Comparison of Ni/Ti and Ni ohmic contacts on <Emphasis Type="Italic">n</Emphasis>-type 6H–SiC

Ni (50 nm)/Ti (10 nm) and Ni (50 nm) contact structures were deposited by vacuum evaporation on n-type 6H–SiC with various doping level. Prior to deposition, part of the substrates had been subjected to plasma cleaning. To achieve ohmic character, the samples were annealed in vacuum. Electrical parameters of the contacts were determined by measuring specific contact resistances. The results were similar for both contact structures; we have not found any influence of plasma cleaning. The lowest value was 1.4 × 10⁻⁴ Ω cm² for substrate with doping level of 1.9 × 10¹⁹ cm⁻³. Using XPS depth profiling it was found, that the titanium layer was shifted upon annealing of the Ni/Ti structures from the interface towards contact surface and that this layer consists of TiC. Between the TiC layer and the substrate was a layer of nickel silicides and carbon. In the plasma-cleaned Ni/Ti/SiC samples, increased content of nickel at the expense of carbon was detected just below the TiC layer. We suggest the snowplow effect of dopants in the SiC substrate upon annealing of the structures as a main factor in ohmic contact formation.     

Power loss calculation as a reliable methodology to assess the ohmic losses of the planar ohmic contacts formed on the photovoltaic devices

The front grid contact is particularly important and requires a low contact resistance which represents the resistance associated with the barrier at the interface of the metal and semiconductor contact structure. Often applied metal contacts are fired at a higher temperature (typically above 700 °C) in air ambient, which produces ohmic contact on both surface of the photovoltaic device. The specific contact resistance is one of the important device parameter on studying the interfacial properties of the metalization system. Therefore, a reliable methodology to assess the ohmic losses of the applied metal contact structure is required. It shows that it is rather simple and reliable to assess the electrical quality of the applied metal contacts by quantifying the total ohmic losses of the solar cell associated with the various resistive components of the solar cell normalized to unit cell area. It has been recently demonstrated that with a new experimental procedure, namely iteration method based on the calculation of power loss (ICPL) associated with the contact resistance of the front Ag thick-film metal contacts, a much reliable value of the specific contact resistance of the order of ≅10⁻⁵ Ω cm² can be extracted for the planar ohmic contacts. In this work, the specific contact resistance of the planar ohmic contacts formed on the heavily doped n⁺ region of the solar cells were studied on large number of finished cells by two independent methods: (i) standard three-point probe (TPP) and (ii) iteration technique based on the calculation of the power loss (ICPL) associated with the contact resistance of the front Ag contacts of the solar cell normalized to unit cell area. It shows that the value of specific contact resistance measured by both methods are desirably much lower than the expected value of 10⁻³ Ω  cm² for the screen-printed Ag metal contacts of the photovoltaic cells used for the A.M. 1.5 applications. Using the iteration, each resistive components of the solar cell normalized to unit cell area were directly evaluated. It is shown that by combining the measurements of specific contact resistance of the planar ohmic contacts and ohmic losses of the cell, it gives a direct and non-destructive diagnostic tool to qualitatively check the electrical quality of the applied Ag metal contacts.

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Low-resistance and highly transparent Ag/IZO ohmic contact to p-type GaN

The electrical, structural, and optical characteristics of Ag/ZnO-doped In₂O₃ (IZO) ohmic contacts to p-type GaN:Mg (2.5 × 10¹⁷ cm^− 3) were investigated. The Ag and IZO (10 nm/50 nm) layers were prepared by thermal evaporation and linear facing target sputtering, respectively. Although the as-deposited and 400 °C annealed samples showed rectifying behavior, the 500 and 600 °C annealed samples showed linear I-V characteristics indicative of the formation of an ohmic contact. The annealing of the contact at 600 °C for 3 min in a vacuum (~ 10^− 3 Torr) resulted in the lowest specific contact resistivity of 1.8 × 10^− 4 Ω·cm² and high transparency of 78% at a wavelength of 470 nm. Using Auger electron spectroscopy, depth profiling and synchrotron X-ray scattering analysis, we suggested a possible mechanism to explain the annealing dependence of the electrical properties of the Ag/IZO contacts.     

