Thermal creep and fracture behaviors of the lead-free Sn–Ag–Cu–Bi solder interconnections under different stress levels

In our previous study, the creep behavior of the lead-free Sn–Ag–Cu–Bi solder joints has been proven to follow the Arrhenius power-law relationship, and the thermal fatigue behavior of the solder joints exhibits the typical creep deformation characteristics with a superposition of the pulsating features. In this study, the thermal creep and fracture behaviors of the lead-free Sn–Ag–Cu–Bi solder interconnections were characterized under different stress levels, with a systematical comparison to that of a traditional Sn60Pb40 near-eutectic solder. The results show that the creep strain rate of both solder connections follows Weertman-Dorn equation, and the calculated creep stress exponent for two solders is reasonably close to other published data. The SEM inspection and analysis of fractographies of creep fractured solder joints manifest that the creep failure of the lead-free Sn–Ag–Cu–Bi solder joint shows obviously intergranular fracture mechanism, while the Sn60Pb40 joint ruptures dominantly by a transgranular sliding mechanism.     

Constitutive models of creep for lead-free solders

The constitutive modeling of creep has been extensively studied due to the important of the creep failure mode in solder joints. However, there are very few studies that considered room temperature aging contributions in their creep modeling studies. This study investigated constitutive modeling of creep of solders by taking into account the possible contribution room temperature aging. Lead-free solder (Sn–4.0Ag–0.5Cu) was found to have a higher creep resistance than Sn–Pb solder at the same stress level and testing temperature. The higher creep resistance was contributed by the second phase intermetallic compounds, Ag₃Sn and Cu₆Sn₅. The precipitation of these intermetallic compounds can significantly block the movement of dislocations and increase the creep resistance of the material. Constitutive models of creep for both lead-free and Sn–Pb eutectic solders were constructed based on the experimental data. The activation energy for SAC405 is much higher than that of Sn–Pb, which also indicates that SAC405 possesses higher creep resistance. The constitutive models can be used in finite element analysis of actual electronic packages to predict solder joint failure. The creep mechanisms of both lead-free and Sn–Pb eutectic solders were also extensively discussed in this dissertation. Dislocation gliding and climb is believed to be the major failure mode at high stresses, while lattice diffusion and grain boundary diffusion is believed to be the major failure mode at low stress levels. Grain boundary sliding is believed to contribute to creep deformation at both high-stresses and low-stresses. For eutectic Sn–Pb, superplastic deformation is a major the creep mechanism at low-stresses and high-temperatures.     

热循环条件下SnAgCu/Cu焊点金属间化合物生长及焊点失效行为

研究了热循环过程中SnAgCu/Cu焊点界面金属间化合物的生长规律及焊点疲劳失效行为。提出了热循环条件下金属间化合物生长的等效方程以及焊点界面区不均匀体模型,并用有限元模拟的方法分析了热循环条件下焊点界面区的应力应变场分布及焊点失效模式。研究结果表明:低温极限较低的热循环,对应焊点的寿命较低。焊点的失效表现为钎料与金属间化合物的界面失效,且金属间化合物厚度越大,焊点中的累加塑性功密度越大,焊点越容易失效。     

Comparative study on stress–strain hysteresis response of SAC solder joints under thermal cycles

The present study attempts to evaluate the stress-strain hysteresis responses of SAC solder joints in Resistor and FleXBGA144 packages subjected to thermal cyclic loading using several constitutive models. The total deformation of the solder material consists of elastic, rate-independent plastic and rate-dependent creep components. The constitutive models discussed in this study each weighted elastic, plastic and creep deformations differently. At low stresses SAC solder alloys were found to be creep resistant, where at higher stresses, the influence of different microstructures disappears as matrix-creep dominates in this region. Thus, the proper constitutive model requires all the three ingredients of the elastic, the creep, and the time-independent plastic data for different stress levels to effectively predict the hysteresis behavior of the SAC solder alloys. The hysteresis loops predicted by constitutive models were also found in close agreement with the loops generated by FEM for the SAC solder joint subjected to thermal cycling.     

