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1.
《Microelectronics Journal》2015,46(7):581-587
Inductors are used extensively in Radio Frequency Integrated Circuits to design matching networks, load circuits of voltage controlled oscillators, filters, mixers and many other RF circuits. However, on-chip inductors are large and cannot be ported easily from one process to the next. Due to modern CMOS scaling, inductorless RF design is rapidly becoming possible. In this paper a new methodology for designing the RF frontend necessary for the DVB-SH in a 90 nm CMOS technology based on the use current conveyors (CC) is presented. The RF frontend scheme is composed of a second generation CC (CCII) LNA with asymmetric input and output, an asymmetric to differential converter, and a passive differential mixer followed by two CCII transimpedance amplifiers to obtain a high gain conversion. Measurements show a conversion gain of 20.8 dB, a 14.5 dB noise figure, an input return loss (S11) of −14.3 dB and an output compression point of −3.9 dBm. This combination draws 28.4 mW from a ±1.2 V supply.  相似文献   

2.
《Microelectronics Journal》2015,46(5):362-369
A new solution for an ultra-low-voltage, low-power, bulk-driven fully differential-difference amplifier (FDDA) is presented in the paper. Simulated performance of the overall FDDA for a 50 nm CMOS process and supply voltage of 0.4 V, shows dissipation power of 31.8 μW, the open loop voltage gain of 58.6 dB and the gain-bandwidth product (GBW) of 2.3 MHz for a 20 pF load capacitance. Despite the very low supply voltage, the FDDA exhibits rail-to-rail input/output swing. The circuit performance has also been tested in two applications; the differential voltage follower and the second-order band-pass filter, showing satisfactory accuracy and dynamic range.  相似文献   

3.
This paper presents static and dynamic studies of a new CMOS realization for the inverting second generation current conveyor circuit (ICCII). The proposed design offers enhanced functionalities compared to ICCII circuits previously presented in the literature. It is characterized by a rail to rail dynamic range with high accuracy, a low parasitic resistor at terminal X (1.6 Ω) and low power consumption (0.31 mW) with wide current mode (3.32 GHz) and voltage mode (3.9 GHz) bandwidths.Furthermore, a new MISO current mode bi-quadratic filter based on using ICCII circuits as active elements is proposed. This filter can realize all standard filter responses without changing the circuit topology. It is characterized by active and passive sensitivities less than unity and an adjustment independently between pole frequency and quality factor. The operating frequency limit of this filter is about 0.8 GHz with 0.674 mW power consumption.The proposed current conveyor circuits and bi-quadratic filter are tested by TSPICE using CMOS 0.18 µm TSMC technology with ±0.8 V supply voltage to verify the theoretical results.  相似文献   

4.
《Microelectronics Journal》2015,46(11):1012-1019
This paper presents a voltage reference generator architecture and two different realizations of it that have been fabricated within a standard 0.18 μm CMOS technology. The architecture takes the advantage of utilizing a sampled-data amplifier (SDA) to optimize the power consumption. The circuits achieve output voltages on the order of 190 mV with temperature coefficients of 43 ppm/°C and 52.5 ppm/°C over the temperature range of 0 to 120°C without any trimming with a 0.8 V single supply. The power consumptions of the circuits are less then 500 nW while occupying an area of 0.2 mm2 and 0.08 mm2, respectively.  相似文献   

5.
Single-grain thin-film transistors (SG-TFTs) fabricated inside location-controlled using μ-Czochralski process exhibit SOI-FETs like performance despite processing temperatures remaining below 350 °C. Thus, the SG-TFT is a potential technology for large-area highly-integrated electronic system and system-in-package, taking advantage of the system-on-flexible substrate and low manufacturing cost capabalities. The SG-TFT is modeled based on the BSIMSOI SPICE model where the mobility parameter is modified to fit the SG-TFT behavior. Therefore, analog and RF circuits can be designed and benchmarked. A two-stage telescopic cascode operational amplifier fabricated in a prototype 1.5 μm SG-TFT technology demonstrates DC gain of 55 dB and unity-gain bandwidth of 6.3 MHz. A prototype CMOS voltage reference demonstrates a power supply rejection ratio (PSRR) of 50 dB. With unity-gain frequency, fT, in the GHz range, the SG-TFT can also enable RF circuits for wireless applications. A 12 dB gain RF cascode amplifier with integrated on-chip inductors operating in the 433 MHz ISM band is demonstrated.  相似文献   

