A timing controller embedded driver IC with 3.24‐Gbps eDP interface for chip‐on‐glass TFT‐LCD applications

This paper presents a timing controller embedded driver (TED) IC with 3.24‐Gbps embedded display port (eDP), which is implemented using a 45‐nm high‐voltage CMOS process for the chip‐on‐glass (COG) TFT‐LCD applications. The proposed TED‐IC employs the input offset calibration scheme, the zero‐adjustable equalizer, and the phase locked loop‐based bang‐bang clock and data recovery to enhance the maximum data rate. Also, the proposed TED‐IC provides efficient power management by supporting advanced link power management feature of eDP standard v1.4. Additionally, the smart charge sharing is proposed to reduce the dynamic power consumption of output buffers. Measured result demonstrates the maximum data rate of 3.24 Gbps from a 1.1 V supply voltage with a 7.9‐inch QXGA 60‐Hz COG‐LCD prototype panel and 44% power saving from the display system.     

TFT‐LCD driver IC with embedded non‐volatile memory for portable applications

Abstract— To improve the display quality and yield of the TFT‐LCD driver IC, non‐volatile multiple‐time‐programmable (MTP) memory, which consists of an EEPROM cell and our proposed sense amplifier and power control circuit (SP), was integrated into a TFT‐LCD driver IC. The proposed SP has a 30% smaller layout area and a 18% faster response time compared to that of the conventional SP. The proposed SP also has lower power consumption because it does not use a static current. The TFT‐LCD quality was also improved by tuning the characteristics of the driver IC and the panel with the VREF, OSC, and VCOM blocks, using non‐volatile MTP memory. When the display quality improved, the yield also improved, along with a reduction in the failure ratio of the display module, which consists of the driver IC and the panel. As a result, the TFT‐LCD driver IC with the non‐volatile MTP memory demonstrated improved display quality and a higher yield compared to conventional driver ICs without such a memory.     

LTPS circuit integration for system‐on‐glass LCDs

Abstract— A 3.5‐in. QVGA‐formatted driving‐circuit fully integrated LCD has been developed using low‐temperature poly‐Si (LTPS) technology. This display module, in which no external ICs are required, integrates all the driving circuits for a six‐bit RGB digital interface with an LTPS device called a “FASt LDD TFT” and achieves a high‐quality image, narrow frame width, and low power consumption. The LTPS process, device, and circuit technologies developed for system‐on‐glass LCD discussed. The development phase of LTPS circuit integration for system‐on‐glass LCDs is also reviewed.     

Super‐large‐sized TFT‐LCD (55 in.) for HDTV application

Abstract— We have developed the world's largest TFT‐LCD, which has a 55‐in.‐diagonal size. This LCD features a 1920 × 1080 (16:9) resolution for full‐HDTV images, 500‐nit luminance, 72% color gamut, and 12‐msec response time at all gray levels. The size of the panel (55 in.) was determined by the maximum efficiency of our fifth‐generation line (glass size: 1100 × 1250 mm). To overcome the limitation of size in photolithography equipment, a new stitcking‐free technology was applied in both the TFT and color‐filter side. And the super‐IPS mode was used as a wide‐viewing‐angle technology because it is suitable in the fabrication of large panels. In this paper, we present issues on both the fabrication and characteristics of the 55‐in. TFT‐LCD.     

In‐cell capacitive‐type touch sensor using LTPS TFT‐LCD technology

Abstract— An LTPS TFT‐LCD with an in‐cell capacitive‐type touch sensor has been proposed and prototyped. The embedded sensor in the pixel was designed to amplify the voltage change caused by capacitive coupling between the detection electrode and conductive object (user's finger). No touch force is needed for sensor actuation and no extra electrical connection for the counter‐substrate is needed. The validity of the observed voltage difference of the sensor output on the TFT substrate was examined. The proposed architecture is considered to be applicable to larger LCDs for various applications such as smartphones, automotive navigation systems, and mobile internet devices.     

