用200 kV电子显微镜分辨Li1-xNbO2中的Nb和O原子

在远离Scherzer聚焦条件下,用200 kV的高分辨电子显微镜拍摄了Li1-xNbO2(x≈0.7)高分辨像,再借助像解卷处理使之恢复为直接反映晶体投影结构的解卷像.在不同晶体厚度的解卷像上均能清楚地分辨间距为0.153nm的Nb和O原子柱,看不见"原子.Nb和O原子的衬度随厚度变化的规律符合赝弱相位物体近似像衬理论.从像模拟得知,即使原始像的离焦量接近Sdaerzer聚焦条件,解卷处理也同样有助于提高像的质量,并分辨开单个的O原子柱.     

精确测定高分辨电子显微像中亮点位置的图像处理方法

本文提出了一些实用的高分辨原子像分割及定位方法。原子像分割由提取原子像的谷位网络实现。原子像亮点定位可由像素点灰度峰值检测法或局部像素点灰度平均法完成。这些方法都基于计算机图像处理技术在原子像分析中的应用。     

高分辨电子显微像的定量分析与应用I.基于图像处理的高分辨像定量分析方法

本文通过研究高分辨电子显微像的图像处理技术,系统地建立了两种高分辨原子像亮点中心精确定位的处理方法:灰度梯度检测法和峰谷提取-灰度平均法.基于原子像亮点中心定位技术,使用最小二乘法,建立了测量高分辨像中局部点阵参数和晶格畸变的实际处理过程.结合像模拟、图像匹配等手段,详细研究了从高分辨像中提取元素分布、原子结构等信息的定量分析方法;并建立了一套UNIX平台上的高分辨像定量分析程序包,具有较高的精度和广泛的用途.     

高分辨电子显微像的解卷处理程序:DEC

高分辨电子显微像因离焦量和晶体厚度等因素的影响，未必能正确反映晶体结构。为此，李方华等建立并发展了高分辨像的解卷处理技术，将单张高分辨像恢复为结构像，并提高像的分辨率。DEC是为高分辨像解卷处理编写的配套计算机程序，将此程序应用于Si0.75Ge0.24晶体中缺陷的实验高分辨像，     

C与Si重构表面碰撞过程的分子动力学模拟

利用 Tersoff半经验多体相互作用势和分子动力学模拟方法研究了荷能 C原子与 Si(0 0 1) - (2× 1)重构表面碰撞动力学过程中入射 C原子能量随时间的变化情况 ,观察到了 C原子和表面 Si原子成键过程中 C原子的吸附、Si原子二聚键的打开、C原子的徙动以及 C、Si原子成键等物理过程 ,并对不同入射位置处入射 C原子和表面 Si原子碰撞过程中能量转移机理进行了分析。模拟结果表明 ,C原子相对于表面不同的局部构型发生不同的碰撞过程 ,而 C原子能量的提高有利于成键过程的发生 ,结果为 Si C在Si表面生长初期物理过程的认识提供了参考数据     

CVD生长Si基Si1-x-yGexCy合金层应变的研究

用Raman谱和AES能谱分析了用RTP/VLP-CVD方法生长在Si衬底上的SiGeC合金外延薄膜的应变。结果表明:用RTP/VLP-CVD方法生长的SiGeC合金中掺入的C呈间隙原子或替位原子的形式分布,其中大部分为间隙原子,少量为替位C原子,但是替位C原子的存在有效地调节了SiGeC合金层的应变;另外由于采用乙烯做C源,生长温度较高也使SiGeC合金层的应变部分被弛豫。由于C的掺入,Si基上生长SiGeC合金的应变和相同Ge含量的SiGe合金相比较大大减小,临界厚度大大增加,有利于在Si衬底上生长出达到一定厚度的更高质量的族元素合金半导体材料。     

球差校正高分辨电子显微像的像衬和解卷处理

本工作将赝弱相位物体近似像衬理论延伸至球差校正高分辨电子显微像,分析了球差校正像的衬度随样品厚度的变化规律。指出非Schemer聚焦条件下球差校正电镜拍摄的高分辨像仍未必反映晶体结构,讨论了解卷处理方法应用于球差校正像的有效性,并以有12型层错的GaN晶体为例,借助像模拟肯定了解卷处理能用于复原原子分辨率晶体缺陷的结构像。     

