LP同质过渡层对ZnO薄膜结构性能的影响

采用磁控溅射法低功率在玻璃衬底上制备低功率(LP)过渡层,再在其上高功率生长ZnO薄膜,研究了LP过渡层对薄膜结构性能的影响。XRD和SEM结果表明,引入LP过渡层后,高射频(RF)功率溅射的ZnO薄膜(002)定向性显著改善。随溅射功率的提高,薄膜(002)定向性有所下降,但致密性明显好转。与无过渡层薄膜相比,在溅射功率分别为30 W和50 W过渡层上生长的薄膜晶粒变大。研究表明,在30 W的LP过渡层上用200 W功率制备的薄膜性能最佳。     

溅射功率对PET衬底上ZnO:Zr薄膜性能的影响

采用直流磁控溅射法在室温下柔性PET衬底上制备出了高质量的掺锆氧化锌(ZnO:Zr)透明导电薄膜。研究了溅射功率对ZnO:Zr薄膜表面形貌、结构、电学和光学性能的影响。溅射功率对ZnO:Zr薄膜的电阻率影响显著:当溅射功率从60W增加到90W时,薄膜的电阻率先减小后增大,在最佳功率80W时,电阻率具有最小值3.67×10-3Ω·cm。所制备的ZnO:Zr薄膜具有良好的附着性能,在可见光区平均透射率高达90%。     

一种双靶磁控溅射制备的Mg掺杂的NiO薄膜

采用磁控溅射“共溅射”方法,将Ar气作为溅射气体,高纯NiO和MgO双陶瓷靶作为溅射靶材。当控制NiO和MgO靶的溅射功率分别为190 W和580 W,溅射真空度为2 Pa,衬底温度为300℃时,得到了Mg掺杂的NiO(Ni_0.61Mg_0.39O)薄膜。该薄膜是一种具有(200)择优取向的晶态薄膜。薄膜表面比较平整,晶粒分布致密,晶粒尺寸约46.9 nm。(200)衍射峰位置相对未掺杂的NiO薄膜向小角度偏移约0.2°。合金薄膜在可见光波段具有较大的透过率,而在300 nm附近透过率陡然下降,其光学带隙向高能方向移动到了3.95 eV。该研究为采用磁控溅射制备高质量的Mg掺杂的NiO薄膜提供了技术支撑。     

衬底负偏压及溅射功率对SiO_2/Cu薄膜形貌的影响

采用射频磁控溅射镀膜技术,分别以不同的衬底负偏压和射频溅射功率下在p型Si(100)基片上制备了SiO2/Cu薄膜。用原子力显微镜(AFM)对薄膜的表面形貌进行扫描分析,实验结果表明,衬底负偏压和射频溅射功率对SiO2/Cu薄膜的表面形貌都有显著的影响。衬底负偏压在0～15 V内,薄膜表面颗粒尺寸和均方根粗糙度都随着衬底负偏压的增大呈减小的趋势,而溅射功率在100～200 W内,薄膜表面颗粒尺寸和均方根粗糙度都随溅射功率的升高呈增大的趋势。成膜初期是层状生长模式,后期为岛状生长模式,整个成膜过程是典型的层岛生长模式。     

射频磁控溅射ITO薄膜中沉积温度对膜特性影响

采用射频磁控溅射的方法,在溅射过程中改变沉积温度以提高铟锡氧化物(ITO)薄膜的电学和光学特性。采用扫描电镜(SEM)分析了ITO薄膜的表面形貌,发现ITO薄膜的晶粒尺寸随着衬底温度的升高而增大。经过后续退火,ITO薄膜的电学特性得到了较大的提高。在溅射条件为工作气压1 Pa、衬底温度200℃和输入功率200 W沉积的样品经过300℃真空退火2 h获得了12.8×10-4Ω.cm的低电阻率和800 nm波段94%的高透过率。     

射频磁控溅射法制备液晶光阀光导层的研究

采用射频磁控溅射的方法制备了用于液晶光阀光导层的氢化非晶硅薄膜,研究了工艺参数对氢化非晶硅薄膜透过率及光电导性能的影响。结果表明,薄膜的沉积速率随着溅射功率和衬底温度的升高呈先增加后减小的趋势,在衬底温度为300℃,溅射功率为300W左右沉积速率达到最大,在溅射2h后沉积速率随着溅射时间的增加而下降;薄膜的光吸收系数随衬底温度的升高而增大,随溅射功率的增加而减小;交流电导率随衬底温度和溅射功率的升高而下降;薄膜在可见光范围内透过率随着H分压的增大而增大,且吸收边发生蓝移。     

