化学机械抛光过程中扭矩的模型分析与试验研究

提出了一个计算化学机械抛光（Chemical Mechanical Polishing,CMP）过程中硅片所受扭矩的模型,并通过CMP过程中摩擦力和扭矩的在线检测试验进行了验证。试验结果表明该扭矩计算模型可以较好地描述CMP过程中硅片所受扭矩的特征。该研究可以为基于抛光头旋转轴扭矩变化的CMP终点检测方法提供理论依据。     

脉冲涡流热成像图像的BEMD提升小波阈值去噪

在脉冲涡流热成像检测中,有效抑制红外热图的噪声是最终提取特征量识别缺陷的关键环节之一。将提升小波阈值去噪的思想运用到二维经验模态分解(BEMD)中,提出了一种基于BEMD的提升小波阈值去噪方法。针对传统软、硬阈值法的局限性,引入包括带有可变因子的隶属函数的模糊阈值处理方法。将该方法运用于脉冲涡流热成像信号的实际消噪处理,实验结果表明,该方法与小波阈值去噪相比,去噪效果更明显,图像的细节特征更清晰。     

基于超声信号的镁合金构件缺陷现代信号处理的研究

为了准确检测出合金类构件内部存在的缺陷,本文针对镁合金构件的近中心缺陷和近表面缺陷,分别采用探头垂直入射和偏心入射的超声检测方式,然后运用自适应滤波去噪信号处理方法对原始信号及特征回波信号进行去噪处理。     

CMP在线光学终点检测算法研究及应用

介绍了化学机械抛光(CMP)中表面膜层为金属和非金属晶圆的在线终点检测原理.研究了窗口检测算法,实时检测光强变化趋势,抓取趋势特征点,从控制抛光过程,实现CMP在线终点检测.实验结果表明,检测算法可达到预期的检测精度,能够满足生产实际需要.     

非高斯非平稳背景噪声中的信号检测研究

非高斯非平稳噪声的干扰问题在通信过程中是经常出现的。在非高斯非平稳背景噪声下,以前经常使用经典信号检测理论对信号进行检测,很难取得较为理想的效果。基于小波变换以及小波去噪原理,提出一种新的阈值处理方法,该方法能有效地去除噪声,使有用信号能从非高斯非平稳噪声中检测出来。实验结果表明,新方法不但去噪效果明显,而且获得了较高的分辨率和信噪比,检测性能较为理想,是对信号检测理论的一种有效推广。     

基于OES的等离子体刻蚀过程

光学发射光谱(OES)诊断技术是高密度等离子体刻蚀工艺过程的关键技术,OES信号作为一种实时信号可以用来预测刻蚀过程的进展程度和判断刻蚀性能的好坏.在自行研发的等离子体刻蚀机平台上,采用美国海洋公司的OES传感器系统,采集多晶硅刻蚀工艺中所产生的OES信号,利用主元素分析法(PCA)对OES数据进行压缩处理,提高了实时信号的快速处理能力.对实验数据的分析表明:波长为405 mn的OES谱线可以明确显示出等离子体刻蚀进程,是一条表征等离子体刻蚀过程的状态检测及终点检测控制的特征谱线.在此基础之上,提出了基于PCA法的终点检测算法,用以判断刻蚀终点.     

CMP综合终点检测研究

在对电机电流终点检测、光学终点检测以及抛光垫温度检测三种终点检测技术的检测原理、特点及其装置分析讨论的基础上,对终点检测硬件电路的设计效果进行了验证。采用STRASBAUGH的Nvision软件进行移植,设置其增益、漂移量、数字过滤器的频率和类型。以W作为抛光对象,以TiN作为阻挡层,优化了工艺参数菜单设置并实施抛光,在实时形成信号曲线的基础上,由主机综合三种终点检测信号的情况,判断出精准的终点位置,为CMP抛光终点的监测和抛光垫的修整和更换提供科学的依据。     

一种改善微弱信号信噪比的小波变换消噪法

通过分析小波变换处理信号噪声的方法及其在微弱信号检测方面的不够完善之处,提出适合于极低信噪比条件下小波消噪法的信号检测原理和方法,即通过构造具有可调功能的阈值函数以及对小波分解系数处理方式的优化设计等方法,在强背景噪声中提取出微弱的信号特征信息,从而实现微弱信号的检测.最后通过Matlab仿真验证该方法的实验效果,理论和实验结果均表明此方法能较大幅度地改善信号比.这里阈值构造过程中充分考虑到了信噪比因素的影响,并对小波分解系数的处理也进行了合理优化,从而使得去噪效果有较大的改善.     