Microstructural analysis of Pd/Pt/Au/Pd ohmic contacts to InGaP/GaAs

Microstructural evolution during the annealing of Pd/Pt/Au/Pd p-ohmic contacts (with and without a thin layer of Zn) to InGaP/GaAs HBTs has been studied using transmission electron microscopy (TEM). Metal layers were deposited by electron beam evaporation directly onto the InGaP emitter layer with the intention of consuming the InGaP during annealing to contact the heavily C-doped p-type GaAs (3×10¹⁹ cm⁻³) base layer below. Initial reaction between Pd and Pt and InGaP formed a five-component amorphous layer (Pd, Pt, In, Ga and P), which crystallized to (Pt_xPd_1−x)5(In_yGa_1−y)P (0≤x, y≤1) at the interface between Pt and the amorphous layer. Annealing at temperatures ≥415°C caused complete decomposition of the InGaP and partial decomposition of the GaAs base layer, producing a contact consisting of (Pt_xPd_1−x)5(In_yGa_1−y)P, PtAs₂ and PdGa. The attainment of low contact resistances did not depend on the presence of Zn. Minimum values of 0.10−0.12 Ω mm were achieved after annealing at 415–440°C for contacts both with and without Zn. This revised version was published online in July 2006 with corrections to the Cover Date.     

Specific contact resistance measurements of the screen-printed Ag thick film contacts in the silicon solar cells by three-point probe methodology and TLM method

The specific contact resistance of the screen-printed Ag contacts in the silicon solar cells has been investigated by applying two independent test methodologies such as three-point probe (TPP) and well-known transfer length model (TLM) test structure respectively. This paper presents some comparative results obtained with these two measurement techniques for the screen-printed Ag contacts formed on the porous silicon antireflection coating (ARC) in the crystalline silicon solar cells. The contact structure consists of thick-film Ag metal contacts patterned on the top of the etched porous silicon surface. Five different contact formation temperatures ranging from 725 to 825 °C for few minutes in air ambient followed by a short time annealing step at about 450 °C in nitrogen ambient was applied to the test samples in order to study the specific contact resistance of the screen-printed Ag metal contact structure. The specific contact resistance of the Ag metal contacts extracted based on the TPP as well as TLM test methodologies has been compared and verified. It shows that the extraction procedure based on the TPP method results in specific contact resistance, ρ _c  = 2.15 × 10⁻⁶ Ω-cm² indicating that screen-printed Ag contacts has excellent ohmic properties whereas in the case of TLM method, the best value of the specific contact resistance was found to be about ρ _c  = 8.34 × 10⁻⁵ Ω-cm². These results indicate that the ρ _c value extracted for the screen-printed Ag contacts by TPP method is one order of magnitude lower than that of the corresponding value of the ρ _c extracted by TLM method. The advantages and limitations of each of these techniques for quantitatively evaluating the specific contact resistance of the screen-printed Ag contacts are also discussed.     

Microstructural and electrical characteristics of rapidly annealed Ni/Mo Schottky rectifiers on cleaned n-type GaN (0001) surface

We have investigated the electrical and microstructural properties of Ni/Mo Schottky rectifiers to n-type GaN by current–voltage (I–V) and transmission electron microscopy (TEM) before and after annealing at 600 °C. The obtained barrier height for as-deposited Ni/Mo contact is 0.66 eV. It is observed that the barrier height increases with annealing temperature up to 500 °C, reaching a maximum value of 0.75 eV at this temperature. However, the Schottky barrier height of the Ni/Mo Schottky contact slightly decreased to 0.67 eV (I–V) when the contact was annealed at 600 °C. According to the HRTEM, STEM and EDX analysis, the formation of Ga-Ni interfacial layer at the interface results in the accumulation of gallium vacancies near the surface of the GaN layer. This could be the reason for increase in barrier heights upon annealing at elevated temperatures. The variation in the measured barrier height after annealing at 600 °C may be due to the formation of native oxide layer at the interface compared to the 500 °C annealed contact.     

