脉中电流对2091铝锂合金动态再结晶动力学的影响

研究了脉冲电流对2091铝锂合金超塑变形中动态再结晶及动力学的影响结果表明,脉冲电流加速动态再结晶,减小形核时的平均晶粒直径.脉冲电流能加快位错墙的形成并使其角度增大,使再结晶形核率提高.脉冲电流加快位错在晶界上的攀移及消失、减小形核界面两边的能量差,降低形核界面的迁移速率及再结晶形核的长大速率分析了脉冲电流作用下的动态再结晶动力学行为     

高密度脉冲电流对服役后期高锰钢辙叉组织结构的影响

用高密度脉冲电流对服役后期的高锰钢辙叉进行表面处理,研究了对其组织结构的影响。结果表明,在较低的温度下（786 K）辙叉发生再结晶,再结晶晶粒尺寸约为29.3μm,远比处理前的晶粒尺寸小,处理后的显微硬度显著降低。在高密度脉冲电流作用下,位错运动能力、原子的扩散能力以及振动频率都提高了,从而使再结晶的形核速率显著提高,...     

脉冲电流对疲劳后30CrMnSiA钢组织结构的影响

对在应力控制下预疲劳卸载的热轧态30CrMnSiA钢样品进行高密度脉冲电流处理后，得到了细小均匀的等轴晶组织，晶粒尺寸远小于热轧样品的晶粒尺寸．处理后样品的疲劳寿命显著提高．高密度脉冲电流使疲劳形成的位错产生运动，当刃型位错的距离达到临界距离时，位错发生湮灭，使局部的位错密度梯度增大，在位错密度低的地方发生再结晶形核，使钢发生再结晶．     

TB17钛合金β相区动态再结晶行为及转变机理EI北大核心CSCD

通过Gleeble-3800热压缩模拟试验机对TB17钛合金β相区进行热压缩实验,研究该合金β相区的动态再结晶行为及转变机理。结果表明:TB17钛合金在β相区变形时会发生动态回复(DRV)与动态再结晶(DRX)。不同应变速率下存在两种动态再结晶形核位置,低应变速率下主要在晶粒内部形核,高应变速率下主要在晶界附近形核。通过EBSD和TEM分析可知,在低应变速率下发生连续动态再结晶(CDRX),其发生的主要形式为亚晶合并转动。高应变速率下发生不连续动态再结晶(DDRX),发生的主要形式为晶界剪切伴随着亚晶转动。尽管两种动态再结晶的转变方式不同,其本质都是通过位错的增殖、滑移和胞状结构演化形成新的动态再结晶晶粒。     

Ti-6Al-4V合金热压缩过程中的动态再结晶

在变形温度为870~960℃、应变速率为5×10^-4 s^-1~5×10^-2 s^-1的条件下对Ti-6Al-4V合金进行单道次等温压缩实验,测出其应力-应变曲线并建立KM模型、Poliak-Jonas模型和Avrami模型,较为系统地描述了这种合金动态再结晶过程中的流变应力、临界应变量、组织演变动力学等的特征。将动态再结晶组织的转变体积分数引入Prasad功率耗散率模型,得到了Ti-6Al-4V合金动态再结晶过程中能量的变化规律并结合微观组织表征揭示了这种合金的动态再结晶机理。结果表明：随着变形温度的提高和应变速率的降低,Ti-6Al-4V合金的动态再结晶临界应变量减小,组织转变的体积分数增大。发生完全动态再结晶时的功率耗散率大于0.34,形核机制为位错诱导的弓出形核机制。     

亚动态再结晶的软化及临界晶核尺寸

根据形核热力学理论,分析了亚动态再结晶形核的热力学过程,导出亚动态再结晶的临界形核尺寸和形核功均小于动态再结晶的临界形核尺寸和形核功的结论。在变形温度1100℃和变形速率5×10~(-2)s~(-1)条件下对 Cr25Ti 铁素体钢进行双道次热模拟试验,试验验证了上述结论。由于动态再结晶组织中尺寸为 n~*′≤n相似文献   

搅拌摩擦加工制备MWCNTs／Al复合材料显微结构及硬度

采用搅拌摩擦加工技术（FSP）制备多壁碳纳米管增强铝基（MWCNTs／A1）复合材料,并对该复合材料的显微结构和硬度进行分析。结果表明：MWCNTs／Al复合材料显微结构为细小的等轴晶,晶粒大小不均匀;MWCNTs与Al基体界面结合良好,界面处分布大量的位错,MWCNTs主要分布在晶内;动态再结晶形核方式为亚晶形核,在...     

