评价金刚石刀具各向异性的周期键链模型

金刚石刀具机械研磨时会表现出很强的各向异性,因此寻找合适的模型来定量地描述该各向异性成为亟待解决的问题.通过深入分析金刚石刀具机械研磨的材料去除机理,使用周期键链(PBC)理论建立了定量描述金刚石刀具机械研磨各向异性的PBC模型.然后使用该模型对金刚石晶体的典型单形进行了晶面及其"好磨"和"难磨"方向的判定.在圆弧刃金刚石刀具研磨机上对{100}和{110}晶面进行了研磨实验,{110}晶面沿<100>方向研磨时最大塑性沟槽深度为19.8 nm,<110>方向为5.1 nm;{100}晶面<100>方向为9.8 nm,<110>方向为3.5 nm,与PBC模型的结论完全一致.最后,根据该模型和金刚石刀具使用中的磨损情况得到了优选的刀具晶面组合:前刀面和后刀面均选用{110}晶面.该PBC模型将为金刚石刀具的机械研磨提供有力的技术支持.     

单晶金刚石切削模具钢磨损机理的分子动力学仿真

为了研究金刚石刀具切削模具钢过程中刀具的磨损机理,建立了金刚石切削模具钢的仿真模型.通过观察切削过程中金刚石原子空间角度变化情况,分析刀具的切削温度、径向分布函数(RDF)和配位数,进一步阐明了金刚石纳米级切削铁的过程中刀具的微观磨损机理,并利用金刚石刀具的磨损实验验证仿真结果.结果表明:铁原子含有未配对d电子,并且铁在(111)面上与金刚石(111)面上的原子符合垂直对准原则,这两个原因导致铁易与金刚石原子形成化学键,与金刚石(111)面上符合垂直对准原则的铁原子同时驱动金刚石原子运动,促使金刚石结构转化为石墨结构.进行了金刚石磨损实验,结果表明:铁与金刚石中的碳产生碳化铁,刀具由金刚石结构转变为石墨结构,铁对金刚石石墨化具有催化作用.     

金刚石刀具研磨声发射信号的非高斯性特征分析

为确保金刚石刀具的制备效率和质量,采用声发射信号作为监测手段对金刚石刀具的精密研磨辅助进行过程调控.然而,该声发射信号的有效特征不能通过传统的信号处理方法辨识,实际研磨中仅能通过人工监听和操作经验定性判断.因此,本文从砂轮磨粒与刀具研磨面的微观接触特点出发,采用泊松过程模型对金刚石刀具研磨中声发射信号的激励机制进行了分析,阐明该信号具有非高斯性特征,采用线性系统理论阐明这一特征可被不失真地传输和接收,同时也给出了该信号高斯化近似的约束条件.最后通过工艺实验验证了该声发射信号的非高斯性特征在金刚石刀具研磨过程中的存在性,也证实了这一特征不受研磨速度和研磨压力等工艺参数的影响,而是与刀具研磨面的耐磨方向存在固有关联关系,从而为声发射信号监测在金刚石刀具研磨自动化系统中的合理应用奠定了方法基础.     

单晶锗纳米尺度分层多次切削的分子动力学模拟

运用分子动力学方法研究了单晶锗材料在多次切削过程中晶体结构的演化和相变.比较了在相同的总加工深度下采用两次不同预设切削深度加工单晶锗后表面/亚表面损伤程度、温度和应力的变化.研究结果表明:切削过程中切削区原子发生高压相变,原子结构从Ge-Ⅰ结构转变为无定形结构,使工件发生塑性变形,切屑以塑性方式去除;切削结束后由于压力...     

单晶金刚石机械研磨结合化学辅助机械抛光组合加工工艺

单晶金刚石因具有最高的硬度和最低的摩擦系数常被用来制备超精密刀具,而表面粗糙度是影响刀具寿命的重要指标.提出采用机械研磨结合化学辅助机械抛光的组合工艺抛光单晶金刚石.实验优化并确定的加工工艺如下:先用5μm和2μm金刚石粉研磨单晶金刚石表面,然后采用化学机械的方法去除机械研磨带来的损伤.用该工艺抛光单晶金刚石,表面粗糙度Ra可达0.8 nm(测量区域70μm×53μm).表面拉曼光谱分析表明化学机械抛光的表面只有1 332 cm-1拉曼峰.     

