Growth and structural properties of crystalline LaAlO3 on Si (0 0 1)

Crystalline LaAlO₃ was grown by oxide molecular beam epitaxy (MBE) on Si (0 0 1) surfaces utilizing a 2 ML SrTiO₃ buffer layer. This SrTiO₃ buffer layer, also grown by oxide MBE, formed an abrupt interface with the silicon. No SiO₂ layer was detectable at the oxide-silicon interface when studied by cross-sectional transmission electron microscopy. The crystalline quality of the LaAlO₃ was assessed during and after growth by reflection high energy electron diffraction, indicating epitaxial growth with the LaAlO₃ unit cell rotated 45° relative to the silicon unit cell. X-ray diffraction indicates a (0 0 1) oriented single-crystalline LaAlO₃ film with a rocking curve of 0.15° and no secondary phases. The use of SrTiO₃ buffer layers on silicon allows perovskite oxides which otherwise would be incompatible with silicon to be integrated onto a silicon platform.     

GaN薄膜电子声成像和电子背散射衍射研究

采用扫描电声显微镜(SEAM)和电子背散射衍射(EBSD)对异质外延在Al2O3衬底上GaN界面区域成像测试分析。异质外延失配应力导致在Al2O3和GaN界面附近的微区晶格畸变在SEAM的声成像中可以清楚看到,而且受应力影响集中区域的微区衬度差异明显。利用EBSD色带图及质量参数分析了失配应力变化,晶格应变和弹性形变在200nm内可以得到释放。     

Growth temperature dependence of epitaxial Gd2O3 films on Si(1 1 1)

This article reports on the epitaxy of crystalline high κ oxide Gd₂O₃ layers on Si(1 1 1) for CMOS gate application. Epitaxial Gd₂O₃ thin films have been grown by Molecular Beam Epitaxy (MBE) on Si(1 1 1) substrates between 650 and 750 °C. The structural and electrical properties were investigated depending on the growth temperature. The C–V measurements reveal that equivalent oxide thickness (EOT) equals 0.7 nm for the sample deposited at the optimal temperature of 700 °C with a relatively low leakage current of 3.6 × 10^?2 A/cm² at |V_g ? V_FB| = 1 V.     

Epitaxial growth of Dy2O3 thin films on epitaxial Dy-germanide films on Ge(0 0 1) substrates

Ultra-thin films of Dy are grown on Ge(0 0 1) substrates by molecular beam deposition near room temperature and immediately annealed for solid phase epitaxy at higher temperatures, leading to the formation of DyGe_x films. Thin films of Dy₂O₃ are grown on the DyGe_x film on Ge(0 0 1) substrates by molecular beam epitaxy. Streaky reflection high energy electron diffraction (RHEED) patterns reveal that epitaxial DyGe_x films grow on Ge(0 0 1) substrates with flat surfaces. X-ray diffraction (XRD) spectrum suggests the growth of an orthorhombic phase of DyGe_x films with (0 0 1) orientations. After the growth of Dy₂O₃ films, there is a change in RHEED patterns to spotty features, revealing the growth of 3D crystalline islands. XRD spectrum shows the presence of a cubic phase with (1 0 0) and (1 1 1) orientations. Atomic force microscopy image shows that the surface morphology of Dy₂O₃ films is smooth with a root mean square roughness of 10 Å.     

Investigation of high-K gate stacks with epitaxial Gd2O3 and FUSI NiSi metal gates down to CET=0.86 nm

Novel gate stacks with epitaxial gadolinium oxide (Gd₂O₃) high-k dielectrics and fully silicided (FUSI) nickel silicide (NiSi) gate electrodes are investigated. Ultra-low leakage current densities down to 10^–7 A cm^–2 are observed at a capacitance equivalent oxide thickness of CET=1.8 nm. The influence of a titanium nitride (TiN) capping layer during silicidation is studied. Furthermore, films with an ultra-thin CET of 0.86 nm at a Gd₂O₃ thickness of 3.1 nm yield current densities down to 0.5 A cm⁻² at V_g=+1 V. The extracted dielectric constant for these gate stacks ranges from k=13 to 14. These results emphasize the potential of NiSi/Gd₂O₃ gate stacks for future material-based scaling of CMOS technology.     

Photoemission (XPS and XPD) study of epitaxial LaAlO3 film grown on SrTiO3(0 0 1)

This study investigates the tensile-strained growth of LaAlO₃ on SrTiO₃(0 0 1) substrate by molecular beam epitaxy (MBE). Growth was controlled in situ by reflection high energy electron diffraction (RHEED). The characterization was carried out ex situ by photoemission and atomic force microscopy (AFM). Photoelectron spectroscopy (XPS) reveals the development of a TiO_x-rich interface. Photoelectron diffraction (XPD) confirms that a 1.2-nm-thick pseudomorphic LaAlO₃ film has been grown on SrTiO₃(0 0 1) substrate with a perpendicular lattice parameter of 0.372±0.02 nm.     

