(001)、(101)、(111) 双轴应变Si、应变SiGe空穴散射机制

本文基于费米黄金法则和波尔兹曼碰撞项近似理论,对Si基应变材料各空穴散射机率与应力强度、晶向的关系进行了深入的研究。结果表明：1）在应力的作用下,Si基应变材料总散射几率明显降低;2）当Ge组分为0.2时,总散射几率量化排序为应变Si/(111)Si1-xGex>应变Si/(101)Si1-xGex>应变Si1-xGex/(111)Si>应变Si1-xGex/(101)Si>应变Si/(001)Si1-xGex>应变Si1-xGex/(001)Si;3）应力作用下空穴声学声子散射几率的降低是引起Si基应变材料总散射几率降低的主要原因。本文量化结论可为Si基应变及其他应变材料的相关研究提供重要理论参考。     

Optically active centers in Si/Si<Subscript>1 − <Emphasis Type="Italic">x</Emphasis></Subscript>Ge<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>:Er heterostructures containing Er<Superscript>3+</Superscript> ions

The basic types of optically active erbium centers that make the major contribution to the photo-luminescence signal from the Si/Si_{1 ? x} Ge _x :Er heterostructures with the Ge content from 10 to 30% are analyzed in detail. It is shown that the origin of the optically active centers containing Er³⁺ ions correlates with the molar composition of the Si_{1 ? x} Ge _x :Er layer and the content of oxygen impurity in the layer. The major contribution to the photoluminescence signal from the Si/Si_{1 ? x} Ge _x :Er heterostructures with the Ge content below 25% is made by the well-known centers containing Er³⁺ ions and oxygen. An increase in the Ge content in the Si_{1 ? x} Ge _x :Er layer (x ≥ 25%) yields the formation of a new type of centers, specifically, the Gecontaining optically active erbium centers unobserved in the Si-based structures previously.     

Structural and electrical properties of SiGe-on-insulator substrates fabricated by direct bonding

A new method for fabricating SiGe-on-insulator substrates, i.e., direct bonding of thermally oxidized Si wafers with Si_{1 − x} Ge _x wafers cut from Czochralski-grown crystals, is suggested. Si_{1 − x} Ge _x layers no larger than 10 μm thick in SiGe/SiO₂/Si compositions were fabricated by chemical mechanical polishing. To increase the Ge content in the Si_{1 − x} Ge _x layer, thermal oxidation was used. It was shown that the increase in the Ge content and heat treatment procedures at 1250°C are not accompanied by degradation of structural and electrical characteristics of Si_{1 − x} Ge _x layers.     

Si/Si1−x Gex epitaxial layers and superlattices. Growth and structural characteristics

Si, Ge, and Si_1−x Ge_x epitaxial layers and Si/Si_1−x Ge_x superlattices have been obtained on (100) and (111) silicon substrates by molecular-beam epitaxy. The growth processes and the structural characteristics and chemical composition of the structures were studied by x-ray diffraction and Auger spectroscopy. It is shown that under the experimental conditions for obtaining Si/Si_1−x Ge_x superlattices structurally perfect, strained superlattices with satellites up to ±5 orders can be obtained. Fiz. Tekh. Poluprovodn. 31, 922–925 (August 1997)     

Epitaxially Grown Monoisotopic Si,Ge, and Si<Subscript>1–<Emphasis Type="Italic">x</Emphasis> </Subscript>Ge<Subscript> <Emphasis Type="Italic">x</Emphasis> </Subscript> Alloy Layers: Production and Some Properties

The technology of the growth of Si, Ge, and Si_1–xGe_x layers by molecular-beam epitaxy with the use of a sublimation source of monoisotopic ³⁰Si or ²⁸Si and/or gas sources of monogermane ⁷⁴GeH₄ is demonstrated. All of the epitaxial layers are of high crystal quality. The secondary-ion mass spectroscopy data and Raman data suggest the high isotopic purity and structural perfection of the ³⁰Si, ²⁸Si, ⁷⁴Ge, and ³⁰Si_1–x⁷⁴Ge_x layers. The ³⁰Si layers doped with Er exhibit an efficient photoluminescence signal.     