刀具磨损对于单点金刚石切削单晶硅的影响（英文）

单点金刚石切削(SPDT)是加工单晶硅最常用的方法,刀具磨损是影响加工表面或工件表面质量的重要因素,但是其中的磨损机制尚不清楚。为了研究刀具磨损对于切削机制的影响,本研究建立了单点金刚石切削单晶硅的分子动力学(MD)仿真模型。仿真结果表明随着刀具磨损程度的增加,切削力、表面损伤层厚度、位错分布面积、剪切变形和相变程度均增加。当使用已经磨损的刀具切削单晶硅时,挤压起主要作用,当使用未磨损刀具时,剪切变形起主要作用,工件表面损伤层主要是由硅的非晶相组成,使用磨损的刀具时产生的轴向力F_t约是未磨损刀具的四倍。模拟结果同时表明使用未磨损金刚石刀具时会导致工件发生塑性变形,当刀具发生磨损后切削过程中会伴随有脆性断裂。     

聚焦离子束加工单晶体金刚石刀具实验研究

作为超精密切削加工刀具的理想材料,单晶体金刚石材料的加工制造方法直接决定了刀具切削加工表面的精度和质量.由于金刚石材料具有明显的各向异性,在传统的金刚石刀具机械刃磨法中需要综合考虑制备工艺和刀具性能的协同关系,主要包括不同晶面表现出显著的物理机械性能差异、不同晶向存在显著的难磨和易磨方向等.本文针对聚焦离子束(FIB)技术加工金刚石刀具的过程中,金刚石材料性质对聚焦离子束加工质量、加工效率的影响规律等关键工艺开展了研究.研究发现,与传统的机械刃磨法相比,聚焦离子束加工是基于高能离子束的轰击溅射实现材料的去除,聚焦离子束加工中存在的级联碰撞现象显著弱化了金刚石材料各向异性的影响.     

高速空气静压轴承的精密动平衡

圆弧刃天然金刚石刀具是加工各类复杂曲面零件的重要工具．在其刃磨过程中,机床主轴的端面跳动严重影响刀尖圆度和刃口半径,进而影响到加工表面的完整性．基于金刚石刀具研磨机床空气静压轴承的动平衡原理,通过现场动平衡实验,能够将主轴轴向振动的最大幅值控制在0．084μm以下,从而可以刃磨出满足超精密加工要求的高质量金刚石刀具．刃磨出的金刚石刀具刃口半径值可以达到0．05μm以下,7／尖圆弧圆度提高到0．2μm以内．     

超精密切削单晶硅的刀具磨损机理

为了研究超精密切削单晶硅过程中金刚石刀具后刀面发生急剧磨损的机理,对单晶硅（111）晶面进行了超精密切削实验,并采用X射线光电子能谱分析仪对单晶硅已切削表面进行化学成分分析.实验结果表明：切削区域的高温高压导致金刚石刀具发生碳原子扩散磨损;切削过程中有碳化硅和类金刚石两种超硬微颗粒形成,而随着切削路程长度的逐渐增加,超硬微颗粒并不随之消失;碳化硅和类金刚石超硬微颗粒在金刚石刀具后刀面刻画和耕犁,从而产生沟槽磨损,直接导致金刚石刀具产生急剧磨损.     

单晶铜纳米切削过程的研究

采用分子动力学三维模型研究单晶铜纳米切削过程，工件原子间相互作用力和工件与刀具原子间相互作用力采用Morse势计算．通过分析切削过程中瞬间原子图像、切削力、单位切削力和轴向切削力与切向切削力比值。发现在整个切削过程中有位错产生，在加工表面发生弹性恢复，但未发生切屑体积的改变，切屑以原子团方式去除，单位切削力和轴向切削力与切向切削力的比值比传统切削时大得多．单晶铜纳米切削过程是位错在晶体中运动产生的塑性变形．     

金刚石刀具刃口的动态微观机械强度各向异性评价方法

为了评价金刚石刀具刃口动态微观机械强度的各向异性,对金刚石晶体的动态微观机械强度进行了理论建模,包括抗拉、剪切和抗压强度.通过比较分析动态微观机械强度的各向异性分布特征,提出了基于金刚石晶体动态微观抗拉强度的刀具刃口微观机械强度各向异性评价新方法,即刀具刃口强度评价因子.刀具刃口强度评价因子越高,其对应的刀具刃磨质量或刀具耐用度就越好.最后,分别采用刃磨工艺实验和刀具耐用度实验对刃口强度评价因子的评价适用性进行了验证,实验数据和理论分析结果具有很好的一致性.     

CVD金刚石材料在高性能刀具上的应用

介绍了在激发氢气和碳氢混合气体的“活化”发光状态下使金刚石沉积的CVD金刚石制造工艺原理和“厚膜”CVD金刚石的新工艺。由于CVD金刚石的聚晶结构使其具有超过天然金刚石断裂韧性的优异特点,因此可作为切削刀具材料使用。介绍了其在高性能切削刀具和修整刀具上的实际应用情况。     

Temperatures during the dry cutting of titanium alloy using diamond composites with ceramic bonding phases

In this paper the thermal properties of diamond composites with ceramic bonding phases, such as the Ti–Si–C system with nanometric Ti(CN) and TiB₂ are presented. The thermal conductivities of the materials were analyzed by the laser pulse method. In addition, computational simulations of the temperature dependence on the distance from the cutting edge were performed according to the finite element method for the investigated composites, commercial PCD, and hypothetical diamond monocrystal. Two cutting speeds were considered during the numeric computations: 100 and 200 m/min. To verify the simulations, the TNGA 160408 cutting insert, which was prepared from the investigated diamond composites and commercial material, was employed. Dry turning tests of titanium alloy were conducted. The temperatures during the machining processes were observed using a thermovision camera, and the surface roughness was measured after the tests. The computational simulations confirmed the strong dependence between the thermal properties of the cutting material and the temperatures within the cutting zone. The temperature measurements during the dry cutting tests reveal significantly higher temperatures than the temperature measurements achieved during the simulations.     