6.
《Microelectronics Journal》2015,46(8):777-782
A new approach for small transconductance (Gm) OTA designs, suitable for relatively low frequency filtering applications in the range of few kHz, is proposed. Small Gm values are achieved by a current cancellation technique, and are adjustable by bulk driving the MOS transistors of the input differential amplifier. The OTA design procedure takes into account Pelgrom׳s modeling of mismatch errors. A common-mode feedback control circuit based on floating gate common-mode voltage detector that shares the filter main capacitances is also presented. Experimental results obtained with a low-pass filter with tunable cutoff frequency implemented in a 0.35 μm CMOS process to verify the effectiveness of the design procedure have shown close agreement with the theory.  相似文献   

7.
A novel current buffer stage with very low input resistance is proposed. Low input resistance is achieved using a potentially instable positive feedback loop. Stability of the circuit under different operating conditions is examined in details. A feedback control block using a bipolar 4-bit current steering DAC as a control mechanism is added to the buffer to control the input resistance and assure stability. The proposed technology-independent design methodology always ensures precision and stability for all different parasitic capacitor and resistor values of the driving signal source as well as for process, mismatch, and environmental variations. Additionally, a novel second generation current conveyor circuit based on this novel input buffer is presented to demonstrate how this buffer makes almost ideal current mode circuits possible. Filter applications using the proposed CCII are performed for further justification. The current buffer and CCII were built in AMS 0.35 μm 2P4M CMOS technology. Measurement results are presented for the current buffer, the CCII circuit, and the filters.  相似文献   

8.
This paper presents a low voltage low power operational transconductance amplifier circuit. By using a source degeneration technique, the proposed realization powered at ±0.9 V shows a high DC gain of 63 dB with a unity gain frequency at 3.5 MHz, a wide dynamic range and a total harmonic distortion of −60 dB at 1 MHz for an input of 1 Vpp. According to the connection of negative current terminal to positive voltage terminal of double output OTA circuit, a second generation current conveyor (CCII-) has been realized. This circuit offers a good linearity over the dynamic range, an excellent accuracy and wide current mode of 56 MHz and voltage mode of 16.78 MHz cut-off frequency f-3 dB.Thereafter, new SIMO current-mode biquadratic filter composed by OTA and CCII as active elements and two grounded capacitors is implemented. This filter is characterized by (i) independent adjusting of pole frequency and quality factor, (ii) it can realize all simulations results without changing the circuit topology, (iii) it shows low power consumption about 0.24 mW. All simulations are performed by Cadence (Cadence Design Systems) technology Tower Jazz 0.18 μm TS18SL.  相似文献   

9.
This paper presents a low-voltage low-power transmitter front-end using current mode approach for 2.4 GHz wireless communication applications, which is fabricated in a chartered 0.18 μm CMOS technology. The direct up-conversion is implemented with a current mode mixer employing a novel input driver stage, which can significantly improve the linearity and consume a small amount of DC current. The driver amplifier utilizes a transimpedance amplifier as the first stage and employs an inter-stage capacitive cross-coupling technique, which enhances the power conversion gain as well as high linearity. The measured results show that at 2.4 GHz, the transmitter front-end provides 15.5 dB of power conversion gain, output P?1 dB of 3 dBm, and the output-referred third-order intercept point (OIP3) of 13.8 dBm, while drawing only 6 mA from the transmitter front-end under a supply voltage of 1.2 V. The chip area including the testing pads is only 0.9 mm×1.1 mm.  相似文献   

10.
In this paper a novel low voltage (LV) very low power (VLP) class AB current output stage (COS) with extremely high linearity and high output impedance is presented. A novel current splitting method is used to minimize the transistors gate–source voltages providing LV operation and ultra high current drive capability. High linearity and very high output impedance are achieved employing a novel resistor based current mirror avoiding conventional cascode structures to be used. The operation of the proposed COS has been verified through HSPICE simulations based on TSMC 0.18 μm CMOS technology parameters. Under supply voltage of ±0.7 V and bias current of 5 μA, it can deliver output currents as high as 14 mA with THD better than ?53 dB and extremely high output impedance of 320 MΩ while consuming only 29 μW. This makes the proposed COS to have ultra large current drive ratio (Ioutmax/Ibias or the ratio of peak output current to the bias current of output branch transistors) of 2800. By increasing supply voltage to ±0.9 V, it can deliver extremely large output current of ±24 mA corresponding to 3200 current drive ratio while consuming only 42.9 μW and exhibiting high output impedance of 350 MΩ. Interestingly, the proposed COS is the first yet reported one with such extremely high output current and a THD even less than ?45 dB. Such ultra high current drive capability, high linearity and high output impedance make the proposed COS an outstanding choice for LV, VLP and high drive current mode circuits. The superiority of the proposed COS gets more significance by showing in this work that conventional COS can deliver only ±3.29 mA in equal condition. The proposed COS also exhibits high positive and negative power supply rejection ratio (PSRR+/PSRR?) of 125 dB and 130 dB, respectively. That makes it very suitable for LV, VLP mixed mode applications. The Monte Carlo simulation results are provided, which prove the outstanding robust performance of the proposed block versus process tolerances. Favorably the proposed COS resolves the major limitation of current output stages that so far has prevented designing high drive current mode circuits under low supply voltages. In brief, the deliberate combination of so many effective novel methods presents a wonderful phenomenal COS block to the world of science and engineering.  相似文献   