Si1-xGex:C缓冲层上Ge薄膜的CVD外延生长

用化学气相沉积方法,在Si(100)衬底上生长Si1xGex:C合金作为缓冲层,继而外延生长了Ge晶体薄膜.根据AES测量结果可以认为,缓冲层包括由衬底中的Si原子扩散至表面与GeH4,C2H4反应而生成的Si1-xGex:C外延层和由Si1-xGex:C外延层中Ge原子向衬底方向扩散而形成的Si1-xGex层.缓冲层上外延所得Ge晶体薄膜晶体取向较为单一,其厚度超过在Si上直接外延Ge薄膜的临界厚度,且薄膜中的电子迁移率与同等掺杂浓度(1.0×1019 cm-3)的体Ge材料的电子迁移率相当.     

Si1-xGex:C缓冲层上Ge薄膜的CVD外延生长

用化学气相沉积方法,在Si(100)衬底上生长Si1xGex:C合金作为缓冲层,继而外延生长了Ge晶体薄膜.根据AES测量结果可以认为,缓冲层包括由衬底中的Si原子扩散至表面与GeH4,C2H4反应而生成的Si1-xGex:C外延层和由Si1-xGex:C外延层中Ge原子向衬底方向扩散而形成的Si1-xGex层.缓冲层上外延所得Ge晶体薄膜晶体取向较为单一,其厚度超过在Si上直接外延Ge薄膜的临界厚度,且薄膜中的电子迁移率与同等掺杂浓度(1.0×1019 cm-3)的体Ge材料的电子迁移率相当.     

Si1-xGex∶C缓冲层上Ge薄膜的CVD外延生长

用化学气相沉积方法，在Si(100)衬底上生长Si1-xGex∶C合金作为缓冲层，继而外延生长了Ge晶体薄膜. 根据AES测量结果可以认为，缓冲层包括由衬底中的Si原子扩散至表面与GeH4, C2H4反应而生成的Si1-xGex∶C外延层和由Si1-xGex∶C外延层中Ge原子向衬底方向扩散而形成的Si1-xGex层. 缓冲层上外延所得Ge晶体薄膜晶体取向较为单一，其厚度超过在Si上直接外延Ge薄膜的临界厚度，且薄膜中的电子迁移率与同等掺杂浓度(1.0E19cm-3)的体Ge材料的电子迁移率相当.     

场发射高分辨电子显微像的复原

本文讨论了弱相位物体近似的实际应用范围，在此基础上对场发射高分辨电子显微像作了解卷处理。     

Restoring atomic configuration at interfaces by image deconvolution

The image deconvolution technique in combination with dynamical scattering effect correction developed previously for crystal defect investigation has been modified to meet the needs of interface studies and applied to a [111] twin model of Si. Elliptical windows are utilized as a new means for Fourier filtering and correcting the amplitudes of reflections. Images were simulated with a 200 kV field-emission high-resolution electron microscope. After image restoration, four images simulated with different defocus values were transformed into structure images with atomic columns revealed individually at correct positions. The effectiveness of the technique is discussed.     

Amplitude correction in image deconvolution for determining crystal defects at atomic level

A method is proposed to improve the image deconvolution technique based on the weak-phase object approximation for determining the crystal defects at atomic level. Originally, both the amplitude and phase modulation caused by the contrast transfer function (CTF) was removed for all reflections in the diffractogram of the image and then the deconvoluted image was obtained by carrying out the inverse FT. In this paper after removing the CTF modulation the amplitudes of reflections are further corrected by constraining the integral amplitudes to be equal to the corresponding structure factor amplitudes of perfect crystals. [110] high-resolution electron microscope images were simulated for a structure model of Si crystal containing the 60 degrees dislocation with different thickness. A comparison between deconvoluted images with the amplitudes corrected by the present method and those uncorrected is given to show the effectiveness of the method. The amplitude-crystal thickness dependence for images simulated close to the Scherzer defocus condition has been analysed and the result serves as an empirical basis of the method. The validity and limitation of the method are discussed.     

