Mechanism of dissolution of a Cu-13Sn alloy in low aggressive conditions

Corrosion of a synthetic Cu-13Sn alloy with a dendritic structure was investigated in a low aggressive medium (0.01 M Na₂SO₄ aqueous solution). The corrosion rate was accelerated through anodic polarization of the alloy in a potential range close to the open-circuit potential. The composition of the corrosion layer was followed as a function of the polarization time, using scanning electron microscopy and energy dispersive spectrometry methods. The results clearly showed that bronze corrosion in these experimental conditions proceeds by decuprification. Selective copper dissolution leads to corrosion layers enriched in tin compounds. It was concluded that bronze is partially passivated through the presence of a tin oxide layer, which slows down copper dissolution rate, compared to pure copper.     

Characterisation of anodic layers on Cu-10Sn bronze (RDE) in aerated NaCl solution

The anodic surfaces formed on Cu-10Sn (wt.%) alloy (α-bronze) are investigated in aerated 0.1 M aqueous chloride solution, using electrochemical reduction and characterisation methods such as scanning electron microscopy (SEM), energy dispersive spectrometry (EDS), Fourier transform infrared spectroscopy (FTIR), X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). On the whole anodic domain, investigations performed on a bronze rotating disk electrode (RDE) reveal the systematic formation of a uniform oxidation layer. It is evidenced that the chemical composition of the layer varies with the applied anodic potential, but also that the latter always exhibits a poorly crystallised (probably nanocrystalline) hydrated and hydroxylated nature. Close to E_oc, the compounds are mainly (hydroxide) oxides of tin and copper, incorporating very low amounts of chlorides. At intermediate oxidation potentials corresponding to the active-passive transition, the first oxidation peak corresponds to the formation of hydrated tin oxyhydroxide chloride species which transforms in a more stable one - probably related to the Sn(II) → Sn(IV) oxidation. At higher anodic potential, on the current plateau, the layer contains hydrated tin (IV) oxyhydroxide and copper chloride (mainly CuCl). However, XRD and XPS results reveal that the barrier layer has a complex nature, including unidentified products and different spatially distributed charged surface zones. The corrosion mechanism involves an internal oxidation of the alloy linked to a preferential dissolution of copper, namely a decuprification. A decuprification factor f_Cu is defined and calculated. Both f_Cu and the layer thickness increase with the applied potential. We show unambiguously that the tin compounds remain in the corrosion layer, acting as stabilizing species. It is suggested that the tin species promote the formation of a network as for tin oxide xerogel, through which copper ions and anions migrate. Both the layer microstructure and the decuprification factor (f_Cu) are in agreement with those found in Type I patina of ancient bronzes.     

Corrosion behaviour of Cu-10Sn bronze in aerated NaCl aqueous media - Electrochemical investigation

Investigation of the electrochemical behaviour of Cu-10Sn (wt.%) alloy has been conducted in aerated aqueous chloride solutions and compared to that of pure Cu and Sn. Cathodic and anodic bronze behaviours have been investigated in function of the chloride concentrations (0.1-0.001 M), the rotation speed of the electrode and the potential sweep rate after 1-h immersion time in open-circuit conditions. At the corrosion potential, the corrosion behaviour appears determined by the charge-transfer controlled reduction of oxygen and the mixed charge- and mass-transfer controlled electrodissolution. In 0.1 M NaCl solution, three anodic regions are evidenced corresponding to: (I) a dissolution part from Eoc value, (II) a maximum current region corresponding to peaks formation and (III) a large current plateau. A partial protective effect of the corrosion product layer is observed at high anodic potential. It has been interpreted as the result of a 3D growth mechanism involving the formation of stable tin species in the layer according to a “pore resistance model”. Results on synthetic alloy are compared with those obtained on an archaeological bronze with a similar composition immersed in the same medium. Equivalent interface behaviour is evidenced between the synthetic and the archaeological bronzes.     

