The analysis of quartz c-axis fabrics using a modified optical microscope

A new fully automated microfabric analyzer (MiFA) is described that can be used for the fast collection of high‐resolution spatial c‐axis orientation data from a set of digital polarized light images. At the onset of an analysis the user is presented with an axial‐distribution diagram (AVA –‘Achsenverteilungsanalyse’) of a thin section. It is then a simple matter to build‐up c‐axis pole figures from selected areas of interest. The c‐axis inclination and colatitudes at any pixel site is immediately available to create bulk fabric diagrams or to select measurements in individual areas. The system supports both the interactive selection of c‐axis measurement sites and grid array selection. A verification process allows the operator to exclude dubious measurements due to impurities, grain boundaries or bubbles. We present a comparison of bulk and individual c‐axis MiFA measurements to pole figures measured with an X‐ray texture goniometer and to data collected from a scanning electron microscope furnished with electron backscatter diffraction (EBSD) facility. A second sample, an experimentally deformed quartzite, illustrates that crystal orientations can be precisely linked to any location within an individual grain.     

Single-section plane assessment in grain boundary engineered brass

The present paper reports a comparative analysis of Σ3 (in the coincidence site lattice notation) grain boundary types, in two grain boundary engineered brass specimens, by use of electron backscatter diffraction (EBSD) data coupled to the measurement of boundary traces in a single section. Although most of the data were analysed using the new single‐section technique, an analysis of boundary plane orientations in three dimensions was made in a subset of the data in order to validate the single section methodology. The single‐section trace analysis procedure, coupled with EBSD, is a viable and robust tool for analysis of Σ3 grain boundary planes. The procedure provides data which suggest that part of the enhanced strain‐to‐failure in specimen B compared to specimen A is the result of an increased proportion of mobile Σ3 boundaries, i.e. those which are displaced from the {111} symmetrical tilt configuration.     

Reconstruction of 3D grain boundaries from rock thin sections,using an advanced polarised‐light microscopy method

Grain boundaries play a significant role in materials by initiating reactions and collecting impurities. Here we present FAGO (Fabric Analyser Grain boundary recOnstruction), a first step towards the automatic determination of three‐dimensional (3D) grain boundary geometry using polarised light. The trace of the grain boundaries from 2D rock thin sections are determined primarily from data acquired using an automatic fabric analyser microscope and the FAME software (fabric analyser‐based microstructure evaluation; Peternell and colleagues and Hammes and Peternell). Based on the Fabric Analyser G50's unique arrangement of nine differently oriented light sources the retardation can be determined independently for each light direction and at each pixel in the field of view. FAGO combines these retardation datasets for each individual pixel together with retardation profiles across grain boundaries, to determine the orientations of the boundaries. The grain boundary traces are then broken up into segments of equal orientation, using the profile‐obtained orientation data. Finally, a 3D grain boundary model is reconstructed. The data processing is almost fully automatic using the MATLAB® environment. Only minor manual inputs are required.     

EBSD and TEM investigation of the hot deformation substructure characteristics of a type 316L austenitic stainless steel

The evolution of crystallographic texture and deformation substructure was studied in a type 316L austenitic stainless steel, deformed in rolling at 900 °C to true strain levels of about 0.3 and 0.7. Electron backscatter diffraction (EBSD) and transmission electron microscopy (TEM) were used in the investigation and a comparison of the substructural characteristics obtained by these techniques was made. At the lower strain level, the deformation substructure observed by EBSD appeared to be rather poorly developed. There was considerable evidence of a rotation of the pre‐existing twin boundaries from their original orientation relationship, as well as the formation of highly distorted grain boundary regions. In TEM, at this strain level, the substructure was more clearly revealed, although it appeared rather inhomogeneously developed from grain to grain. The subgrains were frequently elongated and their boundaries often approximated to traces of {111} slip planes. The corresponding misorientations were small and largely displayed a non‐cumulative character. At the larger strain, the substructure within most grains became well developed and the corresponding misorientations increased. This resulted in better detection of sub‐boundaries by EBSD, although the percentage of indexing slightly decreased. TEM revealed splitting of some sub‐boundaries to form fine microbands, as well as the localized formation of microshear bands. The substructural characteristics observed by EBSD, in particular at the larger strain, generally appeared to compare well with those obtained using TEM. With increased strain level, the mean subgrain size became finer, the corresponding mean misorientation angle increased and both these characteristics became less dependent on a particular grain orientation. The statistically representative data obtained will assist in the development of physically based models of microstructural evolution during thermomechanical processing of austenitic stainless steels.     