11.
《Microelectronics Journal》2014,45(11):1463-1469
A low-power low-noise amplifier (LNA) utilized a resistive inverter configuration feedback amplifier to achieve the broadband input matching purposes. To achieve low power consumption and high gain, the proposed LNA utilizes a current-reused technique and a splitting-load inductive peaking technique of a resistive-feedback inverter for input matching. Two wideband LNAs are implemented by TSMC 0.18 μm CMOS technology. The first LNA operates at 2–6 GHz. The minimum noise figure is 3.6 dB. The amplifier provides a maximum gain (S21) of 18.5 dB while drawing 10.3 mW from a 1.5-V supply. This chip area is 1.028×0.921 mm2. The second LNA operates at 3.1–10.6 GHz. By using self-forward body bias, it can reduce supply voltage as well as save bias current. The minimum noise figure is 4.8 dB. The amplifier provides a maximum gain (S21) of 17.8 dB while drawing 9.67 mW from a 1.2-V supply. This chip area is 1.274×0.771 mm2.  相似文献   

12.
A design of RF down-conversion Gilbert-Cell, with 65 nm CMOS technology, at a supply voltage of 1.8 V, with a new degenerating structure to improve linearity. This architecture opens the way to more integrated CMOS RF circuits and to achieve a good characteristics in terms of evaluating parameters of RF mixers with a very low power consumption (2.17 mW). At 1.9 GHz RF frequency; obtained results show a third order input intercept point (IIP3) equal to 11.6 dBm, Noise Figure (NF) is 4.12 dB, when conversion gain is 8.75 dB.  相似文献   

13.
Organic vertical-type triodes (OVTs) based on the cascade energy band structure as emitter layer are studied. The electric characteristics were dramatically enhanced while incorporating the cascade energy under current driving and voltage driving modes. The improvement is attributed to that injection carriers can obtain higher energy through a stepwise energy level. When the device has a layered structure of F16CuPC (10 nm)/PTCDI (10 nm)/pentacene (100 nm) in emitter, it exhibits a common-base transport factor of 0.99 and a common-emitter current gain of 225 under current driving mode and exhibits a high current modulation-exceeding ?520 μA for a low collector voltage of ?5 V and a base voltage of ?5 V and the current on/off ratio of 103 under voltage driving mode. Furthermore, we realized first organic current mirror that exhibited out/in current ratio of 0.75 and output resistance of 105 Ω by using the OVTs.  相似文献   

14.
The paper presented here offers a two stage amplifier where both stages are in class AB mode. The input stage makes use of a floating gate metal oxide semiconductor (FGMOS) transistor which enables this circuit to operate at lower voltage and also increases overall linearity. The frequency compensation is done using voltage buffer scheme. A super source follower (SSF) acts as voltage buffer and exploited here with a series capacitor. The function of SSF is to enhance phase margin (PM) and gain bandwidth product (GBW) of the amplifier. The small signal equivalent and mathematical analysis of circuit is also given. The performance of the proposed circuit has been verified by using Mentor Graphics Eldo simulation tool with TSMC CMOS 0.18 μm process parameters. The ac simulation results of amplifier show that GBW is 9 MHz and power consumption is 0.5 mW.  相似文献   

15.
A wideband common-gate (CG) low-noise amplifier (LNA) with dual capacitor cross-coupled (CCC) feedback and negative impedance techniques is presented for multimode multiband wireless communication applications. Double CCC technique boosts the input transconductance of the LNA, and low power consumption is obtained by using current-reuse technique. Negative impedance technique is employed to alleviate the correlation between the transconductance of the matching transistors and input impedance. Meanwhile, it also allows us to achieve a lower noise figure (NF). Moreover, current bleeding technique is adopted to allow the choice of a larger load resistor without sacrificing the voltage headroom. The proposed architecture achieves low noise, low power and high gain simultaneously without the use of bulky inductors. Simulation results of a 0.18-μm CMOS implementation show that the proposed LNA provides a maximum voltage gain of 25.02 dB and a minimum NF of 2.37 dB from 0.1 to 2.25 GHz. The input-referred third-order intercept point (IIP3) and input 1-dB compression point (IP1dB) are better than –7.8 dBm and –19.2 dBm, respectively, across the operating bandwidth. The circuit dissipates 3.24 mW from 1.8 V DC supply with an active area of 0.03 mm2.  相似文献   

