Coverage of rough substrates by ZnS using vacuum evaporation and atomic layer epitaxy

The effects of various deposition techniques on the growth of ZnS thin films on a sintered BaTiO₃-based complex perovskite substrate, using the scanning electron microscope have been studied. The results clearly show a non-uniform and incomplete coverage of the sub strate in the case of films grown by electron-beam evaporation and resistance-heated evaporation. A shadowing effect is observed in these films. Increase in the thickness of the films tends to decrease the shadowing effect. On the contrary, films grown by the atomic layer epitaxy method, exhibit a complete and uniform coverage of the substrate, even for thin (< 100 nm) ZnS films.     

Monocrystalline thin films of ZnSe and ZnO grown by atomic layer epitaxy

We report on the growth of monocrystalline thin films of ZnSe and ZnO by atomic layer epitaxy by simple reaction between elemental precursors. Structural and optical properties of these films are discussed with reference to the investigations performed with atomic force microscopy, scanning electron microscopy, cathodoluminescence and photoluminescence.     

Zinc chalcogenide thin films grown by the atomic layer epitaxy technique using zinc acetate as source material

Anhydrous zinc acetate (Zn(CH₃COO)₂) was found to be a suitable source material for growing thin films by the atomic layer epitaxy method. The growth of both ZnS and ZnO thin films with good reproducibility and uniform thickness from Zn(CH₃COO)₂ and H₂S or H₂O respectively was demonstrated.ZnS thin films showed excellent crystallinity and a high orientation of the growth direction. The ZnO thin films were mainly amorphous and the growth rate was approximately one-fifth of that found for ZnS growth.Some experiments were also carried out to dope the ZnS films with manganese and terbium, resulting in yellow and green luminescence respectively.     

Development of crystallinity and morphology in hafnium dioxide thin films grown by atomic layer epitaxy

The structural development of HfO₂ thin films grown from HfCl₄ and water onto glass substrates by atomic layer epitaxy at 500 °C was studied with X-ray diffraction, atomic force microscopy and scanning electron microscopy. The films were found to contain two regions of different crystallinity: a thin amorphous starting layer and a subsequent preferentially oriented polycrystalline layer. The films were built up of densely packed grains. Substantial surface roughening occurred along with increasing film thickness. The films were chlorine free as analyzed by Rutherford backscattering spectrometry.     

A study of ZnTe films grown on glass substrates using an atomic layer evaporation method

Thin zinc telluride films were grown on amorphous substrates by the alternate evaporation of monolayers of zinc and tellurium with the aid of the atomic layer evaporation (ALE) method. The films were characterized by a number of surface sensitive analysis techniques, by X-ray diffraction and by optical absorption. The films were found to be clean, smooth and featureless, and they crystallized with a preferential orientation in the (111) direction. There seemed to be no narrow-range “optimum” temperature affecting the quality of the crystals when grown by using ALE, in sharp contrast to the case in which the films were grown by codepositing the elements. The electronic structure of the films exhibited characteristics features of the bulk material, as deduced from the angle-resolved photoemission and optical absorption. In addition, some features which might be related to particular properties of the surface were present in the photoemission spectra.     

Conformity and structure of titanium oxide films grown by atomic layer deposition on silicon substrates

Conformity and phase structure of atomic layer deposited TiO₂ thin films grown on silicon substrates were studied. The films were grown using TiCl₄ and Ti(OC₂H₅)₄ as titanium precursors in the temperature range from 125 to 500 °C. In all cases perfect conformal growth was achieved on patterned substrates with elliptical holes of 7.5 μm depth and aspect ratio of about 1:40. Conformal growth was achieved with process parameters similar to those optimized for the growth on planar wafers. The dominant crystalline phase in the as-grown films was anatase, with some contribution from rutile at relatively higher temperatures. Annealing in the oxygen ambient resulted in (re)crystallization whereas the effect of annealing depended markedly on the precursors used in the deposition process. Compared to films grown from TiCl₄, the films grown from Ti(OC₂H₅)₄ were transformed into rutile in somewhat greater extent, whereas in terms of step coverage the films grown from Ti(OC₂H₅)₄ remained somewhat inferior compared to the films grown from TiCl₄.     

Nitrogen-doped ZnO thin films grown on glass substrates by atomic layer deposition using NH3 as a doping source

Nitrogen-doped ZnO (ZnO:N) films were successfully grown on glass substrates by atomic layer deposition (ALD). NH3 was used as a doping source, and the substrate temperature was relatively low (90 approximately 210 degrees C). The main focus of the study was to report on the effect of the temperature on the electrical properties (e.g., carrier concentration, mobility, etc.) of the grown ZnO:N films. At all temperatures, the carrier was found to be n-type, and its electron concentration did not show much variation within the values between 3 x 10(16) and 6 x 10(16) cm-3; the mobility increased with the temperature (1 cm2/Vs at 110 degrees C, 5 cm2/Vs at 190 degrees C); and the resistivity decreased with the temperature (203 omegacm at 110 degrees C, 21 omegacm at 190 degrees C). The electrical properties are discussed in relation with the nitrogen concentration, crystallinity, crystal orientation, grain size, and surface morphology. The nitrogen concentration in the ZnO:N films was constant at all temperatures (approximately 2.5 atomic percent); the crystallinity and crystal orientation improved with the temperature; and the mean grain size increased with the temperature (13.2 nm at 110 degrees C, 35.3 nm at 190 degrees C). The results for the ZnO:N films were also compared with the results for the undoped ZnO films.     

