Microstructural aspects of the dissolution and melting of Al2Cu phase in Al-Si alloys during solution heat treatment

The dissolution and melting of Al₂Cu phase in solution heat-treated samples of unmodified Al-Si 319.2 alloy solidified at ≈10 °C were studied using optical microscopy, image analysis, electron probe microanalysis (EPMA), and differential scanning calorimetry (DSC). The solution heat treat-ment was carried out in the temperature range 480 °C to 545 °C for solution times of up to 24 hours. Of the two forms of Al₂Cu found to exist,i.e., blocky and eutectic-like, the latter type is more pronounced in the unmodified alloy (at ≈10 °C) and was observed either as separate eutectic pockets or precipitated on preexisting Si particles, β-iron phase needles, or the blocky Al₂Cu phase. Dissolution of the (Al + Al₂Cu) eutectic takes place at temperatures close to 480 °C through frag-mentation of the phase and its dissolution into the surrounding Al matrix. The dissolution is seen to accelerate with increasing solution temperature (505 °C to 515 °C). The ultimate tensile strength (UTS) and fracture elongation (EL) show a linear increase when plotted against the amount of dissolved copper in the matrix, whereas the yield strength (YS) is not affected by the dissolution of the Al₂Cu phase. Melting of the copper phase is observed at 540 °C solution temperature; the molten copper-phase particles transform to a shiny, structureless phase upon quenching. Coarsening of the copper eutectic can occur prior to melting and give rise to massive eutectic regions of (Al + Al₂Cu). Unlike the eutectic, fragments of the blocky Al₂Cu phase are still observed in the matrix, even after 24 hours at 540 °C.     

Heterogeneous nucleation of Al2Cu in AlCu eutectic liquid droplets embedded in an al matrix

The heterogeneous nucleation of Al₂Cu in AlAl₂ Cu eutectic liquids droplets embedded in an Al matrix has been studied by a combination of optical microscopy, transmission electron microscopy and differential scanning calorimetry. Nucleation of Al₂Cu is stimulated catalytically by the surrounding matrix at a temperature approx. 25°C below the eutectic temperature. With increasing cooling rate, the solidification onset, peak and end temperatures decrease and the peak height and width of the solidification exotherm increase. the contact angle at the AlAl₂ Cu liquid triple point is calculated to be 24.6° from the variation of exothermic peak width with cooling rate, but the corresponding calculated value of the number of potential catalytic nucleation sites is physically unrealistic.     

Structure of As-cast aluminum matrix composite containing Ni3AI-type intermetallic ribbons

An aluminum matrix composite containing rapidly solidified Ni₇₅Al₂₃B₁Zr₁ (at. pct) ribbons has been fabricated by casting at 700 °C, 715 °C, 730 °C, and 875 °C. Microstructural investigation has shown that the matrix contains particles with a composition between Al₃Ni and eutectic. The interfacial zones composed of several layers with different aluminum and nickel contents are observed around the ribbons. The sequence of layers from the ribbon outward in the specimens fabricated at 700 °C, 715 °C, and 730 °C is as follows: AINi → Al₃Ni₂ → the outer layer between Al₃Ni and eutectic. Composite specimens fabricated at 875 °C contain two types of interfacial zones: a single-layer AINi and a triple-layer zone. The first two layers in the triplelayer zone are exactly the same as their counterparts in the specimens fabricated at lower temperatures. The outer layer has a composition close to the Al₃Ni compound. The thickness of the AINi layer increases continuously with the increasing casting temperature. Within the experimental error, the thickness of the Al₃Ni₂ layer seems to be independent of casting temperature. The thickness of the outer layer in the specimens fabricated at 700 °C to 730 °C (Al₃Ni plus eutectic) increases with the casting temperature. However, the outer layer in the 875 °C specimen (Al₃Ni) is much thinner than the others.     

