Mechanical Properties of QFP Joints Soldered with SnAgCu and SnPb Solders

With the development of lead-free solder alloys, the investiagtion focusing on the relibility of lead-free solders are essential. Since the reliability database of lead-free solder joints needs to be further supplied, the creep behavior of SnAgCu soldered joints on Quad Flat Package (QFP) devices under thermo cycling load are studied in this paper, compared to conventional SnPb solder, by finite element simulation based on Garofalo-Arrhenius creep model. Meanwhile, the mechanical properties of SnAgCu and SnPb soldered joints in the pitches of QFP devices are also carried out by means of tensile test. The results indicate that the values of strain and stress of SnAgCu soldered joints were all smaller than those of SnPb under thermal cycling, and the tensile strength of the joints soldered with SnAgCu solder was higher than that of SnPb, which means the reliability of the joints soldered with SnAgCu solder is better than SnPb soldered joints. As the fracture surface morphology of the soldered joints compared, SnAgCu soldered joint presented ductile fracture, while the fracture mechanism of SnPb solder joints displayed both brittle and ductile fracture. Above all, the experimental results is in accord with that of simulation, which will provide guidance for reliability study and application of lead-free solders.     

MECHANICAL PROPERTIES OF FINE PITCH DEVICES SOLDERED JOINTS BASED ON CREEP MODEL

Nonlinear analyses of quad flat package （QFP） on printed circuit board （PCB） assemblies subjected to thermal cycling conditions are presented. Two different solders are considered, namely, Sn37Pb and Sn3.5Ag. The stress and strain response of fine pitch devices soldered joints was investigated by using finite element method based on Garofalo-Arrheninus model. The simulated results indicate creep distribution of soldered joints is not uniform, the heel and toe of soldered joints, the area between soldered joints and leads are the creep concentrated sites. The similar phenomena of stress curves simulated based on Garofalo-Arrheninus model and Anand equations is confirmed, and the creep strain value of Sn3.5Ag soldered joints is lower than that of Sn37Pb soldered joints. Thermal cycling results show that Sn3.5Ag strongly outperforms Sn37Pb for QFP devices under the studied test condition. This is well matched with the experimental outcome analyzed. In addition, the soldered devices were tested by micro-joints tester, the tensile strength of Sn3.5Ag soldered joints is found to be higher than that of Sn37Pb soldered joints. By analyzing the fracture microstructure of soldered joints, it is found that fracture mechanism of Sn3.5Ag soldered joints is toughness fracture, while fracture mechanism of Sn37Pb soldered joints includes brittle fracture and toughness fracture. The results of this study provide an important basis of understanding the mechanical properties of fine pitch devices with traditional Sn37Pb and Sn3.5Ag lead-free soldered joints.     

Reliability Evaluation of QFN Devices Soldered Joints with Creep Model

The solder joint reliability of quad flat non-lead (QFN) package,which has become very popular over the past few years,has received intense interest.The finite element method (FEM) is essential to evaluate the reliability of QFN device.In this paper,Garofalo-Arrheninus model was implemented to simulate the deformation of QFN soldered joints.Equivalent creep strain of the soldered joints was calculated by means of finite element analyses,and was used to evaluate the reliability of QFN packages.It is found that the critical soldered joint of QFN is located the package corner while the maximum creep strain is obtained at the top interface of peripheral soldered joint.The creep strain is provided with periodicity and additivity as the thermal cycling.Nonlinear analysis of QFN package with different lead counts was presented as well,in which the phenomenon that the value of induced creep strain arise as the package size decreasing is noted.Moreover,SnPb and two lead-free solders,namely,Sn3.5Ag/Sn3.8Ag0.7Cu,were both taken into consideration.Simulated results indicate that the creep strain value of lead-free soldered joints is lower than that of SnPb soldered joints,which can be attributed to the difference of stiffness and coefficient of thermal expansion among three solders.Garofalo-Arrheninus model is used to calculate the creep strain of the QFN device for the first time in this study.The results provide an important basis for evaluating the reliability of QFN package.     

