A 35-ns 128K/spl times/8 CMOS SRAM

A 128 K/spl times/8-b CMOS SRAM with TTL input/output levels and a typical address access time of 35 ns is described. A novel data transfer circuit with dual threshold level is utilized to obtain improved noise immunity. A divided-word-line architecture and an automatic power reduction function are utilized to achieve a low operational power of 10 mW at 1 MHz, and 100 mW at 10 MHz. A novel fabrication technology, including improved LOCOS and highly stable polysilicon loads, was introduced to achieve a compact memory cell which measures 6.4/spl times/11.5 /spl mu/m/SUP 2/. Typical standby current is 2 /spl mu/A. The RAM was fabricated with 1.0-/spl mu/m design rules, double-level polysilicon, and double-level aluminum CMOS technology. The chip size of the RAM is 8/spl times/13.65 mm/SUP 2/.     

A 25 ns 8K /spl times/ 8 static MTL/I/SUP 2/L RAM

An experimental 8K /spl times/ 8-bit static MTL RAM has been successfully fabricated in a standard bipolar manufacturing process with 2-/spl mu/m epitaxy and junction isolation, using design rules of 2.2 /spl mu/m minimum dimensions. Despite conservative processing and less aggressive photolithography compared to the most advanced static FET RAMs, a significantly better performance of 25-ns access has been achieved at a comparable bit density of 1730 bits/mm/SUP 2/. Another outstanding feature is the very low power dissipation of only 8 mW in standby and 270 mW at 50-ns or 150 mW at 100 ns-cycle operation. A holding power below 1/spl mu/W has been measured to retain the information in the complete cell array. A further significant advantage is the insensitivity to /spl alpha/-particle radiation which is a characteristic of the MTL structure.     

8/spl times/8 optical switch matrix using generalized Mach-Zehnder interferometers

We report an 8/spl times/8 strictly nonblocking optical cross connect (OXC) using multimode imaging (MMI)-based generalized Mach-Zehnder (MZ) interferometers realized in the silica-on-silicon planar waveguide system. Employing a router-selector architecture, this MMI-MZ OXC design results in a significantly smaller device than conventional directional-coupler based implementations. An average insertion loss of 6 dB and crosstalk of -34 dB, is demonstrated for the 8/spl times/8 OXC.     

A 16 ns 2K/spl times/8 bit full CMOS SRAM

A high-speed 2K/spl times/8 bit full CMOS SRAM fabricated with a platinum silicide gate electrode and single-level aluminum technology is described. A typical address access time of 16 ns, which is comparable to the 16-kb bipolar SRAMs, was achieved. Typical active and standby power dissipations are 150 mW and 25 nW, respectively. The platinum silicide word line reduces the total address access time by 25%. A compact cell layout design, as well as a 1.5-/spl mu/m device feature size, also gives fast access time. The properly controlled bit line swing voltage provides reliable and fast readout operation. The chip size of the SRAM is 2.7/spl times/3.5 mm.     

New radix-(2/spl times/2/spl times/2)/(4/spl times/4/spl times/4) and radix-(2/spl times/2/spl times/2)/(8/spl times/8/spl times/8) DIF FFT algorithms for 3-D DFT

In this paper, new three-dimensional (3-D) radix-(2/spl times/2/spl times/2)/(4/spl times/4/spl times/4) and radix-(2/spl times/2/spl times/2)/(8/spl times/8/spl times/8) decimation-in-frequency (DIF) fast Fourier transform (FFT) algorithms are developed and their implementation schemes discussed. The algorithms are developed by introducing the radix-2/4 and radix-2/8 approaches in the computation of the 3-D DFT using the Kronecker product and appropriate index mappings. The butterflies of the proposed algorithms are characterized by simple closed-form expressions facilitating easy software or hardware implementations of the algorithms. Comparisons between the proposed algorithms and the existing 3-D radix-(2/spl times/2/spl times/2) FFT algorithm are carried out showing that significant savings in terms of the number of arithmetic operations, data transfers, and twiddle factor evaluations or accesses to the lookup table can be achieved using the radix-(2/spl times/2/spl times/2)/(4/spl times/4/spl times/4) DIF FFT algorithm over the radix-(2/spl times/2/spl times/2) FFT algorithm. It is also established that further savings can be achieved by using the radix-(2/spl times/2/spl times/2)/(8/spl times/8/spl times/8) DIF FFT algorithm.     

A 70-MHz 8-bit/spl times/8-bit parallel pipelined multiplier in 2.5-/spl mu/m CMOS

A design is presented for an 8-bit/spl times/8-bit parallel pipelined multiplier for high speed digital signal-processing applications. The multiplier is pipelined at the bit level. The first version of this multiplier has been fabricated in 2.5-/spl mu/m CMOS technology. It has been tested at multiplication rates up to 70 MHz with a power dissipation of less than 250 mW. Clock skew, a major problem encountered in high-speed pipelined architectures, is overcome by the use of a balanced clock distribution network all on metal, and by proper use of clock buffers. These issues and the timing simulation of the pipeline design are discussed in detail. Possible extensions and improvements for achieving higher performance levels are discussed. The conversion of the two-phase clocking scheme to an inherently single-phase clock approach is one possible improvement. A design using this approach has been simulated at 75 MHz and is currently being fabricated.     

