Completely flat erosion magnetron sputtering using a rotating asymmetrical yoke magnet

A completely flat erosion magnetron 5-inch cathode has been developed for planer magnetron sputtering using a rotating asymmetrical yoke magnet. The yoke magnet was composed of an iron yoke base with a 70 mm diameter, an annular outer yoke, a center Fe-Nd-B magnet which was shifted from the yoke base center, and an assisted Fe-Nd-B magnet which was attached to a part of the outer yoke. In order to optimize the magnetic flux density for uniform target erosion from center to outer area, several diameters of the center Fe-Nd-B magnet, from 25 to 36 mm, were tested by the first experiment, and secondly the outer yoke structure was optimized using the first experimental results. The obtained final target utilization was 77% and erosion depth uniformity for the 4-inch diameter was ±6%.     

Completely flat erosion magnetron sputtering using a rotating asymmetrical yoke magnet

A completely flat erosion magnetron 5-inch cathode has been developed for planer magnetron sputtering using a rotating asymmetrical yoke magnet. The yoke magnet was composed of an iron yoke base with a 70 mm diameter, an annular outer yoke, a center Fe-Nd-B magnet which was shifted from the yoke base center, and an assisted Fe-Nd-B magnet which was attached to a part of the outer yoke. In order to optimize the magnetic flux density for uniform target erosion from center to outer area, several diameters of the center Fe-Nd-B magnet, from 25 to 36 mm, were tested by the first experiment, and secondly the outer yoke structure was optimized using the first experimental results. The obtained final target utilization was 77% and erosion depth uniformity for the 4-inch diameter was ±6%.     

Target utilization of planar magnetron sputtering using a rotating tilted unbalanced yoke magnet

The dependence of the magnetic flux density, erosion uniformity, and target utilization on the yoke magnet tilt angle was investigated in a planar magnetron sputtering system, using a rotating, tilted, unbalanced, asymmetrical magnet. In these experiments, circular and elliptical outer yokes were used as the rotating yoke magnet. The magnetic flux density distributions were measured two-dimensionally on the target surface and compared with the erosion uniformity. As the yoke magnet tilt angle increased, the magnetic flux density distribution expanded and became more uniform, and the eroded areas expanded toward the outside of the target surface. With a circular outer yoke, as the yoke magnet tilt angle increased from 0° to 8°, utilization of a 5-inch target linearly increased from 60 to 80%. On the other hand, with an elliptical outer yoke, the utilization of the target was approximately 70%, regardless of the yoke magnet tilt angle. This is because, as the tilt angle is increased, the inner area of the target eroded more deeply, while the outer area eroded less deeply. The deposition rate when using the elliptical outer yoke was 1.2 times faster than that of when using the circular outer yoke at the same magnet tilt angle. By decreasing the magnetic flux density on the inner area of the target with an elliptical outer yoke magnet, a higher deposition rate may be obtained than is observed with a circular magnet, and target utilization of over 70% can be achieved.     

Improved wide erosion nickel magnetron sputtering using an eccentrically rotating tilted center magnet

A wider eroded and higher target utilized magnetron sputtering system for ferromagnetic nickel (Ni) target was developed using a large, tall and eccentrically rotating tilted center magnet. In this system, a tilted center magnet optimized the magnetic field strength between the inner and outer erosion areas by adjusting the tilt angle, and target utilization is found to be higher up to 49% for 5-inch and 4-mm thick Ni target, which is 8% better than when a non-tilted center magnet was used. Moreover, the center non-eroded area was decreased.Furthermore, the rotating mechanism of a yoke magnet could be separated from the cooling water and the target could be cooled more effectively because the water cooling unit was attached not only to the outer area of target, but also to the tilted space of the center magnet.     