Three-dimensional finite element analysis of the mechanical properties of helical thread connection

Conventional analytical and numerical methods for the mechanical properties of helical threads are relied on many assumptions and approximations and thus hardly yield satisfied results. A parameterized 3D finite element model of bolted joints with real helical thread geometry is established and meshed with refined hexahedral elements. The Von Mises plasticity criterion, kinematic hardening rule of materials and interfacial contacts are employed to make it possible for the suggested model be able to approach real assembly conditions. Then, the mechanical properties of bolted joints with different thread pitches, thread numbers and modular ratios are investigated, including the contact pressure distribution at joint interfaces, the axial load distribution and stress concentration in screw threads during the loading and unloading process. Simulation results indicate that the load distribution in screw threads produced by the suggested model agrees well the results from CHEN’s photoelastic tests. In addition, an interesting phenomenon is found that tightening the bolt with a large preload first and then adjusting the clamping force by unloading can make the load distribution more uniform and reduce the maximum residual equivalent stress in thread roots by up to 40%. This research provides a simple and practical approach to constructing the 3D finite element model and predicting the mechanical properties of helical thread connection.     

Distributed collaborative response surface method for mechanical dynamic assembly reliability design

Because of the randomness of many impact factors influencing the dynamic assembly relationship of complex machinery, the reliability analysis of dynamic assembly relationship needs to be accomplished considering the randomness from a probabilistic perspective. To improve the accuracy and efficiency of dynamic assembly relationship reliability analysis, the mechanical dynamic assembly reliability（MDAR） theory and a distributed collaborative response surface method（DCRSM） are proposed. The mathematic model of DCRSM is established based on the quadratic response surface function, and verified by the assembly relationship reliability analysis of aeroengine high pressure turbine（HPT） blade-tip radial running clearance（BTRRC）. Through the comparison of the DCRSM, traditional response surface method（RSM） and Monte Carlo Method（MCM）, the results show that the DCRSM is not able to accomplish the computational task which is impossible for the other methods when the number of simulation is more than 100 000 times, but also the computational precision for the DCRSM is basically consistent with the MCM and improved by 0.40-4.63% to the RSM, furthermore, the computational efficiency of DCRSM is up to about 188 times of the MCM and 55 times of the RSM under 10000 times simulations. The DCRSM is demonstrated to be a feasible and effective approach for markedly improving the computational efficiency and accuracy of MDAR analysis. Thus, the proposed research provides the promising theory and method for the MDAR design and optimization, and opens a novel research direction of probabilistic analysis for developing the high-performance and high-reliability of aeroengine.     

Quantitative metal magnetic memory reliability modeling for welded joints

Metal magnetic memory(MMM) testing has been widely used to detect welded joints. However, load levels, environmental magnetic field, and measurement noises make the MMM data dispersive and bring difficulty to quantitative evaluation. In order to promote the development of quantitative MMM reliability assessment, a new MMM model is presented for welded joints. Steel Q235 welded specimens are tested along the longitudinal and horizontal lines by TSC-2M-8 instrument in the tensile fatigue experiments. The X-ray testing is carried out synchronously to verify the MMM results. It is found that MMM testing can detect the hidden crack earlier than X-ray testing. Moreover, the MMM gradient vector sumKvs is sensitive to the damage degree, especially at early and hidden damage stages. Considering the dispersion of MMM data, theKvs statistical law is investigated, which shows thatKvs obeys Gaussian distribution. SoKvs is the suitable MMM parameter to establish reliability model of welded joints. At last, the original quantitative MMM reliability model is first presented based on the improved stress strength interference theory. It is shown that the reliability degree R gradually decreases with the decreasing of the residual life ratioT, and the maximal error betweenprediction reliability degreeR1and verification reliability degreeR2 is 9.15%. This presented method provides a novel tool of reliability testing and evaluating in practical engineering for welded joints.     

An Error Equivalent Model of Revolute Joints with Clearances for Antenna Pointing Mechanisms

Joint clearances in antenna pointing mechanisms lead to uncertainty in function deviation. Current studies mainly focus on radial clearance of revolute joints, while axial clearance has rarely been taken into consideration. In fact, own?ing to errors from machining and assembly, thermal deformation and so forth, practically, axial clearance is inevitable in the joint. In this study, an error equivalent model(EEM) of revolute joints is proposed with considering both radial and axial clearances. Compared to the planar model of revolute joints only considering radial clearance, the journal motion inside the bearing is more abundant and matches the reality better in the EEM. The model is also extended for analyzing the error distribution of a spatial dual?axis("X–Y" type) antenna pointing mechanism of Spot?beam antennas which especially demand a high pointing accuracy. Three case studies are performed which illustrates the internal relation between radial clearance and axial clearance. It is found that when the axial clearance is big enough, the physical journal can freely realize both translational motion and rotational motion. While if the axial clearance is limited, the motion of the physical journal will be restricted. Analysis results indicate that the consideration of both radial and axial clearances in the revolute joint describes the journal motion inside the bearing more precise. To further validate the proposed model, a model of the EEM is designed and fabricated. Some suggestions on the design of revolute joints are also provided.     

