复合材料热压罐固化温度参数分析和控制

热压罐是用于对胶接结构（如夹层结构制品、组合件的胶接装配等）或复合材料构件进行加热、加压的特种关键工艺设备。本文通过对热压罐设备动态参数分析和工艺实验，结合复合材料固化工艺，研究了控制复合材料构件固化过程的方法和措施，提出了实用的面向固化对象的热压罐固化成型温度控制方法。     

高精度倒装焊机加压机构的研究

随着大规模集成电路器件的发展,采用倒装互连方式的芯片与基板向大尺寸、大面阵发展,对倒装焊机加压机构提出了加压范围大、加压精确的要求。针对自主研制的倒装焊机加压机构,对其结构及控制原理进行了研究。通过对位置和压力的闭环控制,及对压力传感器的校准,提升了压力控制的精确性。     

硅铝合金焊接结构在空间相机中的应用

作为空间相机的一个关键部件,机身结构对保证相机正常工作至关重要。按照光学设计和卫星的要求,完成了机身结构的设计工作,选择高体份硅铝合金材料生产机身,选择焊接方式成型机身。通过有限元分析,计算了机身的静态和动态力学性能,证明了机身结构设计的合理性。计算了焊接应力的大小,证明焊接应力不会影响到机身结构的稳定性。最后,对机身结构进行了力学和热学试验,验证了机身的力学性能和稳定性。结果证明,高分辨率空间光学相机的机身结构可以使用高体份硅铝合金以焊接方式制造。     

一种PMMA表面改性的热压键合方法研究

介绍了一种基于表面改性技术的PMMA热压键合新方法。PMMA表面首先用其单体MMA进行改性，然后在真空热压设备中热压键合。主要的键合参数如下：键合压力0．5MPa～2．5MPa，温度88℃～100℃，时间180s。通过拉力法测量了键合强度，其最大值可达到0．15MPa。实验结果表明，与常规的热压键合方法相比，该方法可有效地降低键合温度，减少键合时间，提高键合强度，从而可减少对PMMA基片上微细图形结构的破坏。使用聚合物的单体（MMA）对PMMA进行改性，可避免对微管道产生化学污染，有利于集成毛细管电泳的生化分析。利用品红和氢氧化钠混合溶液对键合后的微流体芯片进行密封性测试，结果表明，封装后的微流体芯片没有出现泄漏的情况。     

倒装芯片键合技术发展现状与展望

我国集成电路发展十二五规划中提到,大力发展先进封装和测试技术,推进高密度堆叠型三维封装产品的进程,支持封装工艺技术升级和产能扩充。阐述了先进封装技术中的倒装芯片键合工艺现状及发展趋势,以及国际主流倒装设备发展及国内应用现状,重点介绍了北京中电科装备有限公司的倒装机产品。国产电子装备厂商应认清回流焊倒装芯片键合设备市场发展,缩短倒装设备产品开发周期和推向市场的时间,奠定国产电子先进封装设备产业化基础;同时抓紧研发细间距铜柱凸点倒装和热压焊接技术,迎接热压倒装芯片工艺及其设备的挑战。     

PDP制作中的热压成型工艺研究

等离子体显示器与电路的连接是用热压连接带连接的,热压连接和屏是用各向异性导电膜采用热压成型技术进行连接。由于等离子体显示器引线宽度和间距小,电极线数量多,给热压引线带来了许多困难。本文叙述了各向异性导电膜结构和原理,以各向异性导电膜的选择原则作了概括性说明,同时对热压设备作了简介,最后对各向异性导电膜的热压工艺进行了较深入的研究,开发出了二次成型工艺,并成功地应用于21英寸等离子体显示器的研制中。     