Fluidized bed heat treatment of cast Al-Si-Cu-Mg alloys

The effects of fluidized bed heat treatment on the microstructural and mechanical properties of Al-Si-Cu-Mg cast alloys, namely, 354 and 319, were studied. The heating rate in fluidized beds (FBs) is greatervis-à-vis conventional electrical resistance furnaces (CFs). The high heating rate in FBs increases the kinetics of metallurgical phenomena such as Si fragmentation and spherodization during solution heat treatment, as well as the precipitation rate of phases such as Al₅Cu₂Mg₈Si₆ and Al₂Cu during aging. It is observed that the dissolution rate of phases such as Mg₂Si and Al₅Cu₂Mg₈Si₆ takes place very rapidly. The solution heat treatment of 319 alloy using FB results in complete dissolution of Mg₂Si and Al₅Cu₂Mg₈Si₆ particles within 45 minutes. However, for phases such as Al₂Cu and Ferich intermetallics, the dissolution rate is relatively slow. Even on prolonged solution heat treatment for 6 hours, these phases do not dissolve completely. It is observed that incomplete dissolution of the Al₂Cu phase does not significantly affect tensile properties of T4-treated alloys. The optimum solution heat-treatment time in FB for both 354 and 319 alloys is 45 minutes at 527 °C and 493 °C, respectively. Thermal analysis shows an exothermic peak owing to recrystallization and coarsening of eutectic grains during solution heat treatment. The high heating rate in FB causes this transformation to take place at a lower temperature than in CF. It is observed that the nucleation rate of Al₅Cu₂Mg₈Si₆ during aging in FB is greater than using CF. Thermal analysis of samples during the ramp-up stage while aging using FB did not show any phase transformation, while those using CF show two endothermic transformations, which are most likely due to the dissolution of GP zones or the co-cluster of solutes. Aging at 200 °C results in a greater number density of precipitates than those at 240 °C. The tensile strength of samples aged at 200 °C is greater than those aged at 240 °C, because the amount of precipitates formed at 200 °C is greater than that at 240 °C. The total heat-treatment time for T6 temper is less than 2 hours in FBs, which is a significant reduction in heat-treatment time, as well as energy consumption.     

The solidification behavior of 8090 Al-Li alloy

In this work, the solidification and segregation behaviors of 8090 Al-Li alloy have been investigated with differential thermal analysis (DTA) and the metallographic-electron microprobe method. The results show that 8090 Al-Li alloy has a much more complex solidification path than Al-Li binary alloy due to the addition of many alloying elements and the presence of impure elements. Solidification begins at about 635 °C with the reaction of L → α-Al + L′, and this reaction goes on to termination. The alloying element Cu and impure elements Fe and Si have a strong segregation tendency. During solidification, Cu segregates to the interdendrite and finally forms α-Al + T₂ eutectic. As a result, the solidification temperature range is greatly extended. Iron and Si form the insoluble constituents Al₇Cu₂Fe, AlLiSi,etc., although their concentrations in the alloy are quite low. With the increase of Fe content, there is a eutectic reaction of α-Al/Al₃Fe at about 595 °C. The formation of insoluble constituents is influenced by both concentrations of impure elements in the alloy and the cooling rate.     

Microstructural evolution and mechanical properties of AC8A/Al2O3 short-fiber composites after thermal exposure at 150 °C to 350 °C

The microstructural evolution and mechanical properties of an AC8A/12 vol Pct A1₂O₃ (sf) composite fabricated by squeeze casting were characterized. Thermal treatments included the normal T6 temper and thermal exposure at 150 °C, 250 °C, 300 °C, and 350 °C for 400 hours. The predominant strengthening phase in the matrix appeared to be β′ (Mg₂Si) needles. Bulk pure Si particles and dendrites were commonly seen. Large particles, termed asB-type phase, might include hexagonal Al₃(Ni, Cu, Fe, Si, Mg)₂ and orthorhombic Al₃(Ni, Cu, Fe, Si, Mg) phases. Both the Si andB dispersoids were not obviously affected by artificial aging at 150 °C to 350 °C. In certain cases, large cubic β (Mg₂Si) particles, hexagonalQ′ orQ (Al₄Cu₂Mg₈Si₇) precipitates, and numerous small Al particles inside Si dispersoids were also seen. No interfacial reaction product was observed along the fiber/ matrix interface even after long exposure at 350 °C. Amorphous SiO₂ gels, which were used as a binder during fabrication, were occasionally observed. The tensile and fatigue behavior of the AC8A alloys and composites after the preceding thermal exposures were evaluated over the temperature range of 25 °C to 350 °C. The composites showed similar strength as the matrix alloy at room temperature but exhibited higher strength at temperatures above 250 °C, with the sacrifice of the lower ductility. The strength levels of both the alloys and composites were significantly reduced after long thermal exposure, especially for temperatures higher than 250 °C. The loss of strength after long-term exposure at elevated temperatures may be attributed to age-softening of the matrix.     

