Planar-junction, top-illuminated GaInAs/InP pin photodiode with bandwidth of 25 GHz

A top-illuminated GaInAs/InP pin photodiode has been produced in a planar-junction configuration, which combines high reliability (no change in dark current over 4700 h at 175 degrees C) with the widest bandwidth (25 GHz), and highest quantum efficiency (80% at 1.55 mu m), yet reported for this type of device.<>     

High-speed front-illuminated GaInAsP/InP pin photodiode

Describes a high-speed front-illuminated GaInAsP/InP pin photodiode for use at the optical wavelength of 1.3 μm. The device is grown on an n⁺-InP substrate and uses polyimide both as a passivation layer and as a bonding pad holder to reduce parasitic capacitance. An optoelectronic sampling measurement of the impulse response shows a pulsewidth (FWHM) of 28 ps. A 3 dB bandwidth in excess of 18 GHz has been achieved     

Easily manufactured high-speed back-illuminated GaInAs/InP p-i-n photodiode

A back-illuminated planar GaInAs/InP p-i-n photodiode has been fabricated with a simple fabrication process to obtain a high-speed detector. The photodiode has a capacitance as low as 54 fF, a dark current of about 3 pA, and a quantum efficiency of 74% at a 1.55- mu m wavelength. A cutoff frequency of 31 GHz was obtained when the photocurrent was about 500 mu A and the bias voltage was -10 V.<>     

Waveguide-integrated pin photodiode on InP

An InGaAs PIN photodiode was vertically integrated with an inverted optical rib waveguide in InGaAsP. Guided light was transferred to and absorbed by the photodiode at a rate of 0.07dB/?m. For detectors with sufficient length (>300?m) a responsivity of 0.81 A/W was achieved at 1.3 ?m wave-length.     

Cryogenic performance of a high-speed GaInAs/InP p-i-n photodiode

The cryogenic performance of a high-speed GaInAs/InP p-i-n photodiode, with graded bandgap layers at the heterostructure interfaces, was investigated for the first time. DC measurements show that the dark current of the diode decreases sharply as the temperature decreases from 300 to 200 K. A factor of 1000 in dark current reduction was found for this photodiode, when it was cooled from room temperature to about 150 K. Similar modulation bandwidths were found for this device for temperatures between 9 and 300 K, with a bandwidth greater than 20 GHz. No degradation was found in performance at cryogenic temperature compared to room temperature. This enables direct integration of high-speed photodiodes with superconductive and other cryogenic electronics     

Planar embedded InP/GaInAs p-i-n photodiode for very high-speed operation

Planar embedded InP/GaInAs p-i-n photodiodes have been fabricated by using preferential ion-beam etching for planarizing and embedding the p-i-n photodiode structure in a semi-insulating InP substrate. The stray capacitances caused by a bonding pad and an interconnection have been markedly reduced, which resulted in extremely low capacitance of less than 0.08 pF for a diameter of 20 μm of photosensitive area. It has been demonstrated by an optical heterodyne technique that the photodiode exhibits a maximum cutoff frequency of 14 GHz. This result was analyzed taking the depletion layer thickness into account and has been found to be dominated by the carrier transit time. The demonstrated low capacitance and high-speed response result indicates the suitability of the p-i-n photodiodes not only for a discrete p-i-n photodiode but also for optoelectronic integration.     