PMMA基PCR生物芯片及其准分子激光制备技术的几个关键问题

分析了微流控聚合梅链式反应(PCR)芯片循环的几何结构，对常规非闭环的穿透形式，确定了可行的温区排列结构;对于闭环式的空间分布形式，分析了几种结构的热效率。研究了准分子激光对聚甲基丙烯酸甲脂(PMMA)基片的刻蚀机制，获得了刻蚀曲线。对于PCR 芯片微流通道的加工，着重考虑了通道成形和表面粗糙度问题。其中，采用掩模形状控制法解决通道形状问题;采用激光抛光、近阈值能量、去应力退火等技术提高刻蚀通道的表面质量。在对PMMA基PCR芯片的键合问题研究中，采用了胶粘键合和热压键合两种方案，优选出热压键合的方案，制作了热压键合装置，获得了最佳键合参数，满足键合强度和通道成形要求。针对微流体连续流动的控制问题，研制了一台基于精密气泵结合气动控制的注射进样系统。利用制作的PCR 芯片和进样系统，成功地对170bp的DNA模板进行了扩增。     

基于SolidWorks Simulation的压头热应变分析

利用SolidWorks Simulation有限元分析软件对邦定机压头结构进行热应变分析,得出压头工作面热变形规律,为压头结构设计和改进提供了重要依据。     

恒温热压与脉冲热压的优劣分析

随着国内液晶显示器市场的迅猛发展,相应的LCM邦定专用设备也日益受到越来越多的生产厂家的高度重视.恒温热压与脉冲热压是邦定设备上最常用的两种热压方式.详细阐述了这两种热压方式的功能特点及其优缺点,便于厂商根据自身产品合理选择热压方式.     

一种应用于芯片高精度拾放的视觉定位方法

视觉定位技术是全自动芯片拾放设备的核心技术之一,其设计需结合设备功能、结构特点、运动方式来完成。介绍的视觉定位方法采用仰视与俯视双相机、俯视相机双镜头切换方式,适用于全自动粘片机、点胶机、晶圆芯片拾取机等设备中的拾放定位功能,及设备执行部件相对位置校验功能。     

基于PDMS模具热模压制备微流控通道结构的方法

介绍了一种利用聚二甲基硅氧烷(PDMS)的快速成型来制备模具,再进行热模压制造微流控通道结构的方法。通过在硅片上旋涂SU-8胶进行光刻显影,得到结构模版,在此模版上浇注PDMS,脱模即得到PDMS模具。将PDMS模具进行热压,成功地在聚甲基丙烯酸甲酯(PMMA)基片上复制了特定的微流控通道结构。相对于常规的硅微加工和UV-LIGA工艺制造热模压模具,本方法具有加工周期短、工艺简单、成本低等优点。另外,还对温度、压力、时间等热模压的主要工艺参数进行了初步的优化研究。     

Deformation behavior of solid polymer during hot embossing process

Though hot embossing is a well known technique for the fabrication of polymer based micro-device, the deformation behavior of solid polymer during hot embossing process is not investigated clearly. In this paper, the deformation behavior of solid polymer was observed by two methods, synchronous observation and asynchronous analysis. A finite element simulation and a phenomenological model were used to evaluate the deformation behavior of solid polymer during hot embossing. Results showed that the deformation of solid polymer during embossing process included two stages. One was a stress concentration and strain hardening stage, which occurred during the heating and applying pressure process. The “swallowtails” induced by incomplete filling generate at this stage. The other was a stress relaxation and deformation recovery stage, which occurred during the remaining temperature and pressure process. The “swallowtails” were eliminated at this stage. The second stage was significant for improving replication precision, but it had not been reported before.     

BSRF上的微细塑铸研究

利用北京同步辐射装置 (BSRF)上的LIGA技术制作了镍模具 ,试验了溶液浇铸、反应浇铸、大气模压、真空模压四种不同的塑铸方法。结果表明采用自制模压装置 ,采用排气法可以获得与真空模压相近的效果 ;真空模压在这四种方法中具有最好的精度 ,但若不进行工艺参数优化 ,也会导致变形等问题     

微流控通道加工技术的研究进展

在微流控芯片中,微通道是进行微分析的重要保证,其成型质量直接影响芯片的分析性能.从加工机理、技术特点以及适用范围等方面对激光直写加工、光刻加工、热压印技术、微细铣削加工和3D打印等微流控通道主要加工方法进行了阐述,并总结了这几种加工技术的优缺点,这为实际生产提供了一定参考.最后,对微流控通道加工技术的发展进行了展望,未...     

