IV–VI Compound heterostructures grown by molecular beam epitaxy

Structural and optical characterization of some IV–VI superlattices (SL) and multi-quantum wells (MQW) grown by molecular beam epitaxy (MBE) on BaF₂ (111) substrates are shown. Three different types of systems were investigated, namely, PbTe/PbSnTe, PbTe/SnTe and PbTe/PbEuTe. High-resolution X-ray diffraction analysis was performed to determine the strain in the structures. The analysis revealed sharp interfaces and good thickness control. The transition energies between the confined levels in the wells were obtained from the absorption steps observed in infrared transmission measurements. Preliminary results on PbTe/Si heterojunction grown by MBE are also presented.     

Si1 − x Ge x /Si heterostructures grown by molecular-beam epitaxy on silicon-on-sapphire substrates

The growth of heterostructures with Si_{1 ? x} Ge _x layers on $\left( {1\bar 102} \right)$ sapphire substrates by molecular-beam epitaxy with a silicon sublimation source and a germanium gas source (GeH₄) is reported. The systematic study of the influence of substrate temperature and thickness of the silicon buffer layer shows that the optimal conditions for growing epitaxial Si_{1 ? x} Ge _x layers are provided at a temperature of T _S = 375–400°C. There are significant differences in the orientations of Si_{1 ? x} Ge _x layers, depending on the thickness d of the Si buffer layer: the preferred orientations are (100) at d ≥ 100 nm and (110) for thinner layers. Heterostructures with thick (～1 μm) Si_{1 ? x} Ge _x layers, doped with erbium atoms, exhibit intense photoluminescence at λ = 1.54 μm.     

Defect reduction in Hg1−xCdxTe grown by molecular beam epitaxy on Cd0.96Zn0.04Te(211)B

A study on preparation of Cd_0.96Zn_0.04Te(211)B substrates for growth of Hg_1−xCd_xTe epitaxial layers by molecular beam epitaxy (MBE) was investigated. The objective was to investigate the impact of starting substrate surface quality on surface defects such as voids and hillocks commonly observed on MBE Hg_1−xCd_xTe layers. The results of this study indicate that, when the Cd_0.96Zn_0.04Te(211)B substrates are properly prepared, surface defects on the resulting MBE Hg_1−xCd_xTe films are reduced to minimum (size, ∼0.1 m and density ∼500/cm²) so that these MBE Hg_1−xCd_x Te films have surface quality as good as that of liquid phase epitaxial (LPE) Hg_1−xCd_xTe films currently in production in this laboratory.     

Room temperature oxidation of Cu3Ge and Cu3(Si1−xGex) on Si1−xGex

Room temperature oxidation of Cu₃(Si_1−xGe_x) and Cu₃Ge films grown on Si_1−xGe_x at a temperature of 200–400°C was studied using transmission electron microscopy (TEM) in conjunction with energy dispersive spectrometry (EDS). For Cu₃(Si_1−xGe_x) and Cu₃Ge films grown at 200°C and then exposed to air, room temperature oxidation occurred. The Cu₃Ge film was superior to the Cu₃(Si_1−xGe_x) film in reducing the oxidation rate because of its higher Ge concentration. Annealing at higher temperatures such as 400°C resulted in Ge segregation out of the Cu₃(Si_1−xGe_x) film or Si diffusion from the Si_1−xGe_x substrate into the Cu₃Ge overlayer, and hence enhanced the oxidation rate of Cu₃(Si_1−xGe_x) and Cu₃Ge films. The present study shows that upon exposure to air even the Cu₃Ge film grown on Si_1−xGe_x is subject to room-temperature oxidation, revealing that the use of Cu₃Ge contacts on Si_1−xGe_x may be limited by some strict conditions.     

