Copper(I) oxide micro-cubical structures formation by metal organic chemical vapor deposition from copper(II) acetylacetonate

The copper oxide films were deposited by decomposition of copper(II) acetylacetonate precursor in a hot wall horizontal flow tubular furnace by chemical vapor deposition method. The obtained data revealed change in phase of the deposits from crystalline copper(I) oxide (Cu₂O) to copper(II) oxide (CuO) structures on increasing the substrate temperature from 195 to 430 °C. The scanning electron microscope images showed the formation of mono-dispersed micron-sized Cu₂O cubical structures. The Cu₂O micro-cubes were observed to have a comparatively higher optical transmittance than CuO film in the visible spectral region. The Cu₂O micro-cubical films are expected to underlie the potential use as cost effective transparent conducting oxide electrode in solar cell applications.     

Characterization of copper oxide thin films deposited by the thermal evaporation of cuprous oxide (Cu2O)

Thin films of copper oxide were deposited by thermal evaporation of cuprous oxide (Cu₂O) powder. The substrates were either unheated or heated to a temperature of 300 °C. The films were also annealed in air at a temperature of 500 °C for 3 h. The films were characterized by X-ray photoelectron spectroscopy, X-ray diffraction and UV-visible spectrophotometry. The effects of the substrate temperature and post-deposition annealing on the chemical, structural and optical properties of the films were investigated. As-deposited films on unheated substrates consisted of mixed cupric oxide (CuO) and Cu₂O phases, with a higher concentration of the Cu₂O phase. However, the films deposited on heated substrates and the annealed films were predominantly of the CuO phase.     

Property variations of direct-current reactive magnetron sputtered copper oxide thin films deposited at different oxygen partial pressures

Cuprous oxide (Cu₂O) and cupric oxide (CuO) thin films were deposited on glass substrates at different oxygen partial pressures by direct-current reactive magnetron sputtering of pure copper target in a mixture of argon and oxygen gases. Oxygen partial pressure was found to be a crucial parameter in controlling the phases and, thus, the physical properties of the deposited copper oxide thin films. Single-phase Cu₂O thin films with cubic structure were obtained at low oxygen partial pressure between 0.147 Pa and 0.200 Pa while higher oxygen partial pressure promoted the formation of CuO thin films with base-centered monoclinic structure. Polycrystalline Cu₂O thin films deposited with oxygen partial pressure at 0.147 Pa possessed the lowest p-type resistivity of 1.76 Ω cm as well as an optical band gap of 2.01 eV. On the other hand, polycrystalline CuO thin films deposited with oxygen partial pressure at 0.320 Pa were also single phase but showed a n-type resistivity of 0.19 Ω cm along with an optical band gap of 1.58 eV.     

Controlled growth and characteristics of single-phase Cu2O and CuO films by pulsed laser deposition

Copper oxide, Cu₂O and CuO, thin films have been synthesized on Si (100) substrates using pulsed laser deposition method. The influences of substrate temperature and oxygen pressure on the structural properties of copper oxide films were discussed. The X-ray diffraction results show that the structure of the films changes from Cu₂O to CuO phase with the increasing of the oxygen pressure. It is also found that the (200) and (111) preferred Cu₂O films can be modified by changing substrate temperature. The formation of Cu₂O and CuO films are further identified by Fourier transform infrared spectroscopy. For the Cu₂O films, X-ray photoelectron spectroscopic studies indicate the presence of CuO on the surface. In addition, the optical gaps of Cu₂O and CuO films have been determined by measuring the transmittance and reflectance spectra.     

Growth behavior and optical properties of N-doped Cu2O films

N-doped Cu₂O films are deposited by sputtering a CuO target in the mixture of Ar and N₂. The structures zand optical properties have been studied for the films deposited at different temperatures. It is found that N-doping can suppress the formation of CuO phase in the films. The films are highly (100) textured at low temperatures and gradually change to be highly (111) textured at the temperature of 500 °C. With the analysis of (111) and (100) grain sizes, the surface free energy and grain size of critical nuclei are suggested to dominate the film texture. The analysis of the atomic force microscopy shows that the film growth can be attributed to the surface-diffusion-dominated growth. The forbidden rule of band gap transition is found disabled in the N-doped Cu₂O films, which can be attributed to the occupation of 2p electrons of nitrogen at the top of valence band. The optical band gap energy is determined to be 2.52 ± 0.03 eV for the films deposited at different temperatures.     

