共查询到19条相似文献,搜索用时 171 毫秒
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PZT,PT干凝胶的制备及应用 总被引:1,自引:1,他引:1
采用减压抽滤的方法成功制备了Pb(Zr0.5Ti0.5)O3,PbTiO3干凝胶,并用STA449C差热分析仪表征了干凝胶的性能。干凝胶溶解后得到了性能优良的PZT薄膜和PZT/PT复合膜。采用X射线衍射技术表征了两种薄膜的微观结构及成相特征。薄膜的介电性能及漏电流性能由HP4284ALCR及Keithley6517A来确定。试验结果表明:用减压抽滤得到的干凝胶的方法,可以彻底解决溶胶凝胶中先体存放的问题,得到的铁电薄膜有优良的介电与铁电性能。PZT的相对介电常数与介质损耗分别为424,0.033,PT作为中间层的复合膜的相对介电常数和介质损耗分别为261,0.014;PT薄膜可以调整和改进PZT薄膜的性能,使之达到应用于热释电探测器的要求。 相似文献
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复合钒钛酸干凝胶薄膜的湿敏特性研究 总被引:1,自引:0,他引:1
采用sol-gel法制备了复合钒钛酸干凝胶(H2V10Ti2O30-y·nH2O)薄膜,并对其湿敏特性进行了研究。结果表明:该薄膜为层状结构。用此薄膜制备的湿敏元件,在RH为11%~95%的范围内,感湿特性曲线线性好,其响应、恢复时间分别为5s和20s,湿滞为RH2%,感湿温度系数为RH0.45%/℃,并具有良好的稳定性。H2V10Ti2O30-y·nH2O干凝胶薄膜湿敏元件的灵敏度和湿滞均优于复合钒酸(H2V12O31-y·nH2O)干凝胶薄膜湿敏元件。 相似文献
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采用正硅酸乙酯(TEOS)作为Si源,利用溶胶–凝胶旋涂法制备了多孔SiO2干凝胶薄膜,测试分析了200,300和400℃退火后样品的不同特性。研究了退火温度对多孔SiO2干凝胶低k薄膜的化学性质、物理性质和电学性能的影响。结果表明在400℃的退火温度下所制备的薄膜具有最佳性能:其厚度和折射率均达到最小值,分别为156 nm和1.31;孔隙度和均方根粗糙度均达到最大值,分别为33%和2.01 mm,并获得最低的相对介电常数(k=2)和最小的泄漏电流。 相似文献
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采用脉冲激光沉积(PLD)法在石英衬底上制备了ZnO薄膜。为研究ZnO薄膜内部主要点缺陷,我们用(002)ZnO单晶与ZnO薄膜作对比,并进行了霍尔测试、X线衍射(XRD)和光学透射谱等基本表征。霍尔测量得到的高的霍尔迁移率及XRD图表明,制备的ZnO薄膜结晶良好,具有沿c轴高度择优取向。同时,ZnO薄膜衍射峰相对于单晶向大角度方向发生了漂移。透射谱表明,ZnO薄膜在可见光区透过率为75%,吸收带边相对于单晶发生蓝移。各种表征手段证明PLD法制备的ZnO薄膜主要点缺陷为Zn填隙(Zni)。 相似文献
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电子束蒸发方法研究Mg2Si的薄膜及其光学带隙 总被引:1,自引:0,他引:1
Mg_2Si材料作为一种新型环境友好半导体材料,其薄膜制备方法及其光学性质的研究对其应用研发起到基础性作用.采用电子束蒸发方法在Si(111)衬底上沉积Mg膜,在氩气环境下进行热处理以制备Mg_2Si半导体薄膜.采用X射线衍射仪(XRD)、扫描电镜(SEM)、分光光度计对制备的Mg_2Si薄膜进行表征.在氩气环境、温度500℃、压强200 Pa下,研究热处理时间(时间3-7 h)对Mg_2Si薄膜形成的影响.XRD和SEM结果表明:通过电子束蒸发沉积方法在500℃、热处理时间为3~7 h能够得到Mg_2Si薄膜.热处理温度是500时,最佳热处理时间是4 h,得到致密度好的薄膜.通过对薄膜的红外透射谱测试,得到了Mg_2Si薄膜的光学带隙,其间接光学带隙值为0.9433 eV,直接光学带隙值为1.1580 eV.实验数据为Mg_2Si薄膜的研发在制备工艺和光学性质方面提供参考. 相似文献
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研究了改变本底真空对薄膜质量的影响,给出了在该系统中得到质量较高金刚石薄膜的最小本底真空值;阐述了降低灯丝温度对薄膜质量的影响.在较低压力下用甲烷氢气作碳源在1500~1700℃合成质量较高的金刚石薄膜,在灯丝温度为1300℃时,获得了微观形貌为球状物的薄膜.用扫描电镜、喇曼光谱和X-ray衍射(Cu靶)对结果进行分析. 相似文献
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用于微传感器中PZT压电薄膜的制备和图形化 总被引:1,自引:1,他引:0
采用溶胶-凝胶法在Si/Si3N4/Poly-Si/Ti/Pt基片上制备PZT压电薄膜, 为了选择更适合微电子机械系统(MEMS)器件的压电薄膜,采用一般热处理和快速热处理对锆钛酸铅(PZT)压电薄膜进行干燥和结晶.首先,采用V(H2O):V(HCL):V(HF)=280 mL:120 mL:4drops(4滴HF溶液)配比的腐蚀液在室温下对未结晶的PZT压电薄膜进行了湿法腐蚀微细加工;然后,对图形化好的压电薄膜进行再结晶的热处理,实验结果表明这种方法可用于压电薄膜微器件的制备. 相似文献
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Zhen-Kui Shen Zhi-Hui Chen Zhi-Jun Qiu Bing-rui Lu Jing Wan Shao-Ren Deng An-Quan Jiang Xin-Ping Qu Ran Liu Yifang Chen 《Microelectronic Engineering》2010,87(5-8):869-871
The ferroelectric random access memory (FRAM) which uses ferroelectric thin film as memory material is considered to be a candidate for the next generation memory application. In this work, we apply nano-embossing technology to fabricate Pb(Zr0.3,Ti0.7)O3 (PZT) ferroelectric thin film nanostructures and investigate the influence of the patterning process on the material and ferroelectric properties by using SEM, XRD and Precision Ferroelectric Tester. Embossing process has been optimized for embossing depth and pattern profile. It was found that embossing will result in (1 0 0) preferred orientation of the PZT thin film. The electrical characteristics of patterned and un-patterned PZT films have been also studied for comparison. 相似文献
