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 共查询到20条相似文献,搜索用时 9 毫秒
1.
Suddapalli  Subba Rao  Nistala  Bheema Rao 《SILICON》2022,14(6):2741-2756
Silicon - The performances of analog/RF parameters of a graded channel gate stack triple material double gate (GCGS-TMDG) strained-Silicon (s-Si) MOSFET with fixed charges are analyzed by using...  相似文献   

2.
In this paper a double gate MOSFET having non uniform channel doping with gate stack structure is explored to study the linearity analysis. The extractions  相似文献   

3.
Duksh  Yograj Singh  Singh  Balraj  Gola  Deepti  Tiwari  Pramod Kumar  Jit  Satyabrata 《SILICON》2021,13(4):1231-1238
Silicon - In this paper, 2-D analytical models of channel central potential, threshold voltage, subthreshold current and subthreshold swing for graded channel double gate (GC-DG) Junctionless FETs...  相似文献   

4.
Ajay 《SILICON》2020,12(12):2799-2807
Silicon - Junctionless Metal Oxide Semiconductor Field-Effect Transistor (JL MOSFET) is one of the promising candidate to replace the junction based MOSFET for upcoming technology nodes....  相似文献   

5.
Sarkhel  Saheli  Saha  Priyanka  Sarkar  Subir Kumar 《SILICON》2019,11(3):1421-1428
Silicon - The present work focuses on formulating a detailed two dimensional analytical model of the proposed Triple Metal Stacked Front Gate Oxide Double Gate MOSFET with step graded channel...  相似文献   

6.
Sagar  Kallepelli  Maheshwaram  Satish 《SILICON》2022,14(15):9431-9439
Silicon - In this work, TCAD based investigation of various Circular double gate MOSFET (CDGT) architectures have been carried for Low-Power(LP) & High- Performance (HP) applications at...  相似文献   

7.
Das  Satish K.  Nanda  Umakanta  Biswal  Sudhansu M.  Pandey  Chandan Kumar  Giri  Lalat Indu 《SILICON》2022,14(6):2965-2973
Silicon - Short channel effects (SCEs) along with mobility degradation has a great impact on CMOS technology below 100 nm. These effects can be overcome by using gate and channel...  相似文献   

8.
Basak  Arighna  Sarkar  Angsuman 《SILICON》2022,14(1):75-86
Silicon - This paper presents the continuous 2D analytical modelling of electrostatic potential, threshold voltage (Vth), subthreshold swing, drain induced barrier lowering (DIBL) and drain current...  相似文献   

9.
Gupta  Neha  Kumar  Ajay  Chaujar  Rishu 《SILICON》2020,12(6):1501-1510
Silicon - This work investigates design consideration of Gate Electrode Workfunction Engineered (GEWE) silicon nanowire MOSFET at room temperature. It is perceived from the results that the...  相似文献   

10.
Darwin  S.  Arun Samuel  T. S. 《SILICON》2020,12(2):393-403
Silicon - The 2D analytical models for electrostatic potential, threshold voltage, subthreshold swing, Drain Induced Barrier Lowering (DIBL) and drain current of the Dual Material Double Gate...  相似文献   

11.
Seema  Chauhan  S.S. 《SILICON》2021,13(4):1121-1125
Silicon - In recent low-power electronics industry, Tunnel field-effect transistors (TFETs) have shown the superior performance such as decreased leakage current and lower subthreshold slope (SS)....  相似文献   