One step room temperature photodeposition of Cu/TiO2 composite films and its conversion to CuO/TiO2

Cu/TiO₂ composite films were prepared at low temperature on glass substrates by a photodeposition method. Films were deposited by irradiating the substrate while in contact with an aqueous TiO₂ suspension containing copper(II) nitrate and ethanol. Cu/TiO₂ composite films of 500 nm in thickness were deposited at room temperature after a short irradiation time (15 min) with a 125 W mercury vapour lamp. According to scanning electron microscopy observations, the obtained films were homogeneous and porous. Energy dispersive X-ray spectroscopy analysis revealed a 3:1 Cu:Ti atomic ratio. Grazing angle X-ray diffraction analysis showed that the films contained Cu and TiO₂ as major components and Cu₂O as a minor component. Heat treatment at 400 °C in air for a period of 3 h transformed the initial material into a CuO/TiO₂ composite, improved the adhesion to the substrate and favoured a more regular distribution of copper oxide according to backscattering micrographs.     

Low temperature (< 100 °C) deposited P-type cuprous oxide thin films: Importance of controlled oxygen and deposition energy

With the emergence of transparent electronics, there has been considerable advancement in n-type transparent semiconducting oxide (TSO) materials, such as ZnO, InGaZnO, and InSnO. Comparatively, the availability of p-type TSO materials is more scarce and the available materials are less mature. The development of p-type semiconductors is one of the key technologies needed to push transparent electronics and systems to the next frontier, particularly for implementing p-n junctions for solar cells and p-type transistors for complementary logic/circuits applications. Cuprous oxide (Cu₂O) is one of the most promising candidates for p-type TSO materials. This paper reports the deposition of Cu₂O thin films without substrate heating using a high deposition rate reactive sputtering technique, called high target utilisation sputtering (HiTUS). This technique allows independent control of the remote plasma density and the ion energy, thus providing finer control of the film properties and microstructure as well as reducing film stress. The effect of deposition parameters, including oxygen flow rate, plasma power and target power, on the properties of Cu₂O films are reported. It is known from previously published work that the formation of pure Cu₂O film is often difficult, due to the more ready formation or co-formation of cupric oxide (CuO). From our investigation, we established two key concurrent criteria needed for attaining Cu₂O thin films (as opposed to CuO or mixed phase CuO/Cu₂O films). First, the oxygen flow rate must be kept low to avoid over-oxidation of Cu₂O to CuO and to ensure a non-oxidised/non-poisoned metallic copper target in the reactive sputtering environment. Secondly, the energy of the sputtered copper species must be kept low as higher reaction energy tends to favour the formation of CuO. The unique design of the HiTUS system enables the provision of a high density of low energy sputtered copper radicals/ions, and when combined with a controlled amount of oxygen, can produce good quality p-type transparent Cu₂O films with electrical resistivity ranging from 10² to 10⁴ Ω-cm, hole mobility of 1-10 cm²/V-s, and optical band-gap of 2.0-2.6 eV. These material properties make this low temperature deposited HiTUS Cu₂O film suitable for fabrication of p-type metal oxide thin film transistors. Furthermore, the capability to deposit Cu₂O films with low film stress at low temperatures on plastic substrates renders this approach favourable for fabrication of flexible p-n junction solar cells.     

Preparation of Sb<Subscript>2</Subscript>S<Subscript>3</Subscript> film on functional organic self-assembled monolayers by chemical bath deposition

In this work, self-assembled monolayers (SAMs) of octadecyltrichlorosilane (OTS) were applied to induce the nucleation and growth of the antimony sulfide (Sb₂S₃) films on the functional ITO glass substrate at low temperature. The structure, morphology, and optical properties of the Sb₂S₃ films were investigated by X-ray diffraction, scanning electron microscopy, X-ray energy dispersive spectroscopy, and UV–vis spectroscopy. After thermal treatment at 200 °C for 1 h in air, the orthorhombic Sb₂S₃ was formed as a predominant phase in the deposited thin films. When the deposited films were thermally treated at 400 °C for 1 h in air, the orthorhombic Sb₂S₃ was decomposed and a cubic Sb₂O₃ was formed. The optical band energies of the as-deposited and thermally treated Sb₂S₃ films at 200 °C for 1 h in air and nitrogen were found to be 2.05 eV, 1.77, and 1.76 eV, respectively. As chemical templates, the OTS-functionalized SAMs played an important role in controlling the nucleation and growth of Sb₂S₃ films at low temperature. The results obtained from different preparation parameters applied in the present work will allow controlling the growth of the Sb₂S₃ films with uniform surface.     