β-Ga_2O_3 thin film grown on sapphire substrate by plasmaassisted molecular beam epitaxy

Monoclinic gallium oxide(Ga_2O_3) has been grown on(0001) sapphire(Al_2O_3) substrate by plasma-assisted molecular beam epitaxy(PA-MBE). The epitaxial relationship has been confirmed to be [010]( 2ˉ01) β-Ga_2O_3||[ 011ˉ0](0001)Al_2O_3 via in-situ reflection high energy electron diffraction(RHEED) monitoring and ex-situ X-ray diffraction(XRD) measurement. Crystalline quality is improved and surface becomes flatter with increasing growth temperature, with a best full width at half maximum(FWHM) of XRD ω-rocking curve of( 2ˉ01) plane and root mean square(RMS) roughness of 0.68° and 2.04 nm for the sample grown at 730 °C,respectively. Room temperature cathodoluminescence measurement shows an emission at ～417 nm, which is most likely originated from recombination of donor–acceptor pair(DAP).     

Structural and optical properties of GaxIn1−xP layers grown by chemical beam epitaxy

Chemical beam epitaxial (CBE) Ga_xIn_1?xP layers (x≈0.5) grown on (001) GaAs substrates at temperatures ranging from 490 to 580°C have been investigated using transmission electron diffraction (TED), transmission electron microscopy, and photoluminescence (PL). TED examination revealed the presence of diffuse scattering 1/2{111}_B positions, indicating the occurrence of typical CuPt-type ordering in the GaInP CBE layers. As the growth temperature decreased from 580 to 490°C, maxima in the intensity of the diffuse scattering moved from ½{111}_B to ½{?1+δ,1?δ,0} positions, where δ is a positive value. As the growth temperature increased from 490 to 550°C, the maxima in the diffuse scattering intensity progressively approached positions of $\frac{1}{2}\{\bar 110\} $ , i.e., the value of δ decreased from 0.25 to 0.17. Bandgap reduction (～45 meV) was observed in the CBE GaInP layers and was attributed to the presence of ordered structures.     

Evaluation of compositional intermixing at interfaces in Si(Ge)/Si1−x Gex heteroepitaxial structures grown by molecular beam epitaxy with combined sources of Si and GeH4

The main causes of the diffusion spreading of a solid-solution composition near the boundaries of the Si transport channel in a Si/Si_1?x Ge_x heterostructure grown by molecular-beam epitaxy combined with solid (Si) and gaseous (GeH₄) sources are considered. For the grown structures, the contributions from various mechanisms involved in forming the profile of the metallurgical boundary of the layer are compared and the effect of channel boundary spreading on the mobility of a two-dimensional electron gas in the channel is evaluated.     

Strain relaxation mechanisms in Si1−xGex layers grown by solid-phase epitaxy: Influence of the layer composition and growth temperature

The influence of the composition and growth temperature on the strain and defect structure of Si_1−xGe_x layers of 0.21≤x≤0.34 grown on (001) Si wafers by solid phase epitaxy is presented. The strain in the layers was measured by Raman spectroscopy and Rutherford backscattering spectrometry/channeling angular scans. The defects were analyzed using high resolution electron microscopy. Three different relaxation mechanisms have been identified and characterized. The first mechanism occurs at the layer-substrate interface of the samples by the introduction of isolated defects. It is found to be thermally activated with an activation energy of E_a=0.16 eV and a prefactor that depends on the Gecontent of the layer. This mechanism produces partial relaxation of the layers and hinders the growth of fully strained layers. The second relaxation mechanism emerges at a distance from the interface which depends on the stress in the crystallized portion of the layer. In this case, the strain relaxation is caused by stacking faults that nucleate when they are energetically feasible and propagate toward the surface of the sample during growth. At low growth temperatures, the defects are confined to the upper part of the epitaxial layers at a distance from the interface that agrees with the theoretical predictions based on the equilibrium critical layer thickness. The third relaxation mechanism is introduced at high growth temperature and is based on the gliding of the stacking faults toward the layer-substrate interface. As a result of this mechanism, the stress in the layers is reduced compared to the stress in the layers grown at lower temperatures and approaches the equilibrium value corresponding to the total layer thickness. This behavior indicates that the layers grown at low temperature, where the stacking faults are confined to the upper part, are to some extent metastable.     

