基于微通道热沉的片状激光放大器散热模拟及优化

为实现片状结构高重复频率大能量激光放大器的高效热管理，采用有限元分析(FEA)方法，充分考虑增益介质内部非均匀热分布、微通道热沉中的流速、对流扩散等影响因素，引入流-热-固多物理场耦合数值分析模型，对激光放大器热沉进行分析优化，并基于优化结果探讨了不同流速下微通道热沉的散热冷却能力。模拟结果表明：当基底厚度H_b=2 mm、单个微通道高度H_c=4 mm和宽度W_c=0.4 mm、两微通道的间距W_w=0.3 mm时，微通道热沉冷却能力最强，热阻最小；微通道内冷却液流速过大会导致较大的流动压力损失；微通道热沉的平均等效换热系数可达50000 W/(m²·K)。     

复合型微通道热沉设计与制作技术研究

从大功率半导体激光器可靠性封装和应用考虑,利用商用有限元软件Abaqus与CFdesign对微通道热沉材料、结构进行优化设计,结合相应的制造工艺流程制备实用化复合型微通道热沉。微通道热沉尺寸为27 mm×10.8 mm×1.5 mm,并利用大功率半导体激光阵列器件对所制备热沉进行散热能力、封装产生的"微笑效应"进行了测试,复合微通道热沉热阻约0.3 K/W,"微笑"值远小于无氧铜微通道封装线阵列,可以控制在1μm以下。复合型微通道热沉能满足半导体激光阵列器件高功率集成输出的散热需求与硬焊料封装的可靠性要求。     

高功率半导体激光器微通道热沉的模拟优化

针对原curamik微通道热沉因进水通道流量不均而导致散热不均匀的现象,基于FLUENT软件对其进行数值模拟。从内部结构及热沉材料方面提出优化方案,并进一步获得在热沉高度和进出口宽度为固定值的条件下,微通道宽度、间距及通道脊长度3个因素分别对芯片表面温升和压降的影响规律。根据优化的参数,通过选区激光熔化技术制备获得纯镍微通道热沉并进行芯片封装测试。结果显示,微通道热沉散热均匀,热阻为0.39K/W,压降为140kPa,能够满足输出功率为80 W的半导体激光器单巴条芯片的散热要求。     

基于扰流的蜂窝层叠微通道热沉散热实验研究

针对一种基于扰流作用的多层蜂窝形微通道热沉结构设计,在不同流量、不同加热功率、不同热沉设计尺寸等实验条件下时其进行了散热测试实验,对影响该系统性能的因素进行了分析和讨论.散热实验结果显示在热沉进出口管径采用外径为φ6 mm,内径为φ4 mm不锈钢毛细管时,其有效散热热流密度可达18.2 W/cm2,基板温度为48.3℃,微泵耗功为2.4 W,具有良好的换热效果.     

基于微通道散热的板条激光放大器热仿真分析

众所周知,热效应是限制大功率高能量激光器发展的一大瓶颈,在高能激光产生的过程中伴随着大量的废热产生,影响高能量激光器的光束质量甚至会影响其正常工作。为了保证高能量激光器的稳定运作并研究其工作物质的散热过程中的热分布状态,本文建立了一种用于高能Zig-Zag板条激光放大器的双端入水微通道散热模型,利用CFD模拟仿真软件在额定工况下对微通道与空腔热沉进行散热对比,还研究了模型的可变参量：通道高度、翅片厚度,以及水流量对于散热性能的影响。模拟研究发现本文提出的微通道热沉冷却效果优于全腔水冷效果,微通道热沉将晶体表面最高温差控制在4℃以内,表面温度也降低了32%;同时在压降允许范围内优化通道参数能再将冷却效果提升10%,实现增益介质分布式高效散热。     

用于激光脱毛的低成本810 nm半导体激光模块

针对国内激光脱毛设备的需求,提出了宏通道加传导散热热沉的散热设计,并采用正交实验方法对影响宏通道散热能力的4个关键参数和3个水平进行了结构优化设计.仿真结果表明,对于该模块,本文设计的宏通道具有和微通道相同的散热能力.使用宏通道加传导散热热沉研制出低成本半导体激光器模块,测试结果表明,与设计值一致,输出峰值功率达到了603 W,波长807.5 nm,整体结构热阻为0.28℃/W,可以满足激光脱毛设备的使用要求.宏通道热沉成功取代了传统的微通道热沉,达到了降低成本的目的.     