Synthesis and characterization of CeO<Subscript>2</Subscript> thin films deposited by spray pyrolysis

Cerium dioxide (CeO₂) thin films were deposited on glass substrates by spray pyrolysis using a solution of alcohol–water and CeCl₃ · 7H₂O as precursor. The structural, morphological, optical and electrical properties of these films were investigated. SEM images reveal the presence of cracks in the films that depend on substrate temperature and deposition time. Films deposited in temperatures between 400 and 500 °C during up to 10 min are crack free and also present high optical transmittance, reaching up to 90% in the visible range and close to infrared. X-ray diffraction shows that all films are polycrystalline and the growth preferential direction is altered from (111) to (200) with the increase of the deposition temperature. The activation energy of the electrical conduction process is 0.67 ± 0.03 eV.     

Influence of substrate and selenization temperatures on the growth of Cu2SnSe3 films

The effects of substrate temperature and selenization temperature on the structure, composition, electrical and optical properties of Cu₂SnSe₃ films were studied systematically. Cu₂SnSe₃ films deposited at various substrate temperatures (303–573 K) by the flash evaporation method are found to be non-stoichiometric. To compensate the selenium deficiency and obtain a single-phase, an annealing Cu₂SnSe₃ films deposited at 573 K was performed in selenium atmosphere. Cu₂SnSe₃ films deposited at a substrate temperature of 573 K and then selenized at 673 K were single phase and polycrystalline exhibiting monoclinic structure. The films showed p-type conductivity with a direct band gap of 0.84 eV.     

Copper nitride films deposited by dc reactive magnetron sputtering

Copper nitride (Cu₃N) films were deposited on glass substrates by sputtering of copper target under various substrate temperatures in the range 303–523 K using dc reactive magnetron sputtering. The substrate temperature highly influenced the structural, mechanical, electrical and optical properties of the deposited films. The X-ray diffraction measurements showed that the films were of polycrystalline nature and exhibit preferred orientation of (111) phase of Cu₃N. The microhardness of the films increased from 2.7 to 4.4 GPa with the increase of substrate temperature from 303 to 473 K thereafter decreased to 4.1 GPa at higher temperature of 523 K. The electrical resistivity of the films decreased from 8.7 × 10⁻¹ to 1.1 × 10⁻³ Ωcm and the optical band gap decreased from 1.89 to 1.54 eV with the increase of substrate temperature from 303 to 523 K respectively.     

Structure and composition of Cu<Subscript>2</Subscript>O films produced by anodizing copper foil on fiberglass laminate

The effect of process conditions on the composition and structure of anodic Cu₂O films grown in sulfate-chloride electrolytes has been studied using Auger electron spectroscopy, x-ray diffraction, and atomic force microscopy. The results demonstrate that the copper and oxygen depth profiles in the anodic copper(I) oxide films (ACOFs) are similar in shape. The copper content near the surface is only slightly lower than the bulk copper content. Starting at a depth of 9 nm, the Cu content is constant at an average of 62.7 at %. The Cu₂O films grown at a current density j = 3 mA/cm² have the most perfect stoichiometry, with deviations only in the surface layer. Anodic oxidation produces unoriented polycrystalline films of complex composition. In addition to Cu₂O, the films contain CuCl and trace levels of copper. Raising the anode current density influences, for the most part, the formation of (111)-oriented crystallites, changing their orientation from (111) to (220). We assume that nonmetal (oxygen or chlorine) atoms are incorporated into the cubic structure of copper without changing its symmetry but increasing its unit-cell parameter: from 0.3607 (Cu) to 0.426 (Cu₂O) and to 0.541 nm (CuCl).     