12.
Vadthiya Narendar 《SILICON》2018,10(6):2419-2429
The Fin shaped Field Effect Transistors (FinFETs), are the front runner of the current sub-nanometer technology node. The semiconductor industry adopts it in high-performance (HP) and low-power (LP) applications due to greater electrostatic control and better scalability. This paper explores the numerically simulation based comparison of bulk and silicon-on-insulator (SOI) technology double gate (DG), triple gate (TG) FinFETs. The essential processing steps required to create the GS high-k dielectric bulk and SOI FinFETs are demonstrated. The electrical performance parameters of the device such as Ion/Ioff ratio, subthreshold swing (SS), and drain induced barrier lowering (DIBL) are extracted. Based on the three-dimensional (3D) ATLASTM simulation results, TG FinFET shows an ameliorated performance over DG in bulk and SOI technology as well. In order to control the short channel effects (SCEs), gate-stack (GS) high-k dielectrics are introduced with fixed thickness interfacial-layer (IL) and high-k dielectric material in between the gate material and semiconductor. The GS high-k dielectrics suppress the SCEs to large extent in both devices and technologies. The GS SOI FinFETs demonstrates the improved performance over the bulk counterpart and TG FinFET is the best among them. Further, the similar kind of investigation has been carried out for Tfin variations. These devices reveal the excellent control of SCEs when the fin is narrow. The ratio of SOI and bulk TG FinFET Ion/Ioff ratio with Tfin variations provide evidence that, the SOI based devices are competent for HP and LP applications.  相似文献   

13.
A Double-gate (DG) metal-oxide-semiconductor field effect transistor (MOSFET) is emerging device architecture in sub-nanometer regime. The performance of DG MOSFET can be ameliorated by gate and channel engineering. The concept of graded-channel gate-stack (GCGS) and dual-material (DM) are incorporated in DG MOSFET. A two-dimensional (2D) analytical surface potential model for GCGS DMDG MOSFET is developed based on the solution of Poisson’s equations with appropriate boundary conditions. It has been found that analytically modeled data is in good degree of agreement with numerically simulated data. The combination of both DM and GC concept introduces a step variation in potential profile at the junction of both materials in channel region and ameliorates the short channel effects (SCEs). A suppressed subthreshold swing (SS) and drain induced barrier lowering (DIBL) has been observed in the device due to an elevated average velocity of carrier and reduced drain field effect by the use of DM and GC with GS. Further, analog/RF characteristics such as transconductance generation factor (TGF), cut-off frequency (fT) and transconductance frequency product (TFP) have been examined with different GS high-k dielectrics. The numerically simulated data has been extracted using 2D ATLAS device simulator.  相似文献   

14.
Sujatha  G.  Mohankumar  N.  Poornachandran  R.  Saravanakumar  R.  Pandian  M. Karthigai 《SILICON》2022,14(16):10509-10520
Silicon - In this work, the impact of barrier thickness (Tb) on the behavior of InGaAs/InAs/InGaAs composite channel Dual material Double gate (DMDG) high electron mobility transistor (HEMT)...  相似文献   

15.
R. Kiran Kumar  S. Shiyamala 《SILICON》2020,12(9):2065-2072
A 2-dimensional electrostatic potential modeling of fully depleted channel, with high-k based dual work function double gate (DWFDG) MOSFET, has been devel  相似文献   

16.
Ajay 《SILICON》2020,12(11):2571-2580
Silicon - In this proposed article, an investigation has been studied for low leakage current and high on-state current with heavily doping in source and drain region of Double Gate Junctionless...  相似文献   

17.
Rashid  Shazia  Bashir  Faisal  Khanday  Farooq A.  Beigh  M. Rafiq 《SILICON》2023,15(1):205-215
Silicon - This work presents the design and simulation of a novel double-gate L-shaped Schottky barrier MOSFET (DG-LS-SB-MOSFET). The device uses a low work function metal near source-channel...  相似文献   

18.
Basak  Arighna  Sarkar  Angsuman 《SILICON》2021,13(9):3131-3139
Silicon - This paper presents a quantum analytical modeling of UTBB SOIMOSFET as lateral dual gate for the first time. In this paper, a 2-dimensional analytical modeling of electric field...  相似文献   

19.
Kumar  Prashant  Vashishath  Munish  Gupta  Neeraj  Gupta  Rashmi 《SILICON》2022,14(13):7725-7734
Silicon - This paper describes the impression of low-k/high-k dielectric on the performance of Double Gate Junction less (DG-JL) MOSFET. An analytical model of the threshold voltage of DG-JLFET has...  相似文献   

20.
Chakrabarti  Himeli  Maity  Reshmi  Baishya  S.  Maity  N. P. 《SILICON》2022,14(15):9763-9772
Silicon - In this study, an accurate model for threshold voltage of graded channel dual material double gate (GCDMDG) structure metal-oxide-semiconductor (MOS) has been established and a...  相似文献   

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