石英微机械振动陀螺振子的失效分析

微机械惯性器件是振动惯性技术和微电子技术相结合的产物，是振动惯性技术的延伸和发展，这就决定了该器件具有价格低、可靠性高、尺寸小和质量轻等突出特点。目前，它已成为经济发达国家研究的热点，也开始引起国内外惯性技术界的高度重视。     

硅微机械惯性传感器技术及其应用

本文简述了MEMS技术及微机械传感器的技术含义，着重对硅微机械惯性传感器原理及研制硅微机械惯性传感器的关键技术进行描述，为开展硅微机械惯性传感器研究及应用作技术准备及必要的思考。     

微机械惯性传感器

综述微机械惯性传感器的基本工作原理和典型的器件结构,展望它的未来发展趋势。     

微惯性开关设计技术综述

微惯性开关作为微惯性传感器中的一类特殊器件在设计方面因应用背景的差异存在多种技术方案。通过描述惯性开关的工作原理和分类,介绍了国内外微惯性开关的研究概况,针对线性低g值微惯性开关闭合接触力小,触点接触弹跳,硅基导电性较差等共性问题进行了分析和讨论,提出了引入静电力或磁力以增大接触力,采用柔性接触结构以实现平稳接触,采用硅金属化工艺以实现良好的导电性等解决办法,可供微惯性开关结构设计时参考。     

微机械惯性仪表的原理结构与制造技术

介绍了微机械惯性仪表（包括微机械陀螺仪、微机械加速度计及微惯性测量组合）在世界各国的进展，阐述了它们所采用的结构方案、电路原理以及制造工艺，比较了各种主要制造技术的优缺点，提出了在我国开展这一领域研究有实用前途的技术途径     

先进微陀螺器件及微惯性测量单元最新研究进展

微纳加工技术与振动惯性技术的结合使惯性仪表技术发生了重大的变革,拓展了惯性技术在军用和民用领域的应用。高性能微惯性器件对军事装备和国民经济的发展起着越来越大的作用。该文基于美国国防高级研究计划局(DARPA)近年来在微惯性传感器技术领域的资助项目,综合研究了微机电系统(MEMS)谐振陀螺、微光学陀螺(MOG)、声表面波(SAW)陀螺等微惯性传感器技术及微惯性测量单元的最新发展现状,并对其发展面临的技术挑战进行了详细地分析与评述。     

MEMS－IMU的发展与应用

本文简要介绍了微机械电子系统惯性测量元件的基本原理、最新发展和性能指标，对其在导弹测试和评估试验中的应用作了描述，并指出了其发展方向。     

高性能微惯性器件单片集成技术

讨论了高性能微惯性器件单片集成技术。首先对单片集成MEMS技术的优势及面临的困难进行了讨论,并对目前主流的单片集成MEMS技术特点、工艺流程进行了介绍,最后,给出高性能微惯性器件单片集成技术的未来发展趋势。     

低g值微惯性开关防粘连结构的设计与制作

低g值微惯性开关是一种感受惯性加速度、执行开关机械动作的精密惯性装置。为了解决开关芯片在清洗干燥过程中的粘连问题,提高器件的成品率,提出了防粘连的梯形凸台结构。该结构尺寸约为135μm×135μm×20μm,采用玻璃无掩膜湿法腐蚀技术在深约85μm的玻璃封盖底部实现。通过减小质量块与玻璃封盖底部的接触面积,弱化液体表面张力和范德华力的影响,避免了粘连现象的发生,使得低g值微惯性开关芯片在清洗干燥环节的合格率约达95%。采用MEMS体硅加工工艺和圆片级封装技术,完成了带有防粘连凸台结构的低g值微惯性开关的制作。玻璃无掩膜湿法腐蚀技术具有工艺简单、便于操作等优点,它的成功应用较好地满足了器件产业化的要求,为批量研制低g值微惯性开关提供了可靠的工艺基础。     

微机械惯性仪表的原理结构与制造技术

介绍了微机械惯性仪表在世界各国的进展，阐述了它们所采用的结构方案、电路原理以及制造工艺，比较了各种主要制造技术的优缺点，提出了在我国开展这一领域研究有实用前途的技术途径。     

微机械陀螺仪的新进展及发展趋势

微机械陀螺仪是陀螺技术和微电子机械系统(MEMS)技术结合产生的新一代惯性器件。根据其工作原理和采用材料的不同,微机械陀螺可分为硅基微机械振动陀螺(Si-MVGs)、微机械压电振动陀螺(PVGs)和悬浮转子式微机械陀螺等。该文介绍了微机械陀螺仪的主要参数指标和应用,对硅基微机械振动陀螺(Si-MVGs)、微机械压电振动陀螺(PVGs)和悬浮转子式微机械陀螺的最新研究进展作了综合性报道,讨论了微机械陀螺未来的发展趋势。     

声学惯性技术的发展现状

声学惯性器件是一种新型的惯性器件,其具有工作频率高,品质因数Q值高,封装简单等特点,与其他惯性器件相比,声学惯性器件在体积和成本上拥有较大优势。该文在分析了国内、外相关声学惯性技术报道的基础上,对声学惯性技术的国内、外研究现状及应用情况等进行了综合报道和评述,并对声学惯性技术的未来发展趋势进行了展望。     

Micromachined integrated optical polarization-state rotator

We propose and demonstrate a monolithically integrated polarization-state rotator with MEMS technology. The proposed polarization-state rotator is composed of micromachined polarization beam splitters, micromirrors, and phase-shifters integrated on a single silicon chip. The experimental results show that micromachined devices can be useful in manipulating polarization states in lightwave systems, and therefore may play important roles in many polarization-state related applications, such as compact and low-cost polarization-mode dispersion (PMD) compensators.     