Si1−xGex bulk single crystals for substrates of electronic devices

Si_1−xGe_x bulk crystals (0.2<x<0.85) with various B doping levels were grown by the traveling liquidus zone (TLZ) method for fabricating substrates of high mobility electronic devices. Large single crystals with a diameter ranging from 30 to 50 mm were achieved. Si_1−xGe_x crystals were characterized by measuring concentration profile along and perpendicular to the growth axis, indicating good compositional homogeneity. High crystalline quality was evaluated by electron backscatter spectroscopy and X-ray diffraction. Measured hole mobility was higher than the previously reported data for the similar dopant concentration and Ge content, suggesting smaller alloy scattering effects and high crystalline nature in the TLZ-grown Si_1−xGe_x bulk crystals.     

Growth and microstructure of InxGa1−xN films grown on SiC substrates via low pressure metalorganic vapor phase epitaxy

The growth and microstructures of In_xGa_1−xN films (x≤0.23) grown on α(6H)–SiC(0001) wafer/AIN buffer layer/GaN heterostructures by low pressure metalorganic vapor phase epitaxy have been investigated. The system deposition pressure limited the InN content in these films. The maximum InN contents achievable at the deposition pressures of 45 and 90 torr were ∼13 and ∼23%, respectively. Kinetic phenomena based on the rates of adsorption and desorption of the In growth species off the growth surface are presented to explain the film composition dependence on the system pressure. The surface morphologies and microstructures of the In_xGa_1−xN films were analyzed using several techniques, and the formation of pinhole defects in the films was investigated. Most of the pinhole defects were associated with threading dislocations with a c-component Burgers vector. Edge-type dislocations were never observed to terminate in pinholes in the samples observed here. Indium segregation to areas around the defect areas was observed, as was an In compositional gradient in the growth direction. Based on experimental observations, the strain field around dislocations with a c-component Burgers vector could result in the increase of In atoms at the dislocation sites in the film, which result in a change to the local growth mode of the film and causes the pinhole defects to form.     

Structural and optical properties of ZrB2 and HfxZr1−xB2 films grown by vicinal surface epitaxy on Si(1 1 1) substrates

ZrB₂ and Hf_xZr_1?xB₂ films were grown on 4° miscut Si(1 1 1) substrates by chemical vapor deposition of gaseous Hf(BH₄)₄ and Zr(BH₄)₄. The films display superior structural and optical properties when compared with ZrB₂ films grown on on-axis Si(1 1 1). The observed improvements include an optically featureless surface with rms roughness of ～2.5–3.5 nm, a ～50% reduction in the amount of residual strain, and a ～50% lower resistivity. These properties should promote the use of diboride films as buffer layers for nitride semiconductor epitaxy on large-area Si substrates.     

MOVPE grown Ga1−xInxAs solar cells for GaInP/GaInAs tandem applications

Lattice-mismatched Ga_1−xIn_xAs solar cells with an absorption edge between 900 and 1150 nm have been grown on GaAs substrates. Different graded Ga_1−xIn_xAs buffer layers and solar cell structures were evaluated to achieve a good electrical performance of the device. External quantum efficiencies comparable to our best GaAs solar cells were measured. The best 1 cm² cell with a bandgap energy of 1.18 eV has an efficiency of 22.6% at AM1.5g and a short circuit current density of 36.4 mA/cm². To our knowledge, this is the highest reported efficiency for a Ga_0.83In_0.17As solar cell.     

AlxGa1−xN/GaN/AlN heterostructures grown on Si(1 1 1) substrates by MBE for MSM UV photodetector applications

