Electrical characteristics of an organic thin copolymer/p-Si Schottky barrier diode

We have fabricated a poly(aniline-3-methyl thiophene) organic thin material on p-Si substrate by placing a solution of copolymer in acetonitrile on top of a p-Si substrate and then evaporating the solvent. The electrical and interface state density properties of the poly(aniline-3-methyl thiophene) copolymer/p-Si/Al diode have been investigated through methods using current-voltage (I-V), Cheung's, and a modified Norde's function. Good agreement was observed with the values of barrier height as obtained from all of these methods. The diode shows a non-ideal I-V behavior with an ideality factor greater than unity, which could be ascribed to the interfacial layer, interface states and series resistance. The interface state density of diode was determined using the forward-bias I-V characteristic technique at room temperature, and it decreases exponentially with bias from 1.39 × 10¹⁶ cm⁻² eV⁻¹ in (0.06 − E_v) eV to 4.86 × 10¹⁵ cm⁻² eV⁻¹ in (0.51 − E_v) eV.     

Effect of an organic compound (Methyl Red) interfacial layer on the calculation of characteristic parameters of an Al/Methyl Red/p-Si sandwich Schottky barrier diode

An Al/Methyl Red/p-Si sandwich Schottky barrier diode (SBD) has been fabricated by adding a solution of the organic compound Methyl Red in chloroform onto a p-Si substrate, and then evaporating the solvent. Current-voltage (I-V) measurements of the Al/Methyl Red/p-Si sandwich SBD have been carried out at room temperature and in the dark. The Al/Methyl Red/p-Si sandwich SBD demonstrated rectifying behavior. Barrier height (BH) and ideality factor values of 0.855 eV and 1.19, respectively, for this device have been determined from the forward-bias I-V characteristics. The Al/Methyl Red/p-Si sandwich SBD showed non-ideal I-V behavior with the value of ideality factor greater than unity. The energy distribution of the interface state density determined from I-V characteristics increases exponentially with bias from 3.68 × 10¹² cm^− 2 eV^− 1 at (0.81 − E_v) eV to 9.99 × 10¹³ cm^− 2 eV^− 1 at (0.69 − E_v) eV.     

Capacitance and conductance-frequency characteristics of Au-Sb/p-GaSe:Gd Schottky barrier diode

The Schottky barrier height (SBH) values have been obtained from the reverse bias capacitance-voltage (C-V) characteristics of Au-Sb/p-GaSe:Gd Schottky barrier diode (SBD) in the temperature range of 180-320 K. The forward bias capacitance-frequency (C-f) and conductance-frequency (G-f) measurements of Au-Sb/p-GaSe:Gd SBD have been carried out from 0 to 1.00 V with steps of 0.05 V, whereby the energy distribution of the interface states and their relaxation time have been determined from these characteristics. It has been seen that there is a good agreement between the experimental and theoretical C-f and G-f values. Also, the capacitance values obtained from C-f measurements have shown almost a plateau up to a certain value of frequency, then, have decreased. It has been seen that the interface state density has a very small density distribution range (6.02 × 10¹⁰-6.80 × 10¹⁰ cm⁻² eV⁻¹) in the energy range of (0.21−E_v)-(1.21−E_v) eV with bias from the midgap towards the top of the valence band. The interface state density values calculated for Au-Sb/p-GaSe:Gd SBD are rather low than those given in the literature.     

Photovoltaic and interface state density properties of the Au/n-GaAs Schottky barrier solar cell

The electrical and photovoltaic properties of the Au/n-GaAs Schottky barrier diode have been investigated. From the current-voltage characteristics, the electrical parameters such as, ideality factor and barrier height of the Au/n-GaAs diode were obtained to be 1.95 and 0.86 eV, respectively. The interface state distribution profile of the diode as a function of the bias voltage was extracted from the capacitance-voltage measurements. The interface state density D_it of the diode was found to vary from 3.0 × 10¹¹ eV⁻¹ cm⁻² at 0 V to 4.26 × 10¹⁰ eV⁻¹cm⁻² at 0.5 V. The diode shows a non-ideal current-voltage behavior with the ideality factor higher than unity due to the interfacial insulator layer and interface states. The diode under light illumination exhibits a good photovoltaic behavior. This behavior was explained in terms of minority carrier injection phenomenon. The photovoltaic parameters, such as open circuit voltage and short circuit current density were obtained to be 362 mV and J_sc = 28.3 μA/cm² under AM1, respectively.     