Influence of Cu and Sn content in the corrosion of AISI 304 and 316 stainless steels in H2SO4

This paper addresses the influence of Cu and Sn addition on the corrosion resistance of AISI 304 and 316 stainless steels in 30 wt% H₂SO₄ at 25 and 50 °C. The corrosion process was evaluated by gravimetric tests, DC measurements and electrochemical impedance spectroscopy (EIS). The corrosion products were analysed by SEM, X-ray mapping and XPS before and after accelerated tests. The behaviour of both AISI 304 and 316 stainless steels in sulphuric acid solution was greatly improved by increasing Cu concentration and the synergic effect of Cu and Sn. Addition of Sn increased corrosion resistance, but less than addition of copper.     

Evaluation of some non-toxic thiadiazole derivatives as bronze corrosion inhibitors in aqueous solution

The inhibiting effect of four innoxious thiadiazole derivatives (2-mercapto-5-amino-1,3,4-thiadiazole (MAT), 2-mercapto-5-acetylamino-1,3,4-thiadiazole (MAcAT), 2-mercapto-5-methyl-1,3,4-thiadiazole (MMeT) and 2-mercapto-5-phenylamino-1,3,4-thiadiazole (MPhAT)) on bronze corrosion in an aerated solution of 0.2 g L⁻¹ Na₂SO₄ + 0.2 g L⁻¹ NaHCO₃ at pH 5 was studied by potentiodynamic voltammetry and electrochemical impedance spectroscopy.The corrosion parameters determined from the polarisation curves indicate that the addition of the investigated thiadiazole derivatives decreases both cathodic and anodic current densities, due to an inhibition of the corrosion process, through the adsorption of thiadiazoles on the bronze surface. The inhibiting effect of the investigated organic compounds appears to be more pronounced on the anodic process than on the cathodic one and, except for the case MPhAT, it is enhanced by the increases of the inhibitors’ concentration.The adsorption of the thiadiazole derivatives on bronze was confirmed by the presence of the nitrogen atoms in the EDX spectra of the bronze exposed to inhibitor-containing solutions.The magnitude of polarisation resistance values and, consequently, the inhibition efficiencies are influenced by the molecular structure of thiadiazole derivatives. The strongest inhibition was noticed in the presence of compounds with phenyl amino- or amino-functionalities in their molecules. The maximum protection efficiencies were obtained by addition of: 5 mM MAT (95.9%), 1 mM MAcAT (95.7%), 5 mM MMeT (92.6%) and 0.1 mM MPhAT (97%). EIS measurements also revealed that the inhibitor effectiveness of the optimal concentrations of thiadiazole is time-dependent.     

Numerical simulation of corrosion process with two-step charge transfer mechanism in the Cu/CuSO4 + H2SO4 system

The corrosion process in the Cu/CuSO₄ + H₂SO₄ system is considered as the sum of two coupled single-electron electrochemical reactions that occur simultaneously and independently on the surface of the copper electrode. Our numerical model incorporates diffusion and migration of solution species including cuprous ions, as well as the chemical equilibria for copper sulphate and sulphuric acid dissociation. Numerical simulations are compared with the trends discovered during experimental investigation of copper corrosion in similar systems.     

Self-healing mechanism of a protective film prepared on a Ce(NO3)3-pretreated zinc electrode by modification with Zn(NO3)2 and Na3PO4

Self-healing mechanism of a protective film against corrosion of zinc at scratches in an aerated 0.5 M NaCl solution was investigated by polarization measurements, X-ray photoelectron spectroscopy (XPS) and electron-probe microanalysis (EPMA). The film was prepared on a zinc electrode by treatment in a Ce(NO₃)₃ solution and addition of aqueous solutions containing 9.98 or 19.9 μg/cm² of Zn(NO₃)₂ · 6H₂O and 55.2 μg/cm² of Na₃PO₄ · 12H₂O. After the coated electrode was scratched with a knife-edge crosswise and immersed in the NaCl solution for many hours, polarization measurements, observation of pit formation at the scratches, XPS and EPMA were carried out. This film was remarkably protective and self-healing against zinc corrosion on the scratched electrode. The cathodic and anodic processes of zinc corrosion were markedly suppressed by coverage of the surface except for scratches with a thin Ce₂O₃ layer containing a small amount of Ce⁴⁺ and the surface of scratches with a layer composed of Zn₃(PO₄)₂ · 4H₂O, Zn(OH)₂ and ZnO mostly.     