Development of a low-melting-point filler metal for brazing aluminum alloys

The study is concerned with developing low-melting-point filler metals for brazing aluminum alloys. For this purpose, thermal analyses of a series of Al-Si-Cu-Sn filler metals have been conducted and corresponding microstructures observed. The results showed that the liquidus temperature of Al-Si-Cu filler metals dropped from 593 °C to 534 °C, when the amount of copper was increased from 0 to 30 pct. As the copper content reached further to 40 pct, the liquidus temperature would rise to 572 °C. By adding 2 pct tin into the Al-Si-20Cu alloys, the liquidus and solidus temperature would fall from 543 °C to 526 °C and from 524 °C to 504 °C, respectively. The main microstructures of Al-Si-Cu alloys consist of the α-Al solid solution, silicon particles, the CuAl₂ (ϑ) intermetallic, and the eutectic structures of Al-Si, Al-Cu, and Al-Si-Cu. For further improvement of the brazability of this filler metal, magnesium was added as a wetting agent, which would remove the residual oxygen and moisture from the brazed aluminum surface and reduce the oxide film. Based on results gleaned from the thermal analyses, a new filler metal with the composition Al-7Si-20Cu-2Sn-1Mg is proposed, which possesses a melting temperature range of 501 °C to 522 °C and a microstructure that includes an Al-Si solid solution, silicon particles, a tin-rich phase, and CuAl₂, CuMgAl₂, and Mg₂Si intermetallic compounds. When this filler metal was used to braze the 6061-T6 aluminum alloy, an optimized bonding strength of 196 ± 19 MPa was achieved.     

Near-net-shape forming of Al-Al3Ni functionally graded material over eutectic melting temperature

A possibility to make near-net-shape functionally graded material (FGM) products has been examined. The FGM billets having a graded volume fraction of Al₃Ni in thickness direction were machined from an Al-Al₃Ni FGM thick-walled tube manufactured by a vacuum centrifugal method. Billets, which were set in the container for the backward extruding, were heated to 650 °C to 680 °C, at which temperature the FGM becomes a mixture of molten aluminum eutectic and solid intermetallics. Then, billets were extruded successfully to FGM cups by a semisolid forming, except at 650 °C. Residual bulky Al₃Ni particles are found at higher temperature. Thus, an optimum operation temperature is found to be around 660 °C, because bulky Al₃Ni particles transform to fine spheroidal or fibrous shape after the forming. The volume fraction of intermetallics at the bottom region of the cup was condensed more than 60 vol pct in a proper billet setting.     

Thermal analysis of the compositional shift in a transient liquid phase during sintering of a ternary Cu-Sn-Bi powder mixture

In this work, differential scanning calorimetry (DSC) and microstructural analysis were used to study the transient-liquid-phase sintering (TLPS) of a Cu-Sn-Bi powder mixture. During sintering, the liquid phase shifts from a Sn-rich (i.e., ∼90 wt pct Sn) to a Bi-rich (i.e., >78 wt pct Bi) composition. In addition, the presence of Bi creates two melting events: a Sn:Bi eutectic reaction at 139 °C and a reaction involving the melting of (Bi) at 191 °C. The Sn:Bi eutectic melting event was fully transient. The melting event at 191 °C was consistent with the formation of a terminal Bi-rich liquid phase. The rate of compositional shift toward this terminal liquid phase at 260 °C was dependent on the rate of the reaction of the Sn with the Cu powder to form intermetallic phases. For mixtures made with medium and fine Cu powder, the terminal Bi-rich composition was reached after isothermal hold times of 20 and 15 minutes, respectively. This resulted in a new melting point for the mixture of 191 °C. For coarse Cu powders, the rate of the compositional shift toward a Bi-rich composition was much slower. The liquid phase remained at a hypoeutectic Sn-Bi composition estimated at 80 wt pct Sn, while the mixture maintained a melting point of 139 °C.     

Solidification and Re-melting Phenomena During Slurry Preparation Using the RheoMetal™ Process