Effect of optimum plastic depth on stresses and load-bearing capacity of autofrettaged cylinder

Autofrettage is an effective measure to even distribution of stresses and raise load-bearing capacity for (ultra-)high pressure apparatus. Currently, the research on autofrettage has focused mostly on specific engineering problems, while general theoretical study is rarely done. To discover the general law contained in autofrettage theory, by the aid of the authors’ previous work and according to the third strength theory, theoretical problems about autofrettage are studied including residual stresses and their equivalent stress, total stresses and their equivalent stress, etc. Because of the equation of optimum depth of plastic zone which is presented in the authors’ previous work, the equations for the residual stresses and their equivalent stress as well as the total stress and their equivalent stress are simplified greatly. Thus the law of distribution of the residual stresses and their equivalent stress as well as the total stress and their equivalent stress and the varying tendency of these stresses are discovered. The relation among various parameters are revealed. The safe and optimum load-bearing conditions for cylinders are obtained. According to the results obtained by theoretical analysis, it is shown that if the two parameters, namely ratio of outside to inside radius, k, and depth of plastic zone, kj, meet the equation of optimum depth of plastic zone, when the pressure contained in an autofrettaged cylinder is lower than two times the initial yield pressure of the unautofrettaged cylinder, the equivalent residual stress and the equivalent total stress at the inside surface as well as the elastic-plastic juncture of a cylinder are lower than yield strength. When an autofrettaged cylinder is subjected to just two times the initial yield pressure of the unautofrettaged cylinder, the equivalent total stress within the whole plastic zone is just identically equal to the yield strength, or it is a constant. The proposed research theoretically depicts the stress state of ultra-)high pressure autofrettaged cylinder more accurately and more reasonably and provides the reference for design of (ultra-)high pressure apparatus.     

Non-linear torsional vibration characteristics of an internal combustion engine crankshaft assembly

Crankshaft assembly failure is one of the main factors that affects the reliability and service life of engines.The linear lumped mass method,which has been universally applied to the dynamic modeling of engine crankshaft assembly,reveals obvious simulation errors.The nonlinear dynamic characteristics of a crankshaft assembly are instructionally significant to the improvement of modeling correctness.In this paper,a general expression for the non-constant inertia of a crankshaft assembly is derived based on the instantaneous kinetic energy equivalence method.The nonlinear dynamic equations of a multi-cylinder crankshaft assembly are established using the Lagrange rule considering nonlinear factors such as the non-constant inertia of reciprocating components and the structural damping of shaft segments.The natural frequency and mode shapes of a crankshaft assembly are investigated employing the eigenvector method.The forced vibration response of a diesel engine crankshaft assembly taking into account the non-constant inertia is studied using the numerical integral method.The simulation results are compared with a lumped mass model and a detailed model using the system matrix method.Results of non-linear torsional vibration analysis indicate that the additional excitation torque created by non-constant inertia activates the 2nd order rolling vibration,and the additional damping torque resulting from the non-constant inertia is the main nonlinear factor.The increased torsional angular displacement evoked by the high order excitation torque relates to the non-constant inertia.This research project is aimed at improving nonlinear dynamics theory,and the confirmed nonlinear parameters can be used for the structure design of a crankshaft assembly.     

FINITE ELEMENT ANALYSIS ABOUT STRESS AND STRAIN OF SURFACE PEELING IN Cu-Fe-P SHEET

The microstructure of surface peeling in finish rolled Cu-0.1Fe-0.03P sheet is analyzed by scanning electron microscope and energy dispersive spectroscope. Fe-rich areas of different contents are observed in the matrix. The stress distributions and strain characteristics at the interface between Cu matrix and Fe particle are studied by elastic-plastic finite element plane strain model. Larger Fe particles and higher deforming extent of finish rolling are attributed to the intense stress gradient and significant non-homogeneity equivalent strain at the interface and accelerate surface peeling of Cu-0.1Fe-0.03P lead frame sheet.     

激光加热控制微细焊点钎料熔融方法研究

为了研究高密度电子封装器件无钎料桥连的互连新工艺,采用数值模拟的方法讨论了激光单点式以及扫描式加热下细间距QFP(Quad flat package)器件焊点的温度场分布规律,然后在红外炉和激光扫描式加热下进行了QFP256器件的组装工艺试验。理论分析结果表明,由于激光的局部集中加热特性,能够有效地控制焊点温度场分布,从而可以有效地控制焊点钎料的熔融范围,解决细间距引线焊点钎料桥连的问题。试验结果证明了激光单点式和扫描式加热实现细间距引线器件无钎料桥连互连工艺的可行性。     

Diode Laser Soldering Technology of Fine Pitch QFP Devices

The laser provides a controllable means of supplying localized energy for solder joint formation and is a valuable tool in electronics manufacture.Diode laser soldering for fine pitch QFP devices were carried out with Sn-Ag-Cu lead-free solder and Sn-Pb solder respectively,and the mechanical properties of micro-joints of the QFP devices were tested and studied by STR-1000 micro-joints tester.The results indicate that sound QFP micro-joints without bridging or solder ball are gained by means of diode laser s...     

