Accurate determination of the band-offset of a quantum semiconductor structure from its capacitance-voltage profile: Application to an InP/Ga0.47In0.53As/InP single quantum well

We discuss the possible analysis of an electron distribution obtained by capacitance-voltage profiling for the determination of the conduction band offset of a single quantum well. We show that, for this method which requires only relatively light experimental equipment, a nonconsuming computational time interpretation can be set up within a quite satisfactory degree of accuracy. As an application, we report the study of a lattice matched InP/Ga_0.47In_0.53As/InP quantum well for which we get ΔE_c = (200±10) meV, in good agreement with other measurements upon this system.     

Valence band offset in HgTe/Hg1−xCdxTe superlattices

The valence band offset (Λ) between HgTe and CdTe has been determined by means of an optical investigation of (112)B oriented HgTe/Hg_1−xCd_xTe superlattices. Based on the fact that the difference in energy between the first heavy hole and the first light hole subband is to a good approximation due primarily to Λ, it has been shown that Λ=580±40 meV at 5K. In addition Λ has a significant temperature dependence with a linear coefficient of −0.34±0.02 meV/K, i.e., Λ is 480±40 meV at room temperature.     

Effect of successive implantation of Ag+(Cu+) and Xe+ ions on the recombination properties of CdxHg1−x Te crystals

The effect of successive double implantation of Ag⁺(Cu⁺) and Xe⁺ ions on the recombination properties of Cd_xHg_1−x Te (0.2<x<0.3) crystals has been investigated. It is shown that after implantation of ions of one chemical element, followed by diffusion thermal annealing at temperatures below 150–200 K, recombination through local levels lying 30±5 meV below the conduction band bottom dominates. Successive double implantation of Ag⁺(Cu⁺) and Xe⁺ ions followed by diffusion thermal annealing changes the course of the temperature dependence of the lifetime of the nonequilibrium charge carriers. It was determined that for Cd_xHg_1−x Te crystals with x⋍0.20–0.25 in the temperature interval 700–200 K the lifetime of the nonequilibrium charge carriers is low (τ<0.15 μs) and does not depend on the temperature. For Cd_xHg_1−x Te crystals with x⋍0.3 recombination of nonequilibrium charge carriers occurs through two types of levels: in the temperature range 140–200 K — deep levels E _t1⋍E _c −51 meV and at lower temperatures (77–140 K) — through shallower levels E _t2⋍E _c −(16±2) meV. Fiz. Tekh. Poluprovodn. 31, 786–789 (July 1997)     

Temperature dependence of residual stress in epitaxial GaAs/Si(100) films determined from photoreflectance spectroscopy data

In the temperature range T=10–300 K, photoreflectance spectroscopy was used to study the temperature dependence of residual stress in epitaxial n-GaAs films (1–5 μm thick, electron concentration of 10¹⁶–10¹⁷ cm⁻³) grown on Si(100) substrates. A qualitative analysis showed that the photoreflectance spectra measured in the energy region of the E ₀ transition in GaAs had two components. They consisted of the electromodulation component caused by the valence subband |3/2; ±1/2〉-conduction band transition and the low-energy excitonic component. The magnitude of stress was determined from the value of the strain-induced energy shift of the fundamental transition from the subband |3/2; ±1/2〉 with respect to the band gap of the unstressed material E ₀(T)-E ₀ ^{|3/2; ±1/2〉} (T). The increase in the energy shift E ₀-E ₀ ^{|3/2; ±1/2〉} from 22 ± 3 meV at 296 K to 29 ± 3 meV at 10 K, which was found in the experiments, gives evidence of an increase in biaxial stress with decreasing temperature. __________ Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 34, No. 1, 2000, pp. 73–80. Original Russian Text Copyright ? 2000 by Kuz’menko, Ganzha, Bochurova, Domashevskaya, Schreiber, Hildebrandt, Mo, Peiner, Schlachetzki.     