Intermetallic growth study on SnAgCu/Cu solder joint interface during thermal aging

The intermetallic compound (IMC) growth behavior at SnAgCu/Cu solder joint interface under different thermal aging conditions was investigated, in order to develop a framework for correlating IMC layer growth behavior between isothermal and thermomechanical cycling (TMC) effects. Based upon an analysis of displacements for actual flip-chip solder joint during temperature cycling, a special bimetallic loading frame with single joint-shear sample as well as TMC tests were designed and used to research the interfacial IMC growth behavior in SnAgCu/Cu solder joint, with a focus on the influence of stress–strain cycling on the growth kinetics. An equivalent model for IMC growth was derived to describe the interfacial Cu-Sn IMC growth behavior subjected to TMC aging as well as isothermal aging based on the proposed “equivalent aging time” and “effective aging time”. Isothermal aging, thermal cycling (TC) and TMC tests were conducted for parameter determination of the IMC growth model as well as the growth kinetic analysis. The SnAgCu/Cu solder joints were isothermally aged at 125, 150 and 175 °C, while the TC and TMC tests were performed within the temperature range from ?40 to 125 °C. The statistical results of IMC layer thickness showed that the IMC growth for TMC was accelerated compared to that of isothermal aging based on the same “effective aging time”. The IMC growth model proposed here is fit for predicting the IMC layer thickness for SnAgCu/Cu solder joint after any isothermal aging time or thermomechanical cycles. In addition, the results of microstructure evolution observation of SnAgCu/Cu solder joint subjected to TMC revealed that the interfacial zone was the weak link of the solder joint, and the interfacial IMC growth had important influence on the thermomechanical fatigue fracture of the solder joint.     

Magnetic nanoparticle-based solder composites for electronic packaging applications

Sn–Ag–Cu (SAC) alloys are regarded as the most promising alternative for traditional Pb–Sn solders used in electronic packaging applications. However, the higher reflow temperature requirement, possible intermetallic formation, and reliability issues of SAC alloys generate several key challenges for successful adoption of Pb-free solder for next generation electronic packaging needs. Localized heating in interconnects can alleviate thermal stresses by preventing subjection of entire package to the higher reflow temperatures associated with the SAC solders. It had been demonstrated that SAC solder–FeCo magnetic nanoparticles (MNPs) composite paste can be reflowed locally with AC magnetic fields, enabling interconnect formation in area array packages while minimizing eddy current heating in the printed circuit board.Solder/magnetic nanocomposite pastes with varying MNP concentration were reflowed using AC magnetic fields. Differential scanning calorimetry results show a reduced undercooling of the composite pastes with the addition of MNPs. TEM results show that the FeCo MNPs are distributed in Sn matrix of the reflowed solder composites. Optical and SEM micrographs show a decrease in Sn dendrite regions as well as smaller and more homogeneous dispersed Ag₃Sn with the addition of MNPs. The MNPs promote Sn solidification by providing more heterogeneous nucleation sites at relatively low undercoolings. The mechanical properties were measured by nanoindentation. The modulus, hardness, and creep resistance, increase with the MNP concentration. The enhanced mechanical properties are attributed to grain boundary and dispersion strengthening.The reflow of solder composites have been modeled based on eddy current power loss in the substrate and magnetic power losses in the solder bumps. Induction reflow of pure solder bumps (<300 μm) in an area array package using 500 Oe magnetic field at 300 kHz requires excessive eddy current power loss in the substrate, resulting in extreme temperatures that lead to blistering and delamination of the substrate. Solder–MNP composites with modest MNP loading showed temperature increases sufficient to achieve solder reflow when subjected to the same AC magnetic fields. Thermomechanical behavior of a solder joint was also modeled under cyclic temperature variations. The stress and strain are highly localized at the interface between solder and substrate. Plastic work accumulated per cycle can be used for lifetime prediction.In this article we review lead-containing and lead-free solder systems, and the electronic packaging technologies pertinent to soldering process. Recent research on the effects of MNPs on localized heating, microstructure evolution, mechanical properties, and thermomechanical reliability are summarized.     