Phase differentiation via combined EBSD and XEDS

Electron backscatter diffraction (EBSD) and orientation imaging microscopy have become established techniques for analysing the crystallographic microstructure of single and multiphase materials. In certain instances, however, it can be difficult and/or time intensive to differentiate phases within a material by crystallography alone. Traditionally a list of candidate phases is specified prior to data collection. The crystallographic information extracted from the diffraction patterns is then compared with the crystallographic information from these candidate phases, and a best‐fit match is determined. Problems may arise when two phases have similar crystal structures. The phase differentiation process can be improved by collecting chemical information through X‐ray energy‐dispersive spectroscopy (XEDS) simultaneously with the crystallographic information through EBSD and then using the chemical information to pre‐filter the crystallographic phase candidates. This technique improves both the overall speed of the data collection and the accuracy of the final characterization. Examples of this process and the limitations involved will be presented and discussed.     

Using transmission Kikuchi diffraction to characterise α variants in an α+β titanium alloy

Two phase titanium alloys are important for high‐performance engineering components, such as aeroengine discs. The microstructures of these alloys are tailored during thermomechanical processing to precisely control phase fractions, morphology and crystallographic orientations. In bimodal two phase (α + β) Ti‐6Al‐2Sn‐4Zr‐2Mo (Ti‐6242) alloys there are often three microstructural lengthscales to consider: large (～10 μm) equiaxed primary α; >200 nm thick plate α with a basketweave morphology; and very fine scaled (<50 nm plate thickness) secondary α that grows between the larger α plates surrounded by retained β. In this work, we utilise high spatial resolution transmission Kikuchi diffraction (TKD, also known as transmission‐based electron backscatter diffraction, t‐EBSD) and scanning electron microscopy (SEM)‐based forward scattering electron imaging to resolve the structures and orientations of basketweave and secondary α in Ti‐6242. We analyse the α variants formed within one prior β grain, and test whether existing theories of habit planes of the phase transformation are upheld. Our analysis is important in understanding both the thermomechanical processing strategy of new bimodal two‐phase titanium alloys, as well as the ultimate performance of these alloys in complex loading regimes such as dwell fatigue. Our paper champions the significant increase in spatial resolution afforded using transmission techniques, combined with the ease of SEM‐based analysis using conventional electron backscatter diffraction (EBSD) systems and forescatter detector (FSD) imaging, to study the nanostructure of real‐world engineering alloys.     

Crystallographic analysis of facets using electron backscatter diffraction

Applications of electron backscatter diffraction (EBSD), also known as backscatter Kikuchi diffraction in the scanning electron microscope (SEM) are first and foremost microtexture and grain boundary misorientation analysis on a single polished section in the specimen. A more subtle and revealing approach to analysis of these data is to use EBSD to probe the orientations of planar surfaces, i.e. facets, which bound crystals. These surfaces include: • grain or phase boundaries • fractures • cracks It is of great interest to know the crystallography of such facets since it provides a key to understanding the physical properties of them.
As far as investigation methodology is concerned, surfaces or facets associated with polycrystals are of two types: exposed or unexposed. Exposed facets, such as a fracture surface, can be viewed directly in the SEM, whereas unexposed facets, such as a grain boundary, are usually revealed as an etched trace on a polished surface. Photogrammetric methods can be used to obtain the positional orientation of an exposed facet, and the crystallographic orientation is obtained either directly from the surface or by indirect sectioning. Calibrated sectioning is required to obtain the equivalent parameters for an internal surface. The present paper compares the methods for obtaining and interpreting the crystallography of facets, with illustrations from several materials.     

A preliminary electron backscattered diffraction study of sintered NdFeB-type magnets

This paper reports, for the first time, the use of electron backscattered diffraction (EBSD) to study orientation in sintered NdFeB type magnets. The magnetic properties of NdFeB magnets are greatly improved if a strong crystallographic texture is firstly achieved, namely, the direction of the c‐axis is along the direction of magnetization. A systematic survey of sample preparation techniques showed that samples that were mechanically polished and then etched gave the most reliable EBSD data. Analyses were made using both fully automated EBSD scans and by EBSD measurements taken after manual movement of the beam. The EBSD results are presented as secondary electron SEM micrographs, orientation images and 001 pole figures. For the selection of grains investigated, the deviation of the c‐axis was shown to be between 10° and 30° from the ideal [001]//magnetization direction. It is demonstrated that EBSD is a valuable tool for characterizing the microstructure and texture relationships and for assessing the performance of the processing routes of NdFeB magnets.     

