基于闭合磁路的框式薄膜电感的研究

通过磁控溅射工艺制备出三种框式薄膜电感,其中特殊磁芯电感、全磁膜电感为设计制作的具有闭合磁性回路的特殊薄膜电感,而三文治结构电感是目前流行的薄膜电感,这些电感均由下层磁芯层、下层绝缘层(聚偏二氯乙烯,厚度约为40μm)、线圈和线圈中心的磁膜、上层绝缘层和上层磁芯层组成,其差别在于磁芯结构不同。在1~3 MHz频率范围内,比较了三种电感的等效电感、寄生电容和损耗因子。结果表明:与三文治结构电感和全磁膜电感相比,特殊磁芯电感有较高的等效电感量和较小的寄生电容,但损耗较后两者高。     

埋磁芯PCB高精度电感产品开发研究

随着电子产品日益系统化与集成化,将电感等无源器件埋入PCB的需求逐渐增加。文章提出了具有高可靠性和磁芯偏移量≤0.1 mm的磁芯埋入方案,解决了传统磁芯埋入易碎裂分层和偏移的问题。并通过精确计算进行绕线电感的设计,实现了电感精度达10%的环形磁芯PCB制作。此外还摸索出埋磁芯PCB电感饱和电流的检测方案,丰富了埋磁芯PCB的重要参数表征,从而为客户提供完善的产品解决方案。     

埋磁芯PCB产品研究开发

随着PCB行业发展步入系统封装(SOP)阶段,PCB无源器件隐埋技术也成当今研究的热点。我司的埋铜技术的研究已经较成熟,但是对于磁芯的埋入还没涉及过,而目前电源部分电感大都需要手工贴装,工作效率低,存在焊接焊点不良等风险,不利于产品设计小型、高密化,所以对在PCB中埋入磁芯的研究很有必要。在文章中,我们得出磁芯埋入的控制方法,使产品能够满足客户对电感的要求。     

含有非磁性气隙层叠层电感直流特性的研究

为了获得适合功率电感磁芯材料的磁导率及提升器件的直流特性,提出了在器件磁芯材料层中引入一定厚度的非磁性气隙层可有效调节磁芯材料的磁导率,以提升器件的直流偏置性能。设计仿真了尺寸为2.0mm×2.5mm×1.05mm,含有10匝线圈的叠层功率电感中引入非磁性气隙层的直流特性。研究了在磁芯中部引入5²0μm不同厚度气隙层的直流特性,结果表明直流电流从1.18A上升到2.34A;同时研究了引入不同层数及不同分布排列的气隙层的直流特性,表明气隙层数越多,分布在磁芯中越稀疏,可获得更好的直流性能。     

平面磁芯螺旋结构微电感的性能研究

采用MEMS技术(包括光刻、电镀、反应离子刻蚀和机械抛光等)研制了平面磁芯螺旋结构微电感,磁芯材料为铁基纳米晶带材。其中线圈匝数为18匝,线圈导体的宽度和间隙均为30μm,厚度为20μm;电感的尺寸为3mm×3mm。测试结果表明:在频率为1~10MHz时,电感量和品质因数分别为3.2~1.2μH和2.3~1.1;在1MHz下,电感量和品质因数分别为3.2μH和2.3,可应用于微型化DC/DC变换器。     

可调谐微机电电感(英文)

射频可调谐微电感在当前发挥着重要作用,它能满足高性能紧凑型器件设计的要求。对于器件设计者来说,可调电感能调谐电感量并能保证较高或适当的品质因素(Q值),这种能力在可调谐系统中比可调电容更有优势,因为可调电容可靠性较低并且大量占用基片面积。可调电感能节省芯片面积,它为将来便携式通讯系统所需的大范围可调谐系统提供一个优选的方案。因此,从器件角度对可调电感进行综述。根据可调电感的调谐机制,可调电感可分为四大类:离散型、金属屏蔽型、磁芯调谐型和线圈耦合型。对文献报道的可调电感进行概括,讨论这些可调电感优点和缺点,同时也介绍了这些可调电感的制备工艺、结果比较和其应用等。     

用于5～6GHz无线局域网的硅螺旋电感设计

提出一种设计和优化电感版图结构的方法.采用低电阻系数硅衬底和0.18μm Cu/SiO2互连工艺技术,设计出一组工作在5.7GHz的电感,同时优化了版图结构,例如内部磁芯大小、线圈宽度、线圈间距(0.2～11nH)等.与使用原有设计方法测出的电感的Q值相比,经过优化的5.7GHz电感的Q值可改进到5～8.     