Thermal ratcheting of solder-bonded layered plates: cyclic recovery and growth of deflection

This paper describes computational analysis of the thermal ratcheting of solder-bonded layered plates subjected to cyclic thermal loading following solder-bonding. Finite element computations of Si/solder/Cu layered plates are performed by taking into account mechanical ratcheting of the copper as well as temperature-dependent creep of the solder. A sophisticated non-linear kinematic hardening model is used for appropriately representing mechanical ratcheting of the copper; a temperature-dependent power-law creep model is assumed for the solder. It is shown that the layered plates can exhibit either the cyclic recovery or the cyclic growth of deflection depending on the extent of plastic yielding in the copper layer, and that the cyclic recovery always occurs if the copper layer is elastic. It is also demonstrated that the cyclic recovery of deflection can be much greater than the static recovery of deflection at a constant temperature.     

A review of mechanical properties of lead-free solders for electronic packaging

The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (T _h > 0.5T _m even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn–Pb solder alloys. Some recent researches show that the room temperature aging has significant effects on mechanical properties of solders. This paper is intended to review all available data in the field and give rise to the possible factors including room temperature effects which causes the large discrepancies of data. This review of the research literatures has documented the dramatic changes that occur in the constitutive and failure behavior of solder materials and solder joint interfaces during isothermal aging. However, these effects have been largely ignored in most previous studies involving solder material characterization or finite element predictions of solder joint reliability during thermal cycling. It is widely acknowledged that the large discrepancies in measured solder mechanical properties from one study to another arise due to differences in the microstructures of the tested samples. This problem is exacerbated by the aging issue, as it is clear that the microstructure and material behavior of the samples used in even a single investigation are moving targets that change rapidly even at room temperature. Furthermore, the effects of aging on solder behavior must be better understood so that more accurate viscoplastic constitutive equations can be developed for SnPb and SAC solders. Without such well-defined relationship, it is doubtful that finite element reliability predictions can ever reach their full potential.     

Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions

The eutectic Sn–0.7Cu solder alloy is widely used in electronic packaging in which the creep property of the solder joint is essential to meet the global demand for longer operating lifetime in their applications. In this study, the influence of Ag and In additions on tensile creep behavior and thermal properties of bulk eutectic Sn–Cu solder alloy is reported. Results show that addition of Ag and In resulted not only in the formation of new Ag₃Sn and γ-SnIn₄ intermetallic compounds (IMCs), but also in the refinement of grain size of Sn–0.7Cu solder from ∼0.50 to ∼0.15 μm. Accordingly, the creep properties of the Ag or In-containing solder alloys are notably improved. The creep strain rate increases and creep lifetime decreases as the applied stress level and temperature increase. Room and elevated-temperature creep rate of bulk Sn–Cu solder was reduced by 521.0% after Ag addition, but for In addition the reduction was about 200.7%. These differences are attributed to the presence of new Ag₃Sn and γ-SnIn₄ precipitates and their rules in classical dispersion strengthening as a separate phases. Moreover, the eutectic temperature of Sn–0.7Cu is decreased from 227.4 to 217.8 and 224.0 °C with the addition of Ag and In, respectively.     

Investigation on properties of Ga to Sn–9Zn lead-free solder

The influences of different Ga content on the properties of Sn–9Zn lead-free solder were investigated. The results indicate that Ga plays an important role not only in the structure and melting behavior, but also in the solderability and mechanical property. Sn–9Zn–0.5Ga shows finer and more uniform microstructure than Sn–9Zn. With the addition of low-melting-point Ga, TL (liquidus temperature) and TS (solidus temperature) of the alloys decreases with increasing of Ga content while △T (liquidus temperature minus solidus temperature) increases. Ga can improve the oxidation resistance and reduce the surface tension of solder, so the solderability of Sn–9Zn–xGa lead-free solder is significantly improved. When the content of Ga is 0.5 wt.%, the pull force of soldered joint is 16.1 N, enhanced by 11% compared to that of Sn–9Zn, and the fracture micrographs show that the joint failed in a ductile manner. The addition of 3 wt.%Ga resulted in a brittle failure. The introduction of 0.5 wt.% Ga into Sn–9Zn alloy improves creep resistance of the solder.     

Reliability of lead-free solder joints in CSP device under thermal cycling

Finite element method and Garofalo–Arrheninus creep model were combined and used to evaluate the reliability of different lead-free solder joints (SnAgCu, SnAg, SnSb and SnZn) and SnPb solder joints in chip scale package (CSP) 14 × 14 device under thermal cyclic loading. The results show that von Mises stress and equivalent creep strain in each of the four lead-free solder joints and SnPb solder joints were strongly different, increasing in the order SnPb < SnAg < SnSb < SnZn < SnAgCu. It is found that maximum stress–strain concentrates on the top-surface of corner solder joints in the CSP device for all solder joints, and SnAgCu solder joints shows the highest fatigue life among those five kinds of solder joints.     