First investigation of metal–insulator–metal (MIM) capacitor using Pr2O3 dielectrics

Metal–insulator–metal (MIM) capacitors with Pr₂O₃ as high-k material have been investigated for the first time. We varied the thickness of the Pr₂O₃ layers as well as the bottom electrode material. The layers are characterised using X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), transmission electron microscopy (TEM) and secondary ion mass spectroscopy (SIMS). Preliminary information on the interaction of water with the films was obtained from XPS and ab initio pseudopotential calculations. The electrical characterisation shows that Pr₂O₃ MIM capacitors can provide higher capacitance densities than Si₃N₄ MIM capacitors while still maintaining comparable voltage coefficients of capacitance. The Pr₂O₃ dielectric material seems to be suitable for use in silicon RF applications.     

Influence of arsenic on the atomic structure of the Si(112) surface

The surface science techniques of low-energy electron diffraction (LEED), x-ray photoelectron spectroscopy (XPS), and scanning tunneling microscopy (STM) have been used to characterize the clean Si(112) surface and the influence of an As monolayer on the properties and structure of the surface. In agreement with previous studies, the clean surface is found by both LEEd and atomically resolved STM images to be unstable with respect to faceting into other stable planes. Procedures for in-situ deposition of As onto clean Si surfaces were devised and XPS results show that approximately one monolayer of As can be deposited free of any contamination. The As/Si(112) surface is characterized by a sharper LEED pattern than for the clean surface and by STM images characterized by long rows along the direction with a regular width of 1.9 nm. This is consistent with a doubling of the periodicity in the direction of the bulk-terminated unit cell. This implies that As yields a stable but reconstructed Si(112) surface.     

Epitaxial growth of LaAlO3 on Si(0 0 1) using interface engineering

In this work, the potentiality of molecular beam epitaxy techniques to prepare epitaxial lanthanum aluminate (LaAlO₃) films on Si(0 0 1) is explored. We first demonstrate that the direct growth of LaAlO₃ on Si(0 0 1) is impossible : amorphous layers are obtained at temperatures below 600 °C whereas crystalline layers can be grown at higher temperatures but interfacial reactions leading to silicate formation occur. An interface engineering strategy is then developed to avoid these reactions. SrO and SrTiO₃ have been studied as buffer for the subsequent growth of LaAlO₃. Only partial LaAlO₃ epitaxy is obtained on SrO whereas high quality layers are achieved on SrTiO₃. However both SrO and SrTiO₃ appear to be unstable with respect of Si at the growth temperature of LaAlO₃ (700 °C). This leads to the formation of relatively thick amorphous interfacial layers. Despite their instability at high temperature, these processes could be used for the fabrication of twins-free LaAlO₃ templates on Si, and for the fabrication of complex oxide/Si heterostructures for various applications.     

Growth of highly (1 1 1) oriented CuIn0.75Al0.25Se2 thin films

CuIn_0.75Al_0.25Se₂ thin films prepared onto glass substrates at T_S=573 K were single phase, nearly stoichiometric and polycrystalline with a strong (1 1 1) preferred orientation showing sphalerite structure. The results of X-ray diffraction and electron diffraction studies are compared, interpreted and correlated with micro-Raman spectra. The optical absorption studies indicated a direct band gap of 1.16 eV with high absorption coefficient (>10⁴ cm^?1) near the fundamental absorption edge.     

Al-oxynitrides as a buffer layer for Pr2O3/SiC interfaces

We elaborate the possibility of combining high-k dielectrics with wide band gap semiconductors, i.e. Pr₂O₃ on SiC. The thermal stability of interfacial aluminum oxynitride (AlON) layers between Pr-oxide and SiC has been investigated by synchrotron radiation photoemission spectroscopy (SRPES). The interface of Pr₂O₃ with SiC is reactive. Such reaction is successfully prevented by utilizing a stable interlayer derived from AlON. No elemental carbon is observed in detectable amount after Pr-Oxide deposition on AlON covered 3C-SiC and subsequent vacuum annealing. After vacuum annealing at 500 °C AlON transformed to AlN and Pr-aluminate with a small amount of CN close to the SiC surface which were thermally stable even at 900 °C. AlON hence provides a good diffusion barrier between Pr-oxide dielectric and 3C-SiC.     