The melting sequence of the enthalpy exchange material (EEM) and formation of a slurry in the RheoMetal? process was investigated. The EEM was extracted and quenched, together with a portion of the slurry at different processing times before complete melting. The EEM initially increased in size/diameter due to melt freezing onto its surface, forming a freeze-on layer. The initial growth of this layer was followed by a period of a constant diameter of the EEM with subsequent melting and decrease of diameter. Microstructural characterization of the size and morphology of different phases in the EEM and in the freeze-on layer was made. Dendritic equiaxed grains and eutectic regions containing Si particles and Cu-bearing particles and Fe-rich particles were observed in the as-cast EEM. The freeze-on layer consisted of dendritic aluminum tilted by about 30 deg in the upstream direction, caused by the rotation of the EEM. Energy dispersion spectroscopy analysis showed that the freeze-on layer had a composition corresponding to an alloy with higher melting point than the EEM and thus shielding the EEM from the surrounding melt. Microstructural changes in the EEM showed that temperature rapidly increased to 768 K (495 °C), indicated by incipient melting of the lowest temperature melting eutectic in triple junction grain boundary regions with Al₂Cu and Al₅Mg₈Si₆Cu₂ phases present. As the EEM temperature increased further the binary Al-Si eutectic started to melt to form a region of a fully developed coherent mushy state. Experimental results and a thermal model indicated that as the dendrites spheroidized near to the interface at the EEM/freeze-on layer reached a mushy state with 25 pct solid fraction, coherency was lost and disintegration of the freeze-on layer took place. Subsequently, in the absence of the shielding effect from the freeze-on Layer, the EEM continued to disintegrate with a coherency limit of a solid fraction estimated to be 50 pct.     

Melting of secondary-phase particles in Al-Mg-Si alloys

The melting of secondary-phase particles—or, more precisely, the melting of such particles together with the surrounding matrix—in two ternary Al-Mg-Si alloys has been studied. In the quasi-binary Al-Mg₂Si alloy, one melting reaction is found. In the alloy with an Si content in excess of that necessary to form Mg₂Si, three different melting reactions are observed. At upquenching temperatures above the eutectic temperature, the reaction rates are very high, and it is assumed that they are controlled by diffusion of the alloying elements in the liquid. Melting is also observed after prolonged annealing at temperatures below the eutectic temperature in these alloys, which is explained by the different diffusion rates of Mg and Si. The rate of the melting reaction is in this case assumed to be controlled by diffusion of the alloying elements in the solid α-Al phase. It is shown that calculation of the particle/matrix interface composition, which determines when melting is possible, cannot be made solely on the basis of the phase diagram, but must also include the rate of diffusion of Mg and Si. The melting temperatures observed differ somewhat from the accepted eutectic temperatures for these alloys. On prolonged annealing, the liquid droplets formed dissolve into the surrounding matrix and their chemical composition is found to change during dissolution. The resulting eutectic structure after quenching of a droplet is explained by the phase diagram and the different diffusion rates of Mg and Si as well as by the nucleation conditions of the constituents involved.     

Phase transformations at high pressures and temperatures and the structure of a hypoeutectic 1Ni-99Al alloy

The phase transformations in a hypoeutectic 1Ni-99Al alloy are studied by differential barothermal analysis in the temperature range up to 750°C at a compressed argon pressure up to ～100 MPa. The Al matrix of the initial alloy is found to be saturated by micropores at a concentration of 3.7 × 10¹⁰ cm^?3. After melting and solidification in a compressed argon atmosphere, the micropore concentration increases to 3.2 × 10¹¹ cm^?3. As a result of melting and solidification at a high pressure, the initial fine-grained structure of the alloy with an average grain size of 16 μm transforms into a coarse-grained structure during dendritic solidification. The processing of electron-microscopic images is used to determine the volume content of intermetallic compound Al₃Ni in the Al matrix. The liquidus temperature of the alloy at 100 MPa increases by 10°C, and the solidus temperature is 5°C higher than the eutectic transformation temperature in aluminum-rich Al-Ni alloys. The solid-phase decomposition of the supersaturated solid solution of nickel in aluminum occurs at 630°C. At 100 MPa, the field of solid solutions of nickel in aluminum extends to 1.2 at % Ni as compared to the Al-Ni system at atmospheric pressure. The lattice parameters of Al and Al₃Ni are found to increase in the alloy solidified at 100 MPa. The microhardness of the Al matrix in the alloy is measured after a barothermography cycle. A portion of the Al-Ni phase diagram is proposed for a pressure of 100MPa in the nickel content range 0–4.3 at %.     