Variable temperature hall effect on p-Hg1−xCdxTe grown on CdTe and sapphire substrates by liquid phase epitaxy

Variable temperature Hall effect measurements have been made down to 9–10K on p-type Hg_1−xCd_xTe grown by liquid phase epitaxy on both CdTe and sapphire substrates. Carrier freeze-out was usually observed throughout the measured temperature range. For most samples, the hole mobility was well-behaved and exhibited a maximum at ˜ 35K. Values of acceptor ionization energy E_A and donor concentration N_D were estimated from the data, using a model assuming significant compensation, which provided a good fit to the low temperature data. In addition, values of N_D were also estimated from an analysis of the low temperature mobility using the hole effective mass as a parameter to provide reasonable agreement between the N_D values calculated from the Hall coefficient and mobility data. The measured carrier concentration is a result of close compensation between stoichiometric acceptors and donors, with N_D usually in the low-10¹⁷ cm⁻³ range. Average values of E_A for as-grown, undoped x = 0.32 layers on CdTe and sapphire substrates are 7.4 and 6.6 meV, respectively. An activation energy of 0.84 meV was determined for a Cu-doped x = 0.32 layer that was annealed in Hg vapor to reduce the number of Hg vacancies. The average E_A for undoped Hg-annealed x = 0.22 layers on CdTe substrates is 2.35 meV. Layers with x = 0.32 grown on sapphire substrates have average carrier concentrations of 2.92 (σ = 0.54) × 10¹⁶ cm⁻³, compared with 4.64 (θ = 1.26) × 10¹⁶ cm⁻³ for the same composition layers grown on CdTe substrates.     

Study of grown-in defects and effect of thermal annealing in Al0.3Ga0.7As and GaAs LPE layers

Studies of the grown-in deep-level defects in the undoped n-Al_xGa_1-xAs (x = 0.3) and GaAs epitaxial layers prepared by the liquid phase epitaxy (LPE) techniques have been made, using DLTS, I-V and C-V measurements. The effect of 300 °C thermal annealing on the grown-in defects was investigated as a function of annealing time. The results showed that significant reduction in these grown-in defects can be achieved via low temperature thermal annealing process. The main electron and hole traps observed in the Al_0.3Ga_0.7As LPE layer were due to the E_c-0.31 eV and E_v+0.18 eV level, respectively, while for the GaAs LPE layer, the electron traps were due to the E_c-0.42 and 0.60 eV levels, and the hole traps were due to E_v+0.40 and 0.71 eV levels. Research supported in part by the Air Force Wright Aeronautical Laboratories, Aeropropulsion Lab., Wright Patterson Air Force Base, Ohio, subcontract through SCEEE, contract F33615-81-C-2011, task-4, and in part by AFOSR grant no. 81-0187.     

Compositional, structural, optical and electrical characterization of CulnTe2 grown by the tellurization of stoichiometric Cu and in in the liquid phase

A new method to grow single crystals with stoichiometry close to 1:1:2 of CuInTe₂, an important member of the Cu-III-VI₂ family of semiconductors is described. This consists of tellurization in the liquid phase of stoichiometric Cu and In and later solidification under directional freezing. It is found from energy dispersive spectroscopy that the ingots obtained with the evaporation temperature (T_t) of Te at 590 and 635°C were very close to the ideal stoichiometry 1:1:2. Samples of all ingots obtained with T_t between 530 and 690°C, as studied by x-ray and differential thermal analysis, were of single phase having chalcopyrite structure and p-type conductivity. Optical and electrical characterization of different ingots were made. The acceptor ionization energy E_A and the density of states effective mass m _p ^* of the holes are estimated from the temperature dependence of the hole concentration p in samples of different ingots. m _p ^* = (0.78 ± 0.02) m_e agrees quite well with the reported value. From a combined analysis of the variation of E_A with p^1/3 and the knowledge of molecularity and valence stoichiometry of each sample, it is established that the shallow acceptor level observed in different samples with E_A (0) ⋍ 30 meV is due to V_In.     

OMVPE growth of In0.53Ga0.47As on InP using tertiarybutylarsine

We have successfully grown bulk In_0.53Ga_0.47As on InP using tertiarybutylarsine (TBA), trimethylindium and trimethylgallium. The growth temperature was 602° and the V/III ratio ranged from 19 to 38. Net carrier concentrations were 2 – 4 × 10¹⁵ cm^-3, n-type, with a peak 77 K mobility of 68,000 cm²/V. sec. Increasing compensation was observed in In_0.53Ga_0.47As grown at higher V/III ratios. PL spectra taken at 5 K revealed strong near bandgap emission at 0.81 eV—with the best sample having a FWHM of 2.5 meV. At lower energies, donor-acceptor pair transitions were evident. Strong and sharp 5 K PL emission was observed from InP/In_0.53Ga_0.47As/InP quantum wells grown with TBA.     

