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1.
TiBw/TC4 composite was brazed to Ti60 alloy successfully using TiZrNiCu amorphous filler alloy, and the interfacial microstructures and mechanical properties were characterized by SEM, EDX, XRD and universal tensile testing machine. The typical interfacial microstructure was TiBw/TC4 composite/β-Ti + TiB whiskers/(Ti, Zr)2(Ni, Cu) intermetallic layer/β-Ti/Ti60 alloy when being brazed at 940 °C for 10 min. The interfacial microstructure evolution was influenced strongly by the diffusion and reaction between molten fillers and the substrates. Increasing brazing temperature decreased the thickness of brittle (Ti, Zr)2(Ni, Cu) intermetallic layer, which disappeared finally when the brazing temperature exceeded 1020 °C. Fracture analyses indicated that cracks were initialized in the brittle intermetallic layer when (Ti, Zr)2(Ni, Cu) phase existed in the brazing seam. The maximum average shear strength of joints reached 368.6 MPa when brazing was conducted at 1020 °C. Further increasing brazing temperature to 1060 °C, the shear strength was decreased due to the formation of coarse lamellar (α+β)-Ti structure.  相似文献   

2.
Reliable brazing of TZM alloy and ZrC particle reinforced (ZrCp) W composite was achieved in this study by using Ti-28Ni eutectic brazing alloy. The typical interfacial microstructure of TZM/Ti-28Ni/ZrCp-W brazed joint consisted of a Ti solid solution (Ti(s, s)) layer, a continuous Ti2Ni layer and a diffusion layer mainly composed of W particles and (Ti, Zr)C particles. With an increase of brazing temperature, more ZrC particles and W particles entered the molten brazing alloy, which broadened the brazing seam and diminished the Ti2Ni layer, resulting in the disappearance of the Ti2Ni layer eventually. Meanwhile, more Ti(s, s) stripes were observed on the TZM side. The presence of continuous Ti2Ni intermetallic phase and Ti(s, s) stripes structure in joints deteriorated the joining properties, which resulted in the formation of brittle fracture under shear test. In addition, the fracture path was related to the brazing temperature, and cracks initiate and propagate in the continuous Ti2Ni layer at lower temperatures. However, the fracture path tended to be located at the TZM substrate close to the interface between TZM and the brazing seam when the brazing temperature exceeded 1040 °C. The optimal room temperature shear strength reached 120.5 MPa when brazed at 1040 °C for 10 min and the fracture surface exhibited cleavage fracture characteristics, and the shear strength at high temperature of 800 °C for the specimens with highest shear strength at room temperature reached 77.5 MPa.  相似文献   

3.
An amorphous Ti41.7–Zr26.7–Cu14.7–Ni13.8–Co3.1 (wt%) ribbon fabricated by melt spinning was used as filler to vacuum braze Ti–48Al–2Nb–2Cr (at%) intermetallics. The influences of brazing temperature and time on the microstructure and strength of the joints were investigated. It is found that intermetallic phases of Ti3Al and γ-Ti2Cu/Ti2Ni form in the brazed joints. The tensile strength of the joint first increases and then decreases with the increase of the brazing temperature in the range of 900–1050 °C and the brazing time varying from 3 to 15 min. The maximum tensile strength at room temperature is 316 MPa when the joint is brazed at 950 °C for 5 min. Cleavage facets are widely observed on all of the fracture surfaces of the brazed joints. The fracture path varies with the brazing condition and cracks prefer to initiate at locations with relatively high content of γ-Ti2Cu/Ti2Ni phases and propagate through them.  相似文献   