高光束质量大功率半导体激光阵列的微通道热沉

针对现有高光束质量大功率半导体激光阵列内部发光单元条宽、填充因子不断减小,腔长不断增加的发展趋势所带来的热源分布及长度变化影响器件热阻的问题,利用分离热源边界条件结合商用计算流体力学(CFD)软件FLUENT进行数值计算,获得微通道热沉热阻随阵列器件发光单元条宽、空间位置变化关系以及不同阵列腔长对应的微通道优化长度.根据优化参数制备获得尢氧铜微通道热沉,并对宽1 cm,腔长1 mm,条宽100μm,填充因子为25%的半导体激光阵列进行散热能力测试,冷却器外形尺寸27 mm×11 mm×1.5 mm.微通道热沉热阻0.34 K/W,能够满足半导体激光阵列器件高功率集成输出的散热需求.     

高功率微波装置散热热沉传热流动特性

高功率微波装置在运行时面临的高热流密度散热是当前热控必须解决的难题。微小通道热沉散热结构简单,换热能力突出,在一定程度上能够解决高热流密度散热的问题。但使用微小通道热沉散热时,散热面温度在沿工质流动方向不断升高,这对器件稳定运行不利。而射流冲击技术中流体垂直于热源喷射,温度边界层薄,温度梯度大,换热效果强。将射流冲击技术与微通道热沉相结合,不仅能提高换热系数,增大换热量,而且能实现良好的温度均匀性。对高热流密度下射流冲击微小通道热沉进行数值模拟,分析不同射流孔径对其传热和流动特性的影响。结果表明,增大远离出口处的射流孔径,有利于提高传热效率和减小流动阻力。优化后的射流微通道热沉,在质量流量为14 g/s时,换热系数接近39 000 W/(m2·K)。     

两相冲击强化换热激光二极管用单片热沉

针对大功率激光二极管(LD)的冷却需求,基于沸腾-空化耦合效应,以及场协同理论,研制了一种微通道两相冲击强化相变热沉,封装腔长1.5 mm的LD线阵。实验测试了连续功率LD输出0~100 W时的电-光转换效率以及电流-输出功率等特性,冷却工质采用R134a,磁驱齿轮泵电机转速23 Hz时热沉热阻为0.211℃/W。结果显示微通道相变热沉具有良好的取热能力,能够满足大功率LD的散热要求。与改进前的热沉相比,基于场协同理论优化了的两相冲击热沉,热阻明显下降。     

固体激光器中多块热沉夹持晶体散热时接触热导研究

采用圆棒状工作物质的固体激光器中,通常用2块带有半圆型凹槽的金属热沉夹持晶体散热。装配压强在晶体与热沉接触面上的不均匀分布,造成二者间接触热导沿圆周变化,在晶体中产生非轴对称的温度分布。提出采用3块或4块热沉夹持圆棒晶体散热,利用截断高斯模型和塑性形变模型计算晶体与热沉间接触热导,建立了接触散热模型,并用有限元法得到晶体温度分布。结果表明,2块热沉夹持圆棒晶体散热时,晶体侧面压强、接触热导沿圆周变化明显,在热沉凹槽底部达到最大,在2块热沉结合面处为零,晶体端面温度沿周向变化较大。采用3块热沉时,晶体侧面压强、接触热导及温度分布的周向均匀性提高,端面中心温度降低,采用4块热沉时,晶体侧面压强、接触热导及温度分布的周向均匀性最好,端面中心温度最低。     