Magnetron Deposition of In Situ Thermoelectric Mg2Ge Thin Films

Thin films of the semiconducting compound Mg₂Ge were deposited by magnetron cosputtering from source targets of high-purity Mg and Ge onto glass substrates at temperatures T _s = 300°C to 700°C. X-ray diffraction shows that the Mg₂Ge compound begins to form at a substrate temperature T _s ≈ 300°C. Films deposited at T _s = 400°C to 600°C are single-phase Mg₂Ge and have strong x-ray peaks. At higher T _s the films tend to be dominated by a Ge-rich phase primarily due to the loss of magnesium vapor from the condensing film.␣At optimum deposition temperatures, 550°C to 600°C, films have an electrical conductivity σ _600 K = 20 Ω⁻¹ cm⁻¹ to 40 Ω⁻¹ cm⁻¹ and a Seebeck coefficient α = 300 μV K⁻¹ to 450 μV K⁻¹ over a broad temperature range of 200 K to 600 K.     

Current mechanisms in VLWIR Hg1−xCdxTe photodiodes

VLWIR (_c∼15 m to 17 m at 78 K) detectors have been characterized as a function of temperature to determine the dominant current mechanisms impacting detector performance. I_d−V_d curves indicate that VLWIR detectors are diffusion limited in reverse and near zero bias voltages down to temperatures in the 40 K range. At 30 K the detectors are limited by tunneling currents in reverse bias. Since the detectors are diffusion limited near zero bias down to 40 K, the R₀A_imp versus temperature data represents the diffusion current performance of the detector as a function of temperature. The detector spectral response measurement and active layer thickness are utilized to calculate the HgCdTe layer x value and the optical activation energy E_{a optical}. The activation energy, E_{a electrical}, obtained from the measured diffusion limited R₀A_imp versus temperature data is not equal to the activation energy, E_{a optical}, obtained from the spectral response measurement for all x values measured. E_{a electrical}=^*E_{a optical}, where ranges between 0.64 and 1.0 For cutoff wavelengths in the 9 m at 78 K, E_{a electrical}=E_{a optical}. E_{a electrical}=0.65^* E_{a optical} have been measured for_c=17 m at 78 K detectors. As the band gap energy decreases to values in the range of 70 meV and lower, it is reasonable to expect a more dominant role of band tailing effects on the transport properties of the material system. In such a picture, one would expect the optical band gap to be unmodified, whereas the intrinsic concentration could be enhanced from its value for the ideal semiconductor. Such a picture could explain the observed behavior. Further probing experiments and modeling efforts will help clarify the physics of this behavior.     

Transport and interface states in high-κ LaSiOx dielectric

The paper presents the results of capacitance-voltage, conductance-frequency and current-voltage characterization in the wide temperature range (140-300 K) as well as results of low temperature (5-20 K) thermally stimulated currents (TSC) measurements of metal-oxide-semiconductor (MOS) structures with a high-κ LaSiO_x dielectric deposited on p- and n-type Si(1 0 0) substrate. Interface states (D_it) distribution determined by several techniques show consistent result and demonstrates the adequacy of techniques used. Typical maxima of interface states density were found as 4.6 × 10¹¹ eV⁻¹cm⁻² at 0.2 eV and 7.9 × 10¹¹ eV⁻¹cm⁻² at 0.77 eV from the silicon valence band. The result of admittance spectroscopy showed the presence of local states in bandgap with activation energy E_a = 0.38 eV from silicon conductance band, which is in accord with interface states profile acquired by conductance method. Low-temperature TSC spectra show the presence of shallow traps at the interface with activation energies ranging from 15 to 32 meV. The charge carrier transport through the dielectric film was found to occur via Poole-Frenkel mechanism at forward bias.     