4.
卞红  田骁  冯吉才  高峰  胡胜鹏 《焊接学报》2018,39(5):33-36,68
采用TiZrNiCu非晶钎料实现了TC4和Ti60异种钛合金的真空钎焊连接,利用扫描电子显微镜(SEM)、能谱仪(EDS)和X射线衍射仪(XRD)等分析手段研究了钎焊工艺参数对接头界面组织结构及力学性能的影响. 结果表明,TC4/TiZrNiCu/Ti60钎焊接头的典型界面结构为:TC4/α-Ti+β-Ti+(Ti,Zr)2(Ni,Cu)/Ti60. 随着钎焊温度升高或保温时间延长,片层状α+β相逐渐填充整条钎缝,(Ti,Zr)2(Ni,Cu)相含量减少且分布更加均匀. 接头室温抗拉强度随钎焊温度或保温时间的增加均先增大后减小,在990 ℃/10 min钎焊条件下所获接头抗拉强度达到最大为535.3 MPa. 断口分析结果表明,断裂位于钎缝中,断裂方式为脆性断裂.  相似文献   

5.
采用AgCuInTi、AgCuTi和AgCuPd三种钎料对NiTiNb形状记忆合金进行真空钎焊,对应的钎焊温度分别为780℃、880℃和980℃,获得了冶金质量良好的接头。微观分析结果表明,三种接头的中心区域均生成了Ag基固溶体,在该固溶体区与NiTiNb母材之间生成了灰黑色扩散反应层,其中AgCuInTi和AgCuTi钎料对应接头的反应层中生成了(Cu,Ni)Ti化合物相,而AgCuPd钎料对应接头的反应层中生成了(Cu,Pd,Ni)-Ti相。测试三种钎料对应接头的室温抗拉强度,强度最高的是AgCuPd钎料对应接头,平均值达到593 MPa;其次为AgCuInTi钎料对应接头,抗拉强度为528 MPa;强度最低的是NiTiNb/AgCuTi/NiTiNb接头,平均值为459 MPa。保温时间对NiTiNb/AgCuInTi/NiTiNb接头微观组织及强度影响较小。分析接头断口发现,断裂主要发生在性能薄弱的(Cu,Ni)Ti相区或(Cu,Pd,Ni)-Ti相区。  相似文献   

6.
The influence of brazing temperature and brazing time on the microstructure and shear strength of γ-TiAl/GH536 joints brazed with Ti−Zr−Cu−Ni−Fe−Co−Mo filler was investigated using SEM, EDS, XRD and universal testing machine. Results show that all the brazed joints mainly consist of four reaction layers regardless of the brazing temperature and brazing time. The thickness of the brazed seam and the average shear strength of the joint increase firstly and then decrease with brazing temperature in the range of 1090−1170 °C and brazing time varying from 0 to 20 min. The maximum shear strength of 262 MPa is obtained at 1150 °C for 10 min. The brittle Al3NiTi2 and TiNi3 intermetallics are the main controlling factors for the crack generation and deterioration of joint strength. The fracture surface is characterized as typical cleavage fracture and it mainly consists of massive brittle Al3NiTi2 intermetallics.  相似文献   

7.
对TC1钛合金蜂窝夹层结构试件的钎焊界面组织进行观察、分析确定界面生成相的晶体结构,采用EET理论中BLD方法和平均原子模型,计算分析了钎焊界面价电子结构.从原子间结合力的角度分析了钛合金蜂窝夹层结构钎焊界面的价电子结构,探讨了界面结构与力学性能的本质关系.钎焊过程中界面处生成了六方晶体结构TiNi3(Cu,Zr)化合物和体心立方结构Ti(Ni,Zr,Cu)相.从原子间成键角度,最大共价电子数和晶格电子数分别反映了晶体的强度和塑性.TiNi3(Cu,Zr)化合物和Ti(Ni,Zr,Cu)相的最大共价电子数分别为0.055 8和0.303 7,晶格电子分别为0.993 5和1.392 8,而界面处基体的最大共价电子数和晶格电子数分别为0.305 9和1.397 3.因此,与TiNi3(Cu,Zr)化合物相比,Ti(Ni,Zr,Cu)和钛固溶体晶胞不仅具有较高的强度,还具有相对良好的塑性,而TiNi3(Cu,Zr)化合物相的存在和连续分布不利于钎焊界面的强度和塑性.  相似文献   