Micromachined inertial sensors

This paper presents a review of silicon micromachined accelerometers and gyroscopes. Following a brief introduction to their operating principles and specifications, various device structures, fabrication, technologies, device designs, packaging, and interface electronics issues, along with the present status in the commercialization of micromachined inertial sensors, are discussed. Inertial sensors have seen a steady improvement in their performance, and today, microaccelerometers can resolve accelerations in the micro-g range, while the performance of gyroscopes has improved by a factor of 10× every two years during the past eight years. This impressive drive to higher performance, lower cost, greater functionality, higher levels of integration, and higher volume will continue as new fabrication, circuit, and packaging techniques are developed to meet the ever increasing demand for inertial sensors     

线加速度计的现状和发展动向

线加速度计是惯性测量和导航系统的主要惯性元件之一。当前，传统的力再平衡摆式加速度计占据加速度计的主要市场。对加速度计输出数字化的迫切要求，推动了石英振梁式加速度计的发展。随着微电子加工技术向惯性技术的渗透，微硅加速度计已崭露头角并受到广泛的关注。     

The HARPSS process for fabrication of precision MEMS inertial sensors

The high aspect-ratio combined poly- and single-crystal silicon micromachining technology (HARPSS) and its application to fabrication of precision MEMS inertial sensors are presented. HARPSS is a single wafer, all silicon, front-side release process which is capable of producing 10–100's of microns thick, electrically isolated, 3-D poly- and single-crystalline silicon microstructures with various size air-gaps ranging from sub-micron to tens of microns. High aspect-ratio (>50:1) polysilicon structures are created by refilling 100's of microns deep trenches with polysilicon deposited over a sacrificial oxide layer. This technology provides features required for precision micromachined inertial sensors. The all-silicon feature of this technology improves long term stability and temperature sensitivity while fabrication of large area, vertical electrodes with sub-micron gap spacing will increase the sensitivity by orders of magnitude.     

石英微机械陀螺双轴减振设计

石英微机械陀螺是一种应用广泛的惯性测量元器件,对于常见的双轴微机械陀螺,在使用过程中需要同时测量两个轴向的角速度,但各敏感元器件间存在振动干扰。因此,需要减振结构降低这种干扰,若采用单轴减振结构,则每个敏感元器件都需要减振结构,导致双轴微机械陀螺的体积较大,为解决这一问题,设计了一种石英微机械陀螺双轴减振装置,采用新型减振体和减振橡胶垫环形分布的稳固结构,且通过有限元ANSYS软件仿真优化。结果表明,石英微机械减振装置可有效避开石英微机械敏感元器件的工作频率,减振效果良好,可达97%,减少了外界噪声,提高了石英微机械双轴陀螺的性能。     

Microsensor Integration Into Systems-on-Chip

Sensing systems-on-chip (SSoCs), combining micromachined sensing structures and microelectronic building blocks on a single chip, are reviewed. While single-chip pressure and inertial sensing systems have been commercially available for more than a decade, the recent expansion of SSoC into new application areas, ranging from chemical and biochemical sensing to atomic force microscopy, demonstrates the full potential of this microsensor integration approach. Available fabrication processes for integrated sensing systems are summarized, categorizing them into pre-, intra-, and post-CMOS approaches depending on the way the micromachining module is merged with the integrated circuit (IC) technology. Examples of SSoCs are presented to highlight the different integration options, ranging from cointegration of micromachined sensors with purely analog signal chains to microsystems with cointegrated digital signal processors and digital interfaces.     

Opportunities for microtechnology in metrology

The vast infrastructure of the microelectronic and microtechnological processing industry has yielded highly reproducible devices through reliable, reproducible, and fabrication-compatible processing techniques. Much development has occurred in bulk and surface micromachining, as well as in thin-film deposition techniques. Nevertheless, only a limited number of metrological applications have benefited from the use of this technology. Only two metrological applications that use microtechnology have been developed into commercially available devices: the JJA, as a DC reference, and the thermal RMS-to-DC converter, as an AC reference. Single electron tunneling devices and micromachined electrostatic RMS-to-DC converters are still under development. The accuracy requirements of the existing applications will continue to increase. This makes the development of on-chip references and on-chip self-test and self-calibration facilities essential. These microelectronic features, until now have remained unexploited in metrology, as well as in most other applications