Flip-chip planar GaInAs/InP p-i-n photodiode array for paralleloptical transmission

A back-illuminated planar GaInAs/InP p-i-n photodiode array with a simple fabrication process was developed for application to parallel optical transmission. Four p-i-n photodiodes were integrated in the array. The average capacitance and dark current were as low as 0.12 pF and 8 pA, respectively, at -5 V. At a 1.55-μm wavelength, the quantum efficiency of each photodiode was over 80%. The cutoff frequency was 8-10 GHz with four photodiodes when the bias voltage was -3 V and the load resistance was 50 Ω. Crosstalk between channels was -12 dB at the cutoff frequency and -45 dB at 1 GHz     

InGaAs pin photodiode fabricated on semi-insulating InP substrate for monolithic integration

A low-dark-current high-speed InGaAs PIN photodiode suitable for optoelectronic monolithic integration has been fabricated by LPE method on semi-insulating InP substrate. The photodiode has the lowest reported dark-current density of 2.5 × 10?6 A/cm2 at ?10 V in this material system. At the operating voltage of ?5 V, an external quantum efficiency of >90% at 1.3 ?m and >83% at 1.55 ?m, a rise time of <35 ps and an FWHM of <45 ps have been measured.     

Electrorefraction in GaInAs/InP multiple quantum wellheterostructures

Reports the first absolute measurement of electric-field-induced changes in refractive index in GaInAs quantum well heterostructures. Even for wavelengths as far as 40 meV below the absorption edge, excitonic effects dominate electro-optic phase modulation. This effect close to resonance yields index changes two orders of magnitude larger than in bulk material. The authors find that the size of the index change, its dependence on applied voltage, and its behaviour with wavelength are well described in terms of the quantum confined Stark effect on excitonic absorption     

High reliability planar-type GaInAs/InP heterostructure avalanchephotodiodes

High-temperature, long-term life tests of GaInAs/InP heterostructure avalanche photodiodes have been carried out to establish criteria for high reliability photodetectors in 1.55 μm-wavelength optical submarine cable systems. A failure rate of less than 0.2 FIT at 10°C was predicted for the first time with an activation energy of 0.7 eV     

V-band high-efficiency high-power AlInAs/GaInAs/InP HEMT's

The authors report on the state-of-the-art power performance of InP-based HEMTs (high electron mobility transistors) at 59 GHz. Using a 448-μm-wide HEMT with a gate length of 0.15 μm, an output power of 155 mW with a 4.9-dB gain and a power-added efficiency of 30.1% were obtained. By power-combining two of these HEMTs, an output power of 288 mW with 3.6-dB gain and a power-added efficiency of 20.4% were achieved. This is the highest output power reported with such a high efficiency for InP-based HEMTs, and is comparable to the best results reported for AlGaAs/InGaAs on GaAs pseudomorphic HEMTs at this frequency     

Avalanche photodiode with sectional InGaAsP/InP charge layer

An InGaAs/InP avalanche photodiode (APD) with a sectional InGaAsP/InP charge layer at the heterointerface between the InGaAs absorption and InP multiplication region has been designed, fabricated and tested. We demonstrate a new APD structure that utilizes the sectional 140 nm thin charge layer and a 500 nm thin multiplication layer. The band diagram, electrical field distribution and current-voltage (I-V) characteristics up to punch-through voltage have been simulated. The fabricated mesa structure photodiode shows responsivity 0.9 A/W at 1310 nm at 20 V and avalanche gain up to 10 near breakdown voltage 36 V. The measured results revealed that the sectional charge layer could be used for control of the electric field profile in the APD structure.     

High efficiency GaInAs/InP heterojunction IMPATT diodes

Heterojunction IMPATT diodes make it possible to produce new high conversion efficiency devices, combining a low bandgap semiconductor for the avalanche zone with a large bandgap material for the drift region. In this study, the heterojunction GaInAs/InP which seems particularly attractive is used in various structures. The theoretical predictions of performances are determined by a computer simulation which takes into account the main limitation effects of IMPATT diodes and the influence of particular physical phenomena due to the use of heterojunctions and semiconductors, mainly the influence of injection currents. Potential performances of the proposed structure appear very attractive especially in the millimeter-wave range using a MITATT mode (Mixed-Tunneling-Avalanche-Transit-Time) by combining tunneling current and avalanche multiplication injections.     