印制电路板集成螺线管型磁芯电感的制作

为了满足未来移动设备对电路系统高性能、微型化的需求,研究了集成式电压调节器中使用的集成式磁芯电感的制作问题。将磁性粉末与环氧树脂混合制备复合磁性材料作为集成式磁芯电感的磁芯材料,通过丝网印刷工艺沉积磁芯层,采用先进印制电路板制作工艺制备出高感值密度、高品质因子的集成式螺线管型磁芯电感。该集成式螺线管型磁芯电感基于垂直实心铜柱互联形成绕组,展现出优异的性能。并经过一系列的表征证明了其制作工艺的可靠性与创新性,非常适用于板级封装的电源管理模块。最终对其电感性能进行测量,在100 MHz时其单位面积电感密度达到7.35 nH/mm²,品质因子Q达到42.7。     

一种新型磁芯螺线管微电感的设计与优化

利用HFSS仿真软件对一种基于电感耦合的新型磁芯螺线管微电感进行设计,并优化得出其结构参数,该电感尺寸为7 mm×6.6 mm×0.44 mm。利用Agilent E4294A射频阻抗/材料分析仪对微机电系统(MEMS)工艺实现的该新型螺线管微电感进行了性能测试分析。测试结果表明：该电感在1 MHz~20 MHz频率范围内保持较高的电感值和品质因数Q,测试结果与仿真结果较好的吻合,电感值是相同几何结构参数下空心电感的16倍以上,在10 MHz频率时,微电感的电感值为1.17μH,Q值达到50。     

不同磁芯材料在微电感中的应用

叙述了坡莫合金,铁氧体和非晶、纳米晶软磁等材料用作微电感磁芯的磁性材料的特性及其对微电感性能的影响,如电感量和Q值.并介绍了螺线管型微电感的制作工艺过程.     

纳米晶磁芯螺线管微电感的模拟研究

为了研制小尺寸、高性能的片上微电感,采用Fe基非晶薄带经退火得到的纳米晶带材作为磁芯材料,并对其高频磁导率进行了测试。对纳米晶磁芯螺线管微电感建立了物理模型,模拟分析了结构参数对微电感性能的影响。结果表明:在1~10MHz频率范围内,所设计的微电感的电感量L在2~12μH,品质因数Q值在1.3~2.3,非常适用于DC-DC变换器等功率电子器件。     

The partial silicon-on-insulator technology for RF power LDMOSFET devices and on-chip microinductors

A new partial silicon-on-insulator (SOI) formation technology and the associated RF LDMOSFET device structure on a silicon bulk substrate are proposed in this paper. The same technology can also be applied to enhance the quality factor of the integrated on-chip microinductors. The proposed technology is able to reduce both drain/substrate parasitics and leakage current for devices fabricated on bulk substrates. At the same time, the approach overcomes the thermal problem encountered by devices fabricated on full-SOI substrates. To demonstrate the technology, both partial-SOI LDMOSFET and microinductor devices were fabricated on a bulk wafer with their RF performance verified by laboratory measurements.     

可调谐微机电电感(续)(英文)

<正>3 Magnetic Core Tuned Inductor Magnetic core tuned inductor is tuned based on the magneto impedance effect[32].As the bias DC magnetic field is applied along to the axis of the inductor body,the transverse permeability of the soft magnetic layer can be changed to achieve the tunability of the inductance.In order to design tunable microinductors for microwave communication systems,such as the frequency range over 1 GHz,     