溅射功率对AlN薄膜结构形貌的影响

采用直流反应磁控溅射法在Si(111)基片上制备了AlN薄膜,利用X线衍射(XRD)、场发射扫描电子显微镜(FESEM)、原子力显微镜(AFM)对不同溅射功率下制备的AlN薄膜的结构及形貌进行了分析表征。结果表明:在一定范围内,随着溅射功率的增大,薄膜厚度增加,晶粒逐渐长大,表面粗糙度也随之增大;AlN(002)择优取向改善明显,120W时达到最佳。     

衬底温度对PLD法制备的ZnO:Ga薄膜结构和性能的影响

利用脉冲激光沉积法在石英衬底上制备了镓掺杂氧化锌(ZnO:Ga)透明导电薄膜,研究了衬底温度对薄膜的结构、表面形貌和光电性能的影响.研究表明:制备的ZnO:Ga薄膜是具有六角纤锌矿结构的多晶薄膜.随着衬底温度的增加,衍射峰明显增强,晶粒尺寸增大.当衬底温度为450℃时,薄膜的最低电阻率为8.5×10<'-4>Ω·cm,...     

AZO透明导电薄膜的制备

采用射频磁控溅射法在玻璃衬底上制备了ZnO:Al(AZO)透明导电薄膜,并借助XRD、SEM等表征方法,研究了溅射功率和衬底温度对薄膜结构、表面形貌及光电特性的影响。结果表明,制备薄膜的最佳溅射功率和衬底温度分别为180 W、200℃,在此条件下制备的AZO薄膜具有明显的c轴(002)择优取向,其最低方块电阻为18/□,在可见光范围内的平均透光率超过91%,且透明导电性能优于目前平板显示器的要求,有望取代现在市场上的主流氧化铟锡(ITO)薄膜。     

脉冲激光沉积制备Ge纳米薄膜的研究

利用脉冲激光沉积(PLD)技术,在Ar环境下于Si基片上制备出Ge纳米薄膜.用X射线衍射(XRD)仪和原子力显微镜(AFM)观测了薄膜的微观结构和形貌,分析了它们随激光能量密度和衬底温度的变化情况.结果表明:Ge薄膜在室温下即可以结晶,其平均品粒尺寸随脉冲激光能量密度的增大而增大.当脉冲激光能量密度为0.94 J/cm2时,所制备的薄膜由约13 nm的颗粒组成;当脉冲激光能量密度增大为1.31 J/cm2时,颗粒的平均尺寸增大为56 nm,凡薄膜表面变得比较均匀.此外,当衬底温度从室温升到450℃过程中,晶粒平均尺寸随温度升高而增大.在实验基础上,对薄膜的生长机理进行了分析.     

高性能导电薄膜的制备

采用磁控溅射法在玻璃基底上制备了Cr-Cu-Al-Cr薄膜,用焊接法测试薄膜附着性能,用X射线衍射仪、原子力显微镜和台阶仪对薄膜进行表征,研究溅射过程中以及在高温大气环境下薄膜的防氧化方法,分析薄膜晶粒大小与电性能关系,制备出性能较好的导电膜。     

铜薄膜内微孔对其力学性能影响及开裂行为研究

研究了铜薄膜内微孔对其力学性能影响及开裂行为,采用磁控溅射工艺制备聚酰亚胺柔性基板上铜薄膜,通过扫描电镜(SEM)对铜薄膜表面形貌表征、EDS能谱分析及SEM原位拉伸观察实验,得出磁控溅射工艺制备出超薄铜薄膜多为柱状晶结构,且带有微米级孔洞.并测得不同孔隙率铜薄膜载荷与位移增量的变化,由相关公式求出应力-应变关系;分析了不同孔径微孔的上下边缘沿晶开裂,微裂纹萌生、扩展的行为.结果表明:磁控溅射工艺在聚酰亚胺柔性基板上制备的微米级铜薄膜受拉伸时微孔沿晶开裂形成初始微裂纹,孔径≤4μm微孔处局部应力偏低,未能使微裂纹沿晶界改变方向继续扩展,微裂纹受到抑制;在较高的局部应力下,孔径>10μm微孔裂纹继续沿新的晶界方向扩展,与其他微孔裂纹连通;孔隙率越高,多孔微裂纹连通几率越高,薄膜力学性能就越差,且铜薄膜开裂可能性也越高.     