Strained single-crystal GOI (Ge on Insulator) arrays by rapid-melting growth from Si (1 1 1) micro-seeds

Liquid-phase epitaxial growth of Ge islands on insulator (GOI) using Ni-imprint-induced Si (1 1 1) micro-crystal seeds (∼1 μm?) is proposed. As a result, single-crystalline GOI (1 1 1) structures with large area (∼10 μm?) are realized. The transmission electron microscopy observations reveal no dislocation or stacking fault in the laterally grown regions. Moreover, the Raman measurements show that the tensile strain (∼0.2%) which enhances the carrier mobility is induced in the growth regions. This new method can be employed to realize the multi-functional SiGe large scale integrated circuits.     

Orientation dependence of HgCdTe epitaxial layers grown by MOCVD on Si substrates

Orientation dependence of HgCdTe epilayers grown by MOCVD on Si substrates was studied. Substrate orientation is considered to be one of the most sensitive factors to enable hetero-epitaxial growth on silicon substrates, especially in the case of a low temperature growth process. The present work was carried out with characterized features of a low temperature process for HgCdTe growth on Si and using a thin CdTe buffer layer. The (100), (100) misoriented toward [110], (311), (211), (111), and (331) oriented Si substrates were used in the present work. The best results were obtained on (211)Si substrates with an x-ray full width at half maximum of 153 arc sec for a 5 (im thickness HgCdTe layer and 69 arc sec for a 10 um thickness layer. It was found that the effective lattice mismatch of CdTe/Si heterosystem was reduced to 0.6% (for the 611 lattice spacing of CdTe and 333 spacing of Si) in the case of (133)CdTe/(211)Si.     

采用ALD Al2O3作为栅介质的薄势垒增强型AlGaN/GaN MIS-HEMT

本文报道了高性能的增强型（E-mode）氮化镓（GaN）基金属-绝缘体-半导体高电子迁移率晶体管（MIS-HEMT）,该器件势垒层为5-nm厚的铝镓氮（Al0.3Ga0.7N）,并采用氮化硅（SiN）钝化来控制二维电子气（2DEG）密度。与SiN钝化不同,采用原子层淀积（ALD）技术生长的氧化铝（Al2O3）不会增强异质结中的2DEG密度。刻蚀栅区的SiN介质可以耗尽沟道电子,之后采用ALD Al2O3作为栅介质,可以实现MIS结构。栅长为1 μm的E-mode MIS-HEMT具有657mA/mm的最大饱和电流（IDS）、187mS/mm的最大跨导（gm）和1V的阈值电压（Vth）。与相应的E-mode HEMT对比,由于Al2O3栅介质的引入,使器件的性能得到了很大的提升。本文对于同时实现高的Vth和IDS提供了很好的方法。     

Atomic structures of Au and Ag films epitaxially grown on the InP(001)-p(2 × 4) surface

Thin films of Au and Ag deposited onto the InP(001)-p(2 × 4) surface at room temperature have been characterized by means of combined surface-layer analysis of low energy electron diffraction, reflection high energy electron diffraction, Auger electron spectroscopy, and Rutherford backscattering spec-troscopy-channeling techniques. It has been found that the Au film grows epitaxially in the layer-by-layer mode along the <001> direction, while the Ag film grows in the <110> direction in the Stranski-Krastanov mode. The unit cell of a face-centered cubic lattice of the Au film is rotated azimuthally by 45° with respect to the unit cell of a zinc-blende lattice of the InP substrate. The islands of Ag(110) crystallites prefer to orient their (100) faces along the direction of the 4 times superlattice of the InP(001)-p(2 × 4) surface. The analysis of the RBS-channeling minimum yield of 1.5 MeVHe⁺ ions incident along the [001] direction of the InP(OOl) substrate shows that both the epitaxially grown Au film and Ag crystallite of less than 20Å in thickness are excellent in crystalline quality.     

Ga2O3(Gd2O3)/InGaAsenhancement-mode n-channel MOSFETs

We have demonstrated the first Ga₂O₃(Gd₂O₃) insulated gate n-channel enhancement-mode In_0.53Ga_0.47As MOSFET's on InP semi-insulating substrate. Ga₂O₃(Gd₂ O₃) was electron beam deposited from a high purity single crystal Ga₅Gd₃O₁₂ source. The source and drain regions of the device were selectively implanted with Si to produce low resistance ohmic contacts. A 0.75-μm gate length device exhibits an extrinsic transconductance of 190 mS/mm, which is an order of magnitude improvement over previously reported enhancement-mode InGaAs MISFETs. The current gain cutoff frequency, f_t, and the maximum frequency of oscillation, f_max, of 7 and 10 GHz were obtained, respectively, for a 0.75×100 μm² gate dimension device at a gate voltage of 3 V and drain voltage of 2 V     

The characterization of retention properties of metal–ferroelectric (PbZr0.53Ti0.47O3)–insulator (Dy2O3, Y2O3)–semiconductor devices

