Optimizing the performance of a surface mount placement machine

Process planning is an important and integral part of effectively operating a printed circuit board (PCB) assembly system. A PCB assembly system generally consists of different types of placement machines, testing equipment, and material handling equipment. This research develops a new solution approach to determine the component placement sequence and feeder arrangement for a turret style surface mount-placement machine often used in PCB assembly systems. This solution approach can be integrated into a process planning system to reduce assembly time and improve productivity. The algorithm consists of a construction procedure that uses a set of rules to generate an initial component placement sequence and feeder arrangement along with an improvement procedure to improve the initial solution. An industrial case study conducted at Ericsson, Inc., using a Fuji CP4-3 machine and actual PCB data, is presented to demonstrate the performance of the proposed solution approach. The solutions obtained using the proposed solution approach are compared to those obtained using state of the art PCB assembly process optimization software. For all PCBs in the case study, the proposed solution approach yielded lower placement times than the commercial software, thus generating additional valuable production capacity. This research is applicable for both researchers and practitioners in printed circuit board assembly systems     

Advanced integrated-circuit reliability simulation includingdynamic stress effects

A systematic approach to predict semiconductor degradation effects using reliability simulation is described. The DC degradation monitor is first extracted during transient circuit simulation. An AC degradation factor is then used to determine circuit performance degradation. By using these techniques on the design of CMOS components, proper long-term reliability can be achieved for high-speed circuits. Experimental results on digital circuits using an industrial submicrometer technology demonstrate the effectiveness of this approach in reliable VLSI circuit design. Results on two-input NAND gates, DRAM precharging circuit, and SRAM control circuits are presented     

The interpretation and application of Rent's rule

This paper provides a review of both Rent's rule and the placement models derived from it. It is proposed that the power-law form of Rent's rule, which predicts the number of terminals required by a group of gates for communication with the rest of the circuit, is a consequence of a statistically homogeneous circuit topology and gate placement. The term “homogeneous” is used to imply that quantities such as the average wire length per gate and the average number of terminals per gate are independent of the position within the circuit. Rent's rule is used to derive a variety of net length distribution models and the approach adopted in this paper is to factor the distribution function into the product of an occupancy probability distribution and a function which represents the number of valid net placement sites. This approach places diverse placement models under a common framework and allows the errors introduced by the modeling process to be isolated and evaluated. Models for both planar and hierarchical gate placement are presented     

微型天线伺服系统保主导极点配置控制器设计

给出了一种微型天线伺服系统保主导极点配置PID控制器设计方法.首先,针对伺服系统的动态方框图模型,将其划分为电流环、速度环和位置环3个设计环节.然后,通过引入前置滤波器,根据主导极点配置PID控制器设计方法,设计了每个环节的控制器参数,使之满足期望的性能指标要求.仿真结果表明,所设计的伺服控制器能够保证系统对给定位置信...     

Structural Fault Based Specification Reduction for Testing Analog Circuits

Specification reduction can reduce test time, consequently, test cost. In this paper, a methodology to reduce specifications during specification testing for analog circuit is proposed and demonstrated. It starts with first deriving relationships between specifications and parameter variations of the circuit-under-test (CUT) and then reduces specifications by considering bounds of parameter variations. A statistical approach by taking into account of circuit fabrication process fluctuation is also employed and the result shows that the specification reduction depends on the testing confidence. A continuous-time state-variable benchmark filter circuit is applied with this methodology to demonstrate the effectiveness of the approach.     

Active bipolar transistor solid-state crosspoints

The new principle of an active crosspoint for telecommunications traffic exchanges is explained. Its basic difference concerns the application of device gain to obtain more favorable on-state specifications. The realization of this principle has resulted in a stable circuit which is insensitive to transients and temperature variations. This circuit also provides good off-state specifications and broad-band frequency performance. Finally, the concept is such that large-scale integration (LSI) by means of conventional bipolar technology allows the fabrication of large and low-cost crosspoint arrays.     

Variability aware SVM macromodel based design centering of analog circuits

Design centering is the term used for a procedure of obtaining enhanced parametric yield of a circuit despite the variations in device and design parameters. The process variability in nanometer regimes manifest into variations in these devices and design parameters. During design space exploration of analog circuits, a methodology to find design-instances with better yield is necessitated; this would ensure that the circuit will function as per specifications after fabrication, even with impact of statistical variations. We need to evaluate circuit performance for a given instance of a circuit-design identified by possessing a set of nominal values of device-design parameters. A lot of instances need be searched, having different sizes for a given circuit topology. HSPICE is very compute intensive. Instead, we employ macromodeling approach for analog circuits based on support vector machine (SVM), which enables efficient evaluation of performance of such circuits of different sizing during yield optimization loops. These performance macromodels are found to be as accurate as SPICE and at the same time, time-efficient for use in sizing of analog circuits with optimal yield. Process variability aware SVM macromodels are first trained and then used inside the Genetic algorithm loops for design centering of different circuits, subsequently resulting into sized-circuit instances having optimal yield. Post design centering, the sized circuits will be able to provide functions as per specifications upon fabrication. The application of this design centering approach as process variability analysis tool is illustrated on various circuits e.g. two stage op amp, voltage controlled oscillator and mixer circuit with layouts drawn into 90?nm UMC technology (Euro-practice).     

