Effect of evaporated copper and aluminum on post-annealed SiOC(-H) films deposited using plasma-enhanced chemical vapor deposition

Low dielectric constant SiOC(-H) films were deposited on p-type Si(100) substrates by plasma-enhanced chemical vapor deposition (PECVD) using dimethyldimethoxysilane (DMDMOS, C₄H₁₂O₂Si) and oxygen gas as precursors. We studied the detailed electrical characterization of SiOC(-H)/p-Si(100) interfaces using different experimental parameters for using the multilevel interconnections in ultra large-scale integrated circuits (ULSI). To improve the SiOC(-H)/p-Si(100) interface, the wafer was cleaned using the RCA process and rinsed with deionized water. The deposited SiOC(-H) films were annealed at different temperatures ranging from 250 to 450 °C in a vacuum. The interface properties of the SiOC(-H)/p-Si(100) with Cu/SiOC(-H)/p-Si(100)/Al metal-insulator-semiconductor (MIS) structures were investigated by capacitance-voltage (C-V) measurement with a flat band shift by electric field stress. Trapped charge, fixed oxide charge, and the interface trap density of SiOC(-H) films were related to the dielectric breakdown and leakage current density at the SiOC(-H)/p-Si(100) interface. From these analyses, detailed electrical properties defining the interface states of the MIS structures were reported.     

The structures of low dielectric constant SiOC thin films prepared by direct and remote plasma enhanced chemical vapor deposition

Two structures of low dielectric constant (low-k) SiOC films were elucidated in this work. Low-k thin film by remote plasma mode was mainly composed of inorganic Si-O-Si backbone bonds and some oxygen atoms are partially substituted by CH₃, which lowers k value. The host matrix of low-k thin films deposited by direct plasma mode, however, was mainly composed of organic C-C bonds and “M” and “D” moieties of organosilicate building blocks, and thus the low dipole and ionic polarizabilities were the important factors on lowering k value.     

Mechanical characterization of zeolite low dielectric constant thin films by nanoindentation

With semiconductor technologies continuously pushing the miniaturization limits, there is a growing interest in developing novel low dielectric constant materials to replace the traditional dense SiO₂ insulators. In order to survive the multi-level integration process and provide reliable material and structure for the desired integrated circuits (IC) functions, the new low-k materials have to be mechanically strong and stable. Therefore the material selection and mechanical characterization are vital for the successful development of next generation low-k dielectrics. A new class of low-k materials, nanoporous pure-silica zeolite, is prepared in thin films using IC compatible spin coating process and characterized using depth sensing nanoindentation technique. The elastic modulus of the zeolite thin films is found to be significantly higher than that of other low-k materials with similar porosity and dielectric constants. Correlations between the mechanical, microstructural and electrical properties of the thin films are discussed in detail.     

Plasma enhanced chemical vapor deposition of low dielectric constant SiOC(-H) films using MTES/O2 precursor

Low dielectric constant SiOC(-H) thin films were deposited by plasma enhanced chemical vapor deposition (PECVD) using methyltriethoxysilane (MTES) and oxygen as precursors. The SiOC(-H) films were prepared with MTES/O₂ flow rate ratio of 80%, rf power of 700 W and the working pressure was varied from 110 to 150 mTorr. Then the films were annealed at different temperatures in an Ar ambient for 30 min in order to study their thermal stability. Film thickness and refractive index were measured by SEM and ellipsometry, respectively. Bonding characteristics of the films were investigated by Fourier transform infrared (FTIR) spectroscopy. The dielectric constant of SiOC(-H) film was evaluated by C-V measurements using Al/SiOC(-H)/p-Si structure. The dielectric constants as low as 2.4 have been obtained for the film annealed at 500 °C with the working pressure of 150 mTorr. The annealing treatment was found to reduce dielectric constant significantly due to abundant incorporation of methyl group into the Si-O network. These results demonstrated the promising characteristics of SiOC(-H) thin films deposited by using oxygen and MTES precursor.     

Ultraviolet irradiation effect on the properties of leakage current and dielectric breakdown of low-dielectric-constant SiOC(H) films using comb capacitor structure

Low-dielectric constant SiOC(H) films were deposited on p-type Si(100) substrates by plasma-enhanced chemical-vapor deposition (PECVD) using dimethyldimethoxy silane (DMDMS, C₄H₁₂O₂Si) and oxygen gas as precursors. To improve the physicochemical properties of the SiOC(H) films, the deposited SiOC(H) films were exposed to ultraviolet (UV) irradiation in a vacuum. The bonding structure of the SiOC(H) films was investigated by Fourier transform infrared (FTIR) spectroscopy and X-ray photoelectron spectroscopy (XPS). The electrical characterization of SiOC(H) films were carried out through I-V measurements using the comb-like patterns of the TiN/Al/Ti/SiOC(H)/TiN/Al/Ti metal-insulator-metal (MIM) structure. Excessive UV treatment adversely affected the SiOC(H) film, which resulted in an increased dielectric constant. Our results provide insight into the UV irradiation of low-k SiOC(H) films.     

