Status and Trends in Advanced SOI Devices and Materials

A review of recently explored effects in advanced SOI devices and materials is given. The effects of key device parameters on the electrical and thermal floating body effects are shown for various device architectures.Recent advances in the understanding of the sensitivity of electron and hole transport to the tensile or compressive uniaxial and biaxial strains in thin film SOI are presented. The performance and physical mechanisms are also addressed in multi-gate Si, SiGe and Ge MOSFETs. New hot carrier phenomena are discussed. The effects of gate misalignment or underlap,as well as the use of the back gate for charge storage in double-gate nanodevices and of capacitorless DRAM are also outlined.     

Status and Trends in Advanced SOI Devices and Materials

提供了一种用于安德鲁反射测量样品制备新方法.该方法采用聚焦粒子束刻蚀和磁控溅射,可以获得可控的、干净的、无应力的纳米接触用于自旋极化探测.所制备的样品中,磁性和非磁性材料样品的反射谱都表现出复杂的峰和谷结构,这些结构可能源于与界面相关的零偏压反常以及与激发态相关的准离子相互作用.对另一个Co40Fe40B20合金样品采用简单的钕针尖压针方法进行了对比性测量,反射谱中没有观察到谷结构,但谱结构出现较明显的热扩展,这种热扩展可能来源于界面处的非弹性输运.所有的反射谱目前还不能由现有的理论给出令人满意的解释.利用点接触反射方法获得可靠的自旋极化信息还有赖于接触界面特征的进一步分析.而一个更切合实际的、更完善的理论成为迫切的需要.