Al_xGa_1−xN/GaN/AlN heterostructures on silicon (Si) substrate was developed by nitrogen plasma-assisted molecular beam epitaxy (MBE) and their properties were investigated by scanning electron microscopy (SEM), electron dispersive X-ray (EDX), atomic force microscopy (AFM), high resolution X-ray diffraction (XRD), Raman spectroscopy and Hall effect measurements. High purity gallium (7N) and aluminum (6N5) were used in the Knudsen cells. High purity nitrogen with 7N purity was supplied to radio frequency (RF) source to generate reactive nitrogen species. The nitrogen pressure and a discharge power were kept at 1.5×10⁻⁵ Torr and 300 W, respectively. From SEM measurements, the surface morphology of samples presented 2- and 3-dimensional growth modes. The EDX measurements showed that there were no foreign elements in the grown samples. The HR-XRD measurement has confirmed that the Al_xGa_1−xN/GaN/AlN heterostructures samples were epitaxially grown on Si substrate. All the dominant E₂ phonon modes were found in Raman spectra results. Lastly, Al_xGa_1−xN/GaN/AlN heterostructures based metal–semiconductor–metal (MSM) UV photodetectors were fabricated and the electrical characteristics of the devices were investigated by using current–voltage (I–V) and photo-conductivity measurements. The devices presented good I–V and photoconductivity characteristics.     

Possibility of obtaining the (GaSb)1 − x (Si2) x films on silicon substrates by the method of liquid-phase epitaxy

Semiconductors - It is shown that it is possible to grow a continuous series of (GaSb)1 ? x (Si2) x (x = 0?1) alloys on silicon substrates by the method of liquid-phase epitaxy from a...     

Effects of mesa area and orientation on defects in strained InxGa1−xAs films grown by LPOMCVD

We have selectively grown In_xGa_1?xAs (0.04 <x < 0.20, 200 ? 7000Å) on rectangular growth areas (100 μm by 200 mil) patterned on GaAs substrates with very low etch pit densities (～200 cm^?2). The edge orientations of the growth areas were varied on the substrate resulting in distinct facet formation on the deposited mesa structures. Layers were grown using Low-Pressure Organometallic Chemical Vapor Deposition (LPOMCVD) and all samples were annealed for 1 hr at 700° C. Indium content and film thicknesses were very uniform across a wafer so that only the facet shape was varied. Observation of Crosshatch defect densities as a function of growth window orientation showed that 2900Å In_0.08Ga_0.92As mesas with [010] edge orientations exhibited no Crosshatch defects. Identical mesas grown in windows with other edge orientations exhibited varying crosshatch defect densities. Large unpatterned areas of growth were heavily crosshatched. This variation in Crosshatch defect density as a function of mesa orientation appears to be associated with non-area related dislocation nucleation mechanisms at the mesa edges. Proper choice of window orientation for patterned substrate epitaxy will allow the mesa facets to be controlled thereby reducing misfit dislocations in the heterostructure interface.     

Characterization of ternary MgxZn1−xO thin films deposited by electron beam evaporation

Mg_xZn_1−xO (0≤x≤1) thin films were deposited on glass and quartz substrates by electron beam evaporation and effect of the Mg content of the film on its structural, optical and electrical properties were investigated. The structure, surface morphology, optical transmittance, band gap, refractive index and electrical resistivity were found to depend on the Mg content of the film. XRD data revealed that films were polycrystalline in nature. The structure of the films having Mg content in the range of 1–0.74 was cubic, mixed cubic-hexagonal phases for x=0.47 and hexagonal phase for x=0. The composition analysis showed that Mg content in Mg_xZn_1−xO film is high as compared to the corresponding target alloy. It was observed that the optical band gap increases from 3.3 to 6.09 eV, refractive index at 550 nm decreases from 1.99 to 1.75, transmittance increases from about 70% to 90% and electrical resistivity increases from 0.5 to 1.48×10⁶ Ω cm with the increase of Mg concentration in the film from 0 to 1. The results reported in this work are useful for window layer of solar cells and other optoelectronic devices.     

Molecular beam epitaxy of ZnxBe1−xSe: Influence of the substrate nature and epilayer properties

We have studied the heteroepitaxial growth of Zn_xBe_1−xSe onto Si, GaAs and GaP substrates. By comparing the growth on these different substrates, we showed that lattice-matching is not a sufficient condition to achieve a good epitaxy. Then we have investigated by low-temperature photoluminescence and reflectivity spectroscopies a series of Zn_xBe_1−xSe alloys with Be content up to 70%. This allowed us to locate the direct-to-indirect band-gap cross over at x=0.46. We found a bowing parameter b=0.97 eV for the direct band-gap in the whole composition range. Finally, Zn_0.59Be_0.41Se and Zn_0.55Be_0.45Se alloys lattice-matched, respectively, to GaP and Si substrates are direct band-gap semiconductors which exhibit band-gap at 3.72 eV and 3.85 eV.     