基于VMD和小波分析的油液磨粒信号去噪方法

油液金属磨粒检测传感器通过监测机械设备油路中的金属磨粒,可实时反馈机械设备故障特征。为了提升油液磨粒检测传感器的检测精度,文章提出一种针对油液磨粒信号的变分模态分解（Variational Mode Decomposition,VMD）结合小波分析的去噪方法。首先,通过计算各模态分量与原始油液磨粒信号的相关系数确定最优K值;其次,对原始信号进行VMD分解,筛选出特征分量;最后,利用小波阈值去噪方法对特征分量进行降噪处理。实验结果表明,与经验模态分解（Empirical Mode Decomposition,EMD）和传统小波去噪方法相比,本方法的信噪比最高,均方根误差最小,能量占比最大,在油液磨粒信号降噪效果中表现最好,有利于提升磨粒检测传感器的检测精度。     

一种改进的多特征值语音端点检测方法研究

为了提高语音识别系统中语音端点检测的准确性,提出一种改进的多特征值语音端点检测方法.新方法首先对信号进行小波分解及小波去噪处理,对去噪后小波子带系数进行短时能量与基音周期两特征值的提取,综合考虑两特征值的大小来进行语音端点检测.实验证明,改进的检测方法提高了端点检测的抗噪性及准确度.     

A signal processing method for the friction-based endpoint detection system of a CMP process

A signal processing method for the friction-based endpoint detection system of a chemical mechanical polishing(CMP) process is presented.The signal process method uses the wavelet threshold denoising method to reduce the noise contained in the measured original signal,extracts the Kalman filter innovation from the denoised signal as the feature signal,and judges the CMP endpoint based on the feature of the Kalman filter innovation sequence during the CMP process.Applying the signal processing method,the ...     

Model analysis and experimental investigation of the friction torque during the CMP process

A model for calculating friction torque during the chemical mechanical polishing(CMP) process is presented,and the friction force and torque detection experiments during the CMP process are carried out to verify the model.The results show that the model can well describe the feature of friction torque during CMP processing. The research results provide a theoretical foundation for the CMP endpoint detection method based on the change of the torque of the polishing head rotational spindle.     

Endpoint detection method for CMP of copper

A novel method to detect the endpoint during Cu-CMP has been developed. It is based on the determination of the Cu concentration within the slurry on the pad that has just polished the wafer. The measurement of the ion concentration is performed using a capillary and an ion-selective electrode. The endpoint of the CMP process is detected by the decrease of Cu ion concentration, which is displayed by an decreased potential at the electrode. An experimental set-up has been established which can be applied to a commercial polishing tool. The method has been tested under various process conditions. The new endpoint detection system revealed to work independently of the polishing tool and the wafer size.     

基于传统能零比和自相关函数主副峰结合的端点检测法

端点检测是语音信号处理中的一个非常重要的步骤,其准确度直接影响语音信号处理的速度和效果.传统的端点检测方法可以在高信噪比环境下准确地检测语音端点,但在低信噪比情况下,传统的端点检测特征参数不能充分描述语音信号的特征,导致端点检测效果的下降.为此,本文提出了一种对语音进行改进的多窗谱减法降噪和中值滤波减少低信噪比环境下无...     

