Analysis of Convective Thermal Resistance in Ducted Fan-Heat Sinks

The thermal performance of plate fin, round pin-fin, and offset strip-fin heat sinks with a duct-flow type fan arrangement was analytically evaluated. Heat sinks of 65mm$times hbox60, hboxmm hboxplan hboxareatimes hbox50 hboxmm hboxheight$with a 4300-RPM dc fan (60mm$times$15mm) were chosen for the performance comparison. A constant temperature, 6-mm thick heat sink base plate is assumed so that thermal spreading resistance is not involved. The operating point on the fan curve is based on the flow pressure drop impedance curve through a heat sink using the friction factor correlation for the chosen heat sink. The loss coefficients at both the entrance and the exit of the heat sink are included in the flow impedance curve. The operating point is defined by the balance point of the flow impedance curve and the fan performance curve. After determining the operating air velocity, the convective thermal resistance of heat sinks is evaluated from the Nusselt number correlation for the chosen heat sink. Results obtained show that optimized round pin-fin heat sinks provide 32.8%–46.4% higher convective thermal resistance compared to an optimized plate-fin heat sink. The optimized offset strip-fin heat sink shows a slightly lower convective thermal resistance than the plate-fin heat sink. As the offset strip length decreases, however, thermal performance seriously deteriorates.     

Thermal limitations of CW and pulsed silicon TRAPATT diodes

The power density distribution in the avalanche zone of a TRAPATT-diode is approximated by a rectangular pulse in order to consider it as a source function in the heat equation. Heat generation is considered to be periodic, and the dissipation is taken with a thermal time constant larger than the period. The increase in frequency needs a decrease in depletion width, improving the thermal conduction to the heat sink. The power density needed increases with frequency, thus raising the maximum temperature in the depletion region with frequency. The criteria for the best performance is that the two processes of heat generation and conduction to the heat sink are to be so adjusted as to lead to a mininum rise in temperature. The steady state temperature rise in CW operation comes out to beR_{TH} cdot P_{I} cdot W_{ASF}/v_{z} cdot f, while in the pulsed case this expression is related to the maximum temperature. The maximum temperature allowable in the depletion region should be lower than that required for any failure to occur. Using these criteria the thermal limitations for CW and pulsed operations of the TRAPATT diode have been analyzed.     

Transistor design and thermal stability

A model has been developed for the computation of forward second breakdown due to lateral thermal instability in power transistors. The method of analysis is to derive the steady-state current density and temperature distribution of a given transistor design under specified operating conditions, and then to calculate the response of the device to a temperature impulse suddenly applied internally. The current flow calculations have been carried out by using a distributed transistor model, and for the time-dependent heat flow problem the finite difference approach was used. The effect of device design parameters such as chip thickness, base width, emitter width, base impurity concentration, etc., on the thermal stability has been calculated. Also, the effect on transistor stability of the current and voltage operating point, as well as the heat sink temperature, has been analyzed. Information on the stability of a power transistor under pulsed condition is derived by calculating the time constant for thermal runaway. The results of this analysis indicate that the delay time is of the order of 1 ms.     

A numerical study of the thermal performance of an impingement heat sink-fin shape optimization

This paper presents the results of a numerical analysis of the performance of an impingement heat sink designed for use with a specific blower as a single unit. These self-contained heat sink/blower units, which cause impingement type flow on the heat sink fins, are now commonly used for desktop microprocessors. One of the objectives of this study is to examine the effect of the shape of the heat sink fins, particularly near the center of the heat sink, on the thermal performance of the package. The pressure gradient at the center of the heat sink, near the base, tends to be high. It significantly reduces the airflow, and hence, transport in that region. Different fin shapes and airflow rates have been studied with the objective of searching for an optimal heat sink design that would improve the thermal performance without increasing the pressure drop across the heat sink. Parallel plate fins have been studied by removing fin material from the region near the center of the heat sink along the length and height of the fins. Seventeen different designs have been compared, and an "optimum" heat sink shape is reported that results in a lower operating temperature and pressure drop. It is found that removal of fin material from the central region of the heat sink enhances the thermal as well as hydraulic performance of the heat sink.     

Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses

This paper concerns the problem of generating reduced dynamic thermal models whose elements have physical interpretation. The compact models of an electronic system are generated here based on the analysis of the time constant spectra of system transient thermal responses. The proposed method is illustrated on a practical example of an integrated power amplifier with a heat sink. The experiments demonstrate the influence of contact resistance and cooling conditions on the resulting values of thermal model elements.     

Thermal Effect of Ceramic Substrate on Heat Distribution in Thermoelectric Generators

In thermoelectric generators (TEG), poor system design and load matching, which make the system less efficient, have been limiting factors in achieving high conversion efficiency. In this work, to consider the effect of the inlet plenum arrangement and the laminar coolant flow temperature variation in the heat sink, a parallel microchannel heat sink is applied to a real TEG. The focus of this study is a discussion of the temperature difference variation between the cold/hot sides of the TEG legs versus the variation of the thermal conductivity of the ceramic substrate and the thickness of the substrate on the hot side. While the imposed heat flux on the TEG is homogeneously constant, different pressure drops are applied along the microchannel heat sink. The three-dimensional governing equations for the fluid flow and heat transfer are solved using the finite-volume method. The results show that the temperature difference is affected remarkably by the pressure drops in the heat sink, the thermal conductivity of the ceramic substrate, and the thickness of the substrate on the hot side.     

Performance analysis of heat pipe aided NEPCM heat sink for transient electronic cooling

An experimental investigation on the thermal performance of Nano Embedded Phase Change Material (NEPCM) heat sink with heat pipe has been conducted for electronic cooling in Personal computers. The NEPCM and heat pipe configuration in the heat sink effectively eliminates the use of electronic fan. A flat plate heater was used to simulate the computer's microprocessor. The heat sink configurations were placed above the flat plate heater and tested for multiple head load conditions. The addition of NEPCM increases the heat storage capacity, causes a delay effect on the sensible temperature rise and maintained the core temperature of the heat sink at room temperature for prolonged time. Heat pipe charged with R134a refrigerant placed inside the heat sink cavity for regeneration of NEPCM in heat sink. The results showed that use of heat pipe aided NEPCM heat sink caused a 3 °C decrease in the heater's surface plate temperature during six hours of the operating period without the help of electronic fan or any other forced convection.     

高功率轴快流CO2激光器激励源热沉结构优化设计

为了提高激励源的热稳定性,保证4kW轴快流CO₂激光器的光束质量,采用计算流体动力学的方法,理论分析了激光器激励源热沉的散热机理,对热流密度为106W/m2、面积为16cm2的激励源热沉结构进行了优化设计。结果表明,经过优化之后的热沉其表面的最高温度低于340K,完全能够满足激光器正常工作时激励源核心功率MOSFET对散热指标的要求;同时经过数值模拟得到了带凹槽微通道热沉的优化结构尺寸,分别是微通道凹槽间距P=0.6mm,微通道凹槽倾角θ=45°,微通道凹槽交错距离s=0.1mm,同时当雷诺数Re=546.9时,热沉有最优的散热效果,激光输出功率的稳定度可以控制在±2%以内。此研究为设计具有高效散热能力的微通道热沉提供了理论指导。     

Theory and simulation of a thermally matched micromachined thermopile in a wearable energy harvester

In this paper, a new theoretical concept in the thermoelectric theory is discussed, which is important for design optimization of a thermoelectric energy harvester. The general conditions are defined, which are required to make a thermoelectric converter effective in energy harvester application. The necessity of the work has been prompted by the fact that while modeling the harvesters neither a constant temperature difference nor a constant heat flow can be assumed. It is shown that the proposed equations allow thermal optimization of energy harvesters to reach their top performance characteristics. The example of thermal optimization in case of MEMS thermopiles is discussed then. It is shown that the knowledge of thermal properties of the environment, i.e., those of a heat source and a heat sink, play the key role in the optimization procedure.     