退火对Fe/Si结构原子间互扩散及显微结构的影响

在Si(100)衬底上,用直流磁控溅射沉积约100nm的纯金属Fe膜,然后在600～1000℃真空退火2h.用能量为3MeV的C离子进行了卢瑟福背散射(RBS)测量,并用SIMNRA 6.0程序分析了测量结果,给出了界面附近Fe原子与Si原子间互扩散的完整图像.扫描电镜(SEM)观察和X射线衍射(XRD)测量表征了不同温度退火2h后Fe/Si系统表面的显微结构和晶体结构.由RBS、XRD测量与SEM观察结果,分析了退火过程对磁控溅射制备的Fe/Si双层膜结构原子间的互扩散行为、硅化物形成及显微结构的影响.     

First observation of SiO2/Si(100) interfaces by spherical aberration-corrected high-resolution transmission electron microscopy

SiO2/Si(100) interfaces were for the first time observed by a spherical aberration-corrected high-resolution transmission electron microscope in a cross-sectional mode. As the Fresnel fringes were not contrasted at the interfaces, the interfacial structures were clearly observed without the need for artificial image contrast. Atomic steps and defects on the Si(100) surfaces were accurately identified. Also, image simulations with the target imaging performance revealed oxygen atomic columns between silicon-silicon bonds. The present instrument is of potential use for semiconductor science and technology, even for the analysis of oxygen atoms at interfaces.     

Atomic layer deposition of ZrO2 and HfO2 on deep trenched and planar silicon

Conformal ZrO₂ and HfO₂ thin films were grown by atomic layer deposition using novel liquid cyclopentadienyl precursors at 300 °C or 350 °C on planar Si wafers and deep trenched Si with an aspect ratio of 60:1. The crystal growth and phase content in as-deposited films depended on the precursor, film thickness, and the material grown. The structural and electrical behaviour of the films were somewhat precursor-dependent, revealing better insulating properties in the films grown from oxygen-containing precursors. Also the HfO₂ films showed lower leakage compared to ZrO₂.     

A method for multidirectional TEM observation of a specific site at atomic resolution

A new technique has been developed for the three-dimensional structure characterisation of a specific site at atomic resolution. In this technique, a focused ion beam (FIB) system is used to extract a specimen from a desired site as well as to fabricate the electron transparent specimen. A specimen holder with a specimen stage rotation mechanism has also been developed for use with both an FIB system and a high-resolution transmission electron microscope (TEM). The specimen holder allows both the FIB milling of a specimen and its observation in TEM without remounting the specimen from the specimen holder. A specimen for the three-dimensional TEM observation is extracted using the FIB micro-sampling technique and shaped into a pillar to mount on a tip of a needle stub enabling a multidirectional observation. The technique was applied to the multidirectional observation of the crystal structure of an Si single crystal at atomic resolution. The crystal lattice fringes of the two Si(111) planes with distances of 0.31 nm as well as the lattice fringes of the Si(200) with distances of 0.19 nm were clearly observed.     

Crystallographic Properties of Ge/Si Heterojunctions Fabricated by Wet Wafer Bonding

Ge/Si heterojunctions formed by wet wafer bonding were observed using transmission electron microscopy and energy-dispersive x-ray spectroscopy. For the samples annealed at 880°C, there was a transition layer at the heterointerface with modified regions in the Si and Ge extending 20 nm to 30 nm from the interface. In these modified regions, crystal defects were observed, and a large amount of Ge was detected on the Si side of the junction. For the samples annealed at 250°C or 350°C, the transition layers had an amorphous-like structure with a thickness of about 10 nm. No modified layer or enlargement of lattice spacing was observed.     

Al-Cu-Mg合金中T相的扫描透射电镜研究

本文利用扫描透射电子显微术,从原子尺度研究Al-Cu-Mg合金中T相(Al20Cu2Mn3)晶体结构的特征。结果表明T相颗粒(010)面存在两种类型孪晶:层状滑移对称型和呈"蛛网"状向外辐射的多重对称型。对孪晶结构分析发现组成孪晶的"双瞳眼睛"状结构单元多数按规则的周期性平行排列,但也有少数区域以混乱的分布方式存在;在某些局部小区域,"双瞳眼睛"状结构单元转变成平行四边形单胞,从而造成晶体结构也发生相应的改变。