大掺量矿渣复合胶凝材料的硬化浆体形貌特征

通过扫描电镜观察了大掺量矿渣复合胶凝材料在不同水化龄期的硬化浆体形貌,并与水泥硬化浆体形貌进行对比,研究了矿渣在复合胶凝材料中的水化性能与硬化浆体形貌特征的关系.结果显示:大掺量矿渣复合胶凝材料水化早期的浆体结构比水泥浆体结构疏松,28天的浆体结构比水泥浆体结构致密.水化早期,矿渣颗粒被水泥水化产物包裹,与水泥浆体界面薄弱;水化后期,矿渣颗粒的水化产物与水泥水化产物紧密结合,颗粒与水泥浆体的界面牢固.     

水泥-矿渣复合胶凝材料的水化C-S-H凝胶的长龄期特征

研究了掺50%矿渣的水泥-矿渣复合胶凝材料3 a龄期的硬化浆体C-S-H凝胶特性,结果显示:3 a龄期时矿渣反应程度为68.3%,大部分小颗粒矿渣已反应,但许多大颗粒矿渣几乎未反应;长龄期时浆体中Ca(OH)2没有消耗殆尽,从SEM图像中可以发现Ca(OH)2大量存在;水泥-矿渣复合胶凝材料体系3 a龄期的C-S-H凝胶的Ca/Si比、(Al+Mg)/Si比均值分别为1.88和0.60,相较于水泥生成的C-S-H凝胶,水泥-矿渣复合胶凝体系的C-S-H凝胶Ca/Si比较低,且含有大量Al。但Ca/Si比明显高于水泥-粉煤灰复合胶凝材料生成的C-S-H凝胶。     

大掺量粉煤灰混凝土长龄期的微观结构

对深圳平安金融中心2年龄期大掺量粉煤灰混凝土基础底板钻芯取样试件进行了强度、渗透性、碳化深度测试,并通过扫描电镜观察了试件中硬化浆体的微观结构。结果显示:大掺量粉煤灰混凝土长龄期力学性能和耐久性能优异;复合胶凝材料硬化浆体密实,骨料与浆体之间结合紧密;粉煤灰反应程度较高,体系中Ca(OH)2含量较低,硬化浆体中生成大量低Ca/Si的C-S-H凝胶。     

养护高温对复合胶凝材料水化性能的影响

养护温度对胶凝材料的水化速度和硬化浆体结构有重大影响。本文重点对比研究在常温（20℃）以及高温（65℃）下养护的不同组成的胶凝材料水化性能和硬化浆体的显微结构。原材料采用北京兴发水泥有限公司生产的混凝土外加剂性能检测用基准水泥与内蒙古元宝山一级粉煤灰。试验组C为纯水泥净浆试样，F1为粉煤灰掺量为25％的净浆试样，水胶比（w／b）均采用0.4。     

超细矿渣对低品质水泥性能的改善效果

在低品质水泥中掺15%或25%超细矿渣组成复合胶凝材料,将用该复合胶凝材料配制的混凝土与用普通水泥配制的混凝土进行性能对比研究。结果显示:超细矿渣能够明显改善低品质水泥的性能,且超细矿渣掺量越大,性能改善效果越明显;用复合胶凝材料配制的混凝土的强度、抗氯离子渗透性和抗碳化性能达到或超过用普通水泥配制的混凝土。掺超细矿渣的复合胶凝体系硬化浆体的后期微结构非常致密,超细矿渣所起的化学作用明显。     

矿渣对复合胶凝材料硬化浆体微观结构的影响

利用XRD和SEM对掺矿渣复合胶凝材料硬化浆体微观结构进行了研究,结果显示:矿渣的掺入使胶凝材料中水泥的质量分数下降,矿渣反应消耗部分Ca(OH)2,导致硬化浆体中Ca(OH)2的含量降低,2 a龄期时掺70%矿渣样品中仍有Ca(OH)2存在。矿渣掺入后,硬化浆体的早期微观结构会较为疏松,随着养护龄期的延长,大量低Ca/Si的C-S-H凝胶生成,使复合胶凝材料硬化浆体逐渐致密,且凝胶中含Al较多。     

粗石灰石粉对水泥后期水化和硬化浆体微结构的影响

本文研究了粗石灰石粉掺量对水泥后期水化和硬化浆体微结构的影响规律。研究结果表明:当粗石灰石粉的掺量为8%时,对净浆、砂浆、混凝土的90 d抗压强度的影响均非常小;当粗石灰石粉掺量为15%或20%时,对净浆、砂浆、混凝土的90 d抗压强度的不利影响均较大;粗石灰石粉对水泥的水化有一定的促进作用,但粗石灰石粉参与化学反应的程度很低;总体上粗石灰石粉对硬化浆体微结构的不利影响大于积极影响,且其掺量越大,该现象越明显。     