A novel low‐power‐consumption all‐digital system‐on‐glass display with serial interface

Abstract— A new conceptual ultra‐compact LCD panel, which features a simple interface and lower‐power consumption by using low‐temperature polysilicon thin‐film transistor (LTPS‐TFT) technology has been developed. This panel is capable of switching operation modes based on an input command, and all the data are directly communicated with the circuit inside the panel through a Serial Peripheral Interface (SPI) protocol. The integration of the serial‐data‐receiver function on glass substrate has enabled the achievement of a significant reduction in the number of interface pins. Moreover, a low power consumption of 15 μW for a 2.26‐in. reflective LCD panel in combination with the technique of integrating a memory circuit in each pixel has been achieved.     

Thermal dimensional stability of glass substrates for poly‐Si TFT‐LCD application

Abstract— Thermal dimensional stability of Fusion‐drawn Corning Code 1737 glass was investigated at simulated thermal cycles for low‐temperature poly‐Si TFT fabrication. For low‐temperature poly‐Si TFT processes between 550 and 600°C, annealed Code 1737 is required to meet a typical thermal shrinkage requirement of less than 20 ppm. For super‐low‐temperature poly‐Si TFT processes between 400 and 450°C, Code 1737 meets the requirement in the unannealed state. Code 1737 glass having a high strain point of 666°C provides thermal capabilities as a substrate for low‐temperature poly‐Si TFT‐LCD applications.     

A novel pixel memory using integrated voltage‐loss‐compensation (VLC) circuit for ultra‐low‐power TFT‐LCDs

Abstract— A novel pixel memory using an integrated voltage‐loss‐compensation (VLC) circuit has been proposed for ultra‐low‐power TFT‐LCDs, which can increase the number of gray‐scale levels for a single subpixel using an analog voltage gray‐scale technique. The new pixel with a VLC circuit is integrated under a small reflective electrode in a high‐transmissive aperture‐ratio (39%) 3.17‐in. HVGA transflective panel by using a standard low‐temperature‐polysilicon process based on 1.5‐μm rules. No additional process steps are required. The VLC circuit in each pixel enables simultaneous refresh with a very small change in voltage, resulting in a two‐orders‐of‐magnitude reduction in circuit power for a 64‐color image display. The advanced transflective TFT‐LCD using the newly proposed pixel can display high‐quality multi‐color images anytime and anywhere, due to its low power consumption and good outdoor readability.     

A 470 × 235‐ppi poly‐Si TFT‐LCD for high‐resolution 2‐D and 3‐D autostereoscopic displays

Abstract— We have developed a 470 × 235‐ppi poly‐Si TFT‐LCD with a novel pixel arrangement, called HDDP (horizontally double‐density pixels), for high‐resolution 2‐D and 3‐D autostereoscopic displays. 3‐D image quality is especially high in a lenticular‐lens‐equipped 3‐D mode because both the horizontal and vertical resolutions are high, and because these resolutions are equal. 3‐D and 2‐D images can be displayed simultaneously in the same picture. In addition, 3‐D images can be displayed anywhere and 2‐D characters can be made to appear at different depths with perfect legibility. No switching of 2‐D/3‐D modes is necessary, and the design's thin and uncomplicated structure makes it especially suitable for mobile terminals.     

A study of roll‐printing technology for TFT‐LCD fabrication

Abstract— Recently, potential breakthrough technologies for low‐cost processing of TFT‐LCDs and new process developments for flexible‐display fabrication have been widely studied. A roll‐printing process using etch‐resist material as a replacement for photolithographic patterning was investigated. The characterization of the properties of patterns formed in roll printing, a method to fabricate cliché plates for fine patterns, and the design of a new formulation for resist printing ink is reported. The pattern position accuracy, which is one of the most important issues for the successful application of printing processes in display manufacturing was studied and how it can be improved by optimizing the blanket roll structure is explained. New design rules for the layout of the thin‐film‐transistor array was derived to improve the compatibility of roll printing. As a result, a prototype 15‐in.‐XGA TFT‐LCD panel was fabricated by using printing processes to replace all the photolithographic patterning steps conventionally used.     