Analysis of surface states and series resistance in Au/n-Si Schottky diodes with insulator layer using current-voltage and admittance-voltage characteristics

In order to good interpret the experimentally observed Au/n-Si (metal-semiconductor) Schottky diodes with thin insulator layer (18 Å) parameters such as the zero-bias barrier height (Φ_bo), ideality factor (n), series resistance (R_s) and surface states have been investigated using current-voltage (I-V), capacitance-frequency (C-f) and conductance-frequency (G-f) techniques. The forward and reverse bias I-V characteristics of Au/n-Si (MS) Schottky diode were measured at room temperature. In addition, C-f and G-f characteristics were measured in the frequency range of 1 kHz-1 MHz. The higher values of C and G at low frequencies were attributed to the insulator layer and surface states. Under intermediate forward bias, the semi-logarithmic Ln (I)-V plot shows a good linear region. From this region, the slope and the intercept of this plot on the current axis allow to determine the ideality factor (n), the zero-barrier height (Φ_bo) and the saturation current (I_S) evaluated to 2.878, 0.652 and 3.61 × 10⁻⁷ A, respectively. The diode shows non-ideal I-V behavior with ideality factor greater than unity. This behavior can be attributed to the interfacial insulator layer, the surface states, series resistance and the formation barrier inhomogeneity at metal-semiconductor interface. From the C-f and G-f characteristics, the energy distribution of surface states (N_ss) and their relaxation time (τ) have been determined in the energy range of (E_c − 0.493E_v)-(E_c − 0.610) eV taking into account the forward bias I-V data. The values of N_ss and τ change from 9.35 × 10¹³ eV⁻¹ cm⁻² to 2.73 × 10¹³ eV⁻¹ cm⁻² and 1.75 × 10⁻⁵ s to 4.50 × 10⁻⁴ s, respectively.     

Influence of tetramethylammonium hydroxide treatment on the electrical characteristics of Ni/Au/GaN Schottky barrier diode

The effect of tetramethylammonium hydroxide (TMAH) treatment on the electrical properties of Ni/Au/GaN Schottky diodes have been investigated by current–voltage (I–V) and capacitance–voltage (C–V) techniques. The barrier heights and ideality factors measured from I–V characteristics are found to be 0.70 eV and 1.32 for without TMAH treatment, and 0.78 eV and 1.14 for with TMAH treatment, respectively. Cheung method is used to measure the series resistance and barrier height of the Schottky diodes, and the barrier height consistency is checked using the Norde method. The magnitude of interface state density for the diodes without and with TMAH treatment are varied from 7.45 × 10¹³ eV⁻¹ cm⁻² to 6.09 × 10¹² eV⁻¹ cm⁻² and 4.03 × 10¹³ eV⁻¹ cm⁻² to 1.79 × 10¹² eV⁻¹ cm⁻² in the below the conduction band from E_C-0.19 eV to E_C-0.63 eV and E_C-0.22 eV to E_C-0.73 eV. Based on the results, the TMAH treatment effectively removes of surface oxide (Ga_xO_y) layer, formed due to the incorporation of the residual oxygen with Ga atom at the GaN surface during the plasma etching. The decrease in interface state density at the Ni/Au/GaN interface could be the reason for the improvement in the electrical properties.     