OMVPE growth of InP and Ga0.47ln0.53as using ethyldimethylindium

We report the organometallic vapor phase epitaxial (OMVPE) growth of InP and Ga_0.47In_0.53As using a new organometallic indium source, ethyldimethylindium (EDMIn), rather than the traditional sources triethylindium (TEIn) or trimethylindium (TMIn). EDMIn is a liquid at room temperature and its vapor pressure at 17° C was found to be 0.85 Torr using thermal decomposition experiments. The growth results using EDMIn were compared to those using TMIn in the same atmospheric pressure reactor. For InP, use of EDMIn resulted in a high growth efficiency of 1.3 × 10⁴ μm/ mole, which was independent of the growth temperature and comparable to the growth efficiency obtained with TMIn. The high growth efficiency is consistent with the observation of no visible parasitic gas phase reactions upstream of the substrate. The 4K photoluminescence (PL) spectra consist of a peak due to bound excitons and an impurity related peak 38 meV lower in energy. This impurity peak is ascribed to conduction band to acceptor transitions from carbon, due to the decreasing relative intensity of this peak with increasing V/III ratio. The relative intensity of the C impurity peak decreases by five times when the growth temperature is increased from 575 to 675° C, with a corresponding increase in the room temperature electron mobility from 725 to 3875 cm²/ Vs. For GalnAs lattice-matched to InP, use of EDMIn also resulted in a temperatureindependent high growth efficiency of 1.0 x 10⁴ μm/mole, indicating negligible parasitic reactions with AsH₃. The In distribution coefficient was nearly constant at a value of 0.9, however the run to run composition variation was slightly higher for EDMIn than for TMIn. The 4K PL showed donor-acceptor pair transitions due to C and Zn. The C impurity peak intensity decreased dramatically with increasing growth temperature, accompanied by an increase in the room temperature electron mobility to 5200 cm²/Vs. Overall, the growth of both InP and GalnAs using EDMIn was qualitatively similar to that using TMIn, although the room temperature electron mobilities were lower for the new source than for our highest purity bottle of TMIn.     

MIS characterization and modeling of the electrical properties of the epitaxial Caf2/Si(111) interface

CaF₂ layers have grown by molecular beam epitaxy on bothn-type andp- type Si(111). Capacitance-voltage (C-V) and current-voltage (I-V) measurements have been made on metal-insulator-semiconductor (MIS) capacitors to characterize these structures. For devices onp-type Si, C-V characteristics show only the insulator value of the capacitance over a wide range of applied voltages, indicating an accumulated surface. At room temperature, C-V characteristics ofn-type devices show the minimum value of the capacitance (corresponding to inversion) for small voltages, but modulation of the capacitance at larger voltages. At 200 K, this modulation is no longer present in the C-V curves. I-V curves show a rapid increase in the leakage current at relatively low fields at room temperature, and this leakage decreases dramatically with temperature. These results are largely independent of cleaning procedure, growth temperature, and the degree of misalignment of the substrate. The characteristics are modeled by assuming the Fermi level to be pinned at the valence-band edge, and the modulation in the C-V characteristics ofn-type samples to be driven by leakage currents. Work done at GE while a graduate student in the School of Electrical Engineering, Cornell University. Present address: Jet Propulsion Laboratory, 4800 Oak Grove Dr., Pasadena, CA 91109.     

Deep electron levels in undoped polycrystalline CdTe annealed in liquid Cd

The method of deep-level transient spectroscopy (DLTS) is used to determine the set of deep electron levels in undoped n-CdTe polycrystals grown by chemical synthesis from vapor phase in highly nonequilibrium conditions and then subjected to annealing in liquid Cd. After annealing, the electron concentration is found to increase from ∼10⁸ to 10¹⁵ cm⁻³. Electron traps with deep levels E ₁ = 0.84 ± 0.03 eV and E ₂ = 0.71 ± 0.02 eV with total concentration ∼10¹⁴ cm⁻³ are dominant in the DLTS spectrum. The role of grain boundaries and intrinsic point defects in formation of deep-level centers and their effect on the value of conductivity after annealing are discussed. A relation between the level E ₁ and complexes of intrinsic point defects and relation of the level E ₂ to the Cd _i point defect are considered.     

Oxygen and Erbium related donor centers in Czochralski grown silicon implanted with erbium

The Hall effect measurements were conducted on Czochralski-grown silicon after implantation of erbium and two-step annealing at 700 °C and 900 °C. After the first step the formation of oxygen-related shallow donors was observed at E _c in the range 20–40 meV and erbium-related donor centers at ≈E _c -70 meV and ≈E _c -120 meV. Along with the same oxygen-related shallow thermal donors and donor centers at ≈E _c -70 meV, other donor centers at ≈E _c -150 meV are formed following the 900°C anneal, instead of those at ≈E _c -120 meV. The new donor states are of particular interest because of their possible involvement in the photoluminescence process. The obtained results for erbium-implanted silicon are compared with some fragmentary DLTS data found in the current literature on the donors with ionization energies less than 0.2 eV. Fiz. Tekh. Poluprovodn. 33, 1192–1195 (October 1999)     