Wide erosion nickel magnetron sputtering using an eccentrically rotating center magnet

A wide erosion magnetron sputtering system for nickel targets has been developed using a large, tall and eccentrically rotating center magnet. In this system, a water cooling unit was attached behind the target except the moving center magnet area. Therefore, the rotating mechanism of yoke magnet could be separated from the cooling water without decreasing the magnetic flux on the target surface and ensure a high reliability of long life use.Utilization on the 5-inches Ni target was 40%, as compared with 12% utilization of the conventional system. The sputtering rate and erosion depth linearly changed while the target was in use, because the increase of magnetic flux was lower than that of a conventional system. Hence, the target life will be precisely managed by the total sputtering time.     

旋转圆柱靶磁控溅射阴极的磁场模拟及结构设计

基于旋转圆柱靶磁控溅射阴极的工作原理,建立其结构模型,并应用ANSYS有限元方法对旋转靶阴极磁场进行了模拟计算,得到了磁场分量Bx在靶材表面上的二维磁场分布规律。通过调节磁铁的宽和高、磁铁间夹角以及设置可移动磁性挡板等方法优化磁场并设计了一种新型磁场结构旋转靶。本研究为旋转靶磁控溅射阴极的磁场结构设计提供了理论依据。     

无马达驱动的旋转圆柱形磁控溅射器

在大型薄膜连续生产线中,磁控溅射器的溅射速率、使用周期是影响生产效率与成本的重要因素.本文提出一种新型的无马达驱动的具有高溅射速率、高靶材利用率、长的靶使用周期、安装与使用简单的磁控溅射器.可广泛应用于各类大、中型连续生产设备中.     

圆平面磁控溅射靶磁场的ANSYS模拟分析

磁控溅射靶面磁感应强度的水平分布直接关系到靶材的利用率和刻蚀的均匀性.为了寻求更好的磁控靶结构参数,从而实现靶而水平磁感应强度的均匀分布,作者应用ANSYS软件对SD500型磁控溅射镀膜机的圆平面靶表面磁感应强度进行模拟,应用SHT-V型特斯拉计通过同心十字线法对实物靶表面磁感应强度进行测试,将模拟结果与测量结果进行比较,证明其模拟的准确性.进而对圆平面磁控靶的结构参数进行优化设计,得出靶与磁钢间距为3 mm、磁钢高度为15 mm、内磁柱半径为4 mm、内磁柱高度为14 mm时靶面水平磁感应强度最强、分布最均匀.在工程应用中,设计人员可以预先对靶的参数进行优化设计,使设计的磁控溅射靶更好的满足生产和科学研究的需要.     

高靶材利用率的新型磁控溅射器

在现代大型薄膜连续生产线中 ,其生产效率主要受以下两因数的影响 :溅射器的沉积速率和靶材的使用周期。本实验研制了一种圆筒形靶材绕溅射器中心轴线匀速旋转 ,并且与溅射器之间用螺丝固定连接的新型磁控溅射器。论述了新型溅射器的结构与组成 ,并给出实验结果与结论。其具有靶材利用率高、使用周期长、换靶时间短等优点。同时在反应溅射时避免在靶面上的形成介质层 ,提高了溅射过程的稳定性。     

柱弧离子镀和非平衡磁控溅射镀制备Ti-N-C黑色硬质膜

采用柱弧离子镀和中频孪生靶非平衡磁控溅射镀膜技术制备了Ti-N-C多层复合黑色硬质膜.采用轮廊仪扫描电子显微镜(SEM)、分光光度计、显微硬度计等手段研究了所得膜层的各项性能.结果表明,两种工艺都可以获得颜色较深的黑色硬质膜,柱弧离子镀制备黑色硬质膜的效率高、力学性能更好;中频孪生靶非平衡磁控溅射制备的黑色硬质膜表面光滑、颜色更深.     