影响C120超高性能混凝土性能的配比分析与泵送应用

为了使超高性能混凝土能够适应现场施工及泵送要求,文章设计配制了6组超高性能混凝土并进行试验研究,分析了水胶比、钢纤维掺量及粉煤灰对超高性能混凝土性能的影响并对泵送提出建议。结果表明,随着水胶比的降低和钢纤维掺量的增加,混凝土和易性减小,强度增加,粉煤灰的掺入可以明显改善和易性,并且可以提高后期强度。在施工中,宜使用高压砼泵及泵管,采用减少泵管线路的长度及转弯等措施。     

复合胶凝材料水化过程的ESEM观察

利用环境扫描电镜(ESEM)和X射线衍射分析(XRD)研究了由硅酸盐水泥、粉煤灰和膨胀剂组成的复合胶凝材料的水化产物形貌和硬化浆体结构。复合胶凝材料水化初期有过渡产物钾石膏片状晶体生成,CSH凝胶为约1μm长的晶须,而钙矾石则以六方片状晶核形式存在。在粉煤灰颗粒表面有通过溶解-结晶机制生成的水化产物。在水化后期,CSH成为无特征形貌的致密浆体,其中分布有充分发育的棒状钙矾石晶体。粉煤灰颗粒由表面生成的水化产物与周围的浆体紧密结合成为一个整体。     

矿渣砂对混凝土抗压强度和劈裂抗拉强度的影响差异

使用活性低的矿渣作为细骨料配制矿渣砂混凝土,将该混凝土与使用普通河砂的混凝土进行强度实验对比,并通过扫描电子显微镜观察混凝土硬化浆体中矿渣砂和普通河砂的微观形貌,研究了矿渣砂作为细骨料使用时对混凝土强度的影响。结果显示：无论是在标准养护条件还是高温蒸养条件下,矿渣砂混凝土各个龄期的抗压强度都略低于普通河砂混凝土,但是两者的劈裂抗拉强度相差不大,矿渣砂混凝土后期的劈裂抗拉强度甚至超过普通砂混凝土。部分矿渣砂的表面发生了水化反应,其水化产物与水泥的水化产物相互搭接,对混凝土的劈裂抗拉强度有一定的贡献。     

粉煤灰对复合胶凝材料硬化浆体微结构的影响

利用XRD和SEM-EDS对复合胶凝材料硬化浆体微结构进行了研究.结果显示:粉煤灰的掺入使胶凝材料中水泥的比例下降,导致硬化浆体中Ca(OH)2的含量降低,360 d龄期时各样品中仍有Ca(OH)2存在.粉煤灰掺入后,硬化浆体的早期微观结构会较为疏松,随着养护龄期的延长,大量低Ca/Si的C-S-H凝胶生成,使复合胶凝...     

蒸养条件下水泥-磷渣复合胶凝材料的水化产物的长龄期特征

本文通过X射线衍射仪(XRD)、同步热分析仪、扫描电子显微镜(SEM)及能谱仪(EDS)研究了蒸养条件下水泥-磷渣复合胶凝材料一年龄期的水化产物的特征.结果表明:含磷渣的复合胶凝材料并未产生不同于水泥的晶态水化产物,但促进了钙矾石(AFt)向单硫型水化硫铝酸钙(AFm)的转化;1年龄期时,经80℃蒸养的水泥-磷渣复合胶凝材料的硬化浆体中仍能明显观察到未反应的磷渣颗粒;磷渣的火山灰反应消耗了一部分Ca(OH)2,磷渣颗粒与周围结构中的Ca(OH)2及C-S-H凝胶粘结紧密;水泥-磷渣复合胶凝材料水化产生的C-S-H凝胶的Ca/Si比低于纯水泥水化产生的C-S-H凝胶.     

Joint shape, microstructure, and shear strength of lead-free solder joints with different component terminations

The joint shape, microstructure, and shear strength of 95Sn5Sb solder joints with components with different terminal metallizations (AgPd and Ni/AgPd) were investigated and compared to 62Sn36Pb2Ag solder. The rapid reaction between SnSb solder and AgPd leads to the solder not spreading entirely on the Cu pad but agglomerating on the component termination. The shear strength of the SnSb/AgPd solder joint is very low and fracture occurs at the original interface of the AgPd/ceramic. The Ni layer in the SnSb/Ni/AgPd joint effectively avoids interdiffusion between the AgPd and the solder so that a high-strength solder joint with an ideal shape is achieved. However, the terminations of the components have little effect on the shape and the shear strength of the SnPbAg solder joint. Fracture occurs in the SnPbAg solder after shear testing to failure.     