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Pb(Zr_(0.52)Ti_(0.48))O_3(PZT) thin films have been deposited on a p-type Si substrate separated by a polycrystalline silicon/SiO_2 stacked buffer layer.The X-ray diffraction peaks of the PZT thin films prepared on the polycrystalline silicon annealed at different temperatures were measured.In addition,the polarization of the Pt/PZT/polycrystalline silicon capacitor has been investigated.The memory capacitor of the metal/ferroelectric/polycrystalline silicon/SiO_2/semiconductor structure annealed at 650℃... 相似文献
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The ferroelectric properties of Nb-doped PZT thin films prepared by a sol-gel method were evaluated relative to memory device
application requirements. Within the range of 0 to 4 mol %, Nb-doping of PZT compositions near the morphotropic phase boundary
region (i.e. PZT 53/47) enhanced overall ferroelectric properties by reducing the te-tragonal distortion of the unit cell. A 4 mol % Nb-doped
PZT 53/47 thin film (0.26 μm) had a coercivity of 8 V/ μm, a remanence ratio of 0.54, a switchable polarization of 45 μC/cm2, and a specific resistivity of 3 x 109 Ω-cm. Nb-doping levels in excess of 5 mol had a detrimental effect on the resulting thin film ferroelectric properties. X-ray
diffraction (XRD) analysis of highly doped films showed development of a significant PbO phase accompanied by diffraction
line broadening of the perovskite phase. As such, it was postulated that the creation of excessive lead vacancies in the PNZT
lattice resulted in PbO accumulation at the grain boundaries which impeded grain growth, and hence, adversely affected ferroelectric
switching performance. The fatigue performance of the sol-gel derived thin film capacitor system was a function of switching
voltage. At switching fields sufficient to saturate the polarization, the endurance of the thin film capacitor was greater
than 109 cycles. Cycling with lower fields reduced endurance values, but in all cases, the switchable polarization decreased linearly
with the logarithm of cycles. Nb-doping did not have a significant effect on the fatigue performance. 相似文献
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采用sol-gel(溶胶-凝胶)法在Pt/Ti/SiO2/Si基底上分别制备了厚度为400nm,600nm,800nm的PZT(锆钛酸铅,Zr/Ti=52/48)薄膜,研究了厚度对薄膜介电性能与铁电性能的影响。通过对薄膜的铁电性能与介电性能进行测试,分析了不同厚度薄膜的剩余极化强度、介电常数与介电损耗;通过对介电调谐率与最大正切损耗的计算,进一步分析了薄膜的介电调谐性能。实验结果表明,薄膜的介电常数与介电损耗随薄膜厚度的增大而增加;厚度为600nm的薄膜具有最好的介电调谐性能与铁电性能。 相似文献
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电极对PZT铁电薄膜性能的影响 总被引:7,自引:1,他引:7
用溶胶-凝胶法制备PZT铁电薄膜。以Pt/Ti/SiO2/Si为底电极,Au为上电极,形成金属-铁电薄膜-金属结构的铁电电容器。研究电极对PZT铁电薄膜结构和电性能的影响,实验发现,金属Ti的厚度会影响PZT铁电薄膜的结构。界面层的存在使介电系数、自发极化、矫顽电压、漏电流都与薄膜的厚度有关。 相似文献