Characterization and tribological application of diamond-like carbon (DLC) films prepared by radio-frequency plasma-enhanced chemical vapor deposition (RF-PECVD) technique

Diamond-like carbon (DLC) films were successfully prepared on glass substrates and surfaces of selenium drums via radio frequency plasma enhanced chemical vapor deposition method. The microstructure, surface morphology, hardness, film adhesion, and tribological properties of the films were characterized and evaluated by X-ray photoelectron spectroscopy, atomic force microscopy, and micro-sclerometer and friction-wear spectrometer. The results showed that DLC films have smooth surfaces, homogeneous particle sizes, and excellent tribological properties, which can be used to improve the surface quality of the selenium drums and prolong their service life.     

Microstructure and electrical properties of Cu films obtained by chemical vapor deposition of copper(I) pentafluoropropionate complexes with vinyltrialkylsilanes

Copper thin layers were deposited on Si(111) and glass substrates by chemical vapor deposition method using [Cu(OOCC₂F₅)(L)], L = vinyltrimethylsilane (1), vinyltriethylsilane (2) as precursors. Application of multistage depositions of Cu films on a glass surfaces resulted in formation of the metallic membranes. Fabricated crystalline copper layers, which contains some carbon (5-9%) and oxygen (1-5%) impurities, have been characterized by grazing incidence X-ray diffraction and X-ray photoelectron methods. The morphology studies exhibited metallic layers composed of copper grains, their size and packed density depends on deposition parameters. Electrical properties of metallic films were studied by four-point probe, as a function of temperature in 103-333 K range.     

Effect of lattice-mismatch strain on the structural and dielectric properties of (Pb,Sr)TiO3 thin films grown by pulsed laser deposition

Pb_0.35Sr_0.65TiO₃ (PST) thin films have been fabricated on LaAlO₃ (LAO) and MgO substrates using the pulsed laser deposition technique. The microstructure characteristics of the films were examined by means of X-ray diffraction, atomic force microscopy, scanning electron microscopy and Raman spectroscopy, and the results indicate that the films are epitaxially grown and show good crystallinity. The dielectric constant dependence on DC bias voltage and temperature were measured in a planar capacitor configuration for these films. Compared to the PST thin film grown on LAO, the film grown on MgO showed a higher temperature of the capacitance maximum and a higher dielectric constant at zero bias. We explain the results by taking into account the lattice-mismatch strain between the substrate and the film. In contrast to the in-plane compressive strain induced by the LAO substrate, the in-plane tensile strain induced by the MgO substrate enlarges the unit cell of PST and enhances the magnitude of dipole moments, which increases the dielectric constant. These results indicate that a reasonable in-plane tensile strain could improve the dielectric properties of PST thin films.     

The effect of geometrical misfit dislocation on formation of microstructure and photoluminescence of Wurtzite GaN/Al2O3 (0001) films grown by low pressure metal-organic chemical vapor deposition

The incoherent GaN/sapphire interface and microstructure of GaN were observed by high resolution transmission electron microscopy. The most mobile 60° mixed-type dislocation is related to a structural metastability of the Wurtzite GaN film. In spite of the same feature of interband absorption, the photoluminescence mechanism is sensitive to deep level. A strong light emission from the bound exciton of Wurtzite GaN at 358 nm was observed in an n-type GaN sample with the GaN buffer layer. The donor–acceptor pair recombination at 380 nm with LO phonon replicas at 390 and 403 nm and the deep level at 559 nm were observed in both an undoped GaN sample with GaN buffer layer and an n-type GaN sample with AlN buffer layer. This optical behavior is sensitive to the Si doping and the type of buffer layer materials. The deep level emission along the dislocation line is suggested by the local band bending model providing the potential barrier of 0.63 eV by the space charge.     

Band gap optimization in Cu(In1 − xGax)(Se1 − ySy)2 by controlled Ga and S incorporation during reaction of Cu-(In,Ga) intermetallics in H2Se and H2S

A large number of companies around the world are developing a variety of manufacturing approaches aimed at low-cost, high throughput, large area CIS-based photovoltaic modules that maintain laboratory-scale cell efficiencies. The most critical technological issue, which directly impacts on the cost-of-ownership of large-scale production, is the specific technology employed for the deposition of the chalcopyrite absorber film. In standard reactive annealing processes, the complex reaction kinetics during the chalcogenization of the precursor film, results in phase segregated multinary alloys. This in turn results in compositionally graded absorber films, which could adversely affect the performance of devices, if grading is not carefully controlled through proper process control. Against this background, a clear understanding of the reaction paths for the formation of the chalcopyrite multinary alloys is essential. In this paper, the details of a fast solid-state reaction process producing single-phase homogeneous Cu(In_1 − xGa_x)(Se_1 − yS_y)₂ alloys, are discussed. The most significant material properties of the resulting single-phase chalcopyrite alloys, as well as the corresponding device characteristics, are also reviewed. This technology has been successfully demonstrated in a pilot facility at the University of Johannesburg and is currently been applied on a commercial level by Johanna Solar Technology GmbH.