The influence of rapid thermal annealing on electrical and structural properties of Pt/Au Schottky contacts to n-type InP

The electrical and structural properties of Pt/Au Schottky contacts to n-InP have been investigated in the annealing temperature range of 200–500 °C by current–voltage (I–V), capacitance–voltage (C–V), Auger electron spectroscopy (AES) and X-ray diffraction (XRD) measurements. The barrier height of as-deposited Pt/Au Schottky contact is found to be 0.46 eV (I–V) and 0.68 eV (C–V). For the contacts annealed at 300 °C, the barrier height is increased to 0.51 eV (I–V) 0.89 eV (C–V). Further increase in annealing temperature up to 500 °C, the barrier height has been found to decrease to 0.49 eV (I–V) 0.82 eV (C–V) from those values obtained at 300 °C. It has been found that the electrical characteristics are significantly improved for Pt/Au Schottky contacts upon annealing at 300 °C. Based on the Auger electron spectroscopy and X-ray diffraction results, the formation of Pt–In and Au–In intermetallic compounds at the interface may be the reason for the increase of barrier height after annealing at 300 °C for Pt/Au Schottky contacts. From the atomic force microscopy (AFM) results, it is evident that the surface becomes smooth with RMS roughness of 16.91 nm for the Pt/Au Schottky contacts after annealing at 500 °C compared to the 300 °C annealed sample (RMS roughness of 17.33 nm).     

Effects of thermal annealing on the electrical and structural properties of Pt/Mo Schottky contacts on n-type GaN

Thermal annealing temperature effects on the electrical and structural properties of platinum/molybdenum (Pt/Mo) Schottky contacts on n-type GaN have been investigated by current–voltage (I–V), capacitance–voltage (C–V), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS) techniques. As-deposited Pt/Mo/n-GaN Schottky diode exhibits barrier height of 0.75 eV (I–V) and 0.82 eV (C–V). Upon annealing at 400 and 500 °C, the barrier height slightly increased to 0.77 eV (I–V) and 0.92 eV (C–V) and 0.82 eV (I–V) and 0.97 eV (C–V), respectively. A maximum barrier height of 0.83 eV (I–V) and 0.99 eV (C–V) is obtained on the Pt/Mo contacts annealed at 600 °C. X-ray photoelectron spectroscopy results shows that the Ga 2p core-level shift towards the low-energy side for the contact annealed at 600 °C as compared to the as-deposited one. Based on the results of XPS and XRD studies, the formation of gallide phases at Pt/Mo/n-GaN interface could be the reason for the increase of Schottky barrier heights upon annealing at elevated temperatures. The atomic force microscopy (AFM) results showed that the Pt/Mo contact does not seriously suffer from thermal degradation during annealing even at 600 °C (RMS roughness of 5.41 nm). These results make Pt/Mo Schottky contacts attractive for high temperature device applications.     

Study of lattice damage produced by neon implantation into AlInN

Neon ions were implanted into MOCVD grown wurtzite AlInN/GaN hetrostructures with dose ranging from 10¹⁴ to 9 × 10¹⁵ ions/cm². Structural characterization was carried out by X-ray diffraction and the dose dependence of strain was monitored before and after annealing. An increase in strain was observed in low dose regime until it saturates at a dose of 5 × 10¹⁵ cm⁻² and decreased with further increase in dose. Strain accumulation is attributed to the clustering of individual defects whereas decrease in level of strain is due to the capturing of defects by fixed sinks.     