Geometric optimization of a micro heat sink with liquid flow

Over the course of the past decade, a number of investigations have been conducted to better understand the fluid flow and heat transfer in microchannel heat sinks, particularly as it pertains to applications involving the thermal control of electronic devices. In the current investigation, a detailed numerical simulation of the heat transfer occurring in silicon-based microchannel heat sinks has been conducted in order to optimize the geometric structure using a simplified, three-dimensional (3-D) conjugate heat transfer model [two-dimensional (2-D) fluid flow and 3-D heat transfer]. The micro heat sink modeled in this investigation consists of a 10 mm long silicon substrate with rectangular microchannels fabricated with different geometries. The rectangular microchannels had widths ranging from 20 /spl mu/m to 220 /spl mu/m and a depth ranging from 100 /spl mu/m to 400 /spl mu/m. The effect of the microchannel geometry on the temperature distribution in the microchannel heat sink is presented and discussed assuming a constant pumping power. The model was validated by comparing the predicted results with previously published experimental results and theoretical analyses, and indicated that both the physical geometry of the microchannel and the thermophysical properties of the substrate are important parameters in the design and optimization of these microchannel heat sinks. For the silicon-water micro heat sink, the optimal configuration for rectangular channel heat sinks occurred when the number of channels approached 120 channels per centimeter.     

Optimization of Microchannel Heat Sinks Using Entropy Generation Minimization Method

In this paper, an entropy generation minimization (EGM) procedure is employed to optimize the overall performance of microchannel heat sinks. This allows the combined effects of thermal resistance and pressure drop to be assessed simultaneously as the heat sink interacts with the surrounding flow field. New general expressions for the entropy generation rate are developed by considering an appropriate control volume and applying mass, energy, and entropy balances. The effect of channel aspect ratio, fin spacing ratio, heat sink material, Knudsen numbers, and accommodation coefficients on the entropy generation rate is investigated in the slip flow region. Analytical/empirical correlations are used for heat transfer and friction coefficients, where the characteristic length is used as the hydraulic diameter of the channel. A parametric study is also performed to show the effects of different design variables on the overall performance of microchannel heat sinks.      

Design and Optimization of Single-Phase Liquid Cooled Microchannel Heat Sink

Semiconductor devices for demanding automotive applications generate a large amount of heat $({≫}{rm 100}~{rm W}/{rm cm}^{2})$. These high power devices can be cooled off very effectively by liquid coolant flowing through the microchannel heat sink. Microchannel heat sinks are very attractive because of their compactness, light weight, and large surface-to-volume ratio. Higher surface-to-volume ratio results in enhanced cooling performance. In this paper, a systematic robust analytical method is presented for design and optimization of single-phase liquid cooled microchannel heat sink. Effects of various design parameters such as eccentricity and footprint of heat source or device, thickness of the heat sink base, channel aspect ratio, number of microchannels or fins, coolant flow rate, and thermal conductivity of heat sink material on heat sink thermal resistances and pressure drop are delineated. Finally, analytical results are compared with experimental data and good agreement is obtained. The analytical method helps to reduce the design cycle time and time-to-market significantly.      

Microchannel heat sinks for two-dimensional high-power-densitydiode laser arrays

The operation of a two-dimensional GaInAsP/InP diode laser array with CW power dissipation up to 500 W/cm² into a Si microchannel heat sink is discussed. The approximately 1×4-mm² laser array was used to characterize the heat sink, and the value of 0.040°C cm²/W was obtained for the thermal resistance per unit area. The extrapolated value for a 1-cm² heated area is 0.070°C cm²/W     

Immersion-cooled heat sinks for electronics: insight fromhigh-speed photography

The development of effective heat sinks for the primary heat-dissipating component of a typical portable electronics device is an ongoing challenge. Thermal management using air-cooling is limited by the inherently limited thermal properties of the coolant. Other alternatives, including liquid immersion cooling, phase-change materials, and heat pipes, may merit consideration if the basic mechanisms can be reliably predicted. This study sheds light on the nucleation characteristics of an etched cavity-enhanced surface for use in an immersion-cooled heat sink. The target application is a high-density multichip module with several heat dissipating sources. High-speed photography was used to record parameters such as bubble interactions, bubble size, departure frequency and active site density while varying the cavity spacing and heat flux. The cavities, which have a characteristic dimension of approximately 40 μm, are arranged in a square cluster 12.7 mm on each side. It was determined that the contribution of latent heat as a heat dissipation mechanism is only minor (less than 16%). In addition, it is proposed that the latent heat dissipation percentage may be used as a thermal performance indicator. Interactions between neighboring heat sources were also studied. These interactions decreased the bubble departure frequency and thereby affected the latent heat contribution     