Analog circuit design optimization based on symbolic simulation andsimulated annealing

A methodology for the automatic design optimization of analog integrated circuits is presented. A non-fixed-topology approach is realized by combining the optimization program OPTIMAN with the symbolic simulator ISAAC. After selecting a circuit topology, the user invokes ISAAC to model the circuit. ISAAC generates both exact and simplified analytic expressions, describing the circuit's behavior. The model is then passed to the design optimization program OPTIMAN. This program is based on a generalized formulation of the analog design problem. For the selected topology, the independent design variables are automatically extracted and OPTIMAN sizes all elements to satisfy the performance constraints, thereby optimizing a user-defined design objective. The global optimization method used on the analytic circuit models is simulated annealing. Practical examples show that OPTIMAN quickly designs analog circuits, closely meeting the specifications, and that it is a flexible and reliable design and exploration tool     

Constraint transformation for IC physical design

In a top-down design methodology, design tasks are divided into simpler subtasks across levels of a hierarchy as an effective divide-and-conquer technique. For every task, tolerances are defined on all performance characteristics to take into account parasitics, mismatches, and other nondeterministic process parameter variations. Constraint transformation is a process used to translate performance specifications into subtask requirements. This paper introduces the problem of constraint transformation and describes some formal solutions for analog circuit applications. Examples illustrate the methodology and show the suitability of this approach in industrial-strength applications     

Optimizing Embedded Passive Content in Printed Circuit Boards

A genetic algorithm's optimization approach is used in conjunction with a size/cost model to study the optimum mix of passives (resistors and capacitors) to embed within a printed circuit board on an application-specific basis. Using the models and solution approach developed in this paper, the effect of board size on the optimum embedded passive solution (minimum cost solution) is studied, and an assessment of whether better system solutions can be found by varying or constraining the size of the board using several different criteria has been performed. Example optimization results for a GSM mobile phone are presented. The analysis has shown that the system size limitation when embedded passives are used is not only dependent on the quantity, type, and electrical properties (capacitance and resistance) of the embeddable components, but is also very sensitive to layout specifications and the placement of the nonembeddable parts.     

Built-in Self Test of RF Subsystems with Integrated Detectors

This paper describes a built-in self test technique for RF subsystems, using low-overhead on-chip detectors to calculate circuit specifications. A novel on-chip amplitude detector has been designed and optimized for RF circuit specification test. The detector has small area overhead with a low-frequency output. A test chip was fabricated in a commercial 0.18 μm CMOS process. By using on-chip detectors in a loopback setup, both the system performance and specifications of the individual components can be accurately measured. Measurements show accurate prediction of system and component specifications.     

NBTI degradation and its impact for analog circuit reliability

A methodology to quantify the degradation at circuit level due to negative bias temperature instability (NBTI) has been proposed in this work. Using this approach, a variety of analog/mixed-signal circuits are simulated, and their degradation is analyzed. It has been shown that the degradation in circuit performance is mainly dependent on the circuit configuration and its application rather than the absolute value of degradation at the device level. In circuits such as digital-to-analog converters, NBTI can pose a serious reliability concern, as even a small variation in bias currents can cause significant gain errors.     

A current based self-test methodology for RF front-end circuits

This paper presents a critical step in the realization of a robust, low overhead, current-based Built-In Self-Test (BIST) scheme for RF front-end circuits. The proposed approach involves sampling the high frequency supply current drawn by the circuit under test (CUT) and using it to extract information about various performance metrics of the RF CUT. The technique has inherently high fault coverage and can handle soft faults, hard faults as well as concurrent faults because it shifts the emphasis from detecting individual faults, to quantifying all the significant performance specifications of the CUT. This work also presents the realization of an HF current monitor which is a critical component in the proposed architecture. The current monitor has then been interfaced with three standard RF front-end circuits; a Low noise amplifier, a Single Balanced Mixer and a Voltage controlled oscillator, while minimally impacting their performance. The extracted information has then been used to create a mapping between variations in CUT performance and the sensed current spectrum. The monitor circuit has been fabricated in the IBM 6 metal, RF CMOS process, with a gain of 24 db and bandwidth of 3.9 GHz.     