Sol–gel derived Co<Subscript>3</Subscript>O<Subscript>4</Subscript> thin films: effect of annealing on structural,morphological and optoelectronic properties

Nanocrystalline Co₃O₄ thin films were prepared on glass substrates by using sol–gel spin coating technique. The effect of annealing temperature (400–700 °C) on structural, morphological, electrical and optical properties of Co₃O₄ thin films were studied by X-ray diffraction (XRD), Scanning Electron Microscopy, Electrical conductivity and UV–visible Spectroscopy. XRD measurements show that all the films are nanocrystallized in the cubic spinel structure and present a random orientation. The crystallite size increases with increasing annealing temperature (53–69 nm). These modifications influence the optical properties. The morphology of the sol–gel derived Co₃O₄ shows nanocrystalline grains with some overgrown clusters and it varies with annealing temperature. The optical band gap has been determined from the absorption coefficient. We found that the optical band gap energy decreases from 2.58 to 2.07 eV with increasing annealing temperature between 400 and 700 °C. These mean that the optical quality of Co₃O₄ films is improved by annealing. The dc electrical conductivity of Co₃O₄ thin films were increased from 10⁻⁴ to 10⁻² (Ω cm)⁻¹ with increase in annealing temperature. The electron carrier concentration (n) and mobility (μ) of Co₃O₄ films annealed at 400–700 °C were estimated to be of the order of 2.4–4.5 × 10¹⁹ cm⁻³ and 5.2–7.0 × 10⁻⁵ cm² V⁻¹ s⁻¹ respectively. It is observed that Co₃O₄ thin film annealing at 700 °C after deposition provide a smooth and flat texture suited for optoelectronic applications.     

Ti/Al/Ni/Au在N-polar GaN上的欧姆接触

N-polar GaN以其特有的材料特性和化学活性日益受到研究者关注,而N-polar GaN上欧姆接触也成为研究的热点。以Ti/Al/Ni/Au作为欧姆接触金属,分析了N-polar GaN上欧姆接触的最优退火条件,并借助剖面透射电子显微镜(TEM)和能量色散X射线能谱仪(EDX)研究了金属和N-polar GaN之间的反应生成物。结果表明,当退火温度升高到860℃时,可得到比接触电阻率ρc为1.7×10~(-5)Ω·cm~2的最优欧姆接触特性。TEM和EDX测试发现,除了生成已报道的AlN,还会在界面处产生多晶AlO_x,两者共同作用会进一步拉高势垒,从而对N-polar GaN上欧姆接触产生不利影响。     

Electrical and structural properties of double metal structure Ni/V Schottky contacts on n-InP after rapid thermal process

The electrical, structural, and surface morphological properties of Ni/V Schottky contacts have been investigated as a function of annealing. The Schottky barrier height value from I–V and C–V measurements for as-deposited Ni/V/n-InP diode is 0.61 eV (I–V) and 0.91 eV (C–V), respectively. It has been observed that the Schottky barrier height decreases with increasing annealing temperature as compared to the as-deposited contact. For the contact annealed at 200 °C, the obtained barrier height decreased to 0.52 eV (I–V) and 0.78 eV (C–V). Further, the annealing temperature increased to 300 and 400 °C, the barrier height slightly increased to 0.58 eV (I–V), 0.82 eV (C–V) and 0.59 eV (I–V), 0.88 eV (C–V). However, after annealing at 500 °C, results then decrease in barrier height to 0.51 eV (I–V) and 0.76 eV (C–V), which is lower than the value obtained for the sample annealed at 200 °C. The Norde method is also employed to extract the barrier height of Ni/V/InP Schottky diode, and the values are 0.68 eV for the as-deposited and 0.56 eV for the contact annealed at 500 °C, which are in good agreement with those obtained by I–V technique. Based on the results of AES and XRD studies, it is concluded that the formation of indium phases at the Ni/V/n-InP interface may be the reason for the increase in the barrier height for the as-deposited contact. The decrease in the barrier height upon annealing at 500 °C may be due to the formation of phosphide phases at the interface. The AFM results showed that there is no significant degradation in the surface morphology (RMS roughness of 0.61 nm) of the contact even after annealing at 500 °C.     