Magnesium silicide intermetallic alloys

Methods of induction melting an ultra-low-density magnesium silicide (Mg₂Si) intermetallic and its alloys and the resulting microstructure and microhardness were studied. The highest quality ingots of Mg₂Si alloys were obtained by triple melting in a graphite crucible coated with boron nitride to eliminate reactivity, under overpressure of high-purity argon (1.3 X 10⁵ Pa), at a temperature close to but not exceeding 1105 °C ± 5 °C to avoid excessive evaporation of Mg. After establishing the proper induction-melting conditions, the Mg-Si binary alloys and several Mg₂Si alloys macroalloyed with 1 at. pct of Al, Ni, Co, Cu, Ag, Zn, Mn, Cr, and Fe were induction melted and, after solidification, investigated by optical microscopy and quantitative X-ray energy dispersive spectroscopy (EDS). Both the Mg-rich and Si-rich eutectic in the binary alloys exhibited a small but systematic increase in the Si content as the overall composition of the binary alloy moved closer toward the Mg₂Si line compound. The Vickers microhardness (VHN) of the as-solidified Mg-rich and Si-rich eutectics in the Mg-Si binary alloys decreased with increasing Mg (decreasing Si) content in the eutectic. This behavior persisted even after annealing for 75 hours at 0.89 pct of the respective eutectic temperature. The Mg-rich eutectic in the Mg₂Si + Al, Ni, Co, Cu, Ag, and Zn alloys contained sections exhibiting a different optical contrast and chemical composition than the rest of the eutectic. Some particles dispersed in the Mg₂Si matrix were found in the Mg₂Si + Cr, Mn, and Fe alloys. The EDS results are presented and discussed and compared with the VHN data. Formerly Formerly     

Nitrogen Ceramics: Liquid Phase Sintering

Abstract

The role of a minor silicate eutectic liquid phase as a transport medium in sintering hot–pressed silicon nitride (β Si₃N₄) ceramics was identified in the 1970s. A similar mechanism is applicable to hot–pressed Si–Al–O–N ceramic alloys which offer an advantage in control of the final liquid volume and hence in superior high temperature mechanical properties. By increasing the liquid volume it is possible to densify ceramic alloys without application of pressure at the sintering temperature and hence to fabricate components of complex shape. The Lucas Syalon ceramics typify the new range of pressureless–sintered ceramics based on the β Si₃N₄ structure. They are fabricated from the ultrafine compound powders α Si₃N₄, SiO₂, Al₂O₃, Y₂O₃, and a polytypoid phase (a substitute for A1N). The ceramics consist of submicrometre solid solution crystals of general composition Si_3?xAl_xO_xN_4?x(x < 1) within a minor matrix phase which may be either a glassy Y–Si–Al oxynitride or be crystallized to form yttrogarnet. Analysis of matrix glass compositions shows them to be residues of liquids near to a ternary eutectic in the Y₂O₃–SiO₂–Al₂O₃ system which is well below the sintering temperature of ～ 1800°C. Sintering models, based on particle rearrangement due to dissolution of the major α Si₃N₄ component in the eutectic liquid and its reprecipitation as a β Si₃N₄ solid solution, are discussed. Properties and current applications of Syalon ceramics are surveyed briefly. PM/0266     

Multistage sintering approach to prepare Ni3Al/α-Al2O3 composites

The nickel aluminide intermetallic matrix composites (IMC), Ni₇₆Al₂₄B_0.1 with either 5 or 10 vol pct α-Al₂O₃, were synthesized through a multistage sintering approach from the elemental powders of Ni, Al, and oxide of α-Al₂O₃. An electroless nickel-boron (Ni-B) plating process was adopted to improve the contacted interface between the reinforced oxide ceramics and the metal matrix, as well as to supply the atomic scale boron in the metallic matrix of the IMCs. The entire process comprises steps involving preparing a powdery starting material, sealing it within a metal sheath or can, compacting or cold deforming it, preliminarily heating the compacted material at a relatively low temperature, executing a pore-eliminating (mechanical deforming) process to eliminate the pores resulting from the preceding heating step, and sintering the material at a relatively high temperature to develop a transient liquid phase to heal or to eliminate any microcracks, crazes, or collapsed pores from the previous steps. Most of all, it is important that contact with a heat absorbent material, such as a metal sheath, produces the Ni₂Al₃ phase during preliminary heating. This new phase is a brittle and crispy material with a low melting point (1135 °C). It has been found to play an important role in preventing any significant cracks during the pore-eliminating process and in developing a transient liquid phase in the following 1200 °C sintering step. This multistage sintering with a heat absorbent process is beneficial for producing a product that has large dimensions, a desirable shape, good density, and excellent mechanical properties. The resulting elongation of tensile tests in air reaches 14.6 and 8.9 pct for the present 5 and 10 vol pct powder metallurgy IMCs, respectively.     

