新型电路保护产品帮助提高电器性能

除了除了安全性之外，对电子产品的可靠度要求，所使用半导体器件的脆弱性，外来能量的冲击以及不当的使用，都需要使用各种电路保护产品，以使电子产品正常、高效运转和使用。     

可携式设计当道整合型被动组件势起

近年来,可携式信息电子产品与移动通信产品朝着轻薄短小、多功能、高可靠度与低价化的趋势发展,顺此之势,在电子产品的电路设计之中,主动组件设计已大步迈向50C(系统单芯片)化的发展;同时,面积占据最大、数量最多的被动组件也正进行一场积体整合化的革命.     

焊点可靠度试验及失效分析测试

电子产品小型化、多功能化的发展趋势,促使SMT新技术持续发展,焊点可靠度试验设计与测试,势必成为评价SMT新技术的重中之重,采用新元器件或新工艺之前都要进行标准、优化的可靠度试验,以确保产品的贴装质量.阐述了SMT焊点可靠度试验的常用方法,通过试验结果进行焊点可靠度评价,列举了外观检查、金相切片分析、扫描超声检查、能谱及扫描电镜分析、染色及渗透检测技术等常用的焊点失效分析检测技术.     

电子产品装点绿色智能建筑-第19届台北国际建筑建材及产品展上的电子产品

一件产品的创新研发可能需要花费大量的时间和金钱,但是可能在造福世人的同时为自己赚来大笔的财富。以“绿色”的观念来看,产品的完整生命周期不仅包括从研发到上市,也包括使用、维护,更要包括产品的下市、回收甚至再利用。所以,在许多非电子行业的交流活动中,往往更容易发现电子产品与技术的创新应用,也会让我们对电子产品完整生命周期获得更全面的认识。     

联想：TablePC将成“第五屏”

在今年CES上，联想推出了全球首款专为多人平面交互的电子产品——IdeaCentreHorizon，并创造了“TablePC”这一全新的电子产品类别。据了解，这款产品搭载联想自主研发的Aure界面，支持多人操作，并可切换为Windows8系统。     

第四届国际连接器技术与产业发展论坛

主办单位:《电子产品世界》杂志社德国慕尼黑国际博览集团承办单位:《电子产品世界》杂志社指导单位:中国电子学会元件分会连接器与开关技术部背景介绍随着电子产品设计的不断复杂化,高性能的连接器产品正在广泛地应用在各种电子产品领域中,并且已经逐渐从高端的工业级和军事航天等应用转向更多更广泛的民用应用领域,并且有逐渐向消费电子领域扩展的趋势。因此,如何提升连接器产品在电子设计中的使用价值,带给电子产品全新的功能体验,就成为众多连接器厂商研发产品的重点。另一方面,     

“我们的目标是做百年企业!” 专访深圳市力征科技有限公司总经理特助 程国兴先生

1、《电子质量》:在电源滤波器领域,台湾「High&Low、HAL」品牌已成为规格齐全、高质量、高可靠度的象征,作为一家总部设在台北,研发制造设在深圳的企业,你们如何移植台湾市场的成功经验?程特助:台湾电子业从60年代开始发展,到80年代已成为国际重要的电子产品代工基地。此时各大电子业     

深圳市华宝电子科技有限公司——专业生产汽车行驶记录仪

深圳市华宝电子科技有限公司,是快速发展中的高新技术氽业。致力于汽车安全电子产品、智能交通电子产品的研究、开发、生产及销售,秉承“科技让你更安全”、“科技让你更轻松”理念设计产品,提供最具竞争力与高附加价值的产品给客户。公司拥有一支由汽车电子领域专家、微处理技术专才、高级程序员、GPS开发工程师构成的充满激情的研发团队,各类专业技术人员占公司总人数的75％,     