PbTe films grown by hot wall epitaxy on sapphire substrates

A ‘hot wall epitaxy’ is applied to grow PbTe thin films on sapphire substrates with BaF₂ buffer layer deposited by molecular beam epitaxy (MBE). The microstructural and strain state characteristics of PbTe layer were examined with high resolution X-ray diffraction techniques. The epilayer is composed of two (111)PbTe‖(0001)Al₂O₃ epitaxially oriented domain variants. The domains are azimuthally rotated and their interfacial directions relative to the substrate are [011?]PbTe‖Al₂O₃ and [1?54?]PbTe‖Al₂O₃, respectively. Another possible alignment of the domain variant corresponds to PbTe‖Al₂O₃ orientation. The strain state analysis of PbTe layer points to its relaxation via domain formation and high dislocation density generation in the lattice. Despite the domains formation the measured mobility of electron carriers is approximately 1600 cm²/V s and 30 000 cm²/V s at 300 K and 77 K, respectively. The theoretical analysis of the measured electrical properties indicates that the scattering by acoustic and optical phonons is the factor affecting the conduction process.     

电化学原子层外延制备Bi—Se系薄膜

采用电化学原子层外延（electrochemical atomic layer epitaxy，ECALE）方法尝试在Pt电极上沉积Bi2Se3纳米热电薄膜。利用循环伏安扫描研究了Bi^3＋、Se^4＋在Pt电极上的欠电势沉积参数，在此基础上利用自动电沉积系统交替沉积400个Bi、Se原子层。采用电量分析、XRD、EDX对沉积物进行表征。电量分析表明沉积物中存在硒的富余，XRD结果表明沉积物中除了Bi2Se3化合物外还有单质Se的富余。EDX分析沉积物的硒铋原子比为4：1，与XRD分析结果一致。     

The transient layer in magnetic garnet films grown by liquid phase epitaxy

A thin (～ 0.1 μm) layer is formed initially during the so-called “transient” period preceding the establishment of the steady state diffusion boundary layer in the melt, when films are dipped in a horizontal plane while undergoing axial rotation. Further evidence is given for the existence of the transient as a separate and distinct growth mode as compared to steady state growth. The transient layer, which grows comparatively rapidly, nevertheless has properties virtually identical to those of the subsequently grown steady state layer, except for its higher Pb concentration.     

Monocrystalline zinc oxide films grown by atomic layer deposition

In the present work we report on the monocrystalline growth of (00.1) ZnO films on GaN template by the Atomic Layer Deposition technique. The ZnO films were obtained at temperature of 300 °C using dietylzinc (DEZn) as a zinc precursor and deionized water as an oxygen precursor. High resolution X-ray diffraction analysis proves that ZnO layers are monocrystalline with rocking curve FWHM of the 00.2 peak equals to 0.07°. Low temperature photoluminescence shows a sharp and bright excitonic line with FWHM of 13 meV.     

Carbon incorporation process in GaAsN films grown by chemical beam epitaxy using MMHy or DMHy as the N source

Crystal quality of GaAsN films can be improved by using CBE for low-temperature growth. However, low-temperature growth increases C incorporation in the films, which degrades their electrical properties. Consequently, C incorporation was investigated in view of the surface reaction of N sources on a substrate surface, and MMHy and DMHy were compared. When MMHy was used as an N source, C concentration in GaAsN drastically increases below 380 °C than that in GaAs due to insufficient CH_x desorption. In the case of DMHy, N(CH₃)₂ is desorbed more readily than CH_x, therefore, the C concentration can then be reduced using DMHy.     

Characterizations of NbAlO thin films grown by atomic layer deposition

Niobium-aluminate (NbAlO) thin films have been prepared on silicon (100) with different Nb₂O₅:Al₂O₃ growth cycle ratio by atomic layer deposition (ALD) technology. The structural, chemical and optical properties of NbAlO thin films are investigated using X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and spectroscopic ellipsometry (SE). The results show that all the obtained NbAlO films are amorphous and fully oxidized. It is also found that the proportion of components in the NbAlO film can be well-controlled by varying the ALD growth cycles of the independent oxides. Furthermore, the refraction index of the prepared films is observed to increase with an increase of the concentration of Nb in the mixtures.     