Heat transfer and residual stress modeling of a diamond film heat sink for high power laser diodes

A three-dimensional finite element model of heat transfer and residual stress within high power laser diodes and their heat sinks is developed. These components are typically used in telecommunication applications. The model addresses both p-side down and p-side up laser diodes mounted on a variety of commercially available gold plated diamond heat sinks. In addition, the model is optimized with respect to the dimensions of the diamond film, and the laser diode cavity lengths. Finally, the design and performance of diamond film heat sinks for high performance GaAs and InP laser diodes are discussed. The results demonstrate the superior performance achieved through thermal engineering of the dominant thermal transport path from the laser diode heat source through diamond films to the heat sink.     

Thermal design and optimization of natural convection polymer pin fin heat sinks

The design and optimization methodology of a thermally conductive polyphenylene sulphide (PPS) polymer staggered pin fin heat sink, for an advanced natural convection cooled microprocessor application, are described using existing analytical equations. The geometric dependence of heat dissipation and the relationships between the pin fin height, pin diameter, horizontal spacing, and pin fin density for a fixed base area and excess temperature are discussed. Experimental results of a pin finned thermally conductive PPS heat sink in natural convection indicate substantially high thermal performance. Numerical results substantiate analytical modeling results for heat sinks within the Aihara et al. fin density range. The cooling rates and coefficient of thermal performance, COP/sub T/, that relates cooling capability to the energy invested in the formation of the heat sink, has been determined for such heat sinks and compared with conventional aluminum heat sinks.     

射流微通道耦合高效散热器传热实验研究

针对光导开关高重复频率运行时产生丝电流加热,使光导开关温度迅速超过材料最高允许使用温度,造成开关失效或损伤的难题,本文结合微通道散热技术和射流冷却技术的优点,设计了射流微通道耦合高效散热器。通过实验测试,对不同运行工况下射流微通道耦合高效散热器的传热特性进行了研究,并与美国进口的蜂窝型微通道散热器进行散热性能对比。实验结果表明：体积流量为3 L/min的情况下,射流微通道耦合高效散热器的换热系数超过35 000 W/(K·m²),散热量高达1 000 W,相比蜂窝型微通道散热器散热量提升了45%。在测试流量下,随着体积流量的增加,射流微通道耦合高效散热器的平均换热系数接近线性增加,而蜂窝型微通道散热器的平均换热系数在大流量下却增加缓慢。此外,采用射流微通道耦合高效散热器冷却的热源面温度均匀性明显优于采用蜂窝型微通道散热器冷却的热源面温度均匀性,采用射流微通道耦合高效散热器的热源面温度波动能降低58%,更有利于降低光导开关热应力。     

Problems of realizing a long pulse length, high duty cycle p-Ge landau level fir laser

The hot-hole p-Ge laser, which requires a large power density ( $\overline J \bullet \overline E $ ? 10⁵ watts/cm³) for excitation, has fundamental heat dissipation and lattice temperature constraints that limit the laser pulse length and duty cycle that can be achieved. This paper presents a two-dimensional heat equation analysis of the p-Ge laser bar configuration along with consideration of constraints of resonator size, heat sink dissipation limits, and temperature cut-off limits (～20°K). In order to realize a CW p-Ge laser, the present bar sizes (typically 3×4×50 mm), would need to be decreased by over an order of magnitude and the heat sink dissipation capability appreciably increased. The detailed graphs and equations presented provide design data for future p-Ge lasers and optimization data with respect to laser pulse length and duty cycle for existing lasers.