Copper corrosion inhibition in O2-saturated H2SO4 solutions

Corrosion inhibition of copper in O₂-saturated 0.50 M H₂SO₄ solutions by four selected amino acids, namely glycine (Gly), alanine (Ala), valine (Val), or tyrosine (Tyr), was studied using Tafel polarization, linear polarization, impedance, and electrochemical frequency modulation (EFM) at 30 °C. Protection efficiencies of almost 98% and 91% were obtained with 50 mM Tyr and Gly, respectively. On the other hand, Ala and Val reached only about 75%. Corrosion rates determined by the Tafel extrapolation method were in good agreement with those obtained by EFM and an independent chemical (i.e., non-electrochemical) method. The chemical method of confirmation of the corrosion rates involved determination of the dissolved Cu²⁺, using ICP-AES (inductively coupled plasma atomic emission spectrometry) method of chemical analysis. Nyquist plots exhibited a high frequency depressed semicircle followed by a straight line portion (Warburg diffusion tail) in the low-frequency region. The impedance data were interpreted according to two suitable equivalent circuits. The kinetics of dissolved O₂ reduction and hydrogen evolution reactions on copper surface were also studied in O₂-saturated 0.50 M H₂SO₄ solutions using polarization measurements combined with the rotating disc electrode (RDE). The Koutecky-Levich plot indicated that the dissolved O₂ reduction at the copper electrode was an apparent 4-electron process.     

Corrosion behavior of alumina ceramics in aqueous HCl and H2SO4 solutions

The corrosion behavior of cold isostatically pressed (CIP) high purity alumina ceramics in aqueous HCl and H₂SO₄ solutions with various concentrations has been studied simultaneously at room temperature (25 °C). Corrosion tests were also performed with 0.65 mol/l HCl and 0.37 mol/l H₂SO₄ solutions at 40, 55 and 70 °C for 48 h. Chemical stability was monitored by determining the amount of Al³⁺, Mg²⁺, Ca²⁺, Na⁺ Si⁴⁺ and Fe³⁺ ions eluted in different concentrations of HCl and H₂SO₄ solutions by means of atomic absorption spectrometry (AAS). By increasing the concentration from 0.37 to 6.5 mol/l, it was notified that the corrosion susceptibility in HCl and H₂SO₄ solutions for the CIP alumina specimens at room temperature decreases.     

Electrochemical corrosion behaviour of microcrystalline aluminium in acidic solutions

The electrochemical corrosion behaviour of microcrystalline pure aluminium coating, fabricated by a magnetron sputtering technique, has been investigated in both 0.5 mol/l NaCl and 0.5 mol/l Na₂SO₄ acidic (pH = 2) aqueous solutions. The corrosion resistance of the microcrystalline Al coating has deteriorated more compared with that of the cast pure Al in Na₂SO₄ acidic solution. However, its oxide film has a higher pitting resistance in the NaCl acidic solution. Chloride ions play a big role in the formation of the oxide film on the microcrystalline Al coating. The higher pitting resistance was attributed to the more acidic isoelectric point which the oxide film achieved.     

Hot corrosion of YSZ/Al2O3 dispersed NiCrAlY plasma-sprayed coatings in Na2SO4-10 wt.% NaCl melt

This study examines the effect of ytrria stabilized zirconia (YSZ) dispersion on hot corrosion behaviour of NiCrAlY bond coat. Hot corrosion studies were conducted on NiCrAlY and NiCrAlY containing 25, 50 and 75 wt.% YSZ coatings obtained through the air plasma spray technique, in Na₂SO₄ + 10 wt.% NaCl environment at 800 °C. The results show that YSZ dispersion lowers the overall hot corrosion tendency of the NiCrAlY, though it enhances the inherent hot corrosion tendency of its metallic constituent (NiCrAlY). Furthermore, there exists a threshold oxide level beyond which it adversely affects the hot corrosion of the coating.     