16.
For serving as ideal switching devices in future energy-efficient applications, scaling down the channel lengths of tunnel-field effect transistors (TFETs) is essential to follow the pace of Si-based CMOS technologies. This work elucidates the short-channel mechanisms and the role of the drain in extremely-scaled TFETs. The scalability of TFETs depends strongly on the appropriately low drain concentration, whereas the capability of the drain for scaling relies on a sufficient drain region. The drain with a light concentration of 5 × 1017 cm−3 and a minimum length of 20 nm enables 5 nm TFETs to exhibit favorable on–off switching characteristics. In sub-20 nm TFETs, the total drain and channel lengths must satisfy the minimum criteria of approximately 25 nm to sustain reversely biased drain voltage of 0.7 V. The asymmetric Si1−xGex source heterojunction is combined with the minimum drain design in 5 nm TFETs to separately optimize the source- and drain-side tunnel junctions, generating ideal on-/off-currents and switching characteristics to serve as a promising design approach of sub-5 nm TFETs.  相似文献   

17.
《Microelectronics Journal》2015,46(2):198-206
In this paper, a highly linear CMOS low noise amplifier (LNA) for ultra-wideband applications is presented. The proposed LNA improves both input second- and third-order intercept points (IIP2 and IIP3) by canceling the common-mode part of all intermodulation components from the output current. The proposed LNA structure creates equal common-mode currents with the opposite sign by cascading two differential pairs with a cross-connected output. These currents eliminate each other at the output and improve the linearity. Also, the proposed LNA improves the noise performance by canceling the thermal noise of the input and auxiliary transistors at the output. Detailed analysis is provided to show the effectiveness of the proposed LNA structure. Post-layout circuit level simulation results using a 90 nm RF CMOS process with Spectre-RF reveal 9.5 dB power gain, -3 dB bandwidth (BW−3dB) of 8 GHz from 2.4 GHz to 10.4 GHz, and mean IIP3 and IIP2 of +13.1 dBm and +42.8 dBm, respectively. The simulated S11 is less than −11 dB in whole frequency range while the LNA consumes 14.8 mW from a single 1.2 V power supply.  相似文献   

18.
This paper is assigned to the design of voltage feedback current amplifiers (VFCAs). Their operation and interesting characteristics are covered and a novel CMOS VFCA is presented. New ideas based on super transistors (STs) are devised and used to design a high performance VFCA. Benefiting from the interesting properties of STs, the proposed VFCA exhibits high linearity, high output impedance, very low input impedance and wide bandwidth. The proposed circuit is designed using TSMC 0.18 μm CMOS technology parameters and supply voltage of ±0.75 V. Simulation results with HSPICE show low THD of ?60 dB at the output signal, very low impedance of 0.6 Ω and 0.2 Ω at the input and feedback ports respectively and high output impedance of 10 MΩ. Moreover it can provide wide ?3 dB bandwidth of 15.5 MHz. The results prove the high capability of the VFCA in current mode signal processing and encourage strong motivation to develop commercially available VFCAs.  相似文献   

19.
Dual diodes with embedded silicon controlled rectifier (DD-SCR) for high-speed applications are presented. A new DD-SCR topography is shown to exhibit a high failure current (It2), small on-state resistance (RON), low voltage overshoot and low parasitic capacitance. This is a preferred device option for broadband high-speed data converter applications in advanced 28 nm CMOS processes. A comprehensive device characterization demonstrates the design tradeoffs and the superior ESD performance in relation to the devices' variations capacitance in the sub 40 fF range.  相似文献   

20.
This paper reports a CMOS compatible fabrication procedure that enables electrowetting-on-dielectric (EWOD) technology to be post-processed on foundry CMOS technology. With driving voltages less than 15 V it is believed to be the lowest reported driving voltage for any material system compatible with post-processing on completed integrated circuits wafers. The process architecture uses anodically grown tantalum pentoxide as a pinhole free high dielectric constant insulator with an overlying 16 nm layer of Teflon-AF®, which provides the hydrophobic surface for droplets manipulation. This stack provides a very robust dielectric, which maintains a sufficiently high capacitance per unit area for effective operation at a reduced voltage (15 V) which is more compatible with standard CMOS technology. The paper demonstrates that the sputtered tantalum layer used for the electrodes and the formation of the insulating dielectric can readily be integrated with both aluminium and copper interconnect used in foundry CMOS.  相似文献   

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