TFT-LCD驱动芯片内置SRAM的低功耗设计

内置SRAM是单片集成TFT-LCD驱动控制芯片中的图像数据存储模块.针对内置SRAM的低功耗设计要求,采用HWD结构和动态逻辑的字线译码电路,实现了1.8Mb SRAM的低功耗设计.电路采用0.18μm CMOS工艺实现,Hspice和Ultrasim仿真结果表明,与静态字线译码电路相比,功耗减小了20%;与DWL结构相比,功耗减小了16%;当访存时钟频率为31MHz时,SRAM存储单元的读写时间小于8ns,电源峰值功耗小于123mW,静态功耗为0.81mW.     

一种用刷新技术实现SRAM抗SEU错误累积的方法

为了防止空间应用SRAM出现SEU错误累积,提出了一种优化的读→校验→回写刷新机制.该机制实时监测处理器状态,当处理器对外部主存进行读操作时,由存储器控制器自主地(即不需处理器干预)对读操作的存储单元进行刷新操作;当处理器进行访问外部主存以外的其他操作时,由存储器控制器自主的对所有的存储单元进行遍历式刷新操作,该机制可以避免长时间未被读的存储单元发生SEU错误的累积,保证SRAM单元中发生错误的比特位数小于校验码的纠检错能力.最后,通过向SRAM随机注错的方法对本机制的存储器控制器进行验证,结果表明存储器控制器满足设计要求.     

一种低压低功耗Flash BiCMOS SRAM的设计

设计了一种静态随机读写存储器(SRAM)的BiCMOS存储单元及其外围电路。HSpice仿真结果表明，所设计的SRAM电路的电源电压可低于3V以下，它既保留了CMOS SRAM低功耗、高集成度的特征，又获得了双极型电路快速、大电流驱动能力的长处，因而特别适用于高速缓冲静态存储器和便携式数字电子设备的存储系统中。     

一种面向可容错应用的低功耗SRAM架构

提出了一种面向可容错应用的低功耗SRAM架构。通过对输入数据进行预编码,提出的SRAM架构实现了以较小的精度损失降低SRAM电路功耗。设计了一种单端的8管SRAM单元。该8管单元采用读缓冲结构,提升了读稳定性。采用打破反馈环技术,提升了写能力。以该8管单元作为存储单元的近似SRAM电路能够在超低压下稳定工作。在40 nm CMOS工艺下对电路进行仿真。结果表明,该8管单元具有良好的稳定性和极低的功耗。因此,以该8管单元作为存储单元的近似SRAM电路具有非常低的功耗。在0.5 V电源电压和相同工作频率下,该近似SRAM电路的功耗比采用传统6管单元的SRAM电路功耗降低了59.86%。     

一种512 Kbit同步高速SRAM的设计

设计了一种深亚微米 ,单片集成的 5 1 2 K( 1 6K× 32位 )高速静态存储器 ( SRAM)。该存储器可以作为IP核集成在片上系统中。存储器采用六管 CMOS存储单元、锁存器型敏感放大器和高速译码电路 ,以期达到最快的存取时间。该存储器用 0 .2 5μm五层金属单层多晶 N阱 CMOS工艺实现 ,芯片大小为 4.8mm× 3.8mm。测试结果表明 ,在 1 0 MHz的工作频率下 ,存储器的存取时间为 8ns,工作电流 7m A。     

用0．8μm工艺技术设计的65—kb BiCMOS SRAM

设计了一种65-kb BiCMOS静态随机存取存储器(SRAM)的存储单元及其外围电路，提出了采用先进的0．8μm BiCMOS工艺，制作所设计SRAM的一些技术要点。实验结果表明，所设计的BiCMOS SRAM，其电源电压可低于3V，它既保留了CMOS SRAM低功耗、高集成密度的长处，又获得了双极型(Bipo1ar)电路快速、大电流驱动能力的优点，因此，特别适用于高速缓冲静态存储系统和便携式数字电子设备中。     

用O.8μm工艺技术设计的65-kb BiCMOS SRAM

设计了一种65-kb BiCMOS静态随机存取存储器(SRAM)的存储单元及其外围电路,提出了采用先进的0.8μm BiCMOS工艺,制作所设计SRAM的一些技术要点.实验结果表明,所设计的BiCMOSSRAM,其电源电压可低于3V,它既保留了CMOS SRAM低功耗、高集成密度的长处,又获得了双极型(BiDolar)电路快速、大电流驱动能力的优点,因此,特别适用于高速缓冲静态存储系统和便携式数字电子设备中.     