Analysis of the electrochemical reaction behavior of alloy AZ91 by EIS technique in H3PO4/KOH buffered K2SO4 solutions

The EIS technique was used to analyze the electrochemical reaction behavior of Alloy AZ91 in H₃PO₄/KOH buffered K₂SO₄ solution at pH 7. The corrosion resistance of Alloy AZ91 was directly related with the stability of Al₂O₃ · xH₂O rich part of the composite oxide/hydroxide layer on the alloy surface. The break down of the oxide layer was estimated to occur mainly on the matrix solid solution phase in Alloy AZ91. The mf capacitive loop arose from the relaxation of mass transport in the solid oxide phase in the presence of Al₂O₃ · xH₂O rich part and from Mg⁺ ion concentration within the broken area in the absence of Al₂O₃ · xH₂O rich part in the composite oxide structure on the alloy surface. The lf inductive loop had tendency of disappear when the dissolution rate of the alloy decreased as a result of the formation of the protective oxide layer.     

An ultrathin polymer coating of carboxylate self-assembled monolayer adsorbed on passivated iron to prevent iron corrosion in 0.1 M Na2SO4

For preparing an ultrathin two-dimensional polymer coating adsorbed on passivated iron, a 16-hydroxyhexadecanoate ion HO(CH₂)₁₅CO₂⁻ self-assembled monolayer (SAM) was modified with 1,2-bis(triethoxysilyl)ethane (C₂H₅O)₃Si(CH₂)₂Si(OC₂H₅)₃ and octadecyltriethoxysilane C₁₈H₃₇Si(OC₂H₅)₃. Protection of passivated iron against passive film breakdown and corrosion of iron was investigated by monitoring of the open-circuit potential and repeated polarization measurements in an aerated 0.1 M Na₂SO₄ solution during immersion for many hours. The time required for passive film breakdown of the polymer-coated electrode was markedly higher in this solution than that of the passivated one, indicating protection of the passive film from breakdown by coverage with the polymer coating. The protective efficiencies of the passive film covered with the coating were extremely high, more than 99.9% in 0.1 M Na₂SO₄ before the passive film was broken down, showing prominent cooperative suppression of iron corrosion in the solution by coverage with the passive film and polymer coating. The polymer-coated surface was characterized by contact angle measurement and electron-probe microanalysis (EPMA). Prevention of passive film breakdown and iron corrosion for the polymer-coated electrode healed in 0.1 M NaNO₃ was also examined in 0.1 M Na₂SO₄.     

The influence of CO2, AlCl3 · 6H2O, MgCl2 · 6H2O, Na2SO4 and NaCl on the atmospheric corrosion of aluminum

The influence of salt deposits on the atmospheric corrosion of high purity Al (99.999%) was studied in the laboratory. Four chloride and sulfate-containing salts, NaCl, Na₂SO₄, AlCl₃ · 6H₂O and MgCl₂ · 6H₂O were investigated. The samples were exposed to purified humid air with careful control of the relative humidity (95%), temperature (22.0 °C), and air flow. The concentration of CO₂ was 350 ppm or <1 ppm and the exposure time was four weeks. Under the experimental conditions all four salts formed aqueous solutions on the metal surface. Mass gain and metal loss results are reported. The corroded surfaces were studied by ESEM, OM, AES and FEG/SEM equipped with EDX. The corrosion products were analyzed by gravimetry, IC and grazing incidence XRD. In the absence of CO₂, the corrosivity of the chloride salts studied increases in the order MgCl₂ · 6H₂O < AlCl₃ · 6H₂O < NaCl. Sodium chloride is very corrosive in this environment because the sodium ion supports the development of high pH in the cathodic areas, resulting in alkaline dissolution of the alumina passive film and rapid general corrosion. The low corrosivity of MgCl₂ · 6H₂O is explained by the inability of Mg²⁺ to support high pH values in the cathodic areas. In the presence of carbon dioxide, the corrosion induced by the salts studied exhibit similar rates. Carbon dioxide strongly inhibits aluminum corrosion in the presence of AlCl₃ · 6H₂O and especially, NaCl, while it is slightly corrosive in the presence of MgCl₂ · 6H₂O. The corrosion effects of CO₂ are explained in terms of its acidic properties and by the precipitation of carbonates. In the absence of CO₂, Na₂SO₄ is less corrosive than NaCl. This is explained by the lower solubility of aluminum hydroxy sulfates in comparison to the chlorides. The average corrosion rate in the presence of CO₂ is the same for both salts. The main difference is that sulfate is less efficient than chloride in causing pitting of aluminum in neutral or acidic media.     