Room temperature oxidation of Cu3Ge and Cu3(Si1−xGex) on Si1−xGex

Room temperature oxidation of Cu₃(Si_1−xGe_x) and Cu₃Ge films grown on Si_1−xGe_x at a temperature of 200–400°C was studied using transmission electron microscopy (TEM) in conjunction with energy dispersive spectrometry (EDS). For Cu₃(Si_1−xGe_x) and Cu₃Ge films grown at 200°C and then exposed to air, room temperature oxidation occurred. The Cu₃Ge film was superior to the Cu₃(Si_1−xGe_x) film in reducing the oxidation rate because of its higher Ge concentration. Annealing at higher temperatures such as 400°C resulted in Ge segregation out of the Cu₃(Si_1−xGe_x) film or Si diffusion from the Si_1−xGe_x substrate into the Cu₃Ge overlayer, and hence enhanced the oxidation rate of Cu₃(Si_1−xGe_x) and Cu₃Ge films. The present study shows that upon exposure to air even the Cu₃Ge film grown on Si_1−xGe_x is subject to room-temperature oxidation, revealing that the use of Cu₃Ge contacts on Si_1−xGe_x may be limited by some strict conditions.     

Ultra-Thin Si<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>Ge<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript> Dislocation Blocking Layers for Ge/Strained Si CMOS Devices

We demonstrate ultra-thin (<150 nm) Si_1−x Ge _x dislocation blocking layers on Si substrates used for the fabrication of tensile-strained Si N channel metal oxide semiconductor (NMOS) and Ge P channel metal oxide semiconductor (PMOS) devices. These layers were grown using ultra high vacuum chemical vapor deposition (UHVCVD). The Ge mole fraction was varied in rapid, but distinct steps during the epitaxial layer growth. This results in several Si_1−x Ge _x interfaces in the epitaxially grown material with significant strain fields at these interfaces. The strain fields enable a dislocation blocking mechanism at the Si_1−x Ge _x interfaces on which we were able to deposit very smooth, atomically flat, tensile-strained Si and relaxed Ge layers for the fabrication of high mobility N and P channel metal oxide semiconductor (MOS) devices, respectively. Both N and P channel metal oxide semiconductor field effect transister (MOSFETs) were successfully fabricated using high-k dielectric and metal gates on these layers, demonstrating that this technique of using ultra-thin dislocation blocking layers might be ideal for incorporating high mobility channel materials in a conventional CMOS process.     

Strain relaxation and dopant distribution in the rapid thermal annealing of Co with Si/Si1−xGex/Si heterostructure

The reaction of cobalt with the Si-sacrificial cap in the strained Si/Si_1−xGe_x/Si MBE grown heterostructure was studied. The Si-cap is added to prevent the relaxation of the SiGe and to guarantee uniform and reliable silicidation reaction. The Si_1−xGe_x epilayer, with Ge content between 18 and 28 at%, was highly B doped, while the Si-cap was undoped or B doped either during growth or by ion implantation. Cobalt evaporation was followed by rapid thermal annealing at 450–700°C for 30 sec in N₂ or Ar+10%H₂. When the silicide penetrated the Si-cap/Si_1−xGe_x interface, noticeable out-diffusion of Ge and B to the surface was observed. In spite of the presence of the Si-cap significant strain relaxation was observed in three cases: (1) in the implanted samples, although the implantation was confined to the Si-cap, (2) when the Co layer was too thick, such that the silicide penetrated the SiGe layer and (3) when the Ge content in the SiGe layer was relatively high (27.5%).     

Characterization of reduced pressure chemical vapor deposited Si0.8Ge0.2/Si multi-layers

We have investigated the Si_0.8Ge_0.2/Si multi-layer grown directly onto the Si (001) substrates using reduced pressure chemical vapor deposition. The thicknesses of the Si_0.8Ge_0.2/Si multi-layer were determined using transmission electron microscopy. From the results of energy-dispersive X-ray spectroscopy and X-ray diffraction analyses on the Si_0.8Ge_0.2/Si multi-layer, Ge composition in the Si_1?xGe_x layers was determined as ～20% and the value of residual strain ε of the Si_0.8Ge_0.2 layer is calculated to be 0.012. Three peaks are observed in Raman spectrum, which are located at approximately 514, 404, and 303 cm^?1, corresponding to the vibration of Si–Si, Si–Ge, and Ge–Ge phonons, respectively. The photoluminescence spectrum originates from the radiative recombinations both from the Si substrate and the Si_0.8Ge_0.2/Si multi-layer. For the Si_0.8Ge_0.2/Si multi-layer, the transition peaks related to the quantum well region observed in the photocurrent spectrum were preliminarily assigned to e–hh and e–lh fundamental excitonic transitions.     