Low-power data-dependent 8/spl times/8 DCT/IDCT for video compression

Traditional fast discrete cosine transform (DCT)/inverse DCT (IDCT) algorithms have focused on reducing arithmetic complexity and have fixed run-time complexities regardless of the input. Recently, data-dependent signal processing has been applied to the DCT/IDCT. These algorithms have variable run-time complexities. A two-dimensional 8/spl times/8 low-power DCT/IDCT design is implemented using VHDL by applying the data-dependent signal processing concept onto the traditional fixed-complexity fast DCT/IDCT algorithm. To reduce power, the design is based on Loeffler's fast algorithm, which uses a low number of multiplications. On top of that, zero bypassing, data segmentation, input truncation and hardwired canonical sign-digit (CSD) multipliers are used to reduce the run-time computation, hence reducing the switching activities and the power. When synthesised using CMC 0.18 /spl mu/m 1.6 V CMOSP technology, the proposed FDCT/IDCT design consumes 8.94/9.54 mW, respectively, with a clock frequency of 40 MHz and a processing rate of 320 Msample/s. This design features lower dynamic power consumption per sample, i.e. it is more power-efficient than other previously reported high-performance FDCT/IDCT designs.     

10 ns 8/spl times/8 multiplier LSI using super self-aligned process technology

Describes a high-speed 8/spl times/8 bit multiplier LSI which uses the newly developed high-speed and low-power bipolar process technology SST-2. SST-2 results in 250 ps delay time and 0.165 pJ power delay product in a low-level current mode logic (LCML) gate. Its multiplication time is about 10 ns, and its power dissipation is about 660 mW. This LSI has a feature called `perfect expandability' for arbitrary scaling of the expanded 8n/spl times/8n bit multiplier without an additional circuit. The results indicate that 32/spl times/32 bit multiplication can be carried out with 55 ns.     

An 8-MHz CMOS subranging 8-bit A/D converter

A 8-bit subranging converter (ADC) has been realized in a 3-/spl mu/m silicon gate, double-polysilicon capacitor CMOS process. The ADC uses 31 comparators and is capable of conversion rates to 8 MHz at V/SUB DD/=5 V. Die size is 3.2/spl times/2.2 mm/SUP 2/.     

An ultralow power 8K/spl times/8-bit full CMOS RAM with a six-transistor cell

A fully static 8K word by 8 bit CMOS RAM, with a six-transistor CMOS cell structure to achieve an extremely low standby power of less than 50 nW has been developed. A 2 /spl mu/m, double polysilicon CMOS process was utilized to realize a 19/spl times/22 /spl mu/m cell size. Redundance technology with polysilicon laser fuses was also developed for improving fabrication yield with relatively large chip size, i.e. 5.92/spl times/7.49 mm. In addition, for reducing operational power dissipation while maintaining fully static operation from outside on the chip, an internally clocked low-power circuit technology using row address transition detectors was employed, which results in only 15 mW operational power at 1 MHz by cutting off all DC current paths. The RAM offers an 80 ns address access time.     

A 40-ns/100-pF low power full-CMOS 256 K (32 K/spl times/8) SRAM

A fast and low-power full-CMOS 256 K (32 K/spl times/8-b) static RAM is described. Typical access time is 40 ns with a 100-pF load. Power dissipation is 100 mW at 10 MHz and <1 /spl mu/W in standby mode. The low standby power has been achieved by introducing a novel six-transistor, polysilicon-interconnected, double-cross-coupled cell. A novel output buffer design, a data-transition detection (DTD) circuit, and several other circuit techniques are introduced to obtain the speed and low active power dissipation. This chip is made in a 1.3-/spl mu/m, twin-tub, single-poly, double-metal technology with a p epi layer on p/SUP +/ substrate.     

A 35 ns 2K /spl times/ 8 HMOS static RAM

This paper describes the circuit design and process techniques used to produce a 35-ns 2K /spl times/ 8 HMOS static RAM aimed at future high-end microprocessor applications. The circuit design uses predecoding of the row and column decoder/driver circuits to reduce active power, address-transition detection schemes to equalize internal nodes, and dynamic depletion-mode configurations for increased drive and speed. The technology is 2.5-3.0-/spl mu/m design rule HMOS employing an L/SUB eff/ of 1.7 /spl mu/m, t/SUB ox/=400 /spl Aring/, double-poly resistor loads, RIE and plasma etching, and wafer-stepper lithography. Using these techniques an access time of 35 ns, dc active power of 65 mA, standby power of 14 mA, and die size of 37.5K mil/SUP 2/ has been achieved. The cell size is 728 /spl mu/m/SUP 2/.     