基于摩擦磨损实验的双盘直槽研磨方法的研具选材研究

双盘直槽（double-disc and linear-groove, DDLG）研磨方法是以1个平端面研磨盘和1个具有多条直沟槽的研磨盘为对磨研具,对圆柱滚子的滚动面进行精密加工的新方法。在加工过程中,圆柱滚子沿直沟槽连续供料,在2个研磨盘的摩擦力矩驱动下连续自转。研磨盘材料的选择是搭建双盘直槽研磨设备的基础。为了确定适用于双盘直槽研磨方法的研磨盘材料组合,基于摩擦磨损实验展开相关研究。首先,基于摩擦原理,分析了圆柱滚子的运动状态和研磨盘材料的摩擦特性对研磨效果的影响,并确定了研磨盘材料摩擦系数的筛选条件。然后,通过销-盘摩擦磨损实验测试了铸铁、45钢、黄铜、聚四氟乙烯（polytetrafluoroethylene, PTFE）、有机玻璃（polymethyl methacrylate, PMMA）、125%铸铁基固结磨料和125%树脂基固结磨料等多种备选材料在研磨条件下的摩擦系数、耐磨性和排屑性能。最后,搭建了双盘直槽研磨试验台,通过观察圆柱滚子的自转情况来验证基于摩擦磨损实验的研具选材方法的合理性。通过摩擦磨损实验测得,铸铁和45钢的滑动摩擦系数大,磨削效率高,但耐磨性差,适合用作大去除量场合的上研磨盘材料;有机玻璃的滑动摩擦系数大,耐磨性好,磨削效率高,适合用作小去除量场合的上研磨盘材料;聚四氟乙烯的滑动摩擦系数小,耐磨性好,可用作下研磨盘直沟槽材料;固结磨料的滑动摩擦系数变化大且易堵塞,不适合用作研磨盘材料。研究结果可为双盘直槽研磨设备的设计提供可行的研具选材依据。     

CHARACTERISTICS OF MICROCUTTING FORCE VARIATION IN ULTRAPRECISION DIAMOND TURNING

An investigation of the characteristics of microcutting forces in diamond turning of crystalline materials is presented. The characteristics of the cutting forces were extracted and analyzed using statistical and spectrum analysis methods. A series of cutting experiments were done on a copper alloy and copper single crystals with different crystallographic orientations. Experimental results indicate that there exists a dominant frequency component and a periodicity of fluctuation of the cutting forces per workpiece revolution in the diamond turning of a single crystal material. The periodicity is closely related to the crystallographic orientation of the material being cut. As the depth of cut increases, the influence of crystallographic orientation of the single-crystal materials on microcutting forces is found to be more pronounced. Moreover, the cutting force ratio between the mean thrust force and the mean cutting force is found to vary with the depth of cut, and a large ratio was observed at a small depth of cut. These findings help to explain quantitatively the periodic fluctuations of microcutting forces (and hence the materials-induced vibration) in ultraprecision diamond turning, which are not encountered in conventional machining.     

On the Lapping Mechanism of Sintered A12O3 Ceramic Surfaces Using Diamonds

In this paper the material removal mechanism during lapping of A1₂O₃ ceramic surfaces is discussed. Powders containing 95% A1₂O₃ were consolidated into green compacts by employing different compaction pressures. The green compacts were subsequently sintered and lapped using synthetic diamonds of different size. The morphology and the chemical composition of the polished surfaces and the lapping debris were examined by Scanning Electron Microscopy (SEM), Energy Dispersive x-ray Analysis (EDAX) and x-ray diffraction (XRD). Based on the experimental observations, the effect of the diamond grit size and of the initial porosity on the surface integrity and the material removal mechanism were investigated. An interpretation is proposed for the nature and the formation of the plastically deformed layer produced on the polished surfaces.     

A study of grinding damage in magnesium oxide single crystals

The sub-surface and surface damage produced by alumina and diamond grinding wheels has been studied as a function of material removal rate. Sub-surface damage is characterised in all cases by a discrete, dense layer of dislocations adjacent to the machined surface. The depth of the layer increases with material removal rate.The nature of the surface damage depends on the mechanism of material removal. As long as the cutting points are unloaded and the residue can escape the material is removed in a brittle manner. This is always the case for the diamond wheel and occurs for low rates of material removal with the alumina wheel. When the cutting surface is loaded with residue, the tool-workpiece interface temperature becomes so high that the material is removed by plastic flow. The finished surface is burnished. Unfortunately as the burnished surface cools down thermal quenching produces a network of surface cracks.