Electrical properties of He+ ion-implanted GaInP

The electrical properties of high resistivity GaInP layers produced by He⁺ ion implantation have been studied. Thick high-resistivity layers (ρ > 10⁷ Ω-cm) were obtained using multi-energy implants (80 keV, 120 keV, and 150 keV). Current-voltage (I-V) measurements of mesa diodes with two ohmic contacts indicate that in the temperature range from 200 to 300K, the dominant current flow mechanism in both n-type and p-type implanted materials is Poole-Frenkel emission, especially in the range of high electric field (>10⁵ V/cm). The thermal activation energy E_a and the potential barrier height Φ_o of the generated deep levels are 0.16±0.005 eV and 0.33±0.005 eV, respectively. At low temperature, the hopping current dominates at low and moderate applied electric fields, and the I-V curves show an ohmic characteristic. The high-temperature annealing behavior of the implanted GaInP indicates that the compensation of free carriers in the material is dominated by damage-related levels, which are annealed out at high temperatures. In regard to typical alloying cycles of metal contacts in device fabrication, it is worth noting that the resistivity is still as high as 2 × 10⁸ Ω-cm for n-type samples (5 × 10⁷ Ω-cm for p-type) after 350°C annealing, which suggests that multi-energy He⁺ implantation is suitable for implant isolation in the GaInP device technology.     

Comparative measurements of the electron emission behavior of Si3N4-InGaAs interfaces prepared by remote and direct PECVD

The effects on the insulator-semiconductor interface of two different deposition methods of silicon nitride on In_0.53Ga_0.47As have been electronically studied using capacitance-voltage (CV) and deep level transient spectroscopy (DLTS) measurements. The CV data showed very similar behavior on both types of sample, but the DLTS results were surprisingly different. The behavior of samples fabricated using direct plasma enhanced chemical vapor deposition (PECVD) can be explained by electronic emission from interface states to the conduction band minimum. However, the remote PECVD method gave a DLTS peak corresponding to electron emission with a low activation energy ≈0.13 eV. As with the direct PECVD samples, the thermal activation energy decreased as the bias was made more positive, but in this case the change in emission energy was only a fraction of the shift in the Fermi level position. A model is proposed involving the concepts of lattice relaxation and hole capture to explain this behavior.     

Formation of aluminum oxide films from aluminum hexafluoroacetylacetonate at 350–450° c

A study of the thermally activated decomposition of Al(hfa)₃ (aluminum hexafluoroacetylacetonate) from the gas phase to form Al₂O₃ on silicon substrates is reported. The decomposition process was carried out in an open tube atmospheric pressure reactor in either argon or oxygen/argon mixtures in the temperature range, 350–450° C. The chemical vapor deposition process resulted in the formation of aluminum oxide films in all instances. The dielectric strength of Al/Al₂O₃/Si capacitors which received a post-metal anneal, but did not receive a high temperature annealing treatment, with aluminum oxide films prepared from Al(hfa)₃ in argon, was found to be in the range 2–6 MV/cm. The difference between the flatband voltage of the MOS structures and the metal-silicon work function difference was positive, indicative of a net negative oxide charge with a density of approximately 3 × 10¹¹ – 3 × 10¹² cm^-2, assuming the charge is located at the oxide-silicon interface. Decomposition of Al(hfa)₃ was also carried out in oxygen/argon mixtures with the oxygen concentration in the range 10–60 vol %. This process led to the deposition of aluminum oxide films with breakdown fields in the range 8–9 MV/cm. However, the flatband voltages of the Al/Al₂O₃/Si capacitors were even more positive than those obtained with Al₂O₃ formed in pure argon. High temperature (800–1000° C) oxygen or nitrogen annealing treatments of alumina films deposited in either argon or oxygen/argon mixtures were evaluated from the point of view of their influence on the oxide film properties. In particular, an annealing process in oxygen at 1000° C for 15 min was found to result in a reduction of the net negative oxide charge, and an improvement of the dielectric strength of films deposited in argon. Films formed in oxygen/argon mixtures did not change appreciably following oxygen annealing, as far as breakdown fields are concerned, but the oxide net negative charge was reduced. As in an earlier study by the authors, of copper film deposition from Cu(hfa)₂, it was found that essentially carbon free films could be obtained under appropriate conditions.     

Electron thermal emission rates of nickel centers in silicon

The majority carrier thermal emission rates of nickel levels in the depletion region of reverse biased silicon p⁺ nn⁺ junctions have been investigated using the admittance spectroscopy technique. We have found two levels associated with nickel in n-type silicon. The “thermal activation energies” have values of E_C − 360 ± 10 meV and E_C − 570 ± 10 meV.