Improved image quality of a high‐transflective tRGB‐t/rW TFT‐LCD

Abstract— This work combines a very simple resolution rescaling method, a well‐known RGB‐to‐YUV converting technique and a detection strategy into an optimized switchable mechanism in order to eliminate the problems of obvious zigzag profiles caused by the special layouts of transflective tRGB‐t/rW TFT‐LCDs and the poor reflective gray‐level contrast ratio effected by the minimum white data in the transmissive RGB‐W + subpixel rendering algorithms. Finally, a transflective tRGB‐t/rW TFT‐LCD is revealed not only to have no visible zigzag profiles and high visibility of reflective gray‐level contrast ratio, but also to have extreme reflectance and transmittance. The excellent optical performance of the proposed system makes it particularly suitable for single‐panel applications that need both high‐transmissive main displays and high‐reflective subdisplays.     

Electrical models of TFT‐LCD panels for circuit simulations

Abstract— As thin‐film‐transistor liquid‐crystal‐display (TFT‐LCD) panels become larger and provide higher resolution, the propagation delay of the row and column lines, the voltage modulation of Vcom, and the response time of the liquid crystal affect the display images now more than in the past. It is more important to understand the electrical characteristics of TFT‐LCD panels these days. There are several commercial products that simulate the electrical and optical performance of TFT‐LCDs. Most of the simulators are made for panel designers. However, this research is for circuit, system, and panel designers. It is made in a SPICE and Cadence environment as a commercial circuit‐design tool. For circuit and system designers, it will help to design the circuit around a new driving method. Also, it can be easily modified for every situation. It also gives panel designers design concepts. This paper describes the electrical model of a 15‐in. XGA (1024 × 768) TFT‐LCD panel. The parasitic resistance and capacitance of the panel are obtained by 3‐D simulation of a subpixel. The accuracy of these data is verified by the measured values of an actual panel. The developed panel simulation platform, the equivalent circuit of a 1 5‐in. XGA panel, is simulated by HSPICE. The results of simulation are compared with those of experiment, according to changing the width of the OE signal. The proposed simulation platform for modeling TFT‐LCD panels can be especially applied to large‐sized LCD TVs. It can help panel and circuit designers to verify their ideas without making actual panels and circuits.     

10‐bit source driver with resistor‐resistor‐string digital‐to‐analog converter

Abstract— A 10‐bit gray‐scale source driver using a resistor‐resistor‐string digital‐to‐analog converter (RR‐DAC) is proposed for a TFT‐LCD source driver. The 10‐bit RR‐DAC consists of an 8‐bit resistor‐string DAC and a two‐bit resistor‐string DAC without an intermediate unity‐gain buffer to isolate the parallel‐connected resistor string. The output deviation of the proposed source driver is less than ±3 mV. The chip area of the proposed 10‐bit source driver with an RR‐DAC is increased to 29% of that of an 8‐bit source driver.     

A new algorithm on the automatic TFT‐LCD mura defects inspection based on an effective background reconstruction

In this study, an automatic detection method for mura defects is developed based on an accurate reconstruction of the background and precise evaluation of the mura index level. To achieve this, an effective background reconstruction method is first developed to represent the brightness intensity of the display panel. As a result, any nonuniform brightness of the background can be removed effectively. Furthermore, the associated mura level is quantified based on the sensitivity of the human eye in order to alternatively grade the liquid‐crystal display panels. The main focus of this study is on the reconstruction of the background from the display under test image. The proposed method takes full advantage of the following three existing methods: low‐pass filtering, discrete cosine transform, and polynomial surface fitting. By applying the method to several case studies, we have shown that it is more effective compared with other existing methods in detecting various types of mura defects.     

New approaches to process simplification for large‐area high‐resolution TFT‐LCDs

Abstract— Novel process architectures are proposed for fabricating large‐area high‐resolution TFT‐LCDs with a minimal number of process steps. A low contact resistance between Al bus lines and the transparent conductive oxide layer, necessary for large‐area panels, is obtained by inducing a self‐formed inter‐metallic compound layer at the interface without using any additional buffer or capping layers. For enhanced brightness and resolution, a new TFT array structure integrated on a color‐filter substrate, referred to as an Array on Color Filter (AOC) structure, has been developed. Good‐quality TFTs were successfully constructed on the newly developed color filter for AOC within a sufficiently wide process margin. By adopting these novel technologies, a 15.0‐in. XGA prototype panel was fabricated and shows good display performance. Thus, these novel technologies have improved cost efficiency and productivity for TFT‐LCD manufacturing, and can be applied to the development of TFT‐LCDs of extended display area and enhanced resolution, benefiting from the low resistance bus lines, the high aperture ratio, and reduction in total process steps.     