脉冲电流对冷加工黄铜的组织及性能的影响

研究了脉冲电流对一种冷加工黄铜再结晶组织和力学性能的影响，结果表明，利用脉冲电流作为形变黄铜的再结晶处理手段，可以得到比常规退火处理更细更均匀的再结晶晶粒，从而使该材料的综合力学性能提高，脉冲电流作用时间短，加热速度快、促进再结晶形核和抑制随后晶粒长大是得到细晶粒的原因。     

纳米尺度圆孔表面薄膜界面失配位错形核机理

研究了无限大基体内纳米尺度圆孔表面薄膜中界面螺型位错形核的临界条件,薄膜考虑了表/界面效应。运用弹性复势方法,获得了两个区域应力场的解析解答,并导出位错形核能公式,由此讨论了表/界面效应对薄膜界面位错形核的影响规律。算例结果表明,表/界面效应在纳米尺度下对位错形核的影响显著,不同表/界面效应下位错形核的临界薄膜厚度有很大差异,当基体与薄膜的相对剪切模量超过某一值后,只有考虑负的表/界面应力时位错才有可能形核;薄膜厚度在小于某一临界尺寸时负的表/界面应力更容易位错形核,薄膜厚度大于某一临界尺寸时正的表/界面应力更容易位错形核。     

高密度脉冲电流处理后冷轧H59黄铜的超细晶结构

将H59双相多晶黄铜冷轧变形后,进行高密度脉冲电流处理.在透射电镜下观察发现,α β'双相粗晶组织均已发生超细晶化转变,而且在α相晶粒中伴有大量的孪晶.经过预应变处理后,α相在脉冲电流作用下发生再结晶细化,并在随后的α→β相变中进一步发生相变细化;β'相在预应变处理后发生再结晶细化.再结晶细化的原因是,预应变处理使晶体中产生大量的缺陷,极大的增加了形核率,而脉冲电流作用时间短,加热速度快,使晶核长大不充分;相变细化的原因是,高密度脉冲电流改变了相变势垒,促进了高电导率相的形核并抑制其长大.     

A Model of Dynamic Recrystallization in Alloys during High Strain Plastic Deformation

1.IntroductionVerysmallrecrystallizedgrainswereobservedintheadiabaticshearbandsinmetalswhentheywereheavilydeformedathighstrainrates,whichwerezonesofhighlylocalizedplasticdeformation[1~5].Pak[1]foundthatshearbandsinacommerciallypuretitaniumwereconsistedofsmallgrainsof5o~3Oonmindiameterwithwell-definedboundaries.Chokshi[2],And.ade[3jandHinesI4Jalsoobservedtherecrystal-lizedgrainswith1oO~2Oonmdiameterswithintheshearbandsofcopper.Cho151showedthattherewereequiaxedcellswiththesizesof2oo~5oonminth…     

Ni-Al系金属间化合物超塑性的研究进展

在一定组织形态和外界条件下,单相或多相的镍铝金属间化合物及其合金表现出超塑性变形行为,其中多相挤压态NiAl合金及单相NisAl合金的超塑性变形机制是晶界滑移(动态回复和再结晶协调变形);单相NiAl的超塑性变形则来自于变形过程中发生动态回复和再结晶;而定向凝固多相NiAl合金的超塑性则是在拉伸过程中动态再结晶与应变硬化平衡的结果.超塑性变形机制多样性源于镍铝金属间化合物晶体结构独特的物理性质.     