Ion beam polishing for three‐dimensional electron backscattered diffraction

Serial sectioning by focused ion beam milling for three‐dimensional electron backscatter diffraction (3D‐EBSD) can create surface damage and amorphization in certain materials and consequently reduce the EBSD signal quality. Poor EBSD signal causes longer data acquisition time due to signal averaging and/or poor 3D‐EBSD data quality. In this work a low kV focused ion beam was successfully implemented to automatically polish surfaces during 3D‐EBSD of La‐ and Nb‐doped strontium titanate of volume 12.6 × 12.6 × 3.0 μm. The key to achieving this technique is the combination of a defocused low kV high current ion beam and line scan milling. The line scan was used to restrict polishing to the sample surface and the ion beam was defocused to ensure the beam contacted the complete sample surface. In this study 1 min polishing time per slice increases total acquisition time by approximately 3.3% of normal 3D‐EBSD mapping compared to a significant increase of indexing percentage and pattern quality. The polishing performance in this investigation is discussed, and two potential methods for further improvement are presented.     

Problems in determining the misorientation axes, for small angular misorientations, using electron backscatter diffraction in the SEM

The errors associated with calculating misorientation axes from electron backscatter diffraction (EBSD) data have been assessed experimentally. EBSD measurements were made on the same grains after imposed rotations of 2°, 5°, 7°, 10°, 12°, 17°, 27° and 180° around the normal to the specimen surface. The misorientation magnitudes and the misorientation axes associated with the imposed rotations have been calculated from the EBSD data. Individual measurements of misorientation axes are precise for misorientation magnitudes greater than ≈ 20°. The errors must be appreciated when assessing misorientation data at lower misorientation magnitudes and particularly at magnitudes less than 5°. Where misorientation axes can be characterized by the distribution of axes from a number of individual measurements, current EBSD techniques are satisfactory, for data sets of 30 measurements, as long as misorientation magnitudes are 10° or more. With larger data sets it may be possible to extend this approach to smaller misorientation magnitudes. For characterization of individual misorientations less than 5°, new EBSD techniques need to be developed.     

Grain size measurement by EBSD in complex hot deformed metal alloy microstructures

The measurement of grain size by EBSD has been studied to enable representative quantification of the microstructure of hot deformed metal alloys with a wide grain size distributions. Variation in measured grain size as a function of EBSD step size and noise reduction techniques has been assessed. Increasing the EBSD step size from 5% to 20% of the approximate mean grain size results in a change in calculated arithmetic mean grain size of approximately 15% and standard noise reduction techniques can produce a further change in reported size of up to 20%. The distribution of measured grain size is found not to be log‐normal, with a long tail of very small sizes in agreement with a computer simulation of linear intercept and areal grain size measurements through randomly oriented grains. Comparison of EBSD with optical measurements of grain size on the same samples shows that, because of the ability of EBSD to distinguish twins and resolve much smaller grains a difference of up to 50% in measured grain size results.     

'Five-parameter' analysis of grain boundary networks by electron backscatter diffraction

This paper describes state‐of‐the‐art analysis of grain boundary populations by EBSD, with particular emphasis on advanced, nonstandard analysis. Data processing based both on misorientation alone and customised additions which include the boundary planes are reviewed. Although commercial EBSD packages offer comprehensive data processing options for interfaces, it is clear that there is a wealth of more in‐depth data that can be gleaned from further analysis. In particular, determination of all five degrees of freedom of the boundary population provides an exciting opportunity to study grain boundaries by EBSD in a depth that was hitherto impossible. In this presentation we show ‘five‐parameter’ data from 50 000 boundary segments in grain boundary engineered brass. This is the first time that the distribution of boundary planes has been revealed in a grain boundary engineered material.     

Electron backscatter diffraction characterization of inlaid cu lines for interconnect applications

Automated electron backscatter diffraction (EBSD) techniques have been used to characterize the microstructures of thin films for the past decade or so. The recent change in strategy from an aluminum‐based interconnect structure in integrated circuits to one based on copper has necessitated the development of new fabrication procedures. Along with new processes, complete characterization of the microstructures is imperative for improving manufacturability of the Cu interconnect lines and in‐service reliability. Electron backscatter diffraction has been adopted as an important characterization tool in this effort. Cu microstructures vary dramatically as a function of processing conditions, including electroplating bath chemistry, sublayer material, stacking sequence of sublayers, annealing conditions, and line widths and depths. Crystallographic textures and grain size and grain boundary character distributions, all of which may influence manufacturability and reliability of interconnect lines, are ideally characterized using EBSD. The present discussion presents some results showing structural dependence upon processing parameters. In addition, the authors identify an in‐plane orientation preference in inlaid Cu lines {111} normal to the line surface and 〈110〉 aligned with the line direction. This relationship tends to strengthen as the line width decreases.     