Mechanical and tribological properties of interlayer films for the damascene-Cu chemical-mechanical planarization process

Chemical-mechanical planarization (CMP) has emerged as the most preferred method to achieve excellent global and local planarity in the damascene-Cu process. As the feature sizes shrink, understanding the fundamentals of CMP is critical for successful implementation of the CMP process in sub 0.35-μm technology. It is also important to understand the effects of mechanical and tribological properties of the interlayer films on the CMP process to conduct successful evaluation and implementation of these materials. In this paper, we present the mechanical and tribological properties of various interlayer films (SiO₂, SiC, low-k B, low-k C, Ta, and Cu) and discuss the CMP process of the films in an alumina-based Cu slurry. Mechanical properties were evaluated using a nanoindentation technique. A micro-CMP tester was used to study the fundamental aspects of the CMP process. The coefficient of friction (COF) was measured during the process and was found to decrease both with downward pressure and with platen rotation. An acoustic sensor, attached to the substrate carrier, was used to monitor the process, and the signal was recorded to examine the difference in polishing behavior of these films. The acoustic emission (AE) signal was found to increase with the increase in platen velocity and pressure. Effects of machine parameters on the polishing behavior of the interlayer films and the correlation of mechanical properties with tribological properties have been discussed.     

卡尔曼滤波在iBeacon室内定位系统中的应用

为了抑制iBeacon信号在传播过程中由于人员扰动、多径效应等引起的噪声,以及移动定位过程中定位结果的不稳定,在iBeacon室内定位系统中引入了卡尔曼滤波算法分别对采集到的iBeacon信号与移动定位结果进行处理.首先通过卡尔曼滤波对采集的信号进行处理,降低了信号噪声,提高了信号的质量,其次应用卡尔曼滤波对移动定位结果进行二次处理,提高了移动定位结果的稳定性与精度.实验结果表明,在办公室环境下采用卡尔曼滤波进行处理后可将1 m以内的定位精度提高到80%以上.     

光电稳定跟踪平台中微机电陀螺滤波方法研究

根据微机电陀螺的实测数据,分析了其噪声特性,建立了微机电陀螺零漂的AR模型.研究了基于Kalman滤波的陀螺去噪算法,给出了去噪结果,分析了Kalman滤波不能够在微机电陀螺信号去噪中获得较好效果的原因.在此基础上,将基于阈值决策的小波去噪方法应用于微机电陀螺的信号处理中,给出了滤波结果.实测结果表明由于后者不依赖于噪声的精确模型,根据噪声在不同频段的统计特性采用阈值决策滤波,具有更好的抑噪效果.最后给出了两种滤波算法的比较结果.     

A Maximum Likelihood Method for Estimating EEG Evoked Potentials

The problem of EEG evoked potential (EP) estimation is basically one of estimating a transient signal embedded in nonstationary mostly additive noise; and as such it is well suited to a nonstationary estimation approach utilizing, for example, the Kalman filter. The method presented in this paper is based on a model of the EEG response which is assumed to be the sum of the EP and independent correlated Gaussian noise representing the spontaneous EEG activity. The EP is assumed to vary in both shape and latency; the latter is assumed to be governed by some unspecified probability density; and no assumption on stationarity is needed for the noise. With the model described in state-space form, a Kalman filter is constructed, and the variance of the innovation process is derived; a maximum likelihood solution to the EP estimation problem is then obtained via this innovation process. The method was tested on simulated as well as real EEG data.     

应用卡尔曼滤波技术的激光熔覆宽度检测

对金属零件激光成形过程闭环控制系统中,熔覆宽度的检测技术进行了研究,提出了一种基于卡尔曼滤波技术的熔覆宽度检测方法。利用视觉传感系统获取激光加工过程中的熔池图像,经过图像处理与图像标定求熔覆宽度作为参量建立系统状态方程和测量方程,应用卡尔曼滤波算法对图像上的熔宽和熔宽变化进行状态估计,得到最小均方差条件下的熔覆宽度最佳预测值,从而减小过程噪声和测量噪声引起的熔覆宽度测量偏差,测量平均误差由0.028 mm降为0.009 3 mm,实现加工过程熔覆宽度的精确检测。实验结果证明:将卡尔曼滤波技术应用到熔覆宽度检测过程中可以大大提高熔宽检测精度。