Electrical and optical properties of P-doped ZnO thin films by annealing temperatures in Nitrogen ambient

The effects of post-annealing temperature on the optical and electrical properties of P-doped ZnO thin films, grown on sapphire substrate, have been investigated when the annealing is performed under nitrogen ambient. Analysis of the XRD shows that regardless of the post-annealing temperature, the P-doped ZnO thin films have grown the (002) peak. The full width of half maximum decreases from 0.194 to 0.181° as the annealing temperature increases from 700 to 900 °C. This phenomenon means that the increase of annealing temperature causes enhancement of the thin film’s crystalline properties. The results of Hall effect measurements indicate that the P-doped ZnO thin films, annealed at 750 and 800 °C exhibit p-type behavior, with hole concentrations of 5.71 × 10¹⁷ cm⁻³ and 1.20 × 10¹⁸ cm⁻³, and hole mobilities of 0.12 cm²/Vs and 0.08 cm²/Vs, respectively. The low-temperature (10 K) photoluminescence results reveal that the peaks related to the neutral-acceptor exciton (A⁰X) at 3.355 eV, free electrons to neutral acceptor (FA) at 3.305 eV and donor acceptor pair (DAP) at 3.260 and 3.170 eV are observed in the films showing p-type behavior with the acceptors. Because P atoms replace O atoms to produce acceptors from P-doped ZnO thin films by the thermal activation process at the appropriate annealing temperature with nitrogen ambient, the p-type ZnO thin films can be fabricated in this way.     

Electrical properties of Schottky diodes based on Carbazole

Sandwich structures of Carbazole thin films have been prepared by using vacuum deposition technique. The plot of current density versus voltage (J–V characteristics) shows two distinct regions. In the lower voltage region ohmic conduction and in the higher voltage region space charge limited conduction (SCLC) is observed. Number of states in the valence band (Nv) is calculated from the temperature dependence of J in the ohmic region. From the temperature dependence of J in the SCLC region trap density (Nt) and activation energy are determined. The values of Nv and Nt are in the order 10²³ m⁻³ and 10²⁷ m⁻³ respectively. The value of activation energy is nearly equal to 0.1 eV and that of the effective mobility is 4.5 × 10⁻⁷ cm² V⁻¹ S⁻¹. Schottky diodes are fabricated using Aluminium (Al) as Schottky contact. It is observed that gold (Au) is more suitable for ohmic contact compared to silver (Ag). From a semi logarithmic plot of J versus V, the barrier height (ϕb), diode ideality factor (n) and saturation current density (J₀) are determined. The value of n increases and ϕb decreases on annealing.     

Deposition of AgGaS<Subscript>2</Subscript> thin films by double source thermal evaporation technique

In this study, polycrystalline AgGaS₂ thin films were deposited by the sequential evaporation of AgGaS₂ and Ag sources with thermal evaporation technique. Thermal treatment in nitrogen atmosphere for 5 min up to 700 °C was applied to the deposited thin films and that resulted in the mono phase AgGaS₂ thin films without the participation of any other minor phase. Structural and compositional analyses showed the structure of the films completely changes with annealing process. The measurements of transmittance and reflectance allowed us to calculate the band gap of films lying in 2.65 and 2.79 eV depending on annealing temperature. The changes in the structure with annealing process also modify the electrical properties of the films. The resistivity of the samples varied in between 2 × 10³ and 9 × 10⁶ (Ω-cm). The room temperature mobility depending on the increasing annealing temperature was in the range of 6.7–37 (cm² V⁻¹ s⁻¹) with the changes in carrier concentrations lying in 5.7 × 10¹³–2.5 × 10¹⁰ cm⁻³. Mobility-temperature dependence was also analyzed to determine the scattering mechanisms in the studied temperature range with annealing. The variations in the electrical parameters of the films were discussed in terms of their structural changes.     

Characterization of an AlN buffer layer and a thick-GaN layer grown on sapphire substrate by MOCVD

An AlN buffer layer and a thick-GaN layer for high-electron-mobility transistors (HEMTs) were grown on sapphire substrate by metal–organic chemical vapor deposition (MOCVD). The structural and morphological properties of the layers were investigated by high resolution X-ray diffraction (HRXRD) and atomic force microscopy (AFM) techniques. The optical quality of the thick-GaN layer was also evaluated in detail by a photoluminescence (PL) measurement. It was found that the AlN buffer layer possesses high crystal quality and an atomically flat surface with a root-mean-square (rms) roughness of 0.16 nm. The screw- and edge-type dislocation densities of the thick-GaN layer were determined as 5.4 × 10⁷ and 5.0 × 10⁹ cm⁻² by means of the mosaic crystal model, respectively. It was observed that the GaN layer has a smooth surface with an rms of 0.84 nm. Furthermore, the dark spot density of the GaN surface was estimated as 6.5 × 10⁸ cm⁻² over a scan area of 4 μm².     