MSP430FR59x：超低功耗嵌入FRAM MCU开发方案

TI公司的MSP430FR59x系列是超低功耗（ULP）嵌入FRAM的MCU,16位RISC架构高达16MHz时钟,工作电压1.8V～3.6V,多达64kB非易失存储器工作模式功耗约为100μA/MHz,待机模式功耗为0.4μA,关断时功耗为0.02μA。器件主要用在仪表、能量收获传感器节点、可穿戴电子、传感器管理和数据记录应用中。     

基于九管存储单元的嵌入式SRAM设计

为了解决深亚微米及纳米尺寸下SRAM设计在可靠性及其他性能方面所面临的挑战,在分析不同存储单元的基础上,提出了一种优化的具有高稳定性的九管存储单元,并采用9管存储阵列,设计了一款高可靠性的512×32位SRAM.基于TSMC 0.18 μm CMOS工艺,对电路进行仿真.实验结果表明:该SRAM在250 MHz工作频率下,存储阵列中数据的读写稳定性高,阵列功耗为7.76 mW,数据读出时间为0.86 ns,电路面积仅比采用传统6管单元增加13.5%.     

手机用TFT-LCD驱动芯片内置SRAM的研究与设计

内置单端口SRAM是单片集成的TFT-LCD驱动控制电路芯片中的重要模块,主要功能是存储CPU送来的一帧画面的显示图像数据以及输出数据到显示单元,其主要性能指标是存储速度和消耗功率。文章讨论了内置SRAM的分块存储结构,阐述了SRAM存储单元的设计方法。在预充电路的设计中采用了分块预充机制,既节省了功耗又保证了预充时间,同时提出了预充时位线电荷再利用设计方案,使得预充电功耗降低了1/2左右。采用0.25μmCMOS工艺设计并实现了TFT-LCD驱动控制电路芯片中的SRAM模块,其容量为418kbits。NanoSim仿真结果表明,SRAM存储单元的读写时间小于8ns,当访存时钟频率为3.8MHz时,静态功耗为0.9mW,动态功耗小于3mW。     

基于SRL结构的抗辐射SRAM单元设计

在空间辐射环境中,单粒子翻转(SEU)效应严重影响了SRAM的可靠性,对航天设备的正常运行构成极大的威胁。提出了一种基于自恢复逻辑(SRL)结构的新型抗辐射SRAM单元,该单元的存储结构由3个Muller C单元和2个反相器构成,并采用读写线路分开设计。单粒子效应模拟实验结果表明,该单元不仅在静态存储状态下对SEU效应具有免疫能力,在读写过程中对SEU效应同样具有免疫能力。     

Low‐Power 512‐Bit EEPROM Designed for UHF RFID Tag Chip

In this paper, the design of a low‐power 512‐bit synchronous EEPROM for a passive UHF RFID tag chip is presented. We apply low‐power schemes, such as dual power supply voltage (VDD=1.5 V and VDDP=2.5 V), clocked inverter sensing, voltage‐up converter, I/O interface, and Dickson charge pump using Schottky diode. An EEPROM is fabricated with the 0.25 μm EEPROM process. Power dissipation is 32.78 μW in the read cycle and 78.05 μW in the write cycle. The layout size is 449.3 μm × 480.67 μm.     

A 0.5 V single power supply operated high-speed boosted andoffset-grounded data storage (BOGS) SRAM cell architecture

This paper proposes a 0.5 V/100 MHz/sub-5 mW-operated 1-Mbit SRAM cell architecture which uses a boosted and offset-grounded data storage (BOGS) scheme. The key target of BOGS is to minimize the charge amount supplied from the embedded charge pump circuits, which are required to boost the effective gate to source voltage (V₀=V_GS-V_T) up to 0.8 V necessary to achieve 100 MHz operation even at 0.5 V single power supply. Thus, the key low-power strategy of BOGS is “putting the right (higher efficiency) boosted power-supply from charge pump circuit into the right position (less power consumed transistor) in a SRAM cell.” This paper is focused on why BOGS can realize a greater savings of the charge amount supplied from the boosted power-line and can reduce the power dissipation to ⩽1/30.4 and ⩽1/3.9 compared to the previously reported negative source-line drive (NSD) scheme and negative word-line drive (NWD) scheme, respectively, while achieving a 0.5 V/100 MHz operation     

An Experimental 0.8 V 256‐kbit SRAM Macro with Boosted Cell Array Scheme

This work presents a low‐voltage static random access memory (SRAM) technique based on a dual‐boosted cell array. For each read/write cycle, the wordline and cell power node of selected SRAM cells are boosted into two different voltage levels. This technique enhances the read static noise margin to a sufficient level without an increase in cell size. It also improves the SRAM circuit speed due to an increase in the cell read‐out current. A 0.18 µm CMOS 256‐kbit SRAM macro is fabricated with the proposed technique, which demonstrates 0.8 V operation with 50 MHz while consuming 65 µW/MHz. It also demonstrates an 87% bit error rate reduction while operating with a 43% higher clock frequency compared with that of conventional SRAM.     