Metal–ferroelectric–insulator–semiconductor (MFIS) capacitors and field effect transistors with the structures of Al/Pb (Zr_0.53, Ti_0.47) O₃ (PZT)/Dy₂O₃/Si and Al/PZT/Y₂O₃/Si were fabricated. The memory windows of Al/PZT/Dy₂O₃/Si and Al/PZT/Y₂O₃/Si capacitors with sweep voltage of 10 V are 1.03 V and 1.48 V, respectively. The effect of band offset on the memory window was discussed. The retention times of Al/PZT/Y₂O₃/Si and Al/PZT/Dy₂O₃/Si MFISFETs are 11.5 days and 11.1 h, respectively. The longer retention time of Al/PZT/Y₂O₃/Si field effect transistors is attributed to the larger conduction band offset at the Y₂O₃/Si interface (2.3 eV) compared to that of Dy₂O₃/Si (0.79 eV).     

Electrical characterization of thiols self-assembled layers on GaP (1 1 1) structures

The experimental studies on III–V semiconductor compounds surface passivation phenomena are mainly dedicated to solve some technological problems as those regarding the ways to keep the chemical stability of native oxides on surfaces. Self-assembled monolayers (SAMs) provide a simple way to produce relatively ordered structures at a molecular scale, which seems to be capable to protect the clean surface against the evolution of oxidation process. In this respect, thin films of SAMs of aliphatic thiol (dodencanthiol—CH₃(CH₂)₁₁SH) and aromatic thiol (4, 4′ tiobisbenzenthiol-S (C₆H₄SH)₂ have been deposited on the surface of GaP (1 1 1) samples. The electrical properties measurements of some structures based on GaP compound was performed. There were recorded current–voltage (I–V) characteristics for complex structures AuGeNi/R-SH/GaP and AuGeNi/Ar-SH/GaP in darkness and also exposed to a Xe lamp. In dark and in “reverse bias” way, the I–V characteristics present the feature of a Zenner diode for GaP/Ar-SH and a gradual increase of current for GaP/R-SH. In dark and “in forward bias” way, the current increases as for a normal diode for both GaP/Ar-SH and GaP/R-SH structures. The complex structures (e.g.: In/AuGeNi/R-SH/GaP/R-SH/AuGeNi/In) are less sensitive to light. The SEM analysis performed on a GaP/R-SH surface shows a continuous packed up layer while GaP/Ar-SH looks like an inhomogeneous deposition of layers with different thickness regions. The diodes’ ideality factors determined from I–V characteristics are unusually high (n2) as a possible result of inhomogeneous Schottky contacts or due to ageing effects, in the field of degradation.     

激光合金化Mn-Al2O3和Mn-Al2O3-NiWC涂层的磨蚀性能研究

为了提高不锈钢桨叶的表面耐磨蚀性能,采用激光合金化技术在1Cr18Ni9Ti不锈钢表面制备了Mn-Al2O3和Mn-Al2O3-NiWC合金化层,原位获得均由枝晶、共晶和未熔氧化铝颗粒组成的高锰钢基复合耐磨蚀涂层,并通过正交试验研究了两种合金化层的显微组织和耐磨蚀性能。结果表明,所有的正交参量下激光合金化Mn-Al2O3均可提高不锈钢的耐磨性,但耐蚀性有的提高,有的降低;参量因素对合金化层耐磨性的影响顺序为Al2O3添加量、扫描速率、激光功率,对耐蚀性的影响次序则恰恰相反;Al2O3添加量决定了Mn-Al2O3复合涂层中硬质相的含量,从而决定了涂层硬度和耐磨性;两种合金化层表面均发生晶界腐蚀、晶粒内和晶界处的点蚀,其耐蚀性与其多种组织、物相及各自的化学成分和耐蚀性及组织均匀性相关。     

Defects induced anomalous breakdown kinetics in Pr2O3 by micro- and nano-characterization

Praseodymium based dielectric thin films have been deposited by metal-organic chemical vapour deposition (MOCVD). The Weibull slope and the characteristic time of the dielectric breakdown (BD) have been determined at nanometer scale by conductive atomic force microscopy (C-AFM). An anomalous behaviour for the dielectric BD has been found. Its physical behaviour has been described taking into account the electrical properties investigated by nanoscopic measurements performed by scanning capacitance microscopy (SCM).Current density–voltage (J–V) measurements have been carried out at different temperatures (from 100 to 200 °C). At low electric fields, a slight dependence of J–V characteristics in function of both temperature and electric field has been observed, while a relatively strong dependence has been found at high fields. The calculation of the activation energies for conduction mechanisms in both field regions pointed out the presence of deep defects that play a relevant role in the BD kinetics.