Order-disorder phase transitions and high-temperature oxide ion conductivity of Er2+xTi2−xO7−δ (x = 0, 0.096)

The Er_2+xTi_2−xO_7−δ (x = 0.096; 35.5 mol% Er₂O₃) solid solution and the stoichiometric pyrochlore-structured compound Er₂Ti₂O₇ (x = 0; 33.3 mol% Er₂O₃) are characterized by X-ray diffraction (phase analysis and Rietveld method), thermal analysis and optical spectroscopy. Both oxides were synthesized by thermal sintering of co-precipitated powders. The synthesis study was performed in the temperature range 650-1690 °C. The amorphous phase exists below 700 °C. The crystallization of the ordered pyrochlore phase (P) in the range 800-1000 °C is accompanied by oxygen release. The ordered pyrochlore phase (P) exists in the range 1000−1200 °C. Heat-treatment at T ≥ 1600 °C leads to the formation of an oxide ion-conducting phase with a distorted pyrochlore structure (P2) and an ionic conductivity of about 10⁻³ S/cm at 740 °C. Complex impedance spectra are used to separately assess the bulk and grain-boundary conductivity of the samples. At 700 °C and oxygen pressures above 10⁻¹⁰ Pa, the Er_2+xTi_2−xO_7−δ (x = 0, 0.096) samples are purely ionic conductors.     

Effect of yttrium doping on the dielectric properties of CaCu3Ti4O12 thin film produced by chemical solution deposition

Pure and yttrium substituted CaCu₃Ti_4 − xY_xO_{12 − x / 2} (x = 0, 0.02, 0.1) thin films were prepared on boron doped silica substrate employing chemical solution deposition, spin coating and rapid thermal annealing. The phase and microstructure of the sintered films were examined using X-ray diffraction and scanning electron microscopy. Dielectric properties of the films were measured at room temperature using electrochemical impedance spectroscopy. Highly ordered polycrystalline CCTO thin film with bimodal grain size distribution was achieved at a sintering temperature of 800 °C. Yttrium doping was found to have beneficial effects on the dielectric properties of CCTO thin film. Dielectric parameters obtained for a CaCu₃Ti_4 − xY_xO_{12 − x / 2} (x = 0.02) film at 1 KHz were k ∼ 2700 and tan δ ∼ 0.07.     

Deposition and post-deposition annealing of thin Y2O3 film on n-type Si in argon ambient

Thin (∼5.0 nm) Y₂O₃ films were deposited on n-type Si (1 0 0) substrate using RF magnetron sputtering. Detailed studies on the effects of post-deposition annealing (PDA) temperatures (400, 600, 800, and 1000 °C) in argon ambient on these films were performed by X-ray diffraction (XRD), Fourier transform infrared spectrometer (FTIR), field emission scanning electron microscopy, and atomic force microscopy. Interfacial layer (IL) of SiO₂ in between Y₂O₃ and the Si substrate for sample annealed from 400 to 800 °C had been suggested from the results of FTIR. As for sample annealed at 1000 °C, presence of IL might consist of both Y₂Si₂O₇ and/or SiO₂ through the detection of Y₂Si₂O₇ compound and Si–O chemical bonding from XRD and FTIR analysis, respectively. For as-deposited sample, no detectable chemical functional group at the IL was recorded. Electrical characteristics of the Y₂O₃ films were acquired by fabricating metal-oxide–semiconductor capacitor as test structure. An improvement in the breakdown voltage (V_B) and leakage current density (J) was perceived as the PDA temperature increased. Of the PDA samples, the attainment of the lowest effective oxide charge, interface trap density, total interface trap density, and the highest barrier height at 1000 °C had contributed to the acquisition of the highest V_B and lowest J.     

