Effect of growth temperature on photoluminescence of self-assembled Ge(Si) islands confined between strained Si layers

The effect of growth temperature on photoluminescence is studied for structures with Ge(Si) islands grown on relaxed SiGe/Si(001) buffer layers and confined between strained Si layers. It is shown that, with decreasing growth temperature in the range from 700 to 630°C, the photoluminescence peak associated with the islands shifts to lower energies, which is due to the increase in Ge content in the islands and to suppression of degradation of the strained Si layers. The experimentally observed shift of the photoluminescence peak to higher energies with decreasing temperature from 630 to 600°C is attributed to the change in the type of the islands from domelike to hutlike in this temperature range. This change is accompanied by an abrupt decrease in the average height of the islands. The larger width of the photoluminescence peak produced by the hut islands in comparison with the width of the peak produced by the domelike islands is interpreted as a result of a wider size dispersion of the hutlike islands.     

Effect of tensile-strained Si layer on photoluminescence of Ge(Si) self-assembled islands grown on relaxed SiGe/Si(001) buffer layers

The results of studying the photoluminescence of the structures with Ge(Si) self-assembled islands embedded into tensile-strained Si layer are reported. The structures were grown on smooth relaxed Si_{1 ? x} Ge_x/Si(001) (x = 0.2–0.3) buffer layers. The photoluminescence peak found in the photoluminescence spectra of the studied structures is related to the indirect (in real space) optical transition between the holes localized in the Ge(Si) islands and electrons localized in the tensile-strained Si layers under and above an island. It is shown that one can efficiently control the position of the photoluminescence peak for a specified type of structure by varying the thickness of the strained Si layers. It is found that, at 77 K, the intensity of the photoluminescence signal from the heterostructures with Ge(Si) self-assembled islands contained between the tensile-strained Si layers exceeds by an order of magnitude the intensity of the photoluminescence signal from the GeSi structures with islands formed on the Si(001) substrates.     

Special features of the photoluminescence of self-assembled Ge(Si)/Si(001) islands grown on a strained Si1−x Gex layer

The effect of the predeposition of strained Si_{1 ? x} Ge_x layers (x ≤ 20%) on photoluminescence (PL) of self-assembled Ge(Si)/Si(001) islands is studied. A shift of the PL peak related to dome-shaped islands (domes) to lower energies, with respect to the PL peak related to pyramidal islands is observed; this shift is related to a much larger height of the domes compared to that of pyramids. It is found that, as the Ge content in the Si_{1 ? x} Ge_x layer (x) becomes higher than 0.1, two separate peaks appear in the broad PL band related to the islands; these peaks are attributed to the zero-phonon and phonon-assisted optical transitions in the islands. The appearance of these transitions is caused by a change of the TO-phonon type involved in radiative recombination: a TO_Ge-Ge phonon is replaced by a TO_Si-Ge phonon with a shorter wavelength.     

Interaction of self-assembled Ge islands and adjacent Si layers grown on unpatterned and patterned Si(001) substrates

For use in electronic devices, self-assembled Ge islands formed on Si(001) must be covered with an additional Si layer. Chemically vapor deposited Si layers initially grow very rapidly over Ge islands because of the catalytic effect of Ge on the reaction of the Si-containing gas. The edges of the Si features covering Ge “pyramids” are rotated by 45° with respect to the edges of the Ge pyramids because of the different mechanisms orienting the Ge islands and the Si features. When multiple layers of islands are formed, the in-plane ordering of the Ge islands depends on the thickness of the Si interlayer separating the island layers. When selective Si is grown on a patterned Si wafer to form the underlying structure for the Ge islands, the position of the islands is influenced by the detailed shape of the Si near the edges, which in turn depends on the thickness of the selectively deposited Si, the pattern size, and the amount of surrounding oxide.     

Special features of the formation of Ge(Si) islands on the relaxed Si1−xGex/Si(001) buffer layers

The results of studying the growth of self-assembled Ge(Si) islands on relaxed Si_1?xGe_x/Si(001) buffer layers (x≈25%), with a low surface roughness are reported. It is shown that the growth of self-assembled islands on the buffer SiGe layers is qualitatively similar to the growth of islands on the Si (001) surface. It is found that a variation in the surface morphology (the transition from dome-to hut-shaped islands) in the case of island growth on the relaxed SiGe buffer layers occurs at a higher temperature than for the Ge(Si)/Si(001) islands. This effect can be caused by both a lesser mismatch between the crystal lattices of an island and the buffer layer and a somewhat higher surface density of islands, when they are grown on an SiGe buffer layer.     

Transition from the two- to three-dimensional growth of Ge films upon deposition onto relaxed SiGe/Si(001) buffer layers

The critical thickness of the two-dimensional growth of Ge on relaxed SiGe/Si(001) buffer layers different in Ge content is studied in relation to the parameters of the layers. It is shown that the critical thickness of the two-dimensional growth of Ge on SiGe buffer layers depends on the lattice mismatch between the film and the substrate and, in addition, is heavily influenced by Ge segregation during SiGe-layer growth and by variations in the growth-surface roughness upon the deposition of strained (stretched) Si layers. It is found that the critical thickness of the two-dimensional growth of Ge directly onto SiGe buffer layers with a Ge content of x = 11–36% is smaller than that in the case of deposition onto a Si (001) substrate. The experimentally detected increase in the critical thickness of the two-dimensional growth of Ge with increasing thickness of the strained (stretched) Si layer predeposited onto the buffer layer is attributed to a decrease in the growth-surface roughness and in the amount of Ge located on the surface as a result of segregation.     

