Finite element analysis of interface delamination and buckling in thin film systems by wedge indentation

A finite element method is used to study the interface delamination and buckling of thin film systems subject to microwedge indentation. In the formulation, the interface adjoining the thin film and substrate is assumed to be the only site where cracking may occur. Both the thin film and the substrate are taken to be ductile materials with finite deformation. A traction-separation law, with two major parameters: interface strength and interface energy, is introduced to simulate the adhesive and failure behaviors of the interface between the film and the substrate. The effects of the interface adhesive properties and the thickness of the thin film on the onset and growth of interface delamination and the film buckling are investigated.     

The surface effect on the strain energy release rate of buckling delamination in thin film-substrate systems

Gurtin-Murdoch continuum surface elasticity model is employed to study the buckling delamination of ultra thin film-substrate system. The effects of surface deformation and residual stress on the large deflection of ultra thin film are considered in analysis. A concept of effective bending rigidity (EBR) for ultra thin plate is proposed on the basis of Gurtin-Murdoch continuum theory and the principle of minimum potential energy. The governing equations with EBR are formally consistent with the classical plate theory, including both small deflection and large deflection. A surface effect factor is introduced to decide whether there is need to consider the surface effect or not. Combining the buckling theory and interface fracture mechanics, we obtain analytical solutions of the critical buckling load and the energy release rate of the interface crack in the film-substrate system. It is seen that the surface deformation and residual stress have significant effects on the buckling delamination of ultra thin film-substrate system.     

The kinking behaviour of a bimaterial interface crack under indentation loading

The aims of this paper are twofold. The first is to evaluate the applicability of the formula for the crack kink angle—based on the maximum principle stress criterion—for predicting the interface kink angle in a bimaterial sample undergoing indentation loading. This formula was developed for cracks in homogenous materials but in this paper, it is used to predict the kink angle using the mode mixity at the tip of a crack lying on a bimaterial interface. The second aim is to examine the behaviour of the system, in terms of the crack kink angle and contact radius, for various coating thickness', crack lengths and combinations of properties of the coating and substrate. The system that is analysed consists of a planar bimaterial sample undergoing indentation with a tungsten-carbide spherical indenter. Two-dimensional, axisymmetric models are created to represent the system, with subdomains used for modelling the cracks. In order to determine the applicability of the kink angle formula, the angle predicted is compared to the angle that is directly calculated using boundary element method models that establish the angle of the kink which yields the maximum mechanical energy release rate. The second aim of the paper is achieved by varying the material property combinations and coating thickness of the bimaterial sample and observing the effect on the kink angle of the interface crack and the contact radius. The methodologies employed are initially verified on homogenous samples with known solutions.     

The effect of facesheet/core delamination in sandwich structures under transverse loading

The present work is concerned with the problem of a delamination crack along the facesheet/core interface of a sandwich structure which is submitted to transverse loading. In contrast to a loading by compressive inplane forces or a bending loading the presumed transverse loading does not lead to buckling of the delaminated facesheet but it may provoke further delamination crack growth. As a kind of crack driving force the energy release rate is studied for a virtual crack growth by means of Irwin's crack closure integral within a finite element modelling. The resultant energy release rate is dependent on various geometrical and material parameters which is investigated in some detail.     

The energy release rate of mode II fractures in layered snow samples

Before a dry snow slab avalanche is released, a shear failure along a weak layer or an interface has to take place. This shear failure disconnects the overlaying slab from the weak layer. A better understanding of this fracture mechanical process, which is a key process in slab avalanche release, is essential for more accurate snow slope stability models. The purpose of this work was to design and to test an experimental set-up for a mode II fracture test with layered snow samples and to find a method to evaluate the interfacial fracture toughness or alternatively the energy release rate in mode II. Beam-shaped specimens were cut out of the layered snow cover, so that they consisted of two homogeneous snow layers separated by a well defined interface. In the cold laboratory 27 specimens were tested using a simple cantilever beam test. The test method proved to be applicable in the laboratory, although the handling of layered samples was delicate. An energy release rate for snow in mode II was calculated numerically with a finite element (FE) model and analytically using an approach for a deeply cracked cantilever beam. An analytical bilayer approach was not suitable. The critical energy release rate G _c was found to be 0.04 ± 0.02 J m⁻². It was primarily a material property of the weak layer and did not depend on the elastic properties of the two adjacent snow layers. The mixed mode interfacial fracture toughness for a shear fracture along a weak layer estimated from the critical energy release rate was substantially lower than the mode I fracture toughness found for snow of similar density.     

