共查询到17条相似文献,搜索用时 187 毫秒
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为降低石墨烯(Gr)透明电极与p-GaN之间的肖特基势垒与接触电阻,进行了将银、金、镍和铂四种金属或氧化镍作为中间层引入它们两者之间的尝试。使用有限元方法模拟研究了Gr与金属或氧化镍的不同厚度组合对LED的光、热和电特性的影响。发现:透明导电层的透光率和LED芯片的表面温度均随石墨烯和金属或氧化镍厚度的增加而降低;1.5nm的Ag、Ni、Pt,1nm Au或1nm的NiOx分别与3层(3L)Gr复合时为优化厚度组合,其中,1.5nm Ni/3L Gr为最佳Gr/金属复合透明电极。 相似文献
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光提取效率的提高对GaN基蓝光LED的广泛应用有重要的影响.计算了以Ni/Au基金属化方法形成的p型GaN电极的折射率,通过分析电极层中的能流传输情况在电极上设计高折射率的耦合层来减少电极层对光的吸收以及提高光的透射,耦合层通过采用圆台结构来减少光在空气/耦合层界面上的全反射以提高GaN基蓝光LED的光提取效率.应用传输矩阵法计算的结果表明,光学厚度为π/2,折射率为2.02的ITO耦合层能使450 nm的蓝光在膜系上的透射率提高到75%. 相似文献
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Ni/Ag/Ti/Au金属系反射镜电极广泛用于GaN基垂直结构发光二极管(LED)的传统制造工艺.这种电极需要进行高温长时间整体退火才能获得高质量的欧姆接触,但对电极的反射率和器件性能影响较大.介绍了一种新工艺方法,该方法将电极分解为接触层和反射层,降低反射层经历的退火温度和时间,获得了拥有良好的欧姆接触特性和高反射率的反射镜电极,解决了传统电极光学性能和电学性能相互制约的问题.首先生长极薄的Ni/Ag作为接触层,对接触层进行高温长时间退火后再生长厚层Ag作为反射层,之后再进行一次低温退火.使得对反射起主要作用的反射层免于高温长时间退火,相较于传统Ni/Ag/Ti/Au电极,该方法在获得更优良的欧姆接触的同时,提升了电极的反射率.在氧气氛围下进行500℃接触层退火3 min,400℃整体退火1 min后,电极的比接触电阻率为1.7×l0-3Ω·cm2,同时在450 nm处反射率为93%. 相似文献
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采用Ti/Al/Ni/Au多层金属体系在Al0.27Ga0.73N/GaN异质结构上制备了欧姆接触. 分别采用线性传输线方法(LTLM)和圆形传输线方法(CTLM)对其电阻率进行了测试. 当Ti(10nm)/Al(100nm)/Ni(40nm)/Au(100nm)金属体系在650℃高纯N2气氛中退火30s时,测量得到的最小比接触电阻率为1.46E-5Ω·cm2. 并制备了Al0.27Ga0.73N/GaN光导型紫外探测器,通过测试发现探测器的暗电流-电压曲线呈线性分布. 实验结果表明在Al0.27Ga0.73N/GaN异质结构上获得了好的欧姆接触,能够满足制备高性能AlGaN/GaN紫外探测器的要求. 相似文献
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Xu Feng Li Cheng-Chieh Chang Yen-Shuo Liu Po-Han Chen Cheng-Yi Liu 《Journal of Electronic Materials》2014,43(1):166-169
This study examines nanomeshed Pt and Pt(Au) thin films formed by a dewetting process on a p-GaN surface. With prolonged annealing, the Pt(Au) layer shows more stable contact resistance to p-GaN and lower sheet resistance than the Pt layer. L–I curves show that the GaN light-emitting diode (LED) with the Pt(Au) transparent conducting layer (TCL) produces more light output power than the GaN LED with the Pt TCL. The higher light output of the LED with the Pt(Au) TCL is attributed to the lower sheet resistance, which improves current spreading in the active region. 相似文献
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Shui-Hsiang Su Cheng-Chieh Hou Meiso Yokoyama Shi-Ming Chen 《Solid-state electronics》2005,49(12):J155
In order to improve the light transmittance and output efficiency of the InGaN/GaN multi-quantum well (MQW) light emitting diodes (LEDs), we proposed a novel Ni/Au mesh p-contact. As compared with the traditional Ni/Au film p-contact, the proposed Ni/Au mesh p-contact has the less light blocking nature yet still keeps well ohmic contact. Our lab result shows that for 470 nm wavelength the Ni/Au mesh p-contact has 95% light transmittance and 11.3 mW output power at a 20 mA injection current. In contrast, at the same 470 nm wavelength, the traditional Ni/Au film p-contact has 72% light transmittance and 8.12 mW output power at a 20 mA injection current. 相似文献
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Sheu J.K. Tsai J.M. Shei S.C. Lai W.C. Wen T.C. Kou C.H. Su Y.K. Chang S.J. Chi G.C. 《Electron Device Letters, IEEE》2001,22(10):460-462
InGaN/GaN multiple-quantum-well light-emitting diode (LED) structures including a Si-doped In0.23Ga0.77N/GaN short-period superlattice (SPS) tunneling contact were grown by metalorganic vapor phase epitaxy. In0.23Ga0.77N/GaN(n+)-GaN(p) tunneling junction, the low-resistivity n+-In0.3Ga0.77 N/GaN SPS instead of high-resistivity p-type GaN as a top contact layer, allows the reverse-biased tunnel junction to form an “ohmic” contact. In this structure, the sheet electron concentration of Si-doped In0.23Ga0.77N/GaN SPS is around 1×1014/cm2, leading to an averaged electron concentration of around 1×1020/cm3. This high-conductivity SPS would lead to a low-resistivity ohmic contact (Au/Ni/SPS) of LED. Experimental results indicate that the LEDs can achieve a lower operation voltage of around 2.95 V, i.e., smaller than conventional devices which have an operation voltage of about 3.8 V 相似文献