Time-resolved photoluminescence from self-assembled Ge(Si) islands in multilayer SiGe/Si and SiGe/SOI structures

The results of a study of the spectral and temporal characteristics of the photoluminescence (PL) from multilayer structures with self-assembled Ge(Si) islands grown on silicon and “silicon-on-insulator” substrates in relation to temperature and the excitation-light wavelength are presented. A substantial increase in island-related PL intensity is observed for structures with Ge(Si) islands grown on silicon substrates upon an increase in temperature from 4 to 70 K. This increase is due to the diffusion of nonequilibrium carriers from the silicon substrate into the active layer with the islands. In this case, a slow component with a characteristic time of ～100 ns appears in the PL rise kinetics. At the same time, no slow component in the PL rise kinetics and no rise in the PL intensity with increasing temperature are observed for structures grown on “silicon-on-insulator” substrates, in which the active layer with the islands is insulated from the silicon substrate. It is found that absorption of the excitation light in the islands and SiGe wetting layers mainly contributes to the excitation of the PL signal from the islands under sub-bandgap optical pump conditions.     

SiO_x、Si/Si_(1-x)Ge_x的横向磁阻和迁移率的无接触测量

用分子束外延技术在ｐ型Ｓｉ衬底上生长成了Ｓｉ／Ｓｉ１－ｘＧｅｘ应变层超晶格和掺铒（Ｅｒ）ＳｉＯｘ外延层,用无接触法测量了它们的横向磁阻,并且用拟合方法由横向磁阻计算了它们的迁移率。     

Comparative analysis of photoluminescence and electroluminescence of multilayer structures with self-assembled Ge(Si)/Si(001) island

Comparative studies of the photoluminescence and electroluminescence of multilayer structures with self-assembled Ge(Si)/Si(001) islands are carried out. The luminescence signal from the islands is observable up to room temperature. Annealing of the structures induces a shift of the luminescence peak to shorter wavelengths. The shift is temperature dependent, making possible controllable variations in the spectral position of the luminescence peak of the Ge(Si) islands in the range from 1.3 to 1.55 μm. The enhancement of the temperature quenching of photoluminescence of the islands with increasing annealing temperature is attributed to the decrease in the Ge content in the islands during annealing and, as a result, to a decrease in the depth of the potential well for holes in the islands. The well-pronounced suppression of the temperature quenching of electroluminescence of the Ge(Si) islands in the unannealed structure with increasing pumping current is demonstrated.     

Resonant cavity enhanced photoluminescence of tensile strained Ge/SiGe quantum wells on silicon-on-insulator substrate

The tensile strained Ge/SiGe multiple quantum wells （MQWs） grown on a silicon-on-insulator （SOI） substrate were fabricated successfully by ultra-high chemical vapor deposition. Room temperature direct band photoluminescence from Ge quantum wells on SOI substrate is strongly modulated by Fabry-Perot cavity formed between the surface of Ge and the interface of buried SiO2. The photoluminescence peak intensity at 1.58 μm is enhanced by about 21 times compared with that from the Ge/SiGe quantum wells on Si substrate, and the full width at half maximum （FWHM） is significantly reduced. It is suggested that tensile strained Ge/SiGe multiple quantum wells are one of the promising materials for Si-based microcavity lijzht emitting devices.     

DCXRD分析Ge/Si(001)多层纳米岛材料

结合透射电镜与原子力显微镜实验,用双晶X射线衍射方法分析了Ge/Si多层纳米岛材料.衍射的卫星峰可以被分解为两个洛仑兹峰,它们分别源于材料的浸润层区和纳米岛区.利用透射电镜得到Si和SiGe层的厚度比,估算出浸润层区与岛区的Ge组分分别为0.51和0.67.这是一种简单估算Ge/Si多层纳米岛材料中Ge组分的方法.     

DCXRD分析Ge/Si(001)多层纳米岛材料

结合透射电镜与原子力显微镜实验,用双晶X射线衍射方法分析了Ge/Si多层纳米岛材料.衍射的卫星峰可以被分解为两个洛仑兹峰,它们分别源于材料的浸润层区和纳米岛区.利用透射电镜得到Si和SiGe层的厚度比,估算出浸润层区与岛区的Ge组分分别为0.51和0.67.这是一种简单估算Ge/Si多层纳米岛材料中Ge组分的方法.     