High frequency characteristics of tin oxide thin films on Si

High frequency characteristics of tin oxide (SnO₂) thin films were studied. SnO₂ thin films have been successfully grown on n-type Si (111) substrates by using a spray deposition technique. The capacitance-voltage (C-V) and conductance-voltage (G/ω-V) characteristics of the metal-oxide-semiconductor (Au/SnO₂/n-Si) Schottky diodes were investigated in the high frequency range from 300 kHz to 5 MHz. It has been shown that the interface state density, D_it, ranges from 2.44 × 10¹³ cm⁻² eV⁻¹ at 300 kHz to 0.57 × 10¹³ cm⁻² eV⁻¹ at 5 MHz and exponentially decreases with increasing frequency. The C-V and G/ω-V characteristics confirm that the interface state density and series resistance of the diode are important parameters that strongly influence the electrical parameters exhibited by the metal-oxide-semiconductor structure.     

Analysis of the energy distribution of interface traps related to tunnel oxide degradation using charge pumping techniques for 3D NAND flash applications

The energy distribution and density of interface traps (D_it) are directly investigated from bulk-type and thin-film transistor (TFT)-type charge trap flash memory cells with tunnel oxide degradation, under program/erase (P/E) cycling using a charge pumping (CP) technique, in view of application in a 3-demension stackable NAND flash memory cell. After P/E cycling in bulk-type devices, the interface trap density gradually increased from 1.55 × 10¹² cm⁻² eV⁻¹ to 3.66 × 10¹³ cm⁻² eV⁻¹ due to tunnel oxide damage, which was consistent with the subthreshold swing and transconductance degradation after P/E cycling. Its distribution moved toward shallow energy levels with increasing cycling numbers, which coincided with the decay rate degradation with short-term retention time. The tendency extracted with the CP technique for D_it of the TFT-type cells was similar to those of bulk-type cells.     

Rectifying pyronine-B/p-type silicon junctions formed by sublimation of pyronine-B

The rectifying junction characteristics of the organic compound pyronine-B film on a p-type Si substrate have been studied. The pyronine-B has been sublimed onto the top of p-Si surface. The barrier height and ideality factor values of 0.79 eV and 1.125 for this structure have been obtained from the forward-bias current–voltage characteristics. The density distribution of the interface states in the inorganic semiconductor bandgap and their relaxation time have been determined from the low-capacitance–frequency characteristics by the Schottky capacitance spectroscopy method. The measurement frequency varies from 90 Hz to 10 MHz. The interface state density N_ss ranges from 2.10×10¹⁰ cm^–2 eV^–1 in (0.79–E_v) eV to 1.16×10¹² cm^–2 eV^–1 in (0.53–E_v) eV. Furthermore, the relaxation time ranges from 1.38×10^–3 s in (0.53–F_V) eV to 7.50×10^–3 s in (0.79–E_V) eV.     

Electrical characterization of the polyaniline/p-silicon and polyaniline titanium dioxide tetradecyltrimethylammonium bromide /p-silicon heterojunctions

Au/PANI/p-Si/Al and Au/PANI TiO₂ TTAB/p-Si/Al heterojunctions have been fabricated by spin coating of soluble polyaniline (PANI) and PANI titanium dioxide (TiO₂) tetradecyltrimethylammonium bromide (TTAB) on the chemically cleaned p-Si substrates. The thicknesses of the polymeric films have been determined by a profilometer. The current-voltage (I-V) characteristics of the heterojunctions have been obtained in the temperature range of 98-258 K. These devices have showed the rectifying behavior such as diode. The I-V characteristics of the devices have been analyzed on the basis of the standard thermionic emission theory at low forward bias voltage regime. It has been shown that the values of ideality factor decrease while the values of barrier height increase with increasing temperature. This temperature dependence has been attributed to the presence of barrier inhomogeneities at the organic/inorganic semiconductor interface. Furthermore, analysis of the double logarithmic I-V plots at higher forward bias voltages at all temperatures indicates that transport through the organic thin film is explained by a space-charge-limited current process characterized by exponential distribution of traps within the band gap of the organic film. The total concentration of traps has been found to be 3.52 × 10¹⁴ cm^− 3 and 3.14 × 10¹⁵ cm^− 3 for PANI and PANI TiO₂ TTAB layer, respectively.     