射频磁控溅射ZnO薄膜的微结构与光学特性

研究了膜厚对ZnO薄膜微结构和光学性能的影响。采用射频磁控溅射法在单晶硅(111)和玻璃基片上制备了不同厚度的ZnO薄膜。通过X射线衍射、原子力显微镜和紫外可见光谱对薄膜进行了表征。结果表明薄膜结晶性能良好,在(002)晶面具有明显的c轴取向。随着薄膜厚度的增加,透射率下降,吸收边红移,禁带宽度逐渐减小。     

Investigation into the influence of direct current (DC) power in the magnetron sputtering process on the copper crystallite size

This paper discusses the influence of direct current (DC) power in the magnetron sputtering process on the crystallite size of the copper (Cu) thin films deposited on p-type silicon substrate at room temperature. X-ray diffraction (XRD) and Karl Suss four-point probe were employed to study the film crystallinity and conductivity, respectively. From the analysis on the XRD patterns, high DC power enhances the Cu film crystallinity with larger crystallite size, which is deduced using Sherrer's formula. The behavior of the electrical property of the Cu films complies with the trend of the film crystallinity with DC power, in which the film conductivity increases with increasing DC power. We attribute these phenomena to the enhanced surface diffusion mechanism of the adatom during the sputtering deposition process, which improves the microstructure of the Cu film.     

缓冲层厚度对透明导电薄膜ZnO:Zr性能的影响

利用直流磁控溅射法在有ZnO:Zr缓冲层的水冷玻璃衬底上成功制备出了ZnO:Zr透明导电薄膜,缓冲层的厚度介于35～208 nm.利用XRD、SEM、四探针测试仪和紫外-可见分光光度计研究ZnO:Zr薄膜的结构、形貌、电光性能.结果表明,薄膜的颗粒尺寸和电阻率对缓冲层厚度具有较强的依赖性.当缓冲层厚度从35 nm增加到103 nm时,薄膜的颗粒尺寸增大,电阻率减小.而当缓冲层厚度从103 nm增加到208 nm时,薄膜的颗粒尺寸减小,电阻率增大.当缓冲厚度为103 nm时,薄膜的电阻率最小为2.96×10-3 Ω·cm,远小于没有缓冲层时的12.9×10-3 Ω·cm.实验结果表明,在沉积薄膜之前先沉积一层适当的缓冲层是提高ZnO:Zr薄膜质量的一种有效方法.     

锰铜薄膜的制备及压阻特性

为了锰铜传感器微型化,采用直流磁控溅射法制备适合高压力测量的锰铜薄膜,用X射线衍射和扫描电子显微镜技术分析了薄膜的结构和形貌,动态加载实验标定了锰铜薄膜的压阻系数。研究结果表明,晶粒尺寸决定了薄膜的压阻系数,经360℃热处理1h后,薄膜晶粒长大,压阻系数有着明显提高(K值达到0.02GPa–1),性能达到锰铜箔的水平。     

Thickness dependence of the structural and electrical properties of copper films deposited by dc magnetron sputtering technique

This paper addresses the influences of film thickness on structural and electrical properties of dc magnetron sputter-deposited copper (Cu) films on p-type silicon. Cu films with thicknesses of 130-1050 nm were deposited from Cu target at sputtering power of 125 W in argon ambient gas pressure of 3.6 mTorr at room temperature. The electrical and structural properties of the Cu films were investigated by four-point probe, atomic force microscopy (AFM) as well as X-ray diffraction (XRD). Results from our experiment show that the grain grows with increasing film thickness, along with enhanced film crystallinity. The root mean square (RMS) roughness as well as the lateral feature size increase with the Cu film thickness, which is associated with the increase in the grain size. On the other hand, the Cu film resistivity decreases to less than 5 μΩ-cm for 500 nm thick film, and further increase in the film thickness has no significant effects on the film resistivity. Possible mechanisms of film thickness dependent microstructure formation of these Cu films are discussed in the paper, which explain the interrelationship of grain growth and film resistivity with increasing Cu film thickness.     

Texture and microstructure of thin copper films

Microstructure is an important factor influencing the reliability of thin film interconnects. The microstructure of copper films is of particular interest because of its use in numerous electronic applications. Pole figure x-ray diffraction and transmission electron microcopy were conducted on copper films deposited by several techniques: sputtering, partially ionized beam deposition, chemical vapor deposition, evaporation, and electroplating. Quantitative texture data are determined from fiber texture plots. A typical copper film consists of three texture components: (111), (200), and random. (220) and (511) texture components are possible under some deposition conditions. Compared to aluminum films, the fraction of the random texture component and the distribution of the (hkl) components in copper films are relatively large. Bimodal grain size distributions are observed in some films.     

退火温度对Cu膜微结构与电阻率的影响

采用磁控溅射方法在玻璃衬底上淀积500 nm厚Cu膜,在不同温度下进行原位退火处理.用X射线衍射仪(XRD)、扫描电镜(SEM)、原子力显微镜(AFM)及四探针测试仪分析了薄膜微结构与电阻率.随着t增加,应变能与表面能的竞争导致Cu(220)取向晶粒组成不断增加;薄膜晶粒不断长大且其几何形态在t＞500 ℃时由柱状晶向等轴晶结构转变;当t＜500 ℃时,随着薄膜电阻率ρ与表面粗糙度Rrms显著减小,而t＞500 ℃时,Rrms呈现增加趋势,而ρ变化不明显.