1.5 V 1 K-CMOS-RAM with only 8 pins

A 256-bit/spl times/4-bit static RAM working on a supply voltage down to 1.2 V is described. A serial interface for the address and the data with a 4-bit bus reduces the pincount of the RAM to only 8. Special design techniques to reach the design goal-very low power at a reasonable circuit speed-are discussed in detail. The device is fabricated in a low power silicon gate CMOS process. An operating power of 500 /spl mu/W/MHz and a standby power of less than 1 /spl mu/W at 1.5 V supply voltage was achieved. With this serial interface a cycle time of 1 /spl mu/s at 1.5 V was measured.     

A Hi-CMOSII 8K/spl times/8 bit static RAM

A Hi-CMOSII static RAM with 8K word by 8 bit organization has been developed. The RAM is fabricated using double polysilicon technology and p- and n-channel transistors having a typical gate polysilicon length of 2 /spl mu/m. The device was realized using low-power high-speed-oriented circuit design and a new redundancy circuit that utilizes laser diffusion programmable devices. The new RAM has an address access time of 65 ns, operating power dissipation of 200 mW, and standby dissipation of 10 /spl mu/W.     

A 4 /spl mu/m NMOS NAND structure PLA

A PLA of NAND structure, using a NMOS Si gate process, has been developed to minimize chip area and maintain medium fast speed. The smallest memory cell size of 7/spl times/9 /spl mu/m is achieved by using ion implantation for PLA bit programming with 4 /spl mu/m design rules. Dynamic clocking scheme and self-timing circuits which are used in this PLA are described. With PLA size at 20/spl times/20/spl times/20, transistor size of 8 /spl mu/m/4 /spl mu/m, and cell size of 7/spl times/12 /spl mu/m, an internal access time of 150 ns is achieved with an external 4 MHz clock. Measured circuit power dissipation is 20 mW under normal conditions.     

A high-speed high-density silicon 8/spl times/8-bit parallel multiplier

An 8/spl times/8-bit parallel multiplier with submicrometer gate lengths has been fabricated using silicon NMOS technology. The multiplication time is 9.5 ns. This corresponds to an average loaded gate delay in the multiplier circuit of 244 ps/gate, which the authors believe is the shortest gate delay for MOS multiplier circuits demonstrated to date. The power dissipation is 600 mW at a supply voltage of 5 V. The multiplier circuit has a total of 1427 transistors in an active area of 0.61/spl times/0.58 mm/SUP 2/, corresponding to a gate density of 1125 gates/mm/SUP 2/.     

An 8K/spl times/8 bit static MOS RAM fabricated by n-MOS/n-well CMOS technology

A 64 kbit fully static MOS RAM which contains about 402500 elements on the chip area of 5.44/spl times/5.80 mm has been designed. The memory cell is a basic cross-coupled flip-flop with four n-MOSFETs and two polysilicon load resistors. The memory cell size is decreased to 16/spl times/19 /spl mu/m (304 /spl mu/m/SUP 2/) by using advanced n-MOS technology with double-level polysilicon films and photolithography of 2 /spl mu/m dimensions. By applying n-well CMOS technology fabricated on a high-resistivity p-type silicon substrate to peripheral circuits of the RAM, high performance characteristics with high speed access times and low power dissipation are obtained. The RAM is designed for single 5 V operation. Address and chip select access times are typically 80 ns. Power dissipation in the active and standby mode is typically 300 and 75 mW, respectively.     

A 128K word/spl times/8 bit dynamic RAM

A 1-Mb DRAM with 128K/spl times/8 bit organization is described. In designing the circuit, half V/SUB cc/ bit line precharge with dummy reverse circuits was adopted for noise reduction. The noise is estimated using a three-dimensional capacitance calculation. In realizing the chip, a 1-/spl mu/m NMOS process with double-level aluminum wiring was used.     

A 256-kbit flash E/SUP 2/PROM using triple-polysilicon technology

A high-density 256-kb flash electrically erasable PROM (E/SUP 2/PROM) with a single transistor per bit has been developed by utilizing triple-polysilicon technology. As a result of achieving a novel compact cell that is as small as 8/spl times/8 /spl mu/m/SUP 2/, even with relatively conservative 2.0-/spl mu/m design rules, a small die size of 5.69/spl times/5.78 mm/SUP 2/ is realized. This flash E/SUP 2/PROM is fully pin-compatible with a 256-kb UV-EPROM without increasing the number of input pins for erasing by introducing a novel programming and erasing scheme. Programming time is as fast as 200 /spl mu/s/byte and erasing time is less than 100 ms per chip. A typical access time of 90 ns is achieved by using sense-amplifier circuitry.