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The influence of p-type Ga N(p Ga N) thickness on the light output power(LOP) and internal quantum efficiency(IQE) of light emitting diode(LED) was studied by experiments and simulations. The LOP of Ga N-based LED increases as the thickness of p Ga N layer decreases from 300 nm to 100 nm, and then decreases as the thickness decreases to 50 nm. The LOP of LED with 100-nm-thick pG a N increases by 30.9% compared with that of the conventional LED with 300-nm-thick p Ga N. The variation trend of IQE is similar to that of LOP as the decrease of Ga N thickness. The simulation results demonstrate that the higher light efficiency of LED with 100-nm-thick p Ga N is ascribed to the improvements of the carrier concentrations and recombination rates. 相似文献
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Zhao Jianzhi Lin Zhaojun Lü Yuanjie Corrigan Timothy D Meng Lingguo Zhang Yu Wang Zhanguo Chen Hong 《半导体学报》2010,31(8)
Ni/Au Schottky contacts with thicknesses of either 50(A)/50(A) or 600 (A)/2000(A) were deposited on strained Al0.3Ga0.7N/GaN heterostructures.Using the measured C-V curves and Ⅰ-Ⅴ characteristics at room temperature,the calculated density of the two-dimensional electron-gas (2DEG) of the 600(A)/2000(A) thick Ni/Au Schottky contact is about 9.13 x 1012 cm-2 and that of the 50(A)/50(A) thick Ni/Au Schottky contact is only about 4.77 ×1012 cm-2.The saturated current increases from 60.88 to 86.34 mA at a bias of 20 V as the thickness of the Ni/Au Schottky contact increases from 50(A)/50(A)to 600(A)/2000(A).By self-consistently solving Schrodinger's and Poisson's equations,the polarization charge sheet density of the two samples was calculated,and the calculated results show that the polarization in the AIGaN barrier layer for the thick Ni/Au Schottky contact is stronger than the thin one.Thus,we attribute the results to the increascd biaxial tensile stress in the Al0.3Ga0.7N barrier layer induced by the 600(A)/2000(A)thick Ni/Au Schottky contact. 相似文献
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The features of the formation of Ta/Ti/Al/Mo/Au ohmic contacts to a Al0.26Ga0.74N/AlN/GaN heterostructure grown on semi-insulating Si(111) substrates are studied. The dependences of the contact resistance on the Al (90, 120, 150, 180 nm) and Ti (15, 30 nm) layer thickness and optimal temperature-time annealing conditions are determined for each studied metallization scheme. It is shown that the minimum achievable contact resistance monotonically increases from 0.43 to 0.58 Ω mm as the Al layer thickness increases from 90 to 180 nm at unchanged Ta, Ti, Mo, Au layer thicknesses. A change in the Ti layer thickness from 15 to 30 nm has no significant effect on the minimum contact resistance. The least contact resistance of 0.4 Ω mm is achieved for Ta/Ti/Al/Mo/Au layers with thicknesses of 10/15/90/40/25 nm, respectively. The optimal annealing temperature for this metallization variant is 825°C at a process duration of 30 s. The grown ohmic contacts have smooth contact-area edges and flat morphology of their surface. 相似文献
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Chang C.S. Chang S.J. Su Y.K. Kuo C.H. Lai W.C. Lin Y.C. Hsu Y.P. Shei S.C. Tsai J.M. Lo H.M. Ke J.C. Sheu J.K. 《Electron Devices, IEEE Transactions on》2003,50(11):2208-2212
Indium tin oxide (ITO) (260 nm) and Ni (5 nm)/Au (10 nm) films were deposited onto glass substrates, p-GaN layers, n/sup +/-InGaN/GaN short-period-superlattice (SPS), n/sup ++/-SPS and nitride-based green light-emitting diodes (LEDs). It was found that ITO could provide us an extremely high transparency (i.e., 95% at 520 nm). It was also found that the 1.03/spl times/10/sup -3/ /spl Omega/cm/sup 2/ specific contact resistance of ITO on n/sup ++/-SPS was reasonably small. Although the forward voltage of the LED with ITO on n/sup ++/-SPS upper contacts was slightly higher than that of the LED with Ni/Au on n/sup ++/-SPS upper contacts, the 20 mA output power and external quantum efficiency of the former could reach 4.98 mW and 8.2%, respectively, which were much larger than the values observed from the latter. The reliability of ITO on n/sup ++/-SPS upper contacts was also found to be reasonably good. 相似文献