新型Al-Zn-Mg-Cu合金热变形组织演化

采用Gleeble-1500D热力模拟试验机研究新型Al-Zn-Mg-Cu高强铝合金在变形温度为300~450℃,应变速率为0.001~10s~(-1)条件下的热变形组织演化。利用光学显微镜(OM)和透射电子显微镜(TEM)观察合金不同热变形条件下的组织形貌特征。结果表明:随着变形温度的升高和应变速率的减小,位错密度减小,亚晶粒尺寸增大;合金热压缩变形过程中主要的软化机制为动态回复和动态再结晶。变形温度为300~400℃时,主要发生动态回复;变形温度为450℃,应变速率为0.001~10s~(-1)时,软化机制以动态再结晶为主,存在晶界弓出、亚晶长大、亚晶合并3种再结晶形核机制。     

40CrNiMoA钢超塑流变初期形变诱发连续再结晶过程的研究

用 TEM 研究了40CrNiMoA 钢超塑变形初期的动态回复、动态再结晶过程,结果发现:随应变量的增加,多边化形成的小角度亚晶界不断吸收晶格位错而逐渐转变为大角度晶界,为晶界滑动提供了条件.     

On interfacial velocities during abnormal grain growth at ultra-high driving forces

Interfacial velocities during grain growth studies of nanocrystalline materials have been investigated. Two types of interfacial velocity parameters were developed in Ni and Ni–Co alloys. The first was a transformation-averaged parameter based on the time to consume the nanocrystalline matrix by abnormal grain growth. The second was a time-averaged parameter based on the rate of size increase of the largest growing grains. Despite the ultra-high driving force and rapid loss of nanostructure during annealing, the averaged grain boundary velocities are considerably lower than reported velocities during recrystallization in high purity systems for the same homologous temperature. It was found that the time-averaged abnormal growth front velocity decreased with increasing migration distance, which was interpreted in terms of a dynamic sulfur segregation model.     

Effect of Electropulsing on Recrystallization and Mechanical Properties of Silicon Steel Strips

Electropulsing-induced recrystallization and its effect on mechanical properties of oriented silicon steel strips (Fe-3.0%Si) were studied by optical microscopy, scanning electron microscopy and electron back-scatter diffraction. The results indicated that electropulsing accelerated recrystallization, and decreased the temperature of recrystallization. Electropulsing favors refinement of the grain structure of the alloy. Effects of electropulsing on strength and elongation of the alloy were discussed from the point view of dislocation dynamics, microstructural changes, and electropulsing kinetics.     

Microstructure evolution and deformation features of AZ31 Mg-alloy during creep

By means of the measurement of the creep curve and the observation of SEM and transmission electron microscope (TEM), an investigation has been made into the microstructure evolution and deformation features of AZ31 Mg-alloy during high temperature creep. Results show that the deformation features of the alloy in the primary stage of creep are that significant amount of dislocation slips are activated on basal and non-basal planes, then these ones are concentrated into the dislocation cells or walls as creep goes on. At the same time, twinning occurs as an additional deformation mechanism in the role of the compatibility stress. During steady state creep, the dislocation cells are transformed into the subgrains, then, the protrusion and coalition of the sub-boundaries results in the occurrence of dynamic recovery (DRV). After the dynamic recrystallization (DRX), the multiple slips in the grain interiors are considered to be the main deformed mechanism in the later stage of the steady state creep. An obvious feature of creep entering the tertiary stage is that the cracks appear on the locations of the triple junction. As creep continues, the cracks are viscous expanded along the grain boundaries; this is taken for being the fracture mechanism of the alloy crept to failure. The multiple slips in the grain interiors and the cracks expanded viscous along the grain boundary occur in whole of specimens, that, together with the twins and dynamic recrystallization, is responsible for the rapid increase of the strain rate in the later stage during creep.     

INFLUENCE OF TWO-PHASE REGION ROLLING ON TRANSFORMATION AND RECRYSTALLIZATION BEHAVIOUR OF FERRITE IN COPPER-CONTAINING HSLA STEEL

Hot deformation of copper-containing microalloyed steels in the two-phase region was carried out to study the effect of copper on transformation and recrystallization behaviour of ferrite in HSLA steels. it was found that presence of copper could decrease the austenite to ferrite transformation temperature. The precipitation of epsilon-copper in ferrite could retard recovery and recrystallization by dislocation and grain boundary pinning in deformed ferrite. Retardation of transformation and ferrite recrystallization resulted in a less mixed structure consisting of fine transformed and recrystallized ferrite in the copper-containing steels.