推陈出新 决胜市场——欧胜发布三款数字消费电子产品

专注于数字消费电子产品的欧胜微电子股份有限公司，在过去几年一直保持持续增长。不断为新的数字消费电子产品提供关键技术，并投入很大精力研发较先进的产品，这是欧胜成功的所在。近日又推出了三款产品：用于数字录音及照相设备的高品质音响产品WM8974，数字图像领域的模拟前端产品WM8216及立体声音频模数转换器(DAC)。     

电子产品的硬件测试技术研究

电子硬件测试技术是电子产品从研发到生产的必经的一个阶段,也是决定一件电子产品质量的重要环节,所以如果将电子产品的硬件测试技术发展的更加完善,更加专业也是很多电子产品生产企业追求的目标。本文从这一目标出发详细介绍了电子产品的硬件测试技术以及发展状况。     

印制电路板的可靠性试验与评价

文章把印制电路板的可靠性概括为三个方面,并分别就其可靠性的试验和评价方法进行了简要综述,提出了后续要介绍的印制电路板领域多种可靠性试验和评价方法。     

有限元分析导热层厚度对印制电路散热性能影响

印制电路板的散热性能是影响电子产品可靠性的重要因素,而电路板的表面温度分布很难通过测量获得。通过有限元分析方法,模拟了印制电路板的温度场分布,并对元器件在嵌入不同厚度铝基导热层基板上稳定工作时的散热过程进行了分析。分析结果表明在PCB内部嵌入不同厚度铝基导热层可以有效地降低元器件失效率,增加产品可靠性,该结果可以为PCB制造过程中基板的选择提供指导。     

A review of board level solder joints for mobile applications

The reliability of electronics under drop-shock conditions has attracted significant interest in recent years due to the widespread use of mobile electronic products. This review focuses on the drop-impact reliability of lead-free solder joints that interconnect the integrated circuit (IC) component to the printed circuit board (PCB). Major topics covered are the physics of failure in drop-impact; the use of board level and component level test methods to evaluate drop performance; micro-damage mechanisms; failure models for life prediction under drop-impact; modelling and simulation techniques; and dynamic stress–strain properties of solder joint materials. Differential bending between the PCB and the IC component is the dominant failure driver for solder joints in portable electronics subjected to drop-impact. Board level drop-shock tests correlate well with board level high speed cyclic bending tests but not with component level ball impact shear tests. Fatigue is the micro-damage mechanism responsible for the failure of solder joints in the drop-shock of PCB assemblies and the fatigue strength of solder joints depends strongly on the strain rate, test temperature, and the sequence of loading. Finally, tin-rich lead-free solders exhibit significantly higher strain rate sensitivity than eutectic SnPb solder.     

PCB的温度与变形的三维有限元分析

为了研究温度、应力对PCB的可靠性的影响,根据实验条件,对某一航天PCB进行有限元模拟分析。得到了PCB的温度、变形、热应力与应变的分布情况,与实验结果很接近。表明有限元在PCB的可靠性的研究中是一种可靠的方法和计算过程中边界条件的正确性。     

A low-profile low-power converter with coreless PCB isolationtransformer

Very small manually wound transformers for sub-watt DC-DC converters are notorious for their relatively high cost and low reliability. In this paper, an isolated low-profile low-power 8 MHz soft-switching power converter using a coreless printed circuit board (PCB) transformer is described. Coreless PCB transformers eliminate several problems of their core-based counterparts in low-power applications. The diameter of the coreless PCB transformer is merely 0.46 cm. The converter's power output is about 0.5 W with a typical transformer efficiency of 63%. The high-frequency capability, high reliability and the low-profile structure make coreless PCB transformers a viable and attractive option for reliable mega-hertz switching converters and micro-circuits     

Advanced Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability During Drop Impact

