A new CR-delay circuit technology for high-density and high-speedDRAMs

The capacitance-resistance (CR) delay circuit technology assures full asynchronicity between memory cell array and peripheral circuits over a wide range of both operating and process conditions and thus realizes a fast access time. A noise compensation scheme is used to generate a constant delay even under the power supply line noise. The circuit was applied to a 4 Mbit dynamic RAM (DRAM) peripheral circuit. As a result, timing loss as well as malfunction could be successfully avoided, and 7 ns faster access time and 39 ns shorter cycle time, compared with a conventional design using normal inverter chains, have been achieved     

A 100-MHz 4-Mb cache DRAM with fast copy-back scheme

A 4-Mb cache dynamic random access memory (CDRAM), which integrates 16-kb SRAM as a cache memory and 4-Mb DRAM into a monolithic circuit, is described. This CDRAM has a 100-MHz operating cache, newly proposed fast copy-back (FCB) scheme that realizes a three times faster miss access time over with the conventional copy-back method, and maximized mapping flexibility. The process technology is a quad-polysilicon double-metal 0.7-μm CMOS process, which is the same as used in a conventional 4-Mb DRAM. The chip size of 82.9 mm² is only a 7% increase over the conventional 4-Mb DRAM. The simulated system performance indicated better performance than a conventional cache system with eight times the cache capacity     

A 45 nm 2-port 8T-SRAM Using Hierarchical Replica Bitline Technique With Immunity From Simultaneous R/W Access Issues

We propose a new 2-port SRAM with a single read bit line (SRBL) eight transistors (8 T) memory cell for a 45 nm system-on-a-chip (SoC). Access time tends to be slower as a fabrication is scaled down because of threshold voltage (V_t) random variations. A divided read bit line scheme with shared local amplifier (DBSA) realizes fast access time without increasing area penalty. We also show an additional important issue of a simultaneous read and write (R/W) access at the same row by using DBSA with the SRBL-8T cell. A rise of the storage node causes misreading. A read end detecting replica circuit (RER) and a local read bit line dummy capacitance (LDC) are introduced to solve this issue. A 128 bit lines - 512 word lines 64 kb 2-port SRAM macro using these schemes was fabricated by a 45 nm bulk CMOS low-standby-power (LSTP) CMOS process technology [1]. The memory cell size is 0.597 mum². This 2-port SRAM macro achieves 7 times faster access time without misreading.     

A 62-ns 16-Mb CMOS EPROM with voltage stress relaxation technique

To meet the increasing demand for higher-density and faster EPROMs, a 16-Mb CMOS EPROM has been developed based on 0.6-μm N-well CMOS technology. In scaled EPROMs, it is important to guarantee device reliability under high-voltage operation during programming. By employing internal programming-voltage reduction and new stress relaxation circuits, it is possible to keep an external programming voltage V_pp of 12.5 V. The device achieves a 62-ns access time with a 12-mA operating current. A sense-line equalization and data-out latching scheme, made possible by address transition detection (ATD), and a bit-line bias circuit with two types of depletion load led to the fast access time with high noise immunity. This 16-Mb EPROM has pin compatibility with a standard 16-Mb mask-programmable ROM (MROM) and is operative in either word-wide or byte-wide READ mode. Cell size and chip size are 2.2 μm×1.75 μm and 7.18 mm×17.39 mm, respectively     

A circuit technology for sub-10-ns ECL 4-Mb BiCMOS DRAM's

The feasibility of realizing an emitter-coupled-logic (ECL) interface 4-Mb dynamic RAM (DRAM) with an access time under 10 ns using 0.3-μm technology is explored, and a deep submicrometer BiCMOS VLSI using this technology is proposed. Five aspects of such a DRAM are covered. They are the internal power supply voltage scheme using on-chip voltage limiters, an ECL DRAM address buffer with a reset function and level converter, a current source for address buffers compensated for device parameter fluctuation, an overdrive rewrite amplifier for realizing a fast cycle time, and double-stage current sensing for the main amplifier and output buffer. Using these circuit techniques, an access time of 7.8 ns is expected with a supply current of 198 mA at a 16-ns cycle time     