Paramagnetic Ge dangling bond type defects at (1 0 0)Si1−xGex/SiO2 interfaces (Invited Paper)

The work addresses the occurrence of Ge dangling bond type point defects at Ge_xSi_1?x/insulator interfaces as evidenced by conventional electron spin resonance (ESR) spectroscopy. Using multifrequency ESR, we report on the observation and characterization of a first nontrigonal Ge dangling bond (DB)-type interface defect in SiO₂/(1 0 0)Ge_xSi_1?x/SiO₂/(1 0 0)Si heterostructures (0.27 ? x ? 0.93) manufactured by the condensation technique, a selective oxidation method enabling Ge enrichment of a buried epitaxial Si-rich SiGe layer. The center, exhibiting monoclinic-I (C_2v) symmetry is observed in highest densities of ～7 × 10¹² cm^?2 of Ge_xSi_1?x/SiO₂ interface for x ～ 0.7, to disappear for x outside the ]0.45–0.87[ interval, with remarkably no copresence of Si P_b-type centers. Neither are trigonal Ge DB centers observed, enabling unequivocal spectral analysis. Initial study of the defect passivation under annealing in molecular H₂ has been carried out. On the basis of all data the defect is depicted as a Ge P_b1-type center, i.e., distinct from a trigonal basic Ge P_b(0)-type center (Ge₃Ge). The modalities of the defect’s occurrence as unique interface mismatch healing defect is discussed, which may widen our understanding of interfacial DB centers in general.     

Low-temperature microwave magnetoresistance of lightly doped <Emphasis Type="Italic">p</Emphasis>-Ge and <Emphasis Type="Italic">p</Emphasis>-Ge<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>Si<Subscript>x</Subscript>

The magnetoresistance of a lightly doped p-Ge_1?xSi_x alloy is studied in the range of compositions x = 1–2 at %. The results are compared with the available data for lightly doped p-Ge. The studies have been carried out using ESR measurements at a frequency of 10 GHz in the temperature range 10–120 K. It is established that micrononuniformity in the distribution of Si in the Ge lattice (Si clusters) suppresses the interference part of the anomalous magnetoresistance and, in addition, results in an averaging of the effects of light and heavy holes. This observation suggests a sharp decrease in the inelastic scattering time in the case of a Ge_1?xSi_x solid solution as compared to that of Ge.     

Low temperature heteroepitaxial growth of Si1−xGexon-Si by photo-enhanced ultra high vacuum chemical vapor deposition using Si2H6 and Ge2H6

Strained-layer Si_1×Ge_x-on-Si heteroepitaxy has been achieved by photolytic decomposition of disilane (Si₂H₆) and digermane (G e₂H₆) in an ultra high vacuum (UHV) chamber at substrate temperatures as low as 275°C. An ArF excimer laser (193 nm) shining parallel to the Si substrate was used as the UV light source to avoid surface damage and substrate heating. The partial pressures of the source gases in the reactor were chosen to vary the Ge mole fraction x from 0.06 to 0.5 in the alloy. The Si₂H₆ partial pressure was kept at 10 mTorr and the Ge₂H₆ partial pressure was varied from 0.13 to 2 mTorr with the laser intensity fixed at 2.75 × 10¹⁵ photons/cm²·pulse. To fit the Si_1−xGe_x growth rate and Ge mole fraction data, the absorption cross section of Ge₂H₆ at 193 nm was set to 1 × 10⁻¹⁶ cm², which is 30 times larger than that of Si₂H₆ (3.4 × 10⁻¹⁸ cm2). For Si_1−xGe_x alloy growth, the deposition rate of Si increases with Ge mole fraction, resulting in increased Si_1−xGe_x alloy growth rates for higher Ge content. The increase of the Si growth rate was attributed to the enhanced adsorption rate of Si₂H₆ pyrolytically in the presence of Ge, rather than due to photolytic decomposition reaction. The Ge mole fraction in Si_1−xGe_x alloys can be predicted by a new model for Si and Ge pyrolytic and photolytic growth. The model describes the increased growth rate of Si_1−xGe_x alloys due to a Ge₂H₆ catalytic effect during photo-enhanced chemical vapor deposition.     