The effect of high temperature annealing on Schottky diode characteristics of Au/n-Si contacts

The current-voltage and capacitance-voltage characteristics of Au/n-Si/Al Schottky barrier diode were measured in the temperature range of 100-800 °C. Au/n-Si/Al Schottky barrier diode annealed at temperatures from 100 °C to 400 °C for 5 min and from 500 °C to 800 °C for 7 min in N₂ atmosphere. The electronic parameters such as barrier height and ideality factor (n) of the device were determined using Cheung's method. To determine whether or not a Schottky diode is ideal it can be used the ideality factor (n) found from its forward current-voltage (I-V) characteristics. It has been found that the value of Φ_b (0.82 or 0.83 eV) remains constant up to 500 °C and 0.80 and 0.79 eV in 600, 750 °C respectively in the forward I-V mode. An ideality factor value of 1.04 was obtained for as-deposited sample. The ideality factor n varied from 1.04 to 2.30. The experimental results have shown that the ideality factor (n) values increases with increasing annealing temperature up to 750 °C. This has been explained in terms of the presence of different metallic-like phases produced by chemical reactions between the Au and Si substrate because of the annealing process. The Φ_b (C-V) values obtained from the reverse-bias C⁻²-V curves of the as-deposited and annealed diode are in the range 0.99-1.12 eV. The difference between Φ_b (C-V) and the Φ_b (I-V) is in close agreement with values reported in literature. Besides Fermi energy level and carrier concentration determined by using thermionic emission (TE) mechanism show strong temperature dependence. It has been seen current-voltage characteristics of the diode show an ideal behavior.     

Study of GeYSi1 − Y:H films deposited by low frequency plasma

In this work, we report a study of the optical properties measured through spectral transmission and spectroscopic ellipsometry in Ge:H and Ge_YSi_1 − Y:H (Y ≈ 0.97) films deposited by low frequency (LF) PE CVD with hydrogen (H) dilution. The dilution was varied in the range of R = 20 to 80. It was observed that H-dilution influences in a different way on the interface and bulk optical properties, which also depend on incorporation of silicon. The films with low band tail characterized by its Urbach energy, E_U, and defect absorption, α_D, have been obtained in Ge:H films for R = 50 with E_U = 0.040 eV and α_D = 2 × 10³ cm^− 1 (hν ≈ 1.04 eV), and in Ge_YSi_1 − Y:H films for R=75 with E_U = 0.030 eV and α_D = 5 × 10² cm^− 1 (hν ≈ 1.04 eV).     

A study on the interface and bulk charge density of AlN films with sputtering pressure

An attempt to correlate deposition-induced effects and the morphological properties with the electrical properties of the aluminum nitride (AlN) films have been made. The AlN film was sputter deposited on silicon while increasing the pressure in steps from 2×10⁻³ to 8×10⁻³ mbar. An X-ray diffractogram revealed that the intensity of (0 0 2) orientation increased till 6×10⁻³ mbar pressure, but it changed to (1 0 0) orientation of the AlN film at 8×10⁻³ mbar. The FTIR spectra of the absorption band of the films were observed around 682 cm⁻¹ and became prominent at 6×10⁻³ mbar. A decrease in the grain size was seen by SEM images at 8×10⁻³ mbar. The AFM measurements revealed that the surface roughness varied from 1.56 to 3.24 nm with pressure. It was found that the insulator charge density (Q_in) increased from 1.4×10¹¹ cm⁻² to 1.3×10¹² cm⁻² with increase in pressure. On the other hand, the interface state density (D_it) was found minimum (7.3×10¹¹ eV⁻¹ cm⁻²) at 6×10⁻³ mbar. It is found that presence of the Q_in and D_it are primarily governed by the sputtering pressure of the AlN film.     