Josephson memory technology

Memory circuit architecture (decoder, cell, cell array, and sense circuit) is surveyed, with emphasis on implementing a memory with fast access and low power consumption. Recent progress in fabrication and circuit technology has improved memory performance. An AC powering scheme, instead of the earlier DC system, has been developed. The AC powering scheme eliminates complicated timing control, which restricts shortening access time, but introduces large power consumption and in-phase powering problems. A parallel decoding scheme that decreases the number of decoding stages is presented. It will decrease the decoding time and AND scheme decoder. An attractive OR-inverter scheme has been proposed for a decoder suitable for a memory with a large capacity. The chip performance strongly depends not only on whether the read mode is destructive or nondestructive but also on the cell connection method, which determines the line inductance. Because the cell input line inductance depends on layered construction of the lines, a planarizing technology for an Nb Josephson integrated circuit has been developed to reduce line inductance by thinning the insulators. Access time of less than 0.5 ns has been confirmed in 1-kb and 4-kb memories using the proposed memory architecture     

A 14-ns 14-Mb CMOS DRAM with 300-mW active power

A 4-Mb high-speed DRAM (HSDRAM) has been developed and fabricated by using 0.7-μm L_eff CMOS technology with PMOS arrays inside n-type wells and p-type substrate plate trench cells. The 13.18-mm×6.38-mm chip, organized as either 512 K word×8 b or 1 M word×4 b, achieves a nominal random-access time of 14 ns and a nominal column-access time of 7 ns, with a 3.6-V V_cc and provision of address multiplexing. The high level of performance is achieved by using a short-signal-path architecture with center bonding pads and a pulsed sensing scheme with a limited bit-line swing. A fast word-line boosting scheme and a two-stage word-line delay monitor provide fast word-line transition and detection. A new data output circuit, which interfaces a 3.6-V V_cc to a 5-V bus with an NMOS-only driver, also contributes to the fast access speed by means of a preconditioning scheme and boosting scheme. Limiting the bit-line voltage swing for bit-line sensing results in a low power dissipation of 300 mW for a 60-ns cycle time     

A 3.5-ns, 500-mW, 16-kbit BiCMOS ECL RAM

A 16-kbit BiCMOS ECL SRAM with a typical address access time of 3.5 ns and 500-mW power dissipation was developed. The RAM was fabricated using half-micrometer, triple-poly, and triple-metal BiCMOS technology. The fast access time with moderate power dissipation has been achieved using new circuit techniques: a grounded-gate, nonlatching-type level converter with a wired-OR predecoder and a direct column sensing scheme having a cascode differential amplifier. As a result of extensive use of high-speed bipolar ECL circuits with self-aligned bipolar transistors, the RAM attains high-speed performance without degrading the low-power BiCMOS RAM characteristics.<>     

A full bit prefetch DRAM sensing circuit

A DRAM sensing circuit that achieves both a fast RAS access time and a high-bandwidth burst operation is proposed. For the data burst capability of synchronous DRAM's, 256-bit-long data I/O lines are divided into eight segments. A small local latch is provided for each segment of 32 bit-line pairs to prefetch eight data out of the 256 sense amplifiers. A local buffer is connected to eight local latches through selection switches. Burst read operations, up to eight bits, are done by activating selection switches and the local buffer serially. Besides this prefetch capability, the segmented data I/O line results in very small capacitance, only 0.09 pF. The sensing scheme uses nMOS bit switches and a full Vdd precharge voltage for bit and segmented data I/O lines. Then, after sense amplifiers are turned on, only low-going bit lines are connected to the segmented data I/O lines without any voltage disturbance because of the small capacitance. The proposed circuit, therefore, realizes a high-speed RAS access, which is 16 ns faster than a conventional DRAM. A circuit layout design based on a 0.5-μm design rule shows no area impact     