一种低功耗抗辐照加固256kb SRAM的设计

设计了一个低功耗抗辐照加固的256kbSRAM。为实现抗辐照加固，采用了双向互锁存储单元（DICE）构以及抗辐照加固版图技术。提出了一种新型的灵敏放大器，采用了一种改进的采用虚拟单元的自定时逻辑来实现低功耗。与采用常规控制电路的SRAM相比，读功耗为原来的11％，读取时间加快19％。     

抗单粒子翻转的双端口SRAM定时刷新机制研究

在空间辐射环境下,存储单元对单粒子翻转的敏感性日益增强。通过比较SRAM的单粒子翻转效应相关加固技术,在传统EDAC技术的基础上,增加少量硬件模块,有效利用双端口SRAM的端口资源,提出了一种新的周期可控定时刷新机制,实现了对存储单元数据的周期性纠错检错。对加固SRAM单元进行分析和仿真,结果表明,在保证存储单元数据被正常存取的前提下,定时刷新机制的引入很大程度地降低了单粒子翻转引起的错误累积效应,有效降低了SRAM出现软错误的概率。     

Simulation and research on a 4T-cell based duplication redundancy SRAM for SEU radiation hardening

A novel 4T-cell based duplication redundancy SRAM is proposed for SEU radiation hardening applications. The memory cell is designed with a 65-nm low leakage process; the operation principle and the SEU radiation hardening mechanism are discussed in detail. The SEE characteristics and failure mechanism are also studied with a 3-D device simulator. The results show that the proposed SRAM structure exhibits high SEU hardening performance with a small cell size.     

低电压低功耗全加器的研究设计

采用传输管逻辑和低电压 XOR/XNOR结构 ,设计了一种新型的适用于低电源电压下工作的低功耗高速全加器电路。在 1 .8V工作电压下 ,获得了运算时间为 0 .85 lns,平均功耗 ( 5 0 MHz) 3.35 μW的良好特性。     

A 0.5-V 25-MHz 1-mW 256-kb MTCMOS/SOI SRAM for solar-power-operated portable personal digital equipment - sure write operation by using step-down negatively overdriven bitline scheme

Multithreshold-voltage CMOS (MTCMOS) technology has a great advantage in that it provides high-speed operation with low supply voltages of less than 1 V. A logic gate with low-V/sub th/ MOSFETs has a high operating speed, while a low-leakage power switch with a high-V/sub th/ MOSFET eliminates the off-leakage current during sleep time. By using MTCMOS circuits and silicon-on-insulator (SOI) devices, the authors have developed a 256-kb SRAM for solar-power-operated digital equipment. A double-threshold-voltage MOSFET (DTMOS) is adopted for the power switch to further reduce the off leakage. As regards the SRAM core design, we consider a hybrid configuration consisting of high-V/sub th/ and low-V/sub th/ MOSFETs (that is, multi-V/sub th/ CMOS). A new memory cell with a separate read-data path provides a larger readout current without degrading the static noise margin. A negatively overdriven bitline scheme guarantees sure write operation at ultralow supply voltages close to 0.5 V. In addition, a charge-transfer amplifier integrated with a selector and data latches for intrabus circuitry are installed to enhance the operating speed and/or reduce power dissipation. A 32K-word /spl times/ 8-bit SRAM chip, fabricated with the 0.35-/spl mu/m multi-V/sub th/ CMOS/SOI process, has successfully operated at 25 MHz under typical conditions with 0.5-V (SRAM core) and 1-V (I/O buffers) power supplies. The power dissipation during sleep time is less than 0.4 /spl mu/W and that for 25-MHz operation is 1 mW, excluding that of the I/O buffers.     

A low voltage SRAM for embedded applications

A 4-kb SRAM design is presented with functionality of 12 MHz at a supply voltage of 0.9 V with an r.m.s. run power (1 MHz) of 18 μW. The circuit operates at maximum frequency of 40 MHz at a supply voltage of 1.6 V with an rms run power (1 MHz) of 64 μW. The design utilizes a subblocked array architecture as well as selective use of NOR/NAND-based decode logic. The sense amplifier design is a low voltage, glitch-free design to conserve power