Electroelastic analysis of an interface anti-plane shear crack in a layered piezoelectric plate

The problem of an anti-plane interface crack in a layered piezoelectric plate composed of two bonded dissimilar piezoelectric ceramic layers subjected to applied voltage is considered. It is assumed that the crack is either impermeable or permeable. An integral transform technique is employed to reduce the problem considered to dual integral equations, then to a Fredholm integral equation by introducing an auxiliary function. Field intensity factors and energy release rate are obtained in explicit form in terms of the auxiliary function. In particular, by solving analytically a resulting singular integral equation, they are determined explicitly in terms of given electromechanical loadings for the case of two bonded layers of equal thickness. Some numerical results are presented graphically to show the influence of the geometric parameters on the field intensity factors and the energy release rate.     

Influence of bimaterial interface on kinking behaviour of a crack growth emanating from notch

The mechanism of crack deviation by an interface modifies considerably the behaviour of bimaterials fracture. Their fracture resistance is highly affected by the difference of the elastic properties of the bonded materials. In this work, the finite element method is applied to analyze the behaviour of a crack emanating from semicircular notch root growing in interface ceramic/metal composites and perpendicularly to this interface. The obtained results showed that the crack grew to interface from harder material, its energy decreased at the approach of the interface, in this case was retarded; an inverse phenomenon occurs if the crack is propagated towards a lower strength material and its energy increases, it has tendency to accelerate. The effects of geometry on the crack deflection near the interface are also discussed.     

Fracture analysis of a surface through-thickness crack in PZT thin film under a continuous laser irradiation

In this paper, the surface crack problem in PZT thin films under a continuous laser irradiation has been investigated by the superposition principle. Using commercial (FEM) software ANSYS 9.0, the piezoelectric fields near the crack tip were solved for surface crack in the finite PZT thin film. The SIFs for crack-tip fields were obtained by using the limited stress extrapolation technique (LSET) and then the energy release rates were calculated by the relation to the intensity factors. When the irradiation time and crack location were changed, the energy release rates G, G_I, and G_e for total, mechanical terms (mode I) and electric contribution were investigated. The results show that the mechanical opening mode I is the main mode for the surface crack under a continuous laser irradiation. However, electric mode IV has inhibiting effect on crack growth. At the beginning of laser irradiation, the surface tiny crack which is close to the centre of film will propagate more easily. During the laser irradiation, the crack which is far from the centre of film will propagate more easily.     

Prediction of initiation and growth of single level delaminations in a transversely loaded composite specimen using fracture mechanics

The behaviour of a composite test specimen with an embedded delamination subjected to transverse tension has been investigated through experimental testing and finite element (FE) analyses. The testing program consisted of specimens in two geometrical configurations; square and rectangular delamination. The initiation and growth of the delamination was numerically predicted by fracture mechanics. FE models were analysed with both MSC.Nastran and Abaqus FE codes. The MSC.Nastran model was used to calculate strain energy release rates employing a crack tip element methodology. The Abaqus model was evaluated using the virtual crack closure technique. Both approaches accurately predicted failure initiation locations as observed in the test specimens. Failure loads were also well predicted. The mode mix at the crack tip in the proposed specimen was found to be similar to the mode mix expected in a conventional in-plane compression specimen.     

Application of virtual crack closure integral method for interface cracks in low-k integrated circuit devices under thermal load

The virtual crack closure integral (VCCI) method is used to evaluate the stress intensity factor (SIF) and energy release rate (ERR) of an interface crack under thermal load. The VCCIs used in this work include the traditionally known “Mode I” and “Mode II” VCCIs and an additional coupling VCCI. The singularity element is used in the finite element method (FEM) implementation. The SIF and ERR calculated by the FEM are compared to the exact solution in the case of a joint dissimilar semi-infinite plates with double edge crack under thermal loading. The FEM result agrees well with the exact solution for relatively coarse meshes. The contribution of the mesh density and material mismatch to the FEM error is also explored. The VCCI method is used with the multi-scale FEM in a delamination risk assessment of a low-k integrated circuits device in flip-chip plastic ball grid array packages. The ERR is calculated for different package configurations and the prediction of the delamination risk is confirmed by reliability tests.