轴承，在试验台上采用了φ360的模型轴承对φ1740可倾6瓦块原型轴承进行模拟试验研究，最高试验比压3．37MPa、最低线速度3．77m／s、最高线速度22．62m／s。试验表明：载荷、进油压力、转速、进油温度和安装间隙比等，对轴承油温升、油流量、功耗、瓦温及油膜厚度等都存在不同程度的影响，其中载荷和转速的影响比较显。按照模型轴承指导设计的红岩子机组书φ1740轴承已在电站可靠运行，同时开发了径向轴承热弹流计算程序，可以预测径向轴承的油膜压力、油膜温度、油膜厚度、损耗、流量等参数。     

Bolt Design of Ceramic Matrix Composite and Superalloy Bolted Joint Based on Damage Failure Load

瞬态热载荷下陶瓷基复合材料螺栓连接结构热应力及装配参数演化

吕超¹,赵淑媛^2*,李正禹²,蒲泽良²,董江龙²,孙新杨³,张文娇⁴

（1.中国航天空气动力技术研究院,北京 100074;2．哈尔滨工业大学 特种环境复合材料技术国家级重点实验室,哈尔滨 150080; 3．哈尔滨工业大学 航天学院,哈尔滨 150001;4．东北农业大学 工程学院,哈尔滨 150030）

创新点说明：

基于有限元软件ABAQUS对陶瓷基复合材料和高温合金螺栓连接结构的单轴拉伸性能进行渐进损伤分析,研究了螺钉几何参数对陶瓷基复合材料-高温合金螺栓连接结构拉伸性能及失效行为的影响规律,并给出了连接结构失效载荷最大时的螺钉尺寸参数。

研究目的：

陶瓷基复合材料由于其耐高温、耐磨、抗高温蠕变、导热系数和热膨胀系数较低等特点,逐渐在飞行器热结构上得到广泛的应用。在飞行器结构中,陶瓷基复合材料常常不可避免的与金属件组成连接结构。螺钉的尺寸参数显著影响陶瓷基复合材料螺栓连接结构承载能力,对螺钉的几何尺寸进行设计对提高陶瓷基复合材料-金属螺栓连接结构的承载能力具有重要意义。

研究方法：

针对2D编织C/SiC陶瓷基复合材料与高温合金GH4169组成的螺栓连接结构,利用UMAT子程序将材料模型嵌入到ABAQUS有限元模型中建立了单钉单搭接螺栓连接结构的渐进损伤分析方法。基于已建立的C/SiC陶瓷基复合材料-高温合金螺栓连接结构的有限元模型,研究六角凸头螺钉的螺钉直径、钉头直径及钉头高度对于连接结构孔周应力分布、拉伸强度以及破坏方式的影响情况,讨论给出承载能力最大的螺钉最优几何参数。

研究结果：

C/SiC陶瓷基复合材料-高温合金螺栓连接结构的刚度随螺钉直径的增加小幅下降,受钉头直径与厚度的影响较小。在给定的螺钉直径、钉头直径及钉头厚度参数范围内,连接结构的拉伸强度均先随各参数的增加而增大而后降低,当螺钉直径为5mm,钉头直径为9.5mm,钉头厚度为2.8mm时室温最终失效载荷达到最大。

结论：

本研究基于ABAQUS有限元软件对2D编织C/SiC陶瓷基复合材料-高温合金进行有限元渐进损伤模拟分析,讨论螺钉尺寸参数对于连接结构拉伸性能的影响规律,为陶瓷基复合材料机械连接结构的工程应用提供设计分析基础及指导。

关键词：2D C/SiC陶瓷基复合材料;渐进损伤分析;拉伸性能;螺钉连接;螺钉参数

     

Experimental study of transient thermal elastic hydrodynamic lubrication of tilted thrust bearing under sudden load changes