8.
Filler metal of a low-melting-point (917 °C) Ti-21Ni-14Cu was brazed onto the substrate of Ti-6Al-4V alloy at 960 °C for 2,4, and 8 h to investigate the microstructural evolution and electrochemical characteristics of the brazed metal as a function of the period of brazing time. Optical microscopy, scanning and transmission electron microscopy, and x-ray diffractometry were used to characterize the microstructure and phase of the brazed metal; also, the potentiostat was used for corrosion study. Experimental results indicate that diffusion of copper and nickel from the filler metal into the equiaxed a plus intergranular β structure of Ti-6Al-4V substrate causes the lamellar Widmanstätten structure to form. The intermetallic Ti2Ni phase existing in the prior filler metal diminishes, while the Ti2Cu phase can be identified for the metal brazed at 960 °C for 2 h, but the latter phase decreases with time. Advantage might be taken from the evidence of faster diffusion of nickel than copper along the β phase to the substrate. In deaerated Hank’s solution, corrosion potential, corrosion current density, and critical potential for active-to-passive transition decrease while the passivation range broadens with the period of brazing time. However, all the brazed metals, immersed for different periods in oxygen-saturated Hank’s solution, show similar corrosion behavior, irrespective of the brazing time.  相似文献   

9.
以B-Ti57CuZrNi-S为钎料,在氩气保护气氛下对TC6/TC11钛合金进行高频感应钎焊工艺实验研究。采用光学显微镜(OM)、扫描电镜(SEM)及能谱分析(EDS)等测试方法,分析气体保护流量、流态以及工艺参数对焊接界面形貌、接头组织及元素分布的影响,并测试接头的抗拉强度。结果表明,钎焊界面主要由富Ti的β-Ti固溶组织和Cu-Ti、Ni-Ti以及(Cu,Ni)Ti/Zr组成的金属间化合物相组成。钎焊接头的抗拉强度随钎焊温度的升高或保温时间的延长,呈现先升高后降低的趋势,接头最高强度可达433MPa。TC6/TC11钛合金高频感应钎焊优化工艺参数带为:焊接温度910℃~930℃,保温时间120~150 s,Ar气保护流量1 MPa。  相似文献   

10.
Ti-Zr-Ni-Cu非晶钎料钎焊Si3N4陶瓷的连接强度   总被引:4,自引:1,他引:4  
采用Ti40Zr25Ni15Cu20非晶钎料钎焊Si3N4陶瓷,研究钎焊工艺参数对界面反应层和接头连接强度的影响。结果表明:随着钎焊时间的增加和钎焊温度的提高,接头弯曲强度都表现出先上升后下降的趋势;钎焊工艺参数对连接强度的影响主要是由于影响反应层厚度所致;在相同钎焊工艺条件下,采用Ti40Zr25Ni15Cu20非晶态钎料和晶态钎料相比,其接头连接强度提高了84%。  相似文献   

11.
为研发一种以TC4薄板直接作为金属造形材料的快速成形技术,选用自制的Ti基快冷薄带钎料,结合高频感应钎焊技术,制备了层积成形试样。通过对试样的力学性能、钎焊接头界面的显微组织进行分析。结果表明,由非晶态钎料制备的层积成形试样抗拉强度高于TC4,而晶态钎料的低于TC4。2种钎料成形试样的钎焊接头组织均由(Ti,Zr)_2(Cu,Ni)+(Ti,Zr)_(ss)共晶组织和富Zr的α-Ti固溶体构成,钎缝的拉伸断口呈人字纹形貌,为脆性断裂。  相似文献   

12.
采用高频感应加热的方式 ,在Ar气保护条件下 ,用Ag -Cu -Ti钎料实现了TiAl基合金与 4 0Cr钢的钎焊连接 ;采用扫描电镜、电子探针、X射线衍射分析等手段对断口、界面、生成相进行了分析 ,并且测试了接头的抗拉强度。结果表明 ,在界面上有Ti(CuAl) 2 、Ag[s,s]、TiC等反应相生成 ,典型接头界面结构为TiAl/Ti(CuAl) 2 +Ag[s ,s]/Ag[s,s]/TiC/ 4 0Cr) ;断裂位置及接头的抗拉强度随保温时间而变化 ;当钎焊连接温度为 114 3K ,保温时间 0 .9ks时接头抗拉强度值最高 ,达到 2 98MPa,断裂主要发生在Ti(CuAl) 2 层内部  相似文献   