Effects of dithionite ion on corrosion of type 304 stainless steel in sulphuric acid solution

Corrosion behaviour of type 304 stainless steel was investigated, with particular attention to additive effects of hydrosulphite (Na₂S₂O₄) on corrosion in 0.1 mol/l H₂SO₄ solution with various amounts of Na₂S₂O₄ up to 60 mmol/l.Corrosion of SUS304 occurred below pH 3.0 at 30 °C in a 0.1 mol/l H₂SO₄ solution in which Na₂S₂O₄ was added to 0.1-20 mmol/l. The maximum corrosion rate at 30 °C was measured as 7.2 g/m² h (7.9 mm/y) in 0.1 mol/l H₂SO₄-10 mmol/l Na₂S₂O₄ at pH 1.2. Microscopic surface observation revealed that active dissolution was accompanied by intergranular corrosion at the metal surface.The SUS304 was easily passivated in 0.1 mol/l H₂SO₄ solution with more than 30 mmol/l Na₂S₂O₄. NiS was detected in the passivated film.     

Influence of pre-oxidation on the hot corrosion of Ti3SiC2 in the mixture of Na2SO4-NaCl melts

Polycrystalline Ti₃SiC₂ suffered from serious hot corrosion attack in the mixture of 75wt.%Na₂SO₄ + 25wt.%NaCl melts at 850 °C. In order to improve the hot corrosion resistance of this material, pre-oxidation treatment was conducted at 1200 °C in air for 2 h. A duplex oxide scale with an outer layer of TiO₂ and an inner layer of a mixture of TiO₂ and SiO₂ was formed during the pre-oxidation. Because the outer oxide layer of the pre-oxidation treated specimens could inhibit hot corrosion process, they exhibited good hot corrosion resistance in the mixture of 75wt.%Na₂SO₄ + 25wt.%NaCl melts at 850 °C for 50 h. However, during the hot corrosion the outer layer of TiO₂ would degrade gradually. Once the outer layer damaged, the hot corrosion rate increased sharply, the corrosion behavior was similar to Ti₃SiC₂ corroded under the same conditions. The microstructure and phase compositions of the hot corrosion samples were investigated by SEM/EDS and XRD.     

Corrosion behaviour of aluminium in copper containing environment

Corrosion behaviour of pure aluminium galvanically connected to metallic copper or in the presence of Cu²⁺ ions was investigated by electrochemical measurements in Na₂SO₄ and Na₂SO₄ + NaCl test solutions. It has been found that in aerated Cl⁻ ion containing solutions pitting corrosion of aluminium emerged immediately, while in the absence of oxygen this process was less violent. Effect of passivating pre-treatment of aluminium surface on corrosion behaviour Cu-Al bimetallic system is also demonstrated.     