An eight-bit prefetch circuit for high-bandwidth DRAM's

A low-power and area-efficient data path circuit for high-bandwidth DRAMs is described. For fast burst read operations, eight data per data I/O are stored in local latches placed close to sense amplifiers. As implemented in a 16-Mb synchronous DRAM (SDRAM), this 8-b prefetch circuit allows an early precharge command and a fast access time because it provides low-capacitance data lines for segmented bit-line pairs. At a column address strobe (CAS) latency of two and a burst length of four, the SDRAM demonstrates 100-MHz seamless read operations from different row addresses, because the row precharge and read access latencies are hidden during the burst cycles. The layout of the prefetch circuit is not limited by the bit-line pitch, and data path circuits are connected by a second-metal layer over the memory cells. As a result, a small chip size of 99.98 mm² is attained. Low-capacitance data lines and small local latches result in low active power. In a 100-MHz full-page burst mode, the SDRAM with a 1 M×16-b configuration dissipates 60 mA at 3.6 V     

A step-down boosted-wordline scheme for 1-V battery-operated fastSRAM's

Fast and low-power circuit techniques for battery-operated low-voltage SRAM's are described. To shorten the read access time with low power dissipation, the step-down boosted-wordline scheme, which is combined with current-sense amplifiers, is proposed. Boosting a selected-wordline voltage shortens the bitline delay before the stored data are sensed. The power dissipation while selecting a wordline is suppressed by stepping down the selected-wordline potential. Moreover, to reduce the standby power, a switched-capacitor-type boosted-pulse generator, which is controlled by an address transition detection (ATD) signal, is used. A 61 kword×16-bit organization SRAM test chip was fabricated using the 0.5-μm multithreshold-voltage CMOS (MTCMOS) process. The power dissipation in the memory array is reduced to 57% (1 mW) at 10 kHz operation in comparison with the conventional boosted-wordline scheme     

Automated bias control (ABC) circuit for high-performance VLSIs

A biasing scheme for sensing circuits, namely an automated bias control (ABC) circuit, for high-performance VLSIs is described. The ABC circuit can automatically gear the output level of sensing circuits to the input threshold voltage of the succeeding CMOS converters. The sensing performance can be accelerated with the ABC circuit either by reducing the excessive signal level margin between the sensing circuits and the CMOS converters or by reducing extra stages of signal amplification. Since feedback control of the ABC circuit ensures correct DC biasing even under large process deviations and circuit condition changes, a wider operation margin can also be obtained. Three successful applications of the ABC circuit are reported: a sense amplifier, an address transition detector (ATD), and an ECL-CMOS input buffer. A 64-kb BiCMOS SRAM employing the proposed sense amplifier and the ATD has been fabricated with a 0.8-μm 9-GHz BiCMOS technology. The SRAM has an address access time of 4.5 ns     

Variation resilient subthreshold SRAM cell design technique

This article presents a circuit technique for designing a variability resilient subthreshold static random access memory (SRAM) cell. The architecture of the proposed cell is similar to the conventional 10T SRAM cell with the exception that dynamic threshold MOS is used for the read/write access FETs and cell content body bias scheme is used for bitline droppers (FETs used to drop bitlines). Moreover, the proposed bitcell utilises single differential port unlike conventional 10T bitcell which utilises dual differential ports. The proposed design offers 2.1× improvement in T _RA (read access time) and 3.2× improvement in T _WA (write access time) compared to CON10T at iso-device-area and 200?mV. It exhibits three roots in its read voltage transfer characteristic (VTC) even at 150?mV showing its ability to function as a bistable circuit. The combination of write and read VTCs for write static noise margin of the proposed design also shows single root signifying its write-ability even at 150?mV. It proves its robustness against process variations by featuring narrower spread in T _RA distribution (by 1.3×) and in T _WA distribution (by 1.2×) at 200?mV.     

A 4-Mbit CMOS EPROM

A high-density (512K-word/spl times/8-b) erasable programmable read-only memory (EPROM) has been designed and fabricated by using 0.8-/spl mu/m n-well CMOS technology. A novel chip layout and a sense-amplifier circuit produce a 120-ns access time and a 4-mA operational supply current. The interpoly dielectric, composed of a triple-layer structure, realizes a 10-/spl mu/s/byte fast programming time, in spite of scaling the programming voltage V/SUB PP/ from 12.5 V for a 1-Mb EPROM to 10.5 V for this 4-Mb EPROM. To meet the increasing demand for a one-time programmable (OTP) ROM, a circuit is implemented to monitor the access time after the assembly. A novel redundancy scheme is incorporated to reduce additional tests after the laser fuse programming. Cell size and chip size are 3.1/spl times/2.9 /spl mu/m/SUP 2/ and 5.86/spl times/14.92 mm/SUP 2/, respectively.     