Pulsed-laser modification of germanium nanoclusters in silicon

The effect of pulsed ruby laser radiation on Ge nanoclusters grown on a (100)-oriented Si substrate is studied. The energy density of radiation corresponds to the melting threshold of the Si surface. Changes in the structure of nanoclusters are analyzed by comparing the experimental Raman spectra to those calculated in terms of Born-von Karman and Vol’kenstein models. It is established that the action of one pulse changes the cluster size and partly relieves the compression. Still greater changes take place in a sample subjected to ten pulses. The Ge nanoclusters transform into clusters of Ge_xSi_1?x solid solution, presumably due to the stress-and vacancy-aided diffusion. Laser-induced thermal processes in germanium nanoclusters in silicon are numerically simulated.     

Role of a Si0.95Ge0.05 epilayer cap on boron diffusion in silicon under inert and dry oxidizing ambient annealing

Silicon (Si) and Si with a 60 nm Si_0.95Ge_0.05 epilayer cap (Si_0.95Ge_0.05/Si) were implanted with 60 keV, 1×10¹³ cm⁻² boron (B) followed by annealing in nitrogen (N₂) or dry oxygen (O₂) in two different anneal conditions. B⁺implantation energy and dose were set such that the B peak is placed inside Si in Si_0.95Ge_0.05/Si samples and concentration independent B diffusion is achieved upon annealing. For samples annealed above 1075 °C, Ge diffusing from the Si_0.95Ge_0.05 epilayer cap in Si_0.95Ge_0.05/Si samples reached the B layer inside Si and resulted in retarded B diffusion compared to the Si samples. For annealing done at lower temperatures, diffusion of Ge from Si_0.95Ge_0.05 epilayer cap does not reach the B layer inside Si. Thus B diffusion profiles in the Si and Si_0.95Ge_0.05/Si samples appear to be similar. B diffusion in dry oxidizing ambient annealing of Si_0.95Ge_0.05/Si samples further depends on the nature of Si_0.95Ge_0.05 oxidation which is set by the duration and the thermal budget of the oxidizing anneal.     

Thin film solar cells incorporating microcrystalline Si1–xGex as efficient infrared absorber: an application to double junction tandem solar cells

We have fabricated efficient (∼7–8%) hydrogenated microcrystalline Si_1–xGe_x (µc‐Si_1–xGe_x:H, x ∼ 0.1–0.17) single junction p‐i‐n solar cells with markedly higher short‐circuit current densities than for µc‐Si:H (x = 0) solar cells due to enhanced infrared absorption. By replacing the conventional µc‐Si:H with the µc‐Si_1–xGe_x:H as infrared absorber in double junction tandem solar cells, the bottom cell thickness can be reduced by more than half while preserving the current matching with hydrogenated amorphous silicon (a‐Si:H) top cell. An initial efficiency of 11.2% is obtained for a‐Si:H/µc‐Si₀.₉Ge₀.₁:H solar cell with bottom cell thickness less than 1 µm. Copyright © 2009 John Wiley & Sons, Ltd.     

Structural analysis of Ge x Si1−x /Si layers by remote plasma-enhanced chemical vapor deposition on Si (100)

In this work, remote plasma-enhanced chemical vapor deposition (RPCVD) has been used to grow Ge _x Si_1−x /Si layers on Si(100) substrates at 450° C. The RPCVD technique, unlike conventional plasma CVD, uses an Ar (or He) plasma remote from the substrate to indirectly excite the reactant gases (SiH₄ and GeH₄) and drive the chemical deposition reactions. In situ reflection high energy electron diffraction, selected area diffraction, and plan-view and cross-sectional transmission electron microscopy (XTEM) were used to confirm the single crystallinity of these heterostructures, and secondary ion mass spectroscopy was used to verify abrupt transitions in the Ge profile. XTEM shows very uniform layer thicknesses in the quantum well structures, suggesting a Frank/ van der Merwe 2-D growth mechanism. The layers were found to be devoid of extended crystal defects such as misfit dislocations, dislocation loops, and stacking faults, within the TEM detection limits (∼10⁵ dislocations/cm²). Ge _x Si_1−x /Si epitaxial films with various Ge mole fractions were grown, where the Ge contentx is linearly dependent on the GeH₄ partial pressure in the gas phase for at leastx = 0 − 0.3. The incorporation rate of Ge from the gas phase was observed to be slightly higher than that of Si (1.3:1).     