Effects of post-deposition annealing temperature and ambient on RF magnetron sputtered Sm<Subscript>2</Subscript>O<Subscript>3</Subscript> gate on n-type silicon substrate

Samarium oxide (Sm₂O₃) thin films with thicknesses in the range of 15–30 nm are deposited on n-type silicon (100) substrate via radio frequency magnetron sputtering. Effects of post-deposition annealing ambient [argon and forming gas (FG) (90% N₂ + 10% H₂)] and temperatures (500, 600, 700, and 800 °C) on the structural and electrical properties of deposited films are investigated and reported. X-ray diffraction revealed that all of the annealed samples possessed polycrystalline structure with C-type cubic phase. Atomic force microscope results indicated root-mean-square surface roughness of the oxide film being annealed in argon ambient are lower than that of FG annealed samples, but they are comparable at the annealing temperature of 700 °C (Argon—0.378 nm, FG—0.395 nm). High frequency capacitance–voltage measurements are carried out to determine effective oxide charge, dielectric constant and semiconductor-oxide interface trap density of the annealed oxide films. Sm₂O₃ thin films annealed in FG have smaller amount of effective oxide charge and semiconductor-oxide interface trap density than those oxide films annealed in argon. Current–voltage measurements are conducted to obtain barrier heights of the annealed oxide films during Fowler–Nordheim tunneling.     

Influences of Ni–5 at.%W Alloy Substrates on the Epitaxial Growth and Surface Morphologies of CeO<Subscript>2</Subscript> Films Deposited by PLD

We fabricated CeO₂ films using pulsed laser deposition (PLD) for YBa₂Cu₃O_7−δ coated conductors on Ni–5 at.%W alloy substrates and investigated the effect of Ni–5 at.%W tapes on the epitaxial growth and surface morphologies of CeO₂ deposited on various substrates at various temperatures ranging from 650 to 770 °C. The texture and microstructure of substrates and CeO₂ films were measured by X-ray diffraction (XRD), optical microscope (OM), field emission scanning electron microscope (FESEM) and atomic force microscopy (AFM). It was found that the texture and microstructure of Ni–5 at.%W substrates, such as Ni(111), grain size, the depth of grain boundary grooves and surface roughness, affected the growth of CeO₂ films. Especially, the depth of grain boundary grooves of substrates resulted in high intensity of CeO₂(111) peak and high surface roughness of CeO₂ films. We also found that high growth temperature effectively reduced the influence of substrate surface roughness on the epitaxial growth of CeO₂ films. CeO₂ films with high in-plane and out-of-plane alignments (Δφ=5.54°, Δω=3.40°) were obtained under optimum condition.     

Thermal evolution of morphological,optical, and photocatalytic properties of Au–Cu2O–CuO nanocomposite thin film

Plasmonic nanocomposite thin films find exciting applications in environmental remediation and photovoltaics. We report on thermal annealing driven development of morphology, structure and photocatalytic performance of Au–Cu₂O–CuO nanocomposite thin film. Nanocomposite thin film coatings of Au–Cu₂O–CuO, prepared by radio frequency (RF) magnetron co-sputtering, were annealed at different temperatures. Thermal annealing driven evolution of morphology of Au–Cu₂O–CuO nanocomposite was studied by field emission scanning electron microscopy (FESEM), which revealed significant growth in size of nanostructures from 10 nm to 69 nm upon annealing. X-ray diffraction (XRD) together with Raman studies confirmed the nanocomposite nature of Au–Cu₂O–CuO film. UV-visible diffuse reflectance spectroscopy (UV-vis-DRS) studies showed band gap variation from 2.44 eV to 1.8 eV upon annealing at 250 °C. Nanocomposite thin film annealed at 250 °C exhibited superior photocatalytic activity for organic pollutants [methylene blue (MB) and methyl orange (MO)] decomposition. The origins of thermal transformation of morphological, optical and photocatalytic behaviour of the Au–Cu₂O–CuO nanocomposite coating are discussed.

     

Influence of thermal annealing on microstructural,morphological, optical properties and surface electronic structure of copper oxide thin films

In this study, effect of the post-deposition thermal annealing on copper oxide thin films has been systemically investigated. The copper oxide thin films were chemically deposited on glass substrates by spin-coating. Samples were annealed in air at atmospheric pressure and at different temperatures ranging from 200 to 600°C. The microstructural, morphological, optical properties and surface electronic structure of the thin films have been studied by diagnostic techniques such as X-ray diffraction (XRD), Raman spectroscopy, ultraviolet–visible (UV–VIS) absorption spectroscopy, field emission scanning electron microscopy (FESEM), atomic force microscopy (AFM), and X-ray photoelectron spectroscopy (XPS). The thickness of the films was about 520 nm. Crystallinity and grain size was found to improve with annealing temperature. The optical bandgap of the samples was found to be in between 1.93 and 2.08 eV. Cupric oxide (CuO), cuprous oxide (Cu₂O) and copper hydroxide (Cu(OH)₂) phases were observed on the surface of as-deposited and 600 °C annealed thin films and relative concentrations of these three phases were found to depend on annealing temperature. A complete characterization reported herein allowed us to better understand the surface properties of copper oxide thin films which could then be used as active layers in optoelectronic devices such as solar cells and photodetectors.     