Board level solder joint reliability performance during drop test is a critical concern to semiconductor and electronic product manufacturers. A new JEDEC standard for board level drop test of handheld electronic products was just released to specify the drop test procedure and conditions. However, there is no detailed information stated on dynamic responses of printed circuit board (PCB) and solder joints which are closely related to stress and strain of solder joints that affect the solder joint reliability, nor there is any simulation technique which provides good correlation with experimental measurements of dynamic responses of PCB and the resulting solder joint reliability during the entire drop impact process. In this paper, comprehensive dynamic responses of PCB and solder joints, e.g., acceleration, strains, and resistance, are measured and analyzed with a multichannel real-time electrical monitoring system, and simulated with a novel input acceleration (Input-G) method. The solder joint failure process, i.e., crack initiation, propagation, and opening, is well understood from the behavior of dynamic resistance. It is found experimentally and numerically that the mechanical shock causes multiple PCB bending or vibration which induces the solder joint fatigue failure. It is proven that the peeling stress of the critical solder joint is the dominant failure indicator by simulation, which correlates well with the observations and assumptions by experiment. Coincidence of cyclic change among dynamic resistance of solder joints, dynamic strains of PCB, and the peeling stress of the critical solder joints indicates that the solder joint crack opens and closes when the PCB bends down and up, and the critical solder joint failure is induced by cyclic peeling stress. The failure mode and location of critical solder balls predicted by modeling correlate well with experimental observation by cross section and dye penetration tests.     

高性能跑车发动机用PCB的生产工艺研究

汽车发动机用PCB要求较高的可靠性,高性能跑车发动机用PCB的可靠性要求更是十分苛刻。世界各大车用PCB制造商即使使用高成本的高Tg材料,也未必能生产出达到高性能跑车发动机要求的PCB。采用较低成本的中Tg材料,结合改进压合工艺,降低PCB材料的应力;并改善电镀铜工艺,降低电镀铜的应力。这样独特的生产工艺,使PCB在Z轴的膨胀大大降低,可使PCB的可靠性得到大幅提高。     

基于镍钯金PCB的数字传声器键合工艺匹配研究

介绍了数字传声器的关键结构,并基于其既有焊接又有键合工艺的特点,为提高PCB连接可靠性,特别是这种IC封装用PCB与芯片连接的可靠性,引入了镍钯金PCB,实现了其高可靠性的连接;并根据键合工艺的的要求,优化选择了键合温度、键合机台压力、功率和键合时间等工艺参数,进行了一系列引线键合实验,取得了键合点的相关实验数据,并对...     

Effects of build-up printed circuit board thickness on the solderjoint reliability of a wafer level chip scale package (WLCSP)

The creep analyses of solder-bumped wafer level chip scale package (WLCSP) on build-up printed circuit board (PCB) with microvias subjected to thermal cyclic loading are presented. The emphasis of this study is placed on the effects of the thickness of the PCB with a microvia build-up layer on the solder joint reliability of the WLCSP assembly. The 62Sn-2Ag-36Pb solder joints are assumed to follow the Garofalo-Arrhenius creep constitutive law. The shear stress and creep shear strain hysteresis loops, shear stress range, creep shear strain range, and creep strain energy density range at different locations in the corner solder joint are presented for a better understanding of the thermal-mechanical behaviors of the solder-bumped WLCSP on build-up PCB with microvias. It is found that, due to the large coefficient of thermal expansion of the build-up resin, the effects of thickness of the PCB with microvia build-up layer become much more significant than that without the microvia build-up layer     

晶圆尺寸级封装器件的热应力及翘曲变形

晶圆尺寸级封装(WLCSP)器件的尺寸参数和材料参数都会对其可靠性产生影响。使用有限元分析软件MSCMarc,对EPS/APTOS生产的WLCSP器件在热循环条件下的热应力及翘曲变形情况进行了模拟,分析了器件中各个尺寸参数对其热应力及翘曲变形的影响。结果表明:芯片厚度、PCB厚度、BCB厚度和上焊盘高度对WLCSP的热应力影响较为明显。其中,当芯片厚度由0.25mm增加到0.60mm时,热应力增加了21.60MPa;WLCSP的翘曲变形主要受PCB厚度的影响,当PCB厚度由1.0mm增加到1.60mm时,最大翘曲量降低了20%。