InGaAs quantum dots grown by molecular beam epitaxy for light emission on Si substrates

The aim of this study is to achieve homogeneous, high density and dislocation free InGaAs quantum dots grown by molecular beam epitaxy for light emission on silicon substrates. This work is part of a project which aims at overcoming the severe limitation suffered by silicon regarding its optoelectronic applications, especially efficient light emission device. For this study, one of the key points is to overcome the expected type II InGaAs/Si interface by inserting the InGaAs quantum dots inside a thin silicon quantum well in SiO2 fabricated on a SOI substrate. Confinement effects of the Si/SiO2 quantum well are expected to heighten the indirect silicon bandgap and then give rise to a type I interface with the InGaAs quantum dots. Band structure and optical properties are modeled within the tight binding approximation: direct energy bandgap is demonstrated in SiO2/Si/InAs/Si/SiO2 heterostructures for very thin Si layers and absorption coefficient is calculated. Thinned SOI substrates are successfully prepared using successive etching process resulting in a 2 nm-thick Si layer on top of silica. Another key point to get light emission from InGaAs quantum dots is to avoid any dislocations or defects in the quantum dots. We investigate the quantum dot size distribution, density and structural quality at different V/III beam equivalent pressure ratios, different growth temperatures and as a function of the amount of deposited material. This study was performed for InGaAs quantum dots grown on Si(001) substrates. The capping of InGaAs quantum dots by a silicon epilayer is performed in order to get efficient photoluminescence emission from quantum dots. Scanning transmission electronic microscopy images are used to study the structural quality of the quantum dots. Dislocation free In50Ga50As QDs are successfully obtained on a (001) silicon substrate. The analysis of QDs capped with silicon by Rutherford Backscattering Spectrometry in a channeling geometry is also presented.     

Properties of tantalum oxide thin films grown by atomic layer deposition

Thin tantalum oxide films were deposited using atomic layer deposition from TaCl₅ and H₂O at temperatures in the range 80–500 °C. The films deposited at temperatures below 300 °C were predominantly amorphous, whereas those grown at higher temperatures were polycrystalline containing the phases TaO₂ and Ta₂O₅. The oxygen to tantalum mass concentration ratio corresponded to that of TaO₂ at all growth temperatures. The optical band gap was close to 4.2 eV for amorphous films and ranged from 3.9 to 4.5 eV for polycrystalline films. The refractive index measured at λ = 550 nm increased from 1.97 to 2.20 with an increase in growth temperature from 80 to 300 °C. The films deposited at 80 °C showed low absorption with absorption coefficients of less than 100 cm⁻¹ in the visible region.     

Stable p-type ZnO films grown by atomic layer deposition on GaAs substrates and treated by post-deposition rapid thermal annealing

Long-term stable p-type ZnO films were grown by atomic layer deposition on semi-insulating GaAs substrates and followed by rapid thermal annealing (RTA) in oxygen ambient. Significant decrease in the electron concentration and increase in the hole concentration, together with the intensity enhancement of acceptor-related A^oX spectral peak and the shift of bound exciton peak from D^oX to A^oX in the low-temperature photoluminescence spectra, were observed as the RTA temperature increased. Conversion of conductivity from intrinsic n-type to extrinsic p-type ZnO occurred at the RTA temperature of 600 °C. The p-type ZnO film with a hole concentration as high as 3.44 × 10²⁰ cm^− 3 and long-term stability up to 180 days was obtained as the RTA treatment was carried out at 700 °C. The results were attributed to the diffusion of arsenic atoms from GaAs into ZnO as well as the activation of As-related acceptors by the post-RTA treatment.     

Structural characterization of high temperature AlN intermediate layer in GaN grown by molecular beam epitaxy

Transmission electron microscopy has been used to study the structural quality of GaN grown on sapphire by plasma assisted molecular beam epitaxy using high temperature AlN intermediate layers with different thicknesses. The introduction of an AlN intermediate layer with an optimum thickness is observed to minimize the density of dislocations reaching the overgrown GaN surface. In this sample, the measured threading dislocation density reaching the surface of 1×10¹⁰ cm⁻² resulted to be seven times lower than that of a reference sample, without any AlN interlayer. The bending at the GaN/AlN interface and following interactions between dislocations have been observed in cross-sectional transmission electron micrographs. This fact explains the decrease of dislocation density reaching the GaN surface.     

Semi-insulating GaN:C epilayers grown by metalorganic vapor phase epitaxy using propane as a carbon source

The influence of propane present in a reactor at various stages of GaN growth by metalorganic vapor phase epitaxy (MOVPE) on sapphire substrates on the character of epitaxial process and the properties of epilayers has been studied. Doped GaN epilayers with carbon concentration 5 × 10¹⁸ cm^–3 characterized by high crystalline perfection, an atomically smooth surface, and electric breakdown voltage above 500 V at a doped layer thickness of 4 μm have been obtained.

     

Stress reduction and electric properties of InSb thin films grown by metalorganic vapor phase epitaxy on sapphire substrates with an InAs buffer layer

InSb thin films were grown by metalorganic vapor phase epitaxy using an InAs buffer layer on sapphire (0001) substrates. The stresses and strains in InSb were controlled by the thickness of the InAs buffer layer, and it was found that with decreasing compressive stress in InSb, the crystalline quality and the electrical properties improved. The thermoelectric properties of InSb were assessed and it was found that the power factor of InSb with a thickness of 5 μm reached as high as 5.8 × 10⁻³ W/mK² at 600 K.