Clock frequency and latency in synchronous digital systems

The tradeoffs in the design of synchronous digital systems between clock frequency and latency in terms of the circuit characteristics of a pipelined data path are described. A design paradigm relating latency and clock frequency as a function of the level of pipelining is developed for studying the performance of a synchronous system. This perspective permits the development of design equations for constrained and unconstrained design problems which describe these performance parameters in terms of the delays of the logic, interconnect, registers, clock skew, and the number of logic states. These results provide an approach to the design of those synchronous digital systems in which latency and clock frequency are of primary importance. From the behavioral specifications for the proposed system, the designer can use these results to select the best logic architecture and the best available device technology to determine if the performance specifications can be satisfied, and, if so, what design options are available for optimization of other system attributes, such as area     

Physics- and process-based bipolar transistor modeling forintegrated circuit design

Many applications require circuits to be operated close to the performance limits of current silicon (production) processes to meet the required circuit specifications for, e.g., high speed, low noise, and low power consumption. Therefore, the circuits must be carefully optimized by selecting the individual transistor configurations. As a consequence, model parameters for a large variety of configurations (100 or more) are often requested. Unfortunately, most present design tools and modeling methods do not support an efficient generation of the respective parameter sets for bipolar compact models. This paper describes an approach that is physics and process based; facilitates an extremely fast generation of consistent model parameter sets, even during the initial phase of process development; and reduces parameter extraction efforts significantly. This allows one to quickly explore various process options in advance and to align process development with circuit product requirements. The approach is supported by a computer-aided-design tool named TRADICA, which can be combined with circuit simulators allowing the emitter size and number of emitter, base, and collector contacts to be the only model parameters visible to designers. Related modeling and parameter extraction issues are also discussed because these areas are often unknown and tend to be underestimated by circuit designers and process developers but have a significant impact on the flexibility, capability, and accuracy of circuit design     

Aladin: A Layout Synthesys Tool for Analog Integrated Circuits

This paper presents a layout synthesis tool called ALADIN for analog integrated circuits. It is developed especially for analog circuit designers who can bring their special knowledge and experience into the synthesis process to create high quality layouts. The layout generation is based on relatively complex sub-circuits rather than non-optimal single devices. A flexible module generator environment is developed for designers to write and maintain technology and application independent module generators of sub-circuits. Based on the thorough study of simulated annealing and genetic algorithm applications in the analog module placement, a genetic placement approach with simulated annealing and a very fast simulated re-annealing placement approach have been developed. A two-stage placement technique is proposed. Analog module routing consists of two phases including global routing and detailed routing. The minimum-Steiner-tree based global routing can be integrated into the placement procedure to improve the routability of placement solutions. The compaction based constructive detailed routing finally realizes the layout of the whole circuit. This tool is integrated into commercial software with convenient interfaces provided. The benefit of ALADIN providing layouts comparable to expert manual ones is demonstrated with several circuits showing its competition compared to other existing tools.     

Automatic layout synthesis of analog ICs using circuit recognition and constraint analysis techniques

A systematic method for automatic layout synthesis of analog integrated circuit modules is presented. This method uses analog circuit recognition and critical net analysis techniques to derive proper layout constraints for analog circuit performance optimization. These layout constraints are analyzed and prioritized according to the recognized analog circuit topologies and classified net sensitivities. The weighted constraints are then used to drive the physical layout generation process to obtain a high-quality custom circuit layout. An efficient, constraint-driven analog floorplanning technique based on a zone-sensitivity partitioning algorithm is specially developed to generate a slicing floorplan incorporating the layout constraints. This layout synthesis approach has three key advantages. First, it can produce a satisfactory analog circuit performance with negligible degradation due to the layout-introduced parasitic effects. Second, it allows a complete automation for netlist-to-layout synthesis so that the layout tool can be used by VLSI system designers. Finally, this method is quite general and can be applied to handle a wide variety of analog circuits. Experimental results in CMOS operational amplifiers and a comparator are presented.     

Innovative circuit board level routing designs for BGA packages

Advances in the performance of electronic devices have resulted in high input/output counts both at the chip and the package level, which has led to the development of new packaging technologies that can accommodate these high counts. This paper presents and analyzes a novel method for the placement of ball grid array (BGA) bonding pads and routing wires on printed circuit boards to maximize signal density, which ultimately reduces the number of circuit board layers needed for routing. This method has been termed as the "balls shifted as needed" method and all the ball placement/trace routing designs shown in this paper are based on this method. We also present a performance metric defined as the number of balls routed out divided by the area of package footprint on the circuit board, and we compare various placement/routing schemes using this method.