金刚石复合热沉面发射激光器面阵热特性研究

通过设计基于金刚石微槽结构的复合热沉,利用不同材料的热导率差异改变热流传导方向,以优化垂直腔面发射半导体激光器(VCSEL)面阵由于温度分布不均匀导致的中心热量堆积的问题,从而改善激光器面阵整体的输出功率,提高可靠性。基于有限元分析法建立三维热电耦合模型,研究了VCSEL面阵单元排布方式对激光器热串扰效应的影响,同时还研究分析了金刚石复合热沉中微槽形状和位置的变化对半导体激光器内部温度的影响,设计最优结构对激光器的出光性能做进一步优化。采用金刚石复合热沉后的垂直腔面发射激光器面阵,与传统金刚石热沉的封装结构相比,激光器发光单元的温度差值降低了29%,为大面积半导体激光器面阵的输出功率优化提供了新思路。     

Optimal design methodology of plate-fin heat sinks for electronic cooling using entropy generation strategy

This paper presents a formal systematic optimization process to plate-fins heat sink design for dissipating the maximum heat generation from electronic component by applying the entropy generation rate to obtain the highest heat transfer efficiency. The design investigations demonstrate the thermal performance with horizontal inlet cooling stream is slightly superior to that with vertical inlet cooling stream. However, the design of vertical inlet stream model can yield to a less structural mass (volume) required than that of horizontal inlet stream model under the same amount of heat dissipation. In this paper, the constrained optimization of plate-fins heat sink design with vertical inlet stream model is developed to achieve enhanced thermal performance. The number of fins and the aspect ratio are the most responsive factors for influencing thermal performances. The heat sink used on AMD Thunderbird 1-GHz processor has been examined and redesigned by presenting optimization methodology. The optimal thermal analysis has a very good agreement to the both of vendors' announced information and using simulation of parabolic hyperbolic or elliptic numerical integration code series (PHOENICS). The optimum design that minimizes entropy generation rate in this paper primarily applied three criteria for plate-fins heat sink optimal design: formal constrained nonlinear programming to obtain the maximum heat dissipation; prescribed heat dissipation; prescribed surface temperature. As a result, the thermal performance can be notably improved; both the sink size and structural mass can apparently be reduced through the presented design method and process. This analysis and design methodology can be further applied to other finned type heat sink designs.     

Heat dissipation design and analysis of high power LED array using the finite element method

High-power Light Emitting Diode (LED) technology has developed rapidly in recent years from illumination to display applications. However, the rate of heat generation increases with the LED illumination intensity. The LED chip temperature has an inverse proportion with the LED lifetime. High-power LED arrays with good thermal management can have improved lifetime. Therefore, for better optical quality and longer LED lifetime it is important to solve the LED thermal problems of all components. In particular, Metal Core Printed Circuit Board (MCPCB) substrate heat sink design and thermal interface materials are key issues for thermal management. This paper presents an integrated multi-fin heat sink design with a fan on MCPCB substrate for a high-power LED array using the finite element method (FEM). The multi-fin heat sink design and simulation results provide useful information for LED heat dissipation and chip temperature estimation.     

一种高功率LED射灯的散热设计与实验研究

以一款MR16 LED射灯为模型,采用ANSYS有限元软件进行热分析。以散热器翅片保持60℃为标准,通过实验与仿真相结合的方法,分析了LED射灯的热流功率、散热器基座厚度、LED芯片间距、对流面积对整个系统散热性能的影响。结果表明,散热器对流面积是影响灯具散热性能的最重要因素;对一定的散热器,存在一个有效的最大芯片输入功率。现有MR16 LED射灯的散热器最大散热功率只能达到2.5 W左右,要使散热功率增大并且发挥散热器最佳性能,必须增加散热器的对流面积。对该结构散热器散热性能的定量研究对今后高功率LED灯具的生产具有一定的指导意义。     

Effects of the substrate on the response of pyroelectric detectors

In our studies dealing with a theoretical analysis on the response of pyroelectric detectors, it has been found that for substrate-attached pyroelectric detectors, the current responsivity falls off with decreasing frequency below a certain frequency due to the flow of heat out of the pyroelectric crystal into the substrate. The rate of the falloff depends on the thermal conductivity of the substrate. The higher the thermal conductivity, the faster the rate of the falloff. The current responsivity flattens out in a lower intermediate frequency range of 10^-2to 10²Hz. In this flat plateau region, the smaller the substrate thermal capacity, the higher the current responsivity. The theoretical analysis agrees with the experimental results using LiTaO3detectors mounted on silicon substrates.     