13.
采用Ni-34Ti共晶钎料实现了TiAl合金的钎焊连接,分析了TiAl合金钎焊接头的界面结构,重点研究了钎焊温度对接头组织及性能的影响规律.结果表明,Ni-34Ti共晶钎料主要由TiNi相和TiNi3相组成,钎料熔点为1 120 ℃.不同钎焊温度下获得的接头界面组织均呈现对称特征,无气孔和裂纹等缺陷,接头中主要形成了TiNiAl2,B2,TiNiAl和TiNi2Al四种物相.Al元素在钎缝中的快速扩散,促进了钎缝中Ti-Ni-Al三元化合物的形成.钎焊温度为1 180 ℃保温10 min条件下,TiAl合金接头获得了最大的室温抗剪强度87 MPa.剪切过程中,裂纹容易在富含TiNi2Al相的区域产生和扩展,大量脆性TiNi2Al相的存在对接头的性能是有害的.  相似文献   

14.
以Ag—Cu—Ti箔状钎料对钛合金TCA和不锈钢1Cr18Ni9Ti进行了真空钎焊。采用扫描电镜、能谱分析、金相显微镜和x一射线衍射等分析测试手段对钎焊过程中所形成的反应产物和接头界面结构进行了分析。结果表明:接头界面形成了Ti(s.s)、AS(s.s)、Ti—Cu金属问化合物等反应产物。连接温度较低(920℃)时,界面结构依次为1Cr18Ni9Ti/TiCu/Ag(s.s)+少量Ti2cu/%2cu/Ti2cu+Ti(s.s)/TC4;连接温度升高(960oC)时,界面结构为1Crl8Ni9Ti/Ti:Cu/Ti:Cu+矩(s.s)/Ti2Cu/Ti2Cu+Ti(s.s)/TCA;连接温度较高(1000oC)时,界面结构为1Crl8Ni9Ti/TiCu2/TiCu/Ti2Cu/Ti:Cu+Ti(s.s)/TC4。提高钎焊温度与延长保温时间对钎焊接头界面组织结构有相似的影响,各反应相、反应层逐渐长大,金属问化合物反应相所占比例增大,而Ag(s.s)组织所占的比例变得更小,这种趋势随着焊接工艺参数的提高更加明显。  相似文献   

15.
Ti61.57Zr17.15Ni14.80Cu6.38(atom fraction, %) metallic glass has applications in brazing. Using the hammer-and-anvil technique, Ti61.67Zr17.15Ni14.80Cu6.38 metallic glass was prepared. The crystallization behavior for this metallic glass was investigated by differential scanning calorimetry(DSC), X-ray diffractometry (XRD) and transmission electron microscopy(TEM). There are three stages in DSC curves of crystallization. The reduced glass temperature Trg is 0.42. The kinetic parameters of crystallization were calculated by a set of equations of the maximum crystallization rate. The crystalline phase formed in the MSⅠ(Metastable stage D is Zr2Cu, in the MSII is α-Ti and in the MSⅢ is Ti2Ni. This kind of alloy has lower glass forming ability, and the Ti61.67Zr17.15Ni14.80Cu6.38 metallic glass has lower thermal stability.  相似文献   

16.
采用Ti40Zr25Ni15Cu20非晶钎料进行了Si3N4陶瓷真空钎焊连接,利用SEM、EDX等微观分析手段,研究了钎焊界面的微观结构,得出界面反应层有两部分组成,接头界面微观结构为Si3N4/TiN/Ti-Si,Zr-Si化合物/钎缝中心;在相同钎焊工艺条件下,研究对比了晶态和非晶态钎料钎焊接头的强度,发现非晶态钎料钎焊的接头强度大大超过用晶态钎料钎焊的接头.  相似文献   