Impurity induced band-gap narrowing in p-type CuIn1 − xGax(S,Se)2

Green's functions modelling of the impurity induced effects in p-type CuIn_1 − xGa_xS₂ and CuIn_1 − xGa_xSe₂ (x = 0.0, 0.5, and 1.0) reveals that: (i) the critical active acceptor concentration for the metal non-metal transition occurs at N_c ≈ 10¹⁷-10¹⁸ cm^− 3 for impurities with ionization energy of E_A ≈ 30-60 meV. (ii) For acceptor concentrations N_A > N_c, the hole gas of the metallic phase affects the band-edge energies and narrows the energy gap E_g = E_g⁰ − ΔE_g. The energy shift of the valence-band maximum ΔE_v1 is roughly twice as large as the shift of the conduction-band minimum ΔE_c1. (iii) ΔE_v1 depends strongly on the non-parabolicity of the valence bands. (iv) Sulfur based compounds and Ga-rich alloys have the largest shifts of their band edges. (v) A high active acceptor concentrations of N_A = 10²⁰ cm^− 3 implies a band-gap narrowing in the order of ΔE_g ≈ 0.2 eV, thus E_g = E_g⁰ − 0.2 eV, and an optical band gap of E_g^opt ≈ E_g⁰ − 0.1 eV.     

100 keV nitrogen ion beam implanted polycarbonate: A possibility for UV blocking devices

Polycarbonate samples were implanted with 100 keV N⁺ ions at fluences 10¹⁵, 10¹⁶ and 5 × 10¹⁶ ions cm⁻². Drastic alterations in UV-Visible transmittance spectra were observed which are interrelated with change in surface color and optical absorption of the implanted samples. UV-Visible transmission studies show that at ion fluence of 10¹⁶ ions cm⁻², transmission approaches to zero at about λ = 427 nm and below up to 200 nm. Optical band gap (E_OPT) reduces with increase in fluence and at maximum ion fluence of 5 × 10¹⁶ N⁺ cm⁻², E_OPT was determined to be 1.56 eV whereas for pristine its value was 3.00 eV. Raman analysis indicates the formation of amorphous carbon on the surface of polycarbonate at an ion fluence of 10¹⁶ N⁺ cm⁻². Rise in fluence to 5 × 10¹⁶ N⁺ cm⁻² results in enhancement in disorder on the surface of the host polymer. Modifications in the structural arrangements were found to be in strong association with changes in optical properties with increase in ion fluence and the same is discussed.     

Defect introduction in Ge during inductively coupled plasma etching and Schottky barrier diode fabrication processes

We have etched Sb-doped n-type (111) oriented Ge by inductively coupled plasma (ICP), using argon, and subsequently studied the defects that this process introduced as well as the effect of this etching on Schottky barrier diode quality. Deep level transient spectroscopy (DLTS) revealed that ICP etching introduced only one prominent defect, EP_0.31, in Ge with a level at 0.31 eV below the conduction band. The properties of this defect are different to those of defects introduced by other particle-related processing steps, e.g. sputter deposition and electron beam deposition, that each introduces a different set of defects. DLTS depth profiling revealed the EP_0.31 concentration was a maximum (3.6 × 10¹³ cm^− 3) close to the Ge surface and then it decreased more or less exponentially into the Ge. Annealing at 250 °C reduced the EP_0.31 concentration to below the DLTS detection limit. Finally, current-voltage (I-V) measurements as a function of temperature revealed that the quality of Schottky contacts fabricated on the ICP-etched surfaces was excellent at − 100 K the reverse leakage current at − 1 V was below 10 ¹³ A (the detection limit of our I-V instrumentation).     