The preparation of permalloy 80/20 thin films using a pulsed DC discharge in a hollow cathode

Permalloy thin films have many applications as sensors and actuators but the preparation of magnetic films by magnetron sputtering is problematic since the target material reduces or changes the magnetic configuration of the magnetron. Hollow cathode discharges can produce similar or greater plasma densities to that found in magnetron sputtering and can therefore be operated over a similar pressure range. Pulsed DC sputtering has been seen to have some advantages compared to DC or RF sputtering. In this paper we report the use of a combination of pulsed DC sputtering with a hollow cathode system to prepare thin films of Permalloy. The deposition rate was found to strongly depend on the gas flow used to prepare the thin films. Combinations of the experimental conditions were found to produce films with a (111) preferential crystal orientation and that the grain size of the crystals was mainly determined by the deposition rate. Furthermore, changes in the degree of ion bombardment did not appear to have any significant affect on the structure of the deposit.     

Deposition rate characteristics for steady state high power impulse magnetron sputtering (HIPIMS) discharges generated with a modulated pulsed power (MPP) generator

High power impulse magnetron sputtering (HIPIMS) pulses have been of great interest over the last decade. With such sputtering techniques a substantial amount of target material can be ionized and used for the engineering of surfaces and coatings. Depending on voltage, system configuration and target material, such discharges can be either transient or reach steady state currents during the pulse. The used HIPIMS power supply was a constant voltage supplies. Similarly, HIPIMS pulses with multiple steady state current phases can be generated using a modulated pulsed power (MPP) generator. A typical pulse consists of an ignition, low current and high current phase. The contribution of these phases to the deposition rate is presented. The ionization rate of single charge chromium ions has been found to increase linearly with increasing peak current density. An increase in deposition rate with lower magnetic field strength at the target surface can be attributed to a higher sputter yield due to a higher cathode voltage due to increasing system impedance in HIPIMS case, weaker trapping of deposition flux and to enhanced ion flux towards the substrate.     

小圆平面靶磁控溅射镀膜均匀性研究

本文从圆平面靶磁控溅射的原理出发,针对圆形平面靶面积小于基片面积的特点进行分析,建立膜厚分布的数学模型,并利用计算机进行模拟计算,目的在于探寻平面靶材面积小于基片面积时影响膜厚均匀性的因素。模拟计算的结果表明:基片偏心自转时,靶基距和偏心距对膜厚分布均有影响。偏心距一定时,随着靶基距的增大,薄膜厚度变小,膜厚均匀性有提高的趋势;靶基距一定时,随着偏心距的增大,膜厚均匀性先变好后变差。当基片自转复合公转时,随着转速比的增大,膜厚均匀性逐渐变好,转速比增大到一定程度后,它对膜厚均匀性的影响逐渐变小。圆形平面靶的刻蚀环范围的变化对薄膜的均匀性有一定的影响。这些理论为小圆平面磁控溅射系统的设计和实际应用提供了理论依据。     

Effect of oxygen concentration and system geometry on the current-voltage relations during reactive sputter deposition of titanium dioxide thin films

Current-voltage relations at different magnetron sputtering systems and gas mixtures were studied during reactive sputter deposition of titanium dioxide thin films. The main goal of this work was to investigate the influence of reactive gas mixture (Ar + O₂) and system geometry on the electrical characteristics of the discharge. The geometries utilized were the conventional magnetron sputtering, hollow cathode magnetron sputtering and triode magnetron sputtering. A change in the system geometry leads to a change in the electric field distribution, which alters the working range of the discharge voltage and magnetron efficiency. It is noticed that the discharge voltage at constant current can be reduced when the geometry is altered from conventional magnetron to hollow cathode magnetron or triode magnetron, at the same time the magnetron efficiency is increased when hollow cathode magnetron or triode magnetron are used instead of conventional magnetron sputtering.     

磁控溅射膜厚均匀性与靶-基距关系的研究

从理论上分析了平面磁控溅射靶沉积薄膜的厚度均匀性.根据磁控溅射阴极靶刻蚀的实际测量数据,建立了靶的刻蚀速率方程,以此为依据,对膜厚均匀性的有关公式进行了讨论.采用计算机计算了基片处于不同靶-基距时,膜厚均匀性的分布.研究结果表明,随着靶基距的增加,膜厚均匀性逐渐变好.在同样的靶基距下,沿靶长度方向的均匀性明显优于宽度方向.最后,通过实验证实了上述结论.     