Initial NaCl-particle induced atmospheric corrosion of zinc—Effect of CO2 and SO2

Initial corrosion and secondary spreading effects during NaCl particle induced corrosion on zinc was explored using in situ and ex situ FTIR microspectroscopy, optical microscopy, and SEM/EDAX. The secondary spreading effect which occurs upon introduction of humid air on NaCl deposited zinc surfaces was strongly dependent on the CO₂ and SO₂ content of the introduced air. Ambient level of CO₂ (350 ppm) resulted in a relatively low spreading effect, whereas the lower level of CO₂ (<5 ppm) caused a much faster spreading over a larger area. In the presence of SO₂, the secondary spreading effect was absent which could limit the cathodic process in this case. At <5 ppm CO₂, the corrosion is more localized, with the formation of simonkolleite (Zn₅(OH)₈Cl₂ · H₂O), zincite (ZnO) and sodium carbonate (Na₂CO₃), and a larger effective cathodic area. At 350 ppm CO₂, the corrosion is more general and formation of simonkolleite, hydrozincite (Zn₅(OH)₆(CO₃)₂) and sodium carbonate was observed. Sodium carbonate was mainly formed in more alkaline areas, in the inner edge of the electrolyte droplet and in the secondary spreading area. Oxidation of sulphur and concomitant sulphate formation was enhanced in the presence of NaCl particles, due to the formation of a droplet, the separation of the anodic and cathodic areas and the accompanying differences in chemical composition and pH in the surface electrolyte.     

Kinetics of intermetallic phase formation at the interface of Sn-Ag-Cu-X (X = Bi, In) solders with Cu substrate

The effects of Bi and In additions on intermetallic phase formation in lead-free solder joints of Sn-3.7Ag-0.7Cu; Sn-1.0Ag-0.5Cu-1.0Bi and Sn-1.5Ag-0.7Cu-9.5In (composition given in weight %) with copper substrate are studied. Soldering of copper plate was conducted at 250 °C for 5 s. The joints were subsequently aged at temperatures of 130-170 °C for 2-16 days in a convection oven. The aged interfaces were analyzed by optical microscopy and energy dispersive X-ray spectroscopy (EDX) microanalysis. Two intermetallic layers are observed at the interface - Cu₃Sn and Cu₆Sn₅. Cu₆Sn₅ is formed during soldering. Cu₃Sn is formed during solid state ageing. Bi and In decrease the growth rate of Cu₃Sn since they appear to inhibit tin diffusion through the grain boundaries. Furthermore, indium was found to produce a new phase - Cu₆(Sn,In)₅ instead of Cu₆Sn₅, with a higher rate constant. The mechanism of the Cu₆(Sn,In)₅ layer growth is discussed and the conclusions for the optimal solder chemical composition are presented.     

Corrosion and corrosion inhibition of Cu-20%Fe alloy in sodium chloride solution

The electrochemical behavior of copper (Cu), iron (Fe) and Cu-20%Fe alloy was investigated in 1.0 M sodium chloride solution of pH 2. The effect of thiourea (TU) addition on the corrosion rate of the Cu-20%Fe electrode was also studied. Open-circuit potential measurements (OCP), polarization and electrochemical impedance spectroscopy (EIS) were used. The results showed that the corrosion rates of the three electrodes follow the sequence: Cu < Cu-20%Fe < Fe. Potentiostatic polarization of the Cu-20%Fe electrode in the range −0.70 V to −0.45 V (SCE), showed that iron dissolves selectively from the Cu-20%Fe electrode surface and the rate of the selective dissolution reaction depends on the applied potential. At anodic potential of −0.45 V, thiourea molecules adsorb at the alloy surface according to the Langmuir adsorption isotherm. Increasing thiourea concentration (up to 5 mM), decreases the selective dissolution reaction and the inhibition efficiency η reach 91%. At [TU] > 5 mM, the dissolution rate of the Cu-20%Fe electrode increases due to formation of soluble thiourea complexes. At cathodic (−0.6 V), the inhibition efficiency of thiourea decreases markedly owing to a decrease of the rate of the selective dissolution reaction and/or desorption of thiourea molecules. The results indicated that thiourea acts mainly as inhibitor of the selective dissolution reaction of the Cu-20%Fe electrode in chloride solution.