Non-alloy Cr/Au Ohmic contacts in the technology of planar beam-lead GaAs <Emphasis Type="Italic">p-i-n</Emphasis> diodes

The characteristics of non-alloy Cr/Au ohmic contacts in planar beam-lead GaAs p-i-n diodes have been studied. The room-temperature reduced contact resistance in the structures studied was 2 × 10⁻⁶ Ω cm². The obtained parameters of p-i-n diodes allow these devices to be used as limiters in radar protection systems.     

Application of power loss calculation to estimate the specific contact resistance of the screen-printed silver ohmic contacts of the large area silicon solar cells

The establishment of a suitable contact formation methodology is a critical part of the technological development of any metal-to-semiconductor contact structure. Many test structures and methodologies have been proposed to estimate the specific contact resistance (ρ_c) of the planar ohmic contacts formed on the heavily doped semiconductor surface. These test structures are usually processed on the same wafer to monitor a particular process. In this study, new experimental procedure has been evolved to assess the value of ρ_c of the screen-printed front silver (Ag) thick-film metal contact to the silicon surface. The essential feature of this methodology is that it is an iteration technique based on the calculation of power loss associated with various resistive components of the solar cell normalized to the unit cell area. Therefore, this method avoids the complexity of making the design of any lay out of a standard contact resistance test structure like transmission line model (TLM) or Kelvin resistor, etc. It was shown that value of specific contact resistance of the order of 1.0 × 10⁻⁵ Ω−cm ² is measured for the Ag metal contacts formed on the n⁺ silicon surface. This value is much lower than the ρ_c data previously reported for the screen-printed Ag contacts. The sintering process of the front metal contact structure at different furnace setting is carried out to understand the possible wet interaction and metal contact formation as a function of the firing. Therefore, the study is further extended to study the peak firing temperature dependence of the ρ_c of screen-printed Ag metal contacts. It will help to assess the specific contact resistance of the ohmic contacts as a function of firing temperature of sintering process.

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Peculiarities in the mechanism of current flow through an ohmic contact to gallium phosphide

The temperature dependence of the electric resistance of the In-GaP ohmic contact has been studied in the range from 77 to 420 K. The resistance was measured in GaP plates of various thickness with two In ohmic contacts. The measured ohmic contact resistance increases with temperature in the interval from 230–420 K. It is suggested that the In-GaP ohmic contact is formed by metallic shunts appearing upon deposition of In atoms on dislocations and other imperfections present (with a density evaluated at (4.5–8)×107 cm⁻²) in the subsurface region of the semiconductor.     

Thermal and Doping Effect on Sn/(n)ZnO Schottky Junction and Its Performance as a <Emphasis Type="Italic">PV</Emphasis> Effect

Thin film Sn/(n)ZnO Schottky junctions with different doping concentrations were prepared by vacuum evaporation. Different junction parameters such as ideality factor, barrier height, Richardson’s constant, short-circuit current, etc. were determined from I–V characteristics. These parameters were found to change significantly with variations of doping concentration and temperature. The structures showed the change of the PV effect, giving a fill factor of 0.42 (efficiency of 0.39 %) with an open-circuit voltage of 124mV and a short-circuit current density of 113 × 10⁻⁵ A ·cm⁻² for a doping concentration, N _d = 3.88 × 10¹⁵ cm ⁻³(2.74 % Al-doped ZnO). However, by increasing the doping concentration, the efficiency was found to increase by up to 4.54 % for doping concentration, N _d = 2.28 × 10¹⁷ cm ⁻³. The conversion efficiencies varied with temperature and were observed to have an overall improvement up to 343 K. Proper doping, annealing, and hydrogenation are necessary to reduce the series resistance so as to achieve an ideal and high efficiency PVconverter.