"GT target", A new high rate sputtering target of magnetic materials

A new type of a magnetic material target for high rate sputtering, "Gap Type target (GT target)" have been developed. GT target have many narrow gaps crossing the magnetic flux produced by permanent magnets attached to the cathode. Therefore, the magnetic flux being necessary for magnetron sputtering leaks out over the target surface without magnetic saturation of target materials. By using the GT target, the high rate sputtering of magnetic materials is possible even with common permanent magnets. For example, with a Fe target of 20 mm thick, the deposition rate of 1.5 μm/min. with 15 W/cm²power density is obtained by DC magnetron sputtering at argon pressure of10^{-2} sim 1.0pa.     

Inverted Cylindrical Magnetron Sputtering

The shape of inverted cylindrical magnetrons makes them ideal for coating a variety of optical components having non‐planar geometries such as prisms, gratings and spherical lenses. In addition, combining dual cathode mid frequency unbalanced magnetron sputtering with the cylindrical geometry produces a unique source for ion enhanced deposition on planar substrates located at the ends of the cathode. Using a 330 mm diameter source, thickness uniformity on stationary substrates of ± 0.25 % over a diameter of 160 mm and ± 1.3 % over 200 mm can be achieved. SiO₂ and Ta₂O₅ deposited on Si have indices of refraction at a wavelength 632 nm of 1.47 and 2.13 respectively and dispersion similar to those reported for ion assisted processes. The off‐axis nature of this arrangement makes such sources particularly useful where the acceleration of negative ions produced at the target surface can damage sensitive materials such as OLEDs.     

Magnetron sputter deposition: Linking discharge voltage with target properties

The discharge voltage is perhaps the most accessible parameter of the magnetron sputter deposition process. As its value can be easily monitored, research reports generally contain its value. Nevertheless, the interpretation of the discharge voltage and/or its behavior, especially during reactive magnetron sputtering, is less straightforward. To understand its behavior, it is necessary to look into the details of the magnetron discharge, the processes occurring at the cathode (or target) and the influence of the important discharge parameters such as discharge current, magnet configuration, and discharge gas pressure. The influence of these parameters can be partially understood from a general formula. This formula, based on the original work of Thornton, shows that the discharge voltage behavior during reactive magnetron sputtering finds its origin in the formation of a compound layer on the target. The discharge voltage behavior depends strongly on the material properties of the compound layer which is formed.     

偏心旋转移动平面磁控溅射在ITO玻璃生产中的应用与探讨

直流平面磁控溅射法是生产ITO玻璃最常用的工艺,但是常规的固定磁控方法只有20%～25%的靶材利用率.为了尽可能提高靶材利用率,我们在原来的固定磁场基础上进行了偏心轴旋转的平面磁场改造,改造后的靶材利用率达到了60%～70%,经过两年多的运行,证明改造是相当成功的.本文阐述了偏心旋转移动平面磁控的具体方法及应该注意的几个问题.     

采用PLC级差法闭环控制中频电源反应溅射沉积Al2O3薄膜

本工作开发了一种靶电压反馈自动控制系统,称为可编程控制器(PLC)级差法反馈控制系统,用于旋转圆柱金属Al靶真空反应溅射沉积Al2O3陶瓷薄膜。根据反应溅射Al2O3工艺特性设计反馈控制的数学模型,再按照数学模型,采用梯形语言在PLC内进行程序编码实现。通过反馈控制参数的优化,实现较高功率26 kW下中频磁控反应溅射Al2O3工艺稳定。测试得到50 nm厚的Al2O3薄膜,其可见光吸收比和太阳光吸收比接近零。这种反应溅射反馈控制系统简易可行且经济实用。