Cu2O thin films deposited by reactive direct current magnetron sputtering

The Cu₂O thin films were prepared on quartz substrate by reactive direct current magnetron sputtering. The influences of oxygen partial pressure and gas flow rate on the structures and properties of deposited films were investigated. Varying oxygen partial pressure leads to the synthesis of Cu₂O, Cu₄O₃ and CuO with different microstructures. At a constant oxygen partial pressure of 6.6 × 10^− 2 Pa, the single Cu₂O films can be obtained when the gas flow rate is below 80 sccm. The as-deposited Cu₂O thin films have a very high absorption in the visible region resulting in the visible-light induced photocatalytic activity.     

Synthesis and electrochromic study of sol-gel cuprous oxide nanoparticles accumulated on silica thin film

In this study, electrochromic properties of cuprous oxide nanoparticles, self-accumulated on the surface of a sol-gel silica thin film, have been investigated by using UV-visible spectrophotometry in a lithium-based electrolyte cell. The cuprous oxide nanoparticles showed a reversible electrochromic process with a thin film transmission reduction of about 50% in a narrow wavelength range of 400-500 nm, as compared to the bleached state of the film. Using optical transmission measurement, we have found that the band gap energy of the films reduced from 2.7 eV for Cu₂O to 1.3 eV for CuO by increasing the annealing temperature from 220 to 300 °C in an N₂ environment for 1 h. Study of the band gaps of the as-deposited, colored and bleached states of the nanoparticles showed that the electrochromic process corresponded to a reversible red-ox conversion of Cu₂O to CuO on the film surface, in addition to the reversible red-ox reaction of the Cu₂O film. X-ray photoelectron spectroscopy indicated that the copper oxide nanoparticles accumulated on the film surface, after annealing the samples at 200 °C. Surface morphology of the films and particle size of the surface copper oxides have also been studied by atomic force microscopy analysis. The copper oxide nanoparticles with average size of about 100 nm increased the surface area ratio and surface roughness of the silica films from 2.2% and 0.8 nm to 51% and 21 nm, respectively.     

Characterization of copper oxide nanolayers deposited by direct current magnetron sputtering

Direct current reactive magnetron sputtering was used to deposit the thin layers of copper oxide (Cu₂O) on glass substrates. A solid disc of pure copper as the target was sputtered in an argon gas under sputtering pressures varying from 0.133 to 4 Pa. The effects of the sputtering power and pressure on the structural and optical properties of Cu₂O thin films were systematically studied. The deposited layers were characterized using X-ray diffraction, atomic force microscopy, profilometry and spectrophotometry. The optical transmission of the films was measured in the visible region. The increase in pressure resulted in a higher growth rate than increasing sputtering power. The increase in power produced Cu₂O thin films that were detrimental to the optical transmission of the films.     

Formation behavior of CaCu<Subscript>3</Subscript>Ti<Subscript>4</Subscript>O<Subscript>12</Subscript> from CaTiO<Subscript>3</Subscript>, CuO and TiO<Subscript>2</Subscript>

The formation behavior of CaCu₃Ti₄O₁₂ (CCTO) had been investigated via solid state reaction from CaTiO₃, CuO and TiO₂ powders. In the temperature range from 750 to 1,200 °C, the reaction sequence was traced by XRD, and the microstructure evolution of calcined powders was also investigated by SEM. CCTO began to form owing to the reaction between CaTiO₃, CuO and TiO₂ at around 850 °C, and became the major phase at 1,000 °C. Finally, the single phase CCTO was obtained at 1,150 °C. However, CCTO was decomposed at CaTiO₃, CuO and TiO₂ when the temperature increased to 1,200 °C. In addition, no other intermediate phases occurred in the synthesized process. The formation behaviors indicated that CaTiO₃ prevented the formation and growth of CCTO.