Lithium conducting glass ceramic with Nasicon structure

Lithium ion conducting glass and glass ceramic of the composition Li_1.4[Al_0.4Ge_1.6(PO₄)₃], have been synthesized. The monolithic glass pieces on thermal treatment resulted in single-phase glass ceramic with the Nasicon structure. Experiments with different electrodes proved that the lithium electrodes provide accurate values for the ionic conductivity using impedance spectroscopy. σ_ionic of the glass ceramic was found to be 3.8×10⁻⁵ S cm⁻¹ at 40°C with an activation energy (E_a) of 0.52 eV. The corresponding values for the glass are 2.7×10⁻⁹ S cm⁻¹ and 0.95 eV, respectively. The Arrhenius dependence of σ_ionic with temperature in glass and glass ceramic is interpreted with a hopping mechanism from which the microscopic characteristics of the lithium cation motion are deduced.     

Electrical and chemical analysis of zinc oxide interfaces with high dielectric constant barium tantalate and aluminum oxide in metal-insulator-semiconductor structures fabricated at Low temperatures

Zinc oxide (ZnO) was incorporated into metal-insulator-semiconductor (MIS) structures featuring high dielectric constant (high-κ) barium tantalate (BaTa₂O₆)or alumina (Al₂O₃)as the insulator, and the structures were electrically evaluated for potential applications in transparent thin film transistors. The ZnO films were deposited by radio-frequency magnetron sputtering at 100 °C whereas the dielectric films were deposited by the same method at room temperature. The leakage currents of both the BaTa₂O₆ and Al₂O₃ structures were on the order of 10⁻⁷A/cm². The trap density and trapped charge concentration at the BaTa₂O₆/ZnO interface were determined to be 6.18 × 10¹¹ eV⁻¹ cm⁻²and 5.82 × 10¹¹ cm⁻² from conductance-voltage and capacitance-voltage measurements. At the Al₂O₃/ZnO interface the trap density and trapped charge were more than an order of magnitude smaller at 1.09 × 10¹⁰ eV⁻¹ cm⁻²and 1.04 × 10¹⁰ cm⁻² respectively. The BaTa₂O₆ structures had significantly larger frequency dispersions due to the larger number of interface traps. Chemical analysis using X-ray photoelectron spectroscopy with depth profiling indicates that acceptor type defects associated with a deficiency of oxygen are related to the observed electron trapping in the BaTa₂O₆MIS structure. Overall, the results indicate that Al₂O₃ would be better suited for transparent thin film transistors deposited at low temperature or without substrate heating.     

Electrical characterization of high-k gate dielectrics on Ge with HfGeN and GeO2 interlayers

Two kinds of HfSiO_x/interlayers (ILs)/Ge gate stack structures with HfGeN- and GeO₂-ILs were fabricated using electron cyclotron resonance (ECR) plasma sputtering and the subsequent post deposition annealing (PDA). It was found that HfGe was formed by the deposition of Hf metal on Ge and changed to HfGeN by N₂ ECR-plasma irradiation, which was used as IL. Another IL was GeO₂, which was grown by thermal oxidation at 500 °C. For dielectrics with HfGeN-IL, PDA of 550 °C resulted in effective oxide thickness (EOT) of 2.2 nm, hysteresis of 0.1 V, and interface state density (D_it) = 7 × 10¹² cm^− 2 eV^− 1. For dielectrics with GeO₂-IL, PDA of 500 °C resulted in EOT of 2.8 nm, hysteresis of 0.1 V, and D_it = 1 × 10¹² cm^− 2 eV^− 1. The structural change of HfSiO_x/GeO₂/Ge during the PDA was clarified by using X-ray photoelectron spectroscopy, and the gate stack formation for obtaining the good IL was discussed.     

Electrical properties of diamond-like carbon films grown using ECR plasma decomposition of methane

Diamond-like carbon films were deposited on p-type silicon substrates by ECR-plasma decomposition of methane. The films have been characterized by scanning electron microscopy and Fourier transformed infrared spectroscopy. The current-voltage (I-V) and capacitance-voltage (C-V) characteristics were measured allowing interface trapped charges to be estimated. The density of states near to the Fermi level was calculated from the measurements to be of the order of 10¹⁹ cm⁻³ eV⁻¹.