Modification of Sn58Bi solder based on graphite

Abstract

A novel composite solder paste with 0·07 wt-% graphite addition was fabricated. The mechanical properties of matrix solder and composite solder alloys were tested using a kind of miniature joint. The results showed that the tensile strength of the Sn58Bi+graphite composite solder joint declined slightly compared with the Sn58Bi solder joint. However, the elongation of the Sn58Bi+graphite composite solder joint was ～13 times as much as that of the Sn58Bi solder joint. Stress relaxation method, which was used to test the creep performance, was verified by nanoindentation method. The result showed that the stress relaxation method was suitable for creep testing. The creep testing results of Sn58Bi and Sn58Bi+0·07 wt-% graphite solder alloys showed that the anticreep performance of Sn58Bi was improved by the addition of graphite.     

Study on creep characterization of nano-sized Ag particle-reinforced Sn–Pb composte solder joints

In the present work, the creep strain of solder joints is measured using a stepped load creep test on a single specimen. Based on the experimental results, the constitutive model on the steady-state creep strain is established by applying a linear curve fitting for the nano-sized Ag particle-reinforced Sn37Pb based composite solder joint and the Sn37Pb solder joint, respectively. It is indicated that the activation energy of the Ag particle-reinforced Sn37Pb based composite solder joints is higher than that of Sn37Pb solder joints. It is expected that the creep resistance of the Ag particle-reinforced Sn37Pb based composite solder joints is superior to that of Sn37Pb solder.     

Critical studies to improve service reliability of Sn–Ag–Cu solder joints by thermal treatments

Lead-free electronic packages intended for use in applications such as aerospace, military, and other highly demanding service conditions, necessitate exceptional mechanical reliability of lead-free electronic solder joints under realistic service conditions. Most current design strategies employed for improving the reliability of lead-free electronic solder joints are aimed at developing suitable alloying additions and reinforcements to the solder itself. At present there exists no suitable methodology to minimize the effects of service conditions while the solder joint is in service. Since thermomechanical fatigue reliability of electronic solder joints is closely related to the crack nucleation that occurs during very early stages of repeated thermal excursions, this study is based on subjecting solder joints to a limited number of thermal shock (TS) cycles in a chosen temperature regime to nucleate cracks, then evaluating their effectiveness in improving reliability when the solder joints are subjected to additional TS cycles in a different temperature regime. This study is a preliminary investigation, aimed at developing suitable methodology to minimize the effects of damage to lead-free solder joint specimens subjected to repeated thermal excursions during service, by imposing appropriate thermal treatments. These thermal treatments can be automatically implemented at programmed intervals during the service life of the electronic packages. Methods employed in these studies may also be useful to enhance long-term service reliability and to obtain a conservative estimate of long-term service reliability.     

Creep and fatigue behaviors of the lead-free Sn–Ag–Cu–Bi and Sn60Pb40 solder interconnections at elevated temperatures

Creep and fatigue behaviors of the interconnections soldered by the lead-free Sn–Ag–Cu–Bi solder were investigated at different elevated temperatures (with the homologue temperature in the range of 0.71– 0.82), with a comparison to that of a traditional Sn60Pb40 solder. The results show that the lead-free Sn–Ag–Cu–Bi solder shows a superior anti-creep performance over the Sn60Pb40 solder, in terms of a much lower creep strain rate and a vastly elongated creep fracture lifetime; in the secondary creep regime, the calculated creep-activation energy for two solders is reasonably close to other published data. In addition, it has also been shown that the joints soldered by the lead-free Sn–Ag–Cu–Bi solder exhibits a superb fatigue property.     