A 12-ns 8-Mbyte DRAM secondary cache for a 64-bit microprocessor

This paper describes three circuit technologies that have been developed for high-speed large-bandwidth on-chip DRAM secondary caches. They include a redundancy-array advanced activation scheme, a bus-assignment-exchangeable selector scheme and an address-zero access refresh scheme. By using these circuit technologies and new small subarray structures, a row-address access time of 12 ns and a row-address cycle time of 16 ns were obtained. An experimental chip made up of an 8-Mbyte DRAM and a 64-bit microprocessor was developed using 0.25-μm merged logic and DRAM process technology     

A 3.3-V 12-ns 16-Mb CMOS SRAM

A 16-Mb CMOS SRAM having an access time of 12 ns under a 3.3-V supply has been developed with a 0.4-μm process technology. An address access time of 12 ns has been achieved by an optimized architecture, the use of an automated transistor size optimizer, and a read-bus midlevel preset scheme (RBMIPS). For better yield and efficient testing, an on-chip test circuit with three test modes has been implemented     

A 6-ns 1-Mb CMOS SRAM with latched sense amplifier

A 1-Mb (256 K×4) CMOS SRAM with 6-ns access time is described. The SRAM, having a cell size of 3.8 μm×7.2 μm and a die size of 6.09 mm×12.94 mm, is fabricated by using 0.5-μm triple-polysilicon and double-metal process technology. The fast access time and low power dissipation of 52 mA at 100-MHz operation are achieved by using a new NMOS source-controlled latched sense amplifier and a data-output prereset circuit. In addition, an equalizing technique at the end of the write operation is used to avoid lengthening of access time in a read cycle following a write cycle     

A driving scheme for active-matrix organic light-emitting diode displays based on feedback

A scheme of driving active matrix organic light emitting diode (AMOLED) displays with hydrogenated amorphous silicon (a-Si) thin-film transistors (TFTs) is presented. By sending a feedback voltage from each pixel to a column driver during the programming cycle, the driving scheme can compensate for the instability of the TFTs, in particular, the shift in the threshold voltage. Measurement results show no change in the OLED current in the presence of a 1.3-V shift in the threshold voltage. Based on circuit analysis, a simple lead compensator and an accelerating pulse were employed to achieve fast pixel programming for a wide range of OLED currents. Simulation results show a programming time of less than 70 /spl mu/s for OLED currents as low as 50 nA.     

A 29-ns 64-Mb DRAM with hierarchical array architecture

A 29-ns (RAS access time), 64-Mb DRAM with hierarchical array architecture has been developed. For consistent high yields and high speed, a CMOS segment driver circuit is used as a hierarchical word line scheme. To achieve high speed, precharge signal (PC) drivers for equalizing the bit lines pairs, and shared sense amplifier signal (SHR) drivers are distributed in the array. To enhance sense amplifiers speed in low array voltage, an over driven sense amplifier is adopted. A hierarchical I/O scheme with semidirect sensing switch is introduced for high speed data transfer in the I/O paths. By combining these proposed circuit techniques and 0.25-μm CMOS process technologies with phase-shift optical lithography, an experimental 64-Mb DRAM has been designed and fabricated. The memory cell size is 0.71×1.20 μm ², and the chip size is 15.91×9.06 mm². A typical access time under 3.3 V power supply voltage is 29 ns     

A 20-ns 4-Mb CMOS SRAM with hierarchical word decoding architecture

A 20 ns 4-Mb CMOS SRAM operating at a single supply voltage of 3.3 V is described. The fast access time has been achieved by a newly proposed word-decoding architecture and a high-speed sense amplifier combined with the address transition detection (ATD) technique. The RAM has the fast address mode, which achieves quicker than 10-ns access, and the 16-b parallel test mode for the reduction of test time. A 0.6-μm process technology featuring quadruple-polysilicon and double-metal wiring is adopted to integrate more than 16 million transistors in a 8.35-mm×18.0-mm die