Microwave properties and applications of Y–Ba–Cu–O thin films grown on various substrates

Microwave properties of YBa₂Cu₃O_7-δ (YBCO) films grown on (100) LaAlO₃ (LAO), (110) NdGaO₃ (NGO) and (001) SrLaAlO₄ (SLAO) substrates were studied in the form of a microstrip ring resonator at temperatures above 20 K. The YBCO resonator on a SLAO substrate showed microwave properties better than or comparable to other YBCO resonators on LAO substrates. For the YBCO resonators on LAO and SLAO substrates, both Q_U and f₀ appeared to decrease as the temperature was raised. Meanwhile the resonator on a NGO substrate showed different behaviors with Q_U showing a peak at ∼70 K, which are attributed to the unique temperature dependence of the loss tangent of the NGO substrate. An X-band oscillator with a YBCO ring resonator coupled to the circuit was prepared and its properties were investigated at low temperatures. The frequency of the oscillator signal appeared to change from 7.925 GHz at 30 K to 7.878 GHz at 77 K, which was mostly attributed to the change in f₀ of the YBCO ring resonator. The signal power appeared to be more than 4.5 mW at 30 K and 2.1 mW at 77 K, respectively. At 55 K, the frequency of the oscillator signal was 7.917 GHz with the 3 dB-linewidth of 450 Hz.     

Features of electron transport in relaxed Si/Si1 − x Ge x transistor heterostructures with a high doping level

The low-temperature electrical and magnetotransport characteristics of partially relaxed Si/Si_{1 ? x} Ge _x heterostructures with an electron conduction channel in an elastically strained nanoscale silicon layer are investigated. It is demonstrated that the electron gas in the system exhibits 2D properties. A dependence of the conductivity along layers in the system on the degree of elastic-stress relaxation in it is observed. To understand the observed regularities, the potential and the electron distribution over the structure layers are calculated in detail for samples with different layer strains and doping levels. For the structure with x = 0.25, the parameters of the potential barrier and characteristics of the quantum well formed in the Si layer are estimated. It is established that the characteristics of the potential formed near interfaces strongly depend on the initial parameters of the system, in particular, on the degree of the plastic relaxation of elastic stresses and on the doping level. The formation of a thin tunneling-transparent barrier near the upper interface can lead to the redistribution of electrons between the 2D and 3D conduction channels in the structure, which ensures the spread of the measured transport characteristics of the samples during the measurements. The interlayer tunneling transitions of carriers from the 2D state in the Si transport channel to the 3D state of the Si_{1 ? x} Ge _x crystal matrix, which are separated by a tunneling-transparent potential barrier near the heterointerface, were observed for the first time during transport in the direction transverse to the layer plane.     

Planar defects and double-domain epitaxy in epitaxial YSi<Subscript>2−x</Subscript> and ErSi<Subscript>2−x</Subscript> thin films on Si substrates

Interfacial reactions of Y and Er thin films on both (111)Si and (001)Si have been studied by transmission electron microscopy (TEM). Epitaxial rare-earth (RE) silicide films were grown on (111)Si. Planar defects, identified to be stacking faults on planes with 1/6 displacement vectors, were formed as a result of the coalescence of epitaxial silicide islands. Double-domain epitaxy was found to form in RE silicides on (001)Si samples resulting from a large lattice mismatch along one direction and symmetry conditions at the silicide/(001)Si interfaces. The orientation relationships are [0001]RESi_2−x// Si, RESi_2−x//(001)Si and [0001]RESi_2−x/ Si, RESi_2−x//(001)Si. The density of staking faults in (111) samples and the domain size in (001) samples were found to decrease and increase with annealing temperature, respectively.