A study of the oxidation behavior and the postannealing effect in a graded SiGe/Si heterostructure

A study on the dry thermal oxidation of a graded SiGe layer was performed. To reduce the Ge pileup effect during the thermal oxidation, the SiGe layer was deposited with much lower Ge content near the free surface than near the SiGe/Si heterointerface. After dry thermal oxidation at 900°C, the Ge composition in the pileup layer was significantly reduced and strain relaxation by defect formation was prevented due to the graded Ge distribution. To homogenize the Ge distribution between the pileup layer and remaining SiGe layer, the oxidized layers were postannealed. The homogenization is significantly enhanced by strain-induced diffusion, and it was confirmed by uphill diffusion of Ge. This result can propose an alternative oxidation method of strained SiGe/Si heterostructures.     

Si基外延Ge薄膜及退火对其特性的影响研究

采用超高真空化学气相沉积(UHV-CVD)系统,用低温Ge缓冲层技术在Si衬底上外延了张应变Ge薄膜.扫描电镜(TEM)图表明Si基外延Ge薄膜拥有低的位错密度,原子力显微镜(AFM)测试Ge层表面粗糙度仅为1.2 nm.对Si基外延Ge薄膜进行了不同温度下的退火,并用双晶X射线衍射(DCXRD)曲线和Raman谱进行...     

Si1-xGex/Si应变材料的生长及热稳定性研究

利用分子束外延（MBE）技术生长了Ge组份为0.1-0.46的Si1-xGex外延层。X射线衍射线测试表明，SiGe/Si异质结材料具有良好的结晶质量和陡峭界面，其它参数与可准确控制。通过X射线双晶衍射摆曲线方法，研究了经700℃、800℃和900℃退火后应变SiGe/Si异质结材料的热稳定性。结果表明，随着退火温度的提高，应变层垂直应变逐渐减小，并发生了应变弛豫，导致晶体质量退化；且Ge组分越小，Si1-xGex应变结构的热稳定性越好；室温下长时间存放的应变材料性能稳定。     

Mechanisms determining three-dimensional SiGe lsland density on Si(001)

Thin, coherently strained, films of SiGe were deposited on Si(001) in the Stranski-Krastanow (SK) growth mode to form small, faceted, dislocation-free-three-dimensional (3D) islands. The number density of these islands was determined as functions of SiGe alloy composition, growth rate, and substrate temperature during growth. From these experiments, the classical model of 3D island nucleation and growth yields an approximate activation energy for diffusion of Ge dimers on a Ge covered Si(001) surface of 0.70 eV. The dependence of the 3D-island number density on growth rate cannot be understood without modifying the classical model to account for the wetting layer present in SK systems. Heteroepitaxial strain is not included in the classical model of island nucleation and growth. A simple linear elastic model that fits the data is developed that predicts the island number density is proportional to the inverse square of the Ge mole fraction in the alloy plus a constant.     

Photoluminescence Properties of Si1—xGex／Si Strained Layer Structures

The investigation on optical properties of Si1-xGex/Si strained layer structures has been carried out actively in recent years.The photoluminescence has be-come a brisker subject in the studies of its various optical properties.A research develop-ment to photoluminescence properties of some new Si1-xGex/Si strained layer struc-tures is introduced.     

Ultrathin body SiGe-on-insulator pMOSFETs with high-mobility SiGe surface channels

A novel concept and a fabrication technique of strained SiGe-on-insulator (SGOI) pMOSFET are proposed and demonstrated. This device has an ultrathin strained SiGe channel layer, which is directly sandwiched by gate oxide and buried oxide layers. The mobility enhancement of 2.3 times higher than the universal mobility of conventional universal Si pMOSFETs was obtained for a pMOSFET with 19-nm-thick Si/sub 0.58/Ge/sub 0.42/ channel layer, which is formed by high-temperature oxidation of a Si/sub 0.9/Ge/sub 0.1/ layer grown on a Si-on-insulator (SOI) substrate. A fully depleted SGOI MOSFET with this simple single-layer body structure is promising for scaled SOI p-MOSFET with high current drive.     

Low threading dislocation density Ge deposited on Si (1 0 0) using RPCVD

Epitaxial Ge layer growth of low threading dislocation density (TDD) and low surface roughness on Si (1 0 0) surface is investigated using a single wafer reduced pressure chemical vapor deposition (RPCVD) system. Thin seed Ge layer is deposited at 300 °C at first to form two-dimensional Ge surface followed by thick Ge growth at 550 °C. Root mean square of roughness (RMS) of ∼0.45 nm is achieved. As-deposited Ge layers show high TDD of e.g. ∼4 × 10⁸ cm⁻² for a 4.7 μm thick Ge layer thickness. The TDD is decreasing with increasing Ge thickness. By applying a postannealing process at 800 °C, the TDD is decreased by one order of magnitude. By introducing several cycle of annealing during the Ge growth interrupting the Ge deposition, TDD as low as ∼7 × 10⁵ cm⁻² is achieved for 4.7 μm Ge thick layer. Surface roughness of the Ge sample with the cyclic annealing process is in the same level as without annealing process (RMS of ∼0.44 nm). The Ge layers are tensile strained as a result of a higher thermal expansion coefficient of Ge compared to Si in the cooling process down to room temperature. Enhanced Si diffusion was observed for annealed Ge samples. Direct band-to-band luminescence of the Ge layer grown on Si is demonstrated.