Effects of localized warpage and stress on chip‐on‐glass packaging: Induced light‐leakage phenomenon in mid‐sized TFT‐LCD

Abstract— Mura defects become visible in a 13.3‐in. TFT‐LCD using chip‐on‐glass (COG) packaging when the thickness of the glass substrate is decreased from 0.5 to 0.3 mm. Mura, the non‐uniform brightness in LCDs, is caused by COG packaging due to the mismatch of the coefficient of thermal expansion (CTE) and Young's modulus between the glass substrate and the IC‐driver Si chips. In this paper, a 3‐D finite‐element‐analysis (FEA) model, coupled with transient thermal analysis is first established to examine the warpage and stress behavior in the upper‐glass‐plate post‐COG‐package processing for identifying the root causes of the light‐leakage phenomenon. Prior to that, the simulated warpage results are validated by surface‐contour measurement. Data and modeling results show that a low bonding temperature together with a low modulus in novel ACF materials can effectively eliminate Mura. Besides, thinner silicon or a shorter length of Si chips as drivers offers enhanced reduction in the localized warpage, and thus can be a practical and low‐cost solution for eliminating mura defects.     

Ultra‐FFS TFT‐LCD with super image quality,fast response time,and strong pressure‐resistant characteristics

Fringe‐field‐switching (FFS) devices using liquid‐crystal (LC) with a negative dielectric anisotropy exhibit high transmittance and wide viewing angle simultaneously. Recently, we have developed an “Ultra‐FFS” thin‐film‐transistor (TFT) LCD using LC with a positive dielectric anisotropy that exhibits high transmittance, is color‐shift free, has a high‐contrast ratio in a wide range, experiences no crosstalk and has a fast response time of 25 msec. In this paper, the device concept is discussed, and, in addition, the pressure‐resistant characteristics of the devices compared with that of the twisted‐nematic (TN) LCD is discussed.     

Thermal‐deformation characterization on the panel of TFT‐LCD TV. Part I: Mechanism of color distortion

Abstract— In this study we applied both numerical simulation and experimental validation to characterize the thermal deformation of the panel and the direct‐lit backlight unit (BLU) of a thin‐film‐transistor liquid‐crystal‐display television (TFT‐LCD TV). Heat emitted from cold‐cathode fluorescent lamps (CCFLs) causes thermal deformation of the LCD and extrudes the panel from the metal front shield at both upper corners: this finally leads to color distortion. In the numerical simulation based on thermal‐fluidic fields of the TFT‐LCD TV, natural convection of air that surrounded the CCFLs resulted in a high temperature at the upper‐right and upper‐left corners of the LCD panel. Numerical results were verified by temperature measurements with good consistency. Additionally, this study has established a measurement system to characterize the temperature distribution on both the BLU and panel and the thermal deformation of the panel causing the color distortion.     

Requirements for large‐sized high‐resolution TFT‐LCDs

Abstract— A 22‐in. prototype TFT‐LCD with a resolution of 200 pixels per inch and wide‐viewing‐angle capability has been developed and its requirements in terms of screen quality and technology will be discussed. An in‐plane‐switching mode with dual‐domain structure, post‐spacers, and high‐resolution process were implemented to achieve superior front‐of‐screen quality. And, also, in order to improve reliability and productivity, we developed a new injection method for liquid crystals which enabled us to eliminate injection holes.     

Ultra‐low‐power LTPS TFT‐LCD technology using a multi‐bit pixel memory circuit

Abstract— Two types of low‐temperature poly‐Si TFT LCDs, which integrate a multi‐bit memory circuit and a liquid‐crystal driver within a pixel, have been developed using two different TFT process technologies. Both a 1.3‐in. 116‐ppi LCD having a 2‐bit pixel memory and a 1.5‐in. 130‐ppi LCD having a 5‐bit pixel memory consume very little power, less than 100 μW, which indicates that this technology is promising for mobile displays.