Flip-chip planar GaInAs/InP p-i-n photodiodes-fabrication andcharacteristics

New flip-chip planar GaInAs/InP p-i-n photodiodes have been fabricated as an array. We describe the structure of the photodiode, the design of a microlens, the fabrication processes, characteristics, and the optical fiber-coupled modules. This photodiode satisfied the requirements for a small junction capacitance and low dark current, good optical fiber coupling, and easy fabrication. We obtained a low dark current with good reproducibility by using two layer polyimide and SiN passivation films. A microlens with a 50 μm φ to 120 μm φ aperture could easily be fabricated with an InP-substrate. By electroplating, flip-chip metal bumps were directly formed on the active region of the photodiode for the first time     

高速InP/InGaAs雪崩光电二极管

采用分层吸收渐变电荷倍增(SAGCM)结构,通过两次扩散、多层介质淀积、AuZn p型欧姆接触、AuGeNi n型欧姆接触等工艺,设计制造了正面入射平面InP/InGaAs雪崩光电二极管,器件利用InGaAs做吸收层,InP做增益层,光敏面直径50 μm;测试结果表明器件有正常的光响应特性,击穿电压32～42 V,在低于击穿电压2 V左右可以得到大约10A/W的光响应度,在0到小于击穿电压1 V的偏压范围内,暗电流只有1 nA左右;器件在2.7 GHz以下有平坦的增益.     

A model-based comparison of AlInAs/GaInAs and InP/GaInAs HBT's: aMonte Carlo study

The high-speed performances of AlInAs/GaInAs and InP/GaInAs heterojunction bipolar transistors (HBTs) are investigated using a one-dimensional self-consistent particle simulator. Optimum alloy compositions for a graded-gap base structure are obtained for both transistors through the tradeoff between the emitter-charging time and base transit time. The saturation velocity in the GaInAs n-type collector is found to be smaller than that in InP, which has been attributed to the diffusion of a large number of hot back-scattered Γ-valley electrons in the GaInAs collector. The difference in the collector transit time in p-type collectors is trivial, since the maximum electron velocity was restricted to below 1.2×10⁸ cm/s due to a strong nonparabolicity effect. The cutoff frequency for the former and the latter are estimated to be 2 and 1.5 times higher, respectively, than for AlGaAs/GaAs HBTs. These results are attributed to a larger bandgap difference between the emitter and base, to yield a high base built-in field, rather than a larger Γ-L band separation energy in the collector to enhance the velocity overshoot effect     

High gain AlInAs/GaInAs/InP HEMT's with individually groundedsource finger vias

High gain, millimeter wave AlInAs/GaInAs/InP HEMT's with individually grounded source finger vias have been fabricated for the first time using a high resolution Cl₂:HBr:BCl₃:Ar RIE process. For comparison of device characteristics at millimeter wave frequencies, HEMT's with end source vias were also fabricated on the same wafer. Fixtured RF characterization has revealed significant reduction in source inductance and reverse transmission in addition to higher gain on devices with individual source vias. These superior RF characteristics exhibited by the HEMT with individually grounded source finger vias illustrate the importance of the via technology for high performance InP-based millimeter wave system applications     

Heterojunction InP/GaInAs phototransistors/bipolar transistorsgrown by MOVPE

Heterojunction InP/GaInAs phototransistors with base terminals have been fabricated by atmospheric pressure metal organic vapour phase epitaxy. When operated as bipolar transistors, the devices exhibit high current gain (>1600) and good junction ideality factors (1.06 for the base/emitter and 1.25 for the base/collector junction). When operated as phototransistors, the devices have large optical gain (>800) at an incident power of 1 μW, at a wavelength of 1.3 μm     

Fabrication of widegap-emitter Schottky-collector transistor using GaInAs/InP

A widegap-emitter transistor with a Schottky collector has been fabricated using n-InP as the emitter, p-GaInAs as the base layer and Ni as the Schottky metallisation. The fabricated transistors show a current gain better than 5 in the common-emitter configuration.