An experimental study is performed to investigate the temperature response and distribution in a sector tilted pad thrust bearing during the transient periods such as the load on the bearing changed abruptly.Lots of thermocouples are placed on different position such as the pad surface,leading and trailing edge as well as the pad block,and then these thermocouples are used to measure the temperature variation during the transient period.The load on one pad and the displacement of the runner are measured with different sensors.The effects of a sudden load change on temperature at different position of the pads are analyzed according to the experimental data.The influence of different initial conditions and the different load increment on temperature variation at the pad surface and pad body are obtained,and temperature responses at leading edge and trailing edge under different conditions are tested.This experimental study shows a significant effect of load increment and initial condition on the temperature distribution of bearing pad interface under sudden load change conditions,and the measurement of real oil film temperature is difficult due to the large thermal inertia of pad surface.     

Modal analysis of prestressed draft pad of freight wagons using finite element method

The present work intends to investigate dynamic behaviour of draft gear using finite element method. The longitudinal force that the draft gear absorbs usually leads to the failure of its components, especially, the load bearing draft pads. Dynamic behaviour of an individual draft pad and a draft gear is determined and characterized with exciting frequencies and corresponding mode shapes. The effect of compressive prestress load on the dynamic behaviour of an individual draft pad is also determined as the draft pads in assembled state are under constant axial compressive force in the draft gear. The vibration characteristics of individual draft pad are compared with draft pads that are part of draft gear. The modal analysis gives us a basis for subjecting a draft pad to higher frequency loading for determining its fatigue behaviour.

     

8407模具钢表面渗铝后的常温硬质阳极氧化

为了防止模具钢表面产生热熔损失效,对渗铝后的8407钢表面进行常温硬质阳极氧化实验,使试样表面形成了氧化膜．着重研究了电流密度和氧化时间对氧化膜厚度和硬度的影响．实验结果确定适宜的氧化条件是：电流密度为2．5A／dm^2左右,氧化时间在60min左右,氧化温度在25℃左右．     

Thermo-mechanical fatigue reliability optimization of PBGA solder joints based on ANN-PSO

Based on a method combined artificial neural network （ANN） with particle swarm optimization （PSO） algorithm, the thermo-mechanical fatigue reliability of plastic ball grid array （PBGA） solder joints was studied. The simulation experiments of accelerated thermal cycling test were performed by ANSYS software. Based on orthogonal array experiments, a back-propagation artificial neural network （BPNN） was used to establish the nonlinear multivariate relationship between thermo-mechanical fatigue reliability and control factors. Then, PSO was applied to obtaining the optimal levels of control factors by using the output of BPNN as the affinity measure. The results show that the control factors, such as print circuit board （PCB） size, PCB thickness, substrate size, substrate thickness, PCB coefficient of thermal expansion （CTE）, substrate CTE, silicon die CTE, and solder joint CTE, have a great influence on thermo-mechanical fatigue reliability of PBGA solder joints. The ratio of signal to noise of ANN-PSO method is 51.77 dB and its error is 33.3% less than that of Taguchi method. Moreover, the running time of ANN-PSO method is only 2% of that of the BPNN. These conclusions are verified by the confirmative experiments.     

Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints

Composite solders were prepared by mechanically dispersing different volumes of nano-sized Ag particles into the Sn-0.7Cu eutectic solder.The effects of Ag particle addition on the microstrueture of Sn-0.7Cu solder joints were investigated. Besides, the effects of isothermal aging on the microstructural evolution in the interfacial intermetallic compound (IMC) layer of the Sn-0.7Cu solder and the composite solder reinforced with l vol% Ag particles were analyzed, respectively. Experimental results indicate that the growth rate of the interfacial IMC layer in the Ag particles reinforced composite solder joint is much lower than that in the Sn-0.7Cu solder joint during isothermal aging. The Ag particles reinforced composite solder joint exhibits much lower layer-growth coefficient for the growth of the IMC layer than the corresponding solder joint.