激光烧蚀坑阵列微结构对7075-T6粘接强度的影响

为了研究脉冲能量和烧蚀坑重叠率对7075-T6铝基板粘接强度影响, 采用纳秒光纤脉冲激光在粘接区域加工烧蚀坑阵列微结构, 通过表面形貌、剪切强度和断裂模式等实验参量对粘接效果进行了分析。结果表明, 脉冲能量对表面形貌、剪切强度及断裂模式几乎无影响; 随着烧蚀坑重叠率的增加, 表面粗糙度先增加后减小, 表面面积增加比一直增加; 与原始材料相比, 激光处理后剪切强度至少提升150%;当烧蚀坑重叠率为30%时, 粘接区域发生内聚断裂的面积最大, 剪切强度提升最明显; 脉冲能量为880μJ、烧蚀坑重叠率为30%时, 剪切强度为27.76MPa, 提升最大。该研究对激光烧蚀提高7075-T6粘接强度是有帮助的。     

长龄期尾矿/矿渣复合碱激发胶凝材料的典型微观形貌

采用扫描电镜观察了由煅烧铝土矿选尾矿(含约25%粉煤灰)、矿渣制备的复合碱胶凝材料在6年龄期内的微观形貌变化,并研究了6年龄期试样中结晶体沉积、粉煤灰颗粒形态等典型形貌特征.结果表明,该胶凝材料具有常见的多孔凝胶典型形貌,且随着龄期的延长而逐渐致密;6年龄期试样因碳化而明显可见碳酸钙晶体沉积于数百微米的大孔和大颗粒粉煤灰空腔中,并观察到高活性的粉煤灰玻璃微珠因碱侵蚀而形成的壳层、被凝胶包裹的低活性多孔玻璃质粉煤灰颗粒及惰性富铁粉煤灰微珠.     

镁合金厚板激光焊缝组织及抗拉强度研究

为了提高镁合金激光焊接认识程度,采用高功率CO2激光焊接了10mm厚AZ31镁合金,并对焊缝微观组织和接头抗拉强度进行了研究.在高温作用下,因为镁元素的高温蒸发与烧损,焊缝表面会形成难以克服的凹坑缺陷.在实验条件下,焊缝熔合区微观组织为等轴枝晶,且随着焊接热输入的减少,晶粒细化.抗拉强度测试表明,表面凹坑和焊缝内气孔缺...     

Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints

This study investigates the influence of adding Sb on the microstructure and adhesive strength of the Sn3.5Ag solder. Both solidus and liquidus temperatures increase as Sb additions increase. Adding 1.5wt.%Sb leads to the narrowest range (6.6°C) between the solidus and liquidus temperature of the solder. Adding Sb decomposes the as-soldered ringlike microstructure of Sn3.5Ag and causes solid-solution hardening. The as-soldered hardness increases with increasing Sb addition. For long-term storage, adding Sb reduces the size of the rodlike Ag₃Sn compounds. The hardness also increases with increasing Sb addition. Adding Sb depresses the growth rate of interfacial intermetallic compounds (IMCs) layers, but the difference between 1% and 2% Sb is not distinct. For mechanical concern, adding Sb improves both adhesive strength and thermal resistance of Sn3.5Ag, where 1.5% Sb has the best result. However, adding Sb causes a variation in adhesive strength during thermal storage. The more Sb is added, the higher the variation reveals, and the shorter the storage time requires. This strength variation helps the solder joints to resist thermal storage.     

Interfacial microstructure and strength of lead-free Sn-Zn-RE BGA solder bumps

Rare earth (RE) elements, primarily La and Ce, were doped in Sn-Zn solder to improve its properties such as wettability. The interfacial microstructure evolution and shear strength of the Sn-9Zn and Sn-9Zn-0.5RE (in wt%) solder bumps on Au/Ni/Cu under bump metallization (UBM) in a ball grid array (BGA) were investigated after thermal aging at 150 /spl deg/C for up to 1000 h. In the as-reflowed Sn-9Zn solder bump, AuSn/sub 4/ intermetallic compounds (IMCs) and Au-Zn circular IMCs formed close to the solder/UBM interface, together with the formation of a Ni-Zn-Sn ternary IMC layer of about 1 /spl mu/m in thickness. In contrast, in the as-reflowed Sn-9Zn-0.5RE solder bump, a spalled layer of Au-Zn was formed above the Ni layer. Sn-Ce-La and Sn-Zn-Ce-La phases were found near the interface at positions near the surface of the solder ball. Upon thermal aging at 150 /spl deg/C, the concentration of Zn in the Ni-Zn-Sn ternary layer of Sn-9Zn increased with aging time. For Sn-9Zn-0.5RE, the Au-Zn layer began to dissolve after 500 h of thermal aging. The shear strength of the Sn-9Zn ball was decreased after the addition of RE elements, although it was still higher than that of the Sn-37Pb and Sn-36Pb-2Ag Pb-bearing solders. The fracture mode of the Sn-9Zn system was changed from ductile to partly brittle after adding the RE elements. This is mainly due to the presence of the brittle Au-Zn layer.