Thermal design and optimization of natural convection polymer pin fin heat sinks

The design and optimization methodology of a thermally conductive polyphenylene sulphide (PPS) polymer staggered pin fin heat sink, for an advanced natural convection cooled microprocessor application, are described using existing analytical equations. The geometric dependence of heat dissipation and the relationships between the pin fin height, pin diameter, horizontal spacing, and pin fin density for a fixed base area and excess temperature are discussed. Experimental results of a pin finned thermally conductive PPS heat sink in natural convection indicate substantially high thermal performance. Numerical results substantiate analytical modeling results for heat sinks within the Aihara et al. fin density range. The cooling rates and coefficient of thermal performance, COP/sub T/, that relates cooling capability to the energy invested in the formation of the heat sink, has been determined for such heat sinks and compared with conventional aluminum heat sinks.     

衬底热导对Mn-Co-Ni-O薄膜热敏 红外探测器性能的影响

研究了用Mn-Co-Ni-O薄膜材料制备的热敏红外探测器件,并主要通过调控衬底热导改进了器件性能。对于较薄的探测元,研究了具有微桥结构的红外器件。结果表明,该器件的响应率比非微桥器件高80%左右,探测率高44%左右。这主要是因为其独特的结构形式降低了器件热导,且对光的全反射效应提高了探测元对光的吸收率。对于较厚的探测元,在衬底上增加了抛光的散热铜片,使器件衬底的导热系数提高了47%左右,但响应电压降低了50%左右。因此需要合理选择散热铜片,以获得合适的时间常数和响应率。     

Investigations of transient thermal properties of conductively cooled diode laser arrays operating under quasicontinuous-wave conditions

Thermal properties of diode laser arrays not only affect electrical and optical characteristics, they can also become determining factors for long-term reliability of the devices. Here, we report on the investigations of transient thermal effects in high-power diode arrays operating under quasicontinuous-wave (QCW) conditions. A novel measurement setup for the transient junction temperature determination is proposed. We show the measurement results of conductively cooled diode laser arrays mounted on the conventional copper heat sink as well as on the thermal expansion matched CuW submount. The presented results allow evaluation of the thermal cycling experienced by the device during pulsed operation. In the following part, time-resolved wavelength and temperature variations within an array are presented. The guidance for heat sink material choice for high-power diode laser arrays designed for QCW operation is given.     

Characterization of compact heat sink models in natural convection

In this study, an approximate analytical-numerical procedure is used to model natural convection cooling of heat sinks using electronics cooling software. The analysis evolves in two stages: a numerical simulation of the detailed heat sink, and a simulation of a compact model that exhibits similar thermal and flow resistance characteristics to those of the actual heat sink. From the analysis, the thermal resistance of the heat sink is evaluated. Subsequently, the effective thermal conductivity that must be assigned to the compact heat sink is determined using the Nusselt number correlation for free convection over a vertical plate. Due to the algebraic form of the Nusselt number correlation, the effective thermal conductivity is determined in an iterative fashion. The purpose of a compact heat sink is to reduce computational effort while retaining a desired level of accuracy. In this article, the compact modeling scheme is first applied to either an extruded or a pin-fin heat sink in order to validate the procedure under laminar conditions. Subsequently, the same approach is applied to a multichip system consisting of a set of pin-fin heat sinks placed in series. At both individual and system-level models, it is found that the compact approach results in substantial savings in mesh size and computing time. These savings are accompanied by a small acceptable error that is less than 10% relative to the detailed model predictions     

Recent advances in device processing and packaging of high-power pulsed GaAs double-drift IMPATT's at X-band

High-power multimesa GaAs hybrid double-drift IMPATT's have been developed for pulsed operation at X-band. The diodes are fabricated from GaAs material grown by a novel "infinite" solution liquid phase epitaxial process. The use of specialized rapid thermal processing and packaging techniques has enabled the fabrication of high-power IMPATT oscillators that have delivered peak output powers of over 40 W with 20-percent efficiency under pulsed RF operation at X-band frequencies. The diodes are constructed with an integral heat sink and bounded with a Au-Sn eutectic solder in a microwave package.     

百瓦级多芯片半导体激光器稳态热分析

半导体激光器在各领域的广泛应用要求其输出功率不断提高,使得多芯片集成封装大功率半导体激光器的发展成为主流之一。针对典型的12 只芯片以阶梯形式封装的百瓦级激光器,利用ANSYS 软件进行了稳态热分析,模拟得出芯片有源区温度及其热耦合温升与热沉结构尺寸变化的关系曲线,分析了该激光器热特性,进而提出一种使芯片散热较好的热沉结构。