Investigation on high temperature mechanical fatigue failure behavior of SnAgCu/Cu solder joint

In this paper, high temperature mechanical fatigue tests on SnAgCu/Cu solder joints were carried out under three test temperatures (100, 125, 150 °C). Failure mechanism was analyzed through observation of micro-crack evolution and fracture morphology. The results show that the deformation curve of solder joint under high temperature mechanical fatigue tests can be divided into three stages: strain hardening stage, stable deformation stage and accelerated failure stage, which is similar to the curve under creep test condition. In addition, the cyclic life decreases rapidly with increasing temperature. Deformation field in the solder joint is non-uniform and shear strain concentration occurs in solder close to the intermetallic compound (IMC) layer. Micro-crack initiates at the corner of the solder joint and then tend to propagate along interface between Cu substrate and solder. The fracture morphology under three temperatures all exhibits ductile fracture mode and the failure path transforms from cutting through the top of Cu₆Sn₅ to propagation in solder matrix close to IMC layer with increasing temperature.     

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Abstract

Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided.     

Phenomenology of the creep process of a precipitation-hardenable AlMgSi alloy wires for overhead power lines. Experimental tests. Simulation

The article presents the results of the experimental test on the creep process of AlMgSi alloy wires (series 6xxx) under the conditions of variable stress. A theoretical analysis of equivalency rheological results of stress and temperature changes by means of Bayley-Norton function, which describes well the low-temperature aluminum alloys creep, was carried out. Therefore, the described issue became one-dimensional. On the basis of experimental tests, it has been proved that negative gradients of stress and temperature may generate three types of rheological behaviour, such as: Temporary decrease of creep speed (type 1), Temporary stop of creep deformation (‘dead’ time)—type 2 and reverse after creep (type 3). The applicable nature of tests is placed in overhead power lines, which undergo cyclical stress- and time-dependent operation. Such a nature of conductor operation creates favourable conditions to decrease creep intensity, whereas its history and value and speed of stress and temperature lowering decide whether conductor rheological activity loss will take place. The actual material parameter controlling the conductor rheological behaviour is stress and temperature rheological equivalent. The article contains exemplary results of current-carrying capacity changes of AlMgSi alloy conductor on a given temperature range, and the calculations include actual creep characteristic and cumulated rheological inactivity caused by negative gradients of stress and temperature.     

Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density

Sn37Pb (SP) and Sn3.5Ag0.5Cu (SAC) ball grid array (BGA) solder joints between Au/Ni (P)/Cu pads were stressed with a moderate current density of 6.0 × 10² A/cm² at an ambient temperature of 125°C up to 600 h. The solder joint reliability was evaluated in terms of temperature measurement, microstructural analysis and mechanical strength test. It was confirmed that no obvious electromigration occurred with this moderate current density. However, the local temperature of solder joints rose considerably due to massive Joule heating, which degraded the solder joint reliability seriously. Phase coarsening was observed for both solders and it was particularly apparent in the SP solder joints. Compared to the SP, the SAC was found to be more reactive and hence a thicker intermetallic compound (IMC) was developed during the current stressing. Nevertheless, the IMC thickening was not as remarkable as expected with current stressing at high temperature. It exhibited a sub-parabolic growth manner that was mainly controlled by grain boundary diffusion. However, a sufficiently thick IMC layer initially formed during reflow soldering and the low diffusivity of the Ni atoms retarded the growth. The shear strength of the solder joints was found to decrease severely with the current stressing time. This degradation was attributed to the large stresses arising from localized thermal mismatch, phase coarsening, volume shrinkage of IMC evolution, Ni–P layer crystallization and the pad cracking during current stressing.     

Experimental evaluation of creep and fatigue behaviour for microscale solder interconnect

This paper presents a novel experimental study for creep and fatigue of solder‐interconnects in microstructures. The strains are directly measured in the fillet area of solder‐joints with a typical linear dimension of 50 μm. An analytical approach is developed for calculating shear stress based on the shear strain measurement and the established solder constitutive relations. Also obtained is the strain‐rate as well as the separated elastic, plastic and creep components from the measured total strain. The data enables the determination of the strain energy density per temperature cycle for the characterization of the solder joint creep fatigue behaviour. Case studies provide evidence for the shear dominance and the creep fatigue mechanism in thermally induced solder joint deformation in surface‐mounted electronic assemblies. Though a similar trend of variation in stress–strain is found in the joints of different solders, the substantial differences in the hysteresis loop area and shape as well as in the creep rate suggest that the solder constitutive parameters should have a profound impact on the creep fatigue endurance of the joints.