Microstructure and mechanical properties of sputter-deposited Cu1−x Ta x alloys

The microstructures and mechanical properties of a family of sputter-deposited Cu_1−x Ta _x (0<x<0.18) alloys have been investigated. The as-deposited microstructures for all film compositions consisted of a polycrystalline, face-centered-cubic (fcc) Cu matrix, with varying levels of Ta in solid solution, plus a very high density of discrete, 1 to 3 nm, fcc Ta particles. Decreased deposition temperature (−120 °C vs 100 °C) increased the level of Ta in solid solution. After annealing (900 °C for 1 hour) the as-deposited 6 at. pct Ta films, the Cu matrix grains remained submicron and the Ta particles remained fcc with no apparent particle coarsening. Additionally, the fcc Ta particles were found before and after annealing to be oriented identically with the Cu matrix and aligned on {111} and {100} habit planes. Annealing 17 at. pct Ta films at 900 °C for 1 hour resulted in the formation of body-centered-cubic (bcc) Ta particles (>50-nm diameter) in addition to the much smaller fcc Ta particles. Annealing the low and high Ta composition films at 900 °C for as long as 100 hours produced no observed change in either the Cu matrix grain size or the size and distribution of the fcc and bcc Ta particles. Microhardness and nanoindentation mechanical property evaluations of bulk hot-pressed materials indicated that the high strengths of the composites were unchanged, even after annealing for 100 hours at 900 °C.     

Interfacial segregation of Ti in the brazing of diamond grits onto a steel substrate using a Cu-Sn-Ti brazing alloy

Diamond grits were brazed onto a steel substrate using a prealloyed Cu-10Sn-15Ti (wt pct) brazing alloy at 925 °C and 1050 °C. Due to the relatively high concentration of Ti in the brazing alloy, the braze matrix exhibited a composite structure, composed of β-(Cu,Sn), a Cu-based solid solution, and various intermetallic compounds with different morphologies. The reaction of Ti with diamond yielded a continuous TiC layer on the surfaces of the diamond grits. On top of the TiC growth front, an intermetallic compound, composed of Sn and Ti, nucleated and grew into a randomly interwoven fine lacey structure. An interfacial structure developed as the interwoven fine lacey phase was semicoherently bonded to the TiC layer, with the Cu-based braze matrix filling its interstices. The thickness of such a composite layer was increased linearly with the square root of isothermal holding time at 925 °C, complying with the law of a diffusion-controlled process. However, at 1050 °C, the segregation behavior of Ti and Sn to the interfaces between the TiC layer and the braze matrix diminished, due to the increased solubility of Ti in the Cu-based liquid phase. The enhanced dissolution of Ti in the Cu-based liquid phase at 1050 °C also caused the precipitation of rod-like CuTi with an average diameter of about 0.2 μm during cooling. SnTi₃ was the predominant intermetallic compound and existed in three different forms in the braze matrix. It existed as interconnected grains of large size which either floated to the surface of the braze matrix or grew into faceted grains. It also exhibited a nail-like structure with a mean diameter of about 1 μm for the rod section and a lamellar structure arising from a eutectic reaction during cooling.     

Elevated temperature fracture toughness of Al-Cu-Mg-Ag sheet: Characterization and modeling

The plane-strain initiation fracture toughness (K _JICi ) and plane-stress crack growth resistance of two Al-Cu-Mg-Ag alloy sheets are characterized as a function of temperature by a J-integral method. For AA2519 +Mg+Ag, K _JICi decreases from 32.5 MPa√m at 25 °C to 28.5 MPa√m at 175 °C, while K _JICi for a lower Cu variant increases from 34.2 MPa√m at 25 °C to 36.0 MPa√m at 150 °C. Crack-tip damage in AA2519+Mg+Ag evolves by nucleation and growth of voids from large undissolved Al₂Cu particles, but fracture resistance is controlled by void sheeting coalescence associated with dispersoids. Quantitative fractography, three-dimensional (3-D) reconstruction of fracture surfaces, and metallographic crack profiles indicate that void sheeting is retarded as temperature increases from 25 °C to 150°C, consistent with a rising fracture resistance. Primary microvoids nucleate from smaller constituent particles in the low Cu alloy, and fracture strain increases. A strain-controlled micromechanical model accurately predicts K _JICi as a function of temperature, but includes a critical distance parameter (l*) that is not definable a priori. Nearly constant initiation toughness for AA2519+Mg+Ag is due to rising fracture strain with temperature, which balances the effects of decreasing flow strength, work hardening, and elastic modulus on the crack-tip strain distribution. Ambient temperature toughnesses of the low Cu variant are comparable to those of AA2519+Mg+Ag, despite increased fracture strain, because of reduced constituent spacing and l*.