Fabrication of gold sub-wavelength pore array using gas-assisted hot embossing with anodic aluminum oxide (AAO) template

This paper reports a novel and effective method for the fabrication of gold sub-wavelength pore array using gas-assisted hot embossing. The novel fabrication comprises the fabrication of AAO template with high order pore array, sputter-coating of gold and gas-assisted hot embossing. AAO template is fabricated by a two-step anodization process. It is then coated with gold (100 nm thick). The gold sub-wavelength pore array is finally formed by using gas-assisted hot embossing process. The transmission spectra of gold sub-wavelength pore array are measured in several conditions such as air, water and glycerol/water mixture. The detection shows significant shift in the wavelength of resonance peak. The gold sub-wavelength pore array can be employed as optical biosensors.     

Hot embossing of diffractive optically variable images in biaxially-oriented polypropylene

The hot embossing of grating-based optically variable devices has been demonstrated in biaxially-oriented polypropylene (BOPP). Embossing of the grating structures was examined over a range of temperatures (80-155 °C) at 135 kN force. However, only at temperatures above the glass transition temperature, T_g, was high quality replication achieved over a full embossing area of 80 × 80 mm. The embossing of several different types of optically variable device has been examined including portrait, non-portrait and 3-dimensional images. The images embossed into BOPP have displayed an optically variable effect when viewed in transmitted light.     

Direct stamp fabrication for NIL and hot embossing using HSQ

Commonly stamps or masters for nanoimprinting are made by electron beam lithography (EBL) and subsequent reactive ion etching into silicon. Here we present a single step procedure to prepare stamps suitable for nanoimprinting and hot embossing. The stamps are directly fabricated in HSQ (hydrogen silsequioxane), a negative EBL resist, which has a high lateral resolution and good mechanical properties. We demonstrate successful pattern transfer in both bulk PMMA and PCL by hot embossing with features down to 20 nm. Such pattern transfer is useful for biological applications. Also, we demonstrate that this approach can make stamps suitable for nanoimprint lithography and have achieved features as small as 35 nm. It was found that the stability and strength of the HSQ could be improved by annealing and that the application of a non-stick coating was not necessarily required although it aided the demoulding.     

Microlens array produced using hot embossing process

In this paper, the fabrication of molds that are suitable for the production of microlens arrays using the replication technique is discussed. Variation of parameters in the replication process were investigated. A focused ion beam was used to fabricate the microlens cavities on three materials, with silicon showing the best result. Hot embossing was used to produce replicated polycarbonate lens array. The temperature of the mold and the embossing force were the two parameters varied. The microlens array produced using the embossing replication process demonstrates the possibility of nanometre fabrication.     

Printing via hot embossing of optically variable images in thermoplastic acrylic lacquer

A novel printing process via hot embossing of either grating or micro-mirror microstructures has been demonstrated in thermoplastic acrylic lacquer. Embossing experiments were performed in the temperature range 100-150 °C and at 80 kN force. The range of microstructures has included a dot-matrix hologram, grating-based optically variable devices (OVDs) and a micro-mirror based OVD. High quality replicas of each type of device have been fabricated using this process. Embossed replicas of grating-based OVDs have shown optical effects including image switching and color movement. For devices based on micro-mirror arrays, the embossed replicas have shown an optically variable switch between a portrait and a non-portrait image. Printing via an embossing process offers the possibility of incorporating optically variable devices into documents without the use of hot stamping foil. This is particularly relevant for documents based on polymeric substrates such as credit cards and polymer banknotes.