Role of surface segregation in formation of abrupt interfaces in Si/Si1−x Gex heterocompositions grown by molecular-beam epitaxy with combined sources

The coefficients of segregation of germanium atoms were measured for the Si_1?x Ge_x system grown by molecular-beam epitaxy with combined Si-GeH₄ sources under the conditions of efficient filling of surface bonds by the products of the decomposition of hydrides. In their turn, these measurements made it possible to determine for the first time the ratio between the coefficients of the incorporation of Si and Ge atoms into the growing Si_1?x Ge_x layer using the developed kinetic model of growth. For the Si-Si_1?x Ge_x structures grown by molecular-beam epitaxy with the Si-GeH₄ combined sources, the role of various mechanisms (pyrolysis, segregation, etc.) in the formation of the profile of metallurgical layer interfaces was compared for a wide range of technological parameters.     

Ge based nanostructures for electronic and photonic devices

Self-assembled Ge_xSi_1−x islands were grown on Si(0 0 1) substrates by solid source molecular beam epitaxy. Two different morphological shapes with different sizes were evolved by tuning the growth time at a constant deposition temperature. Micro-Raman analysis was carried out to investigate the composition, intermixing and strain of resultant islands. The observed broad infra-red photoluminescence signal from grown samples was associated with radiative recombination of holes confined in the Ge islands and electrons localized in the Si buffer layer. The PL peak position and intensity were found to be influenced by the islands size and intermixing of Si and Ge. The electrical properties of the islands were studied through photoexcited I-V characteristics and current imaging using conducting mode atomic force microscopy.     

Enhanced electrical properties of nominally undoped Si/SiGe heterostructure nanowires grown by molecular beam epitaxy

Electrical properties of epitaxial single-crystalline Si/SiGe axial heterostructure nanowires (NWs) on Si〈1 1 1〉 substrate were measured by contacting individual NWs with a micro-manipulator inside an scanning electron microscope. The NWs were grown by incorporating compositionally graded Si_1−xGe_x segments of a few nm thicknesses in the Si NWs by molecular beam epitaxy. The I-V characteristics of the Si/SiGe heterostructure NWs showed Ohmic behavior. However, the resistivity of a typical heterostructure NW was found to be significantly low for the carrier concentration extracted from the simulated band diagram. Similarly grown pure Si and Ge NWs showed the same behavior as well, although the I-V curve of a typical Si NW was rectifying in nature instead of Ohmic. It was argued that this enhanced electrical conductivities of the NWs come from the current conduction through their surface states and the Ge or Si/SiGe NWs are more strongly influenced by the surface than the Si ones.     

Elimination of dislocations in heteroepitaxial MBE and RTCVD Ge x Si1-x grown on patterned Si substrates

We have grown Ge _x Si_1-x (0 <x < 0.20,1000–3000Å thick) on small growth areas etched in the Si substrate. Layers were grown using both molecular beam epitaxy (MBE) at 550° C and rapid thermal chemical vapor deposition (RTCVD) at 900° C. Electron beam induced current images (EBIC) (as well as defect etches and transmission electron microscopy) show that 2800Å-thick, MBE Ge_0.19Si_0.81 on 70-μm-wide mesas have zerothreading and nearly zero misfit dislocations. The Ge_0.19Si{0.81} grown on unpatterned, large areas is heavily dislocated. It is also evident from the images that heterogeneous nucleation of misfit dislocations is dominant in this composition range. 1000Å-thick, RTCVD Ge_0.14Si_0.86 films deposited on 70 μm-wide mesas are also nearly dislocation-free as shown by EBIC, whereas unpatterned areas are more heavily dislocated. Thus, despite the high growth temperatures, only heterogeneous nucleation of misfit dislocations occurs and patterning is still effective. Photoluminescence spectra from arrays of GeSi on Si mesas show that even when the interface dislocation density on the mesas is high, growth on small areas results in a lower dislocation density than growth on large areas.