17.
AgCu/Ni composite interlayer was used to join SiO2 glass ceramic to Ti-6Al-4V alloy successfully, obtaining the largest joint shear strength 110MPa. Ag, Cu and Ni in the interlayer and Ti in the Ti-6Al-4V alloy affect the joint formation and interfacial products significantly. To understand the joint formation process better, behaviors of elements Ag, Cu, Ni and Ti during the brazing of SiO2 glass ceramic to Ti-6Al-4V alloy were investigated in the present work. Active element Ti is the most important component in the joining, realizing the metallurgical bonding of SiO2 glass ceramic to braze alloy. Cu together with Ni reacts to Ti in the base material by Ti-Cu-Ni ternary eutectic reaction, which is beneficial for reducing the massive Ti-Cu and/or Ti-Ni brittle intermetallic compounds on the joint interface. Dispersion of Ag decreases the brittleness of the whole joint effectively.  相似文献   

18.
以Ti为中间层实现了TiAl与Ni基合金的接触反应钎焊。采用扫描电镜和电子探针等手段对钎焊接头的界面结构及生成相进行分析,并对接头剪切强度进行测试。结果表明:当钎焊温度为960℃时,钎缝主要由Tiss和Ti2Ni组成;当钎焊温度从960℃升高到1000℃时,钎缝中生成Ti-Al及Al-Ni-Ti化合物,典型界面结构为:GH99/(Ni,Cr)ss/Ti2Ni+AlNi2Ti+TiNi/Ti3Al+Al3NiTi2/Ti3Al+Al3NiTi2/TiAl;钎焊温度继续升高,Ti3Al和Al3NiTi2变得粗大,导致接头性能下降。当钎焊温度为1000℃,保温10min时,接头剪切强度达到最大值233MPa。随钎焊温度的升高,钎缝厚度先增加后减小。  相似文献   

19.
To design a promising Al—Si filler alloy with a relatively low melting-point, good strength and plasticity for the Cu/Al joint, the Cu, Ni, Zr and Er elements were innovatively added to modify the traditional Al—Si eutectic filler. The microstructure and mechanical properties of filler alloys and Cu/Al joints were investigated. The result indicated that the Al—Si—Ni—Cu filler alloys mainly consisted of Al(s,s), Al2(Cu,Ni) and Si(s,s). The Al—10Si—2Ni—6Cu filler alloy exhibited relatively low solidus (521 °C) and liquidus (577 °C) temperature, good tensile strength (305.8 MPa) and fracture elongation (8.5%). The corresponding Cu/Al joint brazed using Al—10Si—2Ni—6Cu filler was mainly composed of Al8(Mn,Fe)2Si, Al2(Cu,Ni)3, Al(Cu,Ni), Al2(Cu,Ni) and Al(s,s), yielding a shear strength of (90.3±10.7) MPa. The joint strength was further improved to (94.6±2.5) MPa when the joint was brazed using the Al—10Si—2Ni—6Cu—0.2Er—0.2Zr filler alloy. Consequently, the (Cu, Ni, Zr, Er)-modified Al—Si filler alloy was suitable for obtaining high-quality Cu/Al brazed joints.  相似文献   

20.
《Acta Materialia》2003,51(7):1991-2004
TiAl intermetallic alloy joined by infrared brazing using BAg-8 braze alloy was investigated. The microstructural evolution of the brazed joint, shear strength and reaction kinetics across the joint was comprehensively evaluated. According to the experimental observations, silver would not react with the TiAl substrate, but copper reacted vigorously with the TiAl, forming continuous reaction layer. The consumption of copper from molten braze during infrared brazing resulted in depletion of the copper content from the braze. Therefore, chemical composition of the braze deviated from Ag-Cu eutectic into hypoeutectic with increased brazing time and/or temperature. Both AlCuTi and AlCu2Ti phase were observed at the interface between BAg-8 and TiAl substrate for the specimen brazed at 950°C. By increasing the brazing temperature and time, the growth rate of AlCuTi phase was much faster than that of AlCu2Ti phase. The maximum shear strength achieved 343 MPa for the specimen infrared brazed at 950°C for 60 s. Further increasing the brazing time resulted in excessive growth of brittle AlCuTi reaction layer, which greatly deteriorated the shear strength of the joint.  相似文献   

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