Recrystallization behaviour of the nickel-based alloy 80 A during hot forming

The dynamic recrystallization as well as meta‐dynamic and static recrystallization of the nickel‐based alloy 80A was investigated by means of electron backscatter diffraction (EBSD). Specimens were hot compressed at a temperature of 1120°C and a strain rate of 0.1/s at varying strain and soak times to describe the recrystallization behaviour. Various approaches were tested in order to differentiate between recrystallized and deformed grains based on EBSD data. The grain orientation spread was clearly found to be the most reliable procedure. A high twinning of the recrystallized grains was observed, and as a consequence the measured grain size was strongly dependent on whether the coherent and incoherent twin boundaries were regarded as genuine boundaries or removed.     

A statistical analysis of the variation in measured crystal orientations obtained through electron backscatter diffraction

Electron backscatter diffraction (EBSD) techniques are used to determine the crystallography of individual metal grains. This paper examines the variability in the orientation of measurements obtained by EBSD. Although precision and statistics of orientation have been explored in the literature, little attention has been paid to formal statistical inference for quantifying variation in orientation measurements. Our intention is to study precision by developing statistical analyses for quantifying multiple sources of orientation variation, given repeat scans of a metal sample. Three sources of variability are simultaneously explored: variation in repeat measurements at a fixed location, variation among locations within a grain, and grain-to-grain variation. Bayes statistical methods will be applied to a hierarchical model with the uniform-axis-random-spin (UARS) components of Bingham et al. [1] to quantify these sources of variation. Repeat scans of a Inconel 600 specimen will be used to provide an illustrating example of how the statistical methods can be used to arrive at precision estimates.     

EBSD characterization of carbide–carbide boundaries in WC–Co composites

A sample of WC‐6wt%Co was investigated for grain boundary character distribution and occurrence of coincidence site lattice (CSL) boundaries on a statistical basis. For this purpose orientation measurements of the grains were carried out using electron back‐scattered diffraction (EBSD). The dominant misorientation relationships were determined by complementary EBSD data representation tools such as orientation maps, misorientation angle distribution histograms and the sectioned three‐dimensional misorientation space. It was found that the grain boundary character distribution of the material is nearly random and the CSL boundaries are not present in statistically significant amounts. It was also found that the amount of binder phase does not play a role in the formation of special boundaries. The paper focuses on the methodology of characterizing grain boundaries in a hexagonal material using EBSD.     

A new method for locating Kikuchi bands in electron backscatter diffraction patterns

Electron backscatter diffraction (EBSD) device can provide crystal structure, orientation, and phase content data through analysis of EBSD patterns. The reliability and precision of these data depend on the quality of the band position and zone axes data. This study introduces a new image processing method that can accurately provide the location of Kikuchi bands and poles. In this method, pattern rotation and gray gradient calculation are employed after for the initial detection of Kikuchi lines. Hough transform and Gaussian function are used for the final definition of bands position. Based on the position of Kikuchi bands, the indices of lattice planes and zone axes can be obtained precisely and easily. Angles between zone axes are calculated using locating results. The maximum error for a single‐crystal silicon sample is only 8.07%, illustrating the accuracy of this new method.     

Is fast mapping good mapping? A review of the benefits of high‐speed orientation mapping using electron backscatter diffraction

Orientation mapping using automated electron backscatter diffraction (EBSD) is now a common technique for characterizing microstructures. Improvements in software and hardware have resulted in high‐speed mapping capabilities above 80 000 points h^?1. For ‘routine’ microstructural analyses of materials such as steel and aluminium (e.g. texture and grain size measurements and high angle boundary characterization), high‐speed orientation mapping is an ideal approach with minimal penalty on the final statistics. However, for the accurate analysis of very low angle boundaries and for routine analyses of more difficult materials (e.g. most rock samples), we advocate a more patient approach to orientation mapping with an emphasis on data accuracy and reliability. It is important that the objectives of any EBSD analysis are carefully considered before starting – in this way the maximum potential of an EBSD system can be achieved.     

Multivariate statistical approach to electron backscattered diffraction

This paper assesses the potential of multivariate statistical analysis (MSA) applied to electron backscattered diffraction (EBSD) data. Instead of directly indexing EBSD patterns on an individual basis, this multivariate approach reduces a large (thousands) set of individual EBSD patterns into a core set of statistically derived component EBSD patterns which can be subsequently indexed. The following hypotheses are considered in this paper: (1) experimental EBSD patterns from a microstructure can be analytically treated as linear combinations of spatially simple components, (2) MSA has an angular resolution on par with standard EBSD, (3) MSA can discriminate between similar and dissimilar phases, and (4) the MSA approach can improve the effective spatial resolution of automated EBSD.