Printed microinductors on flexible substrates for power applications

A low-profile microinductor was fabricated on a copper-clad polyimide substrate where the current carrying coils were patterned from the existing metallization layer and the magnetic core was printed using a magnetic ceramic-polymer composite material. Highly loaded ferrite-polymer composite materials were formulated, yielding adherent films with 4/spl pi/M/sub s//spl ap/3900 G at +5000 Oe applied DC field. These composite magnetic films combine many of the superior properties of high temperature ceramic magnetic materials with the inherent processibility of polymer thick films. Processing temperatures for the printed films were between 100/spl deg/C and 130/spl deg/C, facilitating integration with a wide range of substrates and components. The quality factor of the microinductor was found to peak at Q=18.5 near 10 MHz, within the optimal frequency range for power applications. A flat, nearly frequency independent inductance of 1.33 /spl mu/H was measured throughout this frequency range for a 5 mm/spl times/5 mm component, with a DC resistance of 2.6 /spl Omega/ and a resonant frequency of 124 MHz. The combination of printed ceramic composites with organic/polymer substrates enables new methods for embedding passive components and ultimately the integration of high Q inductors with standard integrated circuits for low profile power electronics.     

A Copper/Polyimide Fabrication Process for Fabricating High-Inductance Microinductor

This paper reports on a technological process that combines copper as conductor, permalloy as magnetic core material, and polyimide as insulation material to complete a microinductor on glass with high inductance. The shape of the magnetic core scheme was rectangular, of which the width of the long side and short side were 1.4 and 0.6 mm, respectively. The dimensions of the inductor are 3.86 mm times 3.94 mm times 90 mum with coil width of 20 mum and space of 35 mum. The results show that the maximum inductance is 4 muH at 1 MHz, and the maximum quality factor (Q-factor) is 1.5 at 2 MHz.     

MEMS磁芯螺线管微电感的制作工艺研究

采用微机电系统(MEMS)技术制作了磁芯螺线管微电感,该技术包括UV-LIGA、干法刻蚀技术、抛光和电镀技术等。研制的微电感大小为1500μm×900μm×100μm,线圈匝数为41匝,宽度为20μm,线圈之间的间隙为20μm,高深宽比为5∶1。测试结果表明:在1～10MHz频率下,其电感量为0.408～0.326μH,Q值为1.6～4.2。     

Packaging-compatible high Q microinductors and microfilters forwireless applications

To meet requirements in mobile communication and microwave integrated circuits, miniaturization of the inductive components that many of these systems require is of key importance. At present, active circuitry is used which simulates inductor performance and which has high Q-factor and inductance; however, such circuitry has higher power consumption and higher potential for noise injection than passive inductive components. An alternate approach is to fabricate integrated inductors, in which lithographic techniques are used to pattern an inductor directly on a substrate or a chip. However, integrated inductors can suffer from low Q-factor and high parasitic effects due to substrate proximity. To expand the range of applicability of integrated microinductors at high frequency, their electrical characteristics, especially quality factor, should be improved. In this work, integrated spiral microinductors suspended (approximately 60 μm) above the substrate using surface micromachining techniques to reduce the undesirable effect of substrate proximity on the inductor performance are investigated. The fabricated inductors have inductances ranging from 15-40 nH and Q-factors ranging from 40-50 at frequencies of 0.9-2.5 GHz. Microfilters based on these inductors are also investigated by combining these inductors with integrated polymer filled composite capacitors     

具有核/壳结构的纳米复合高频软磁材料

具有核/壳结构的复合纳米材料兼有外壳层和内核材料的性能,由于其结构和组成能够在nm尺度上进行设计和剪裁,因而具有许多独特的光、电、磁、催化等物理与化学性质。简要介绍了实验室在过渡金属纳米复合高频软磁材料研究方面的最新进展,内容包括:绝缘壳层(如SiO2、Al2O3、C-SiO2等)复合材料,能显著改善过渡金属纳米颗粒的热温度性,有效防止氧化和团聚,具有饱和磁化强度高、高频软磁性能优异的特点;半导体壳层(如ZnO)复合材料,研究了材料的光致发光性能,观测到在ZnO材料中较少出现的700nm发光峰;螺旋碳纳米管与Fe组成的复合材料,实验结果表明该复合材料具有良好的高频吸波性能,有望成为新一代轻质高频吸波材料。