Stress analysis of lead-free solders with under bump metallurgy in a wafer level chip scale package

The wafer level chip scale assembly (WLCSP) has increasingly become popular due to its compact, wafer scale assembly. In a WLCSP assembly, the under bump metallurgy (UBM) connecting the solder joints and the chip is crucial for the assembly reliability. This study focuses on a WLCSP with 96.5Sn3.5Ag/95.5Sn3.8Ag0.7Cu solder joints and Ti/Cu/Ni UBM on a 2–layer microvia build-up electric board. Furthermore, the Garofalo-Arrhenius creep model in finite element analysis ANSYS 6.0 is used for simulations on the WLCSP assembly under thermal cycling to investigate the deformations of the assembly with different thickness of nickel layer, the maximum equivalent strain and maximum equivalent stress of microvias/joints. Finally, the Coffin-Manson equation is applied to predict the fatigue lives of four combinations of solder joints with different eutectic alloy and thickness of nickel layer.     

电子封装焊点可靠性及寿命预测方法

高功率、高密度、小型化是现代电子封装结构的基本特征，软焊料是电子封装中应用最广的连接材料，一个焊点的破坏往往导致整个封装结构的失效。软钎料的无铅化是目前发展的重要趋势。针对目前所开发的无铅焊料，文中介绍电子封装结构中焊点的破坏行为和焊点寿命预测的基本方法。     

Anand Parameters Determination for SnAgCu Solder Bearing Micro-amounts Rare Earth Ce

SnAgCu solder system with the addition of rare earth Ce,which has better thermo-mechanical properties compared to those of SnPb solder,is regarded as one of the promising candidates for electronic assembly.Moreover,the SnAgCuCe solder alloys can provide good quality joints with Cu substrates.However,there is few report of the constitutive model for SnAgCu solder beating micro-amounts rare earth Ce.In this paper,the unified viscoplastic constitutive model,Anand equations,is used to represent the inelastic deformation behavior for SnAgCu and SnAgCuCe solders.In order to obtain the acquired data for the fitting of the material parameters of this unified model,a series of experiments of constant strain rate test were conducted under isothermal conditions at different temperatures.The Anand parameters of the constitutive equations for SnAgCu and SnAgCuCe solder were determined from separated constitutive relations and experimental results.Nonlinear least-square fitting was selected to determine the model constants.And the simulated results were then compared with experimental measurements of the stress-inelastic strain curves:excellent agreement was found.The model accurately predicted the overall trend of steady-state stress-strain behavior of SnAgCu and SnAgCuCe solders for the temperature ranges from 25℃ to 150℃,and the strain rate ranges from 0.01 s-1 to 0.001 s-1.It is concluded that the Anand model can be applied for representing the inelastic deformation behavior of solders at high homologous temperature and can be recommended for finite element simulation of the stress-strain response of lead free soldered joints.Based on the Anand model,the investigations of thermo-mechanical of SnAgCu and SnAgCuCe soldered joints in fine pitch quad flat package by finite element code were done under thermal cyclic loading,it is found that the reliability of SnAgCu soldered joints can be improved remarkably with addition of rare earth Ce.The results may provide a theory guide for developing constitutive model for lead-free solders.     

The reliability of soldered joints produced at a low temperature

Under severe service conditions of electronic instruments (at elevated temperatures and vibrations in electronic systems), failures in their operation frequently occur. Severe intrinsic thermal conditions of operating instruments may cause such failures. However, malfunctions in electronic devices may often be due to defects in soldered joints that were made at lowered temperatures. An approach is proposed that makes it possible to considerably improve the reliability of soldered joints.     

The development of the physical fundamentals of contact soldering as a factor for reducing the number of defects in electronic devices

Automated control systems employ electronic components that are connected with a printed circuit board (PCB) by soldered joints. At elevated temperatures and with high vibration levels, soldering defects may occur that are characterized by the deterioration or complete loss of contact with the PCB, which can lead to the failure of the system. In this work, an approach is proposed to considerably improve the reliability of soldered joints.