La-substitution Bi2Ti2O7 thin films grown by chemical solution deposition

(La_0.05Bi_0.95)₂Ti₂O₇ (LBTO) thin films had been successfully prepared on P-type Si substrate by chemical solution deposition method. The structural properties of the films were studied by X-ray diffraction. The phase of (La_0.05Bi_0.95)₂Ti₂O₇ is more stable than the phase of Bi₂Ti₂O₇ without La substitution. The films exhibited good insulating properties with room temperature resistivities in the range of 10¹²-10¹³ Ω cm. The dielectric constant of the film annealed at 550 °C at 100 kHz was 157 and the dissipation factor was 0.076. The LBTO thin films can be used as storage capacitors in DRAM.     

Luminescent properties of Gd2Ti2O7: Eu phosphor films prepared by sol-gel process

Gd₂Ti₂O₇: Eu³⁺ thin film phosphors were fabricated by a sol-gel process. X-ray diffraction (XRD), atomic force microscopy (AFM) and photoluminescence (PL) spectra as well as lifetimes were used to characterize the resulting films. The results of XRD indicated that the films began to crystallize at 800 °C and the crystallinity increased with the elevation of annealing temperatures. Uniform and crack free phosphor films were obtained, which mainly consisted of grains with an average size of 70 nm. The doped Eu³⁺ showed orange-red emission in crystalline Gd₂Ti₂O₇ phosphor films due to an energy transfer from Gd₂Ti₂O₇ host to them. Both the lifetimes and PL intensity of the Eu³⁺ increased with increasing the annealing temperature from 800 to 1000 °C, and the optimum concentrations for Eu³⁺ were determined to be 9 at.%. of Gd³⁺ in Gd₂Ti₂O₇ film host.     

V-doping effects on ferroelectric properties of K0.5Bi4.5Ti4O15 thin films

V-doped K_0.5Bi_4.5Ti₄O₁₅ (K_0.5Bi_{4.5 − x/3}Ti_4 − xV_xO₁₅, KBTiV-x, x = 0.00, 0.01, 0.03, and 0.05) thin films were prepared on a Pt(111)/Ti/SiO₂/Si(100) substrate by a chemical solution deposition method. The thin films were annealed by using a rapid thermal annealing process at 750 °C for 3 min in an oxygen atmosphere. Among them, KBTiV-0.03 thin film exhibited the most outstanding electrical properties. The value of remnant polarization (2P_r) was 75 μC/cm² at an applied electric field of 366 kV/cm. The leakage current density of the thin film capacitor was 5.01 × 10⁻⁸ at 100 kV/cm, which is approximately one order of magnitude lower than that of pure K_0.5Bi_4.5Ti₄O₁₅ thin film capacitor. We found that V doping is an effective method for improving the ferroelectric properties of K_0.5Bi_4.5Ti₄O₁₅ thin film.     

Ferroelectric properties of Bi3.4Dy0.6Ti3O12 thin films crystallized in N2

Bi_3.4Dy_0.6Ti₃O₁₂ (BDT) ferroelectric thin films were deposited on Pt/Ti/SiO2/Si substrates by chemical solution deposition (CSD) and annealed in an N₂ environment after pre-annealing in air at 400 °C. The effect of crystallization temperature on the structural and electrical properties of the BDT films was studied. The BDT films annealed in N₂ in the temperature range of 600 °C to 750 °C were crystallized well and the average grain size increased with increasing crystallization temperature, while the remanent polarization of the films is not a monotonic function of the crystallization temperature. The BDT films crystallized at 650 °C have the largest remanent polarization value of 2P_r = 39.4 μC/cm², and a fatigue-free characteristic.     

Influence of annealing on humidity response of RF sputtered nanocrystalline MgFe2O4 thin films

Humidity response of Radio Frequency sputtered MgFe₂O₄ thin films onto alumina substrate, annealed at 400 °C, 600 °C and 800 °C has been investigated. Crystalline phase formation of thin films annealed at different temperature was analyzed by X-ray Diffraction. A particle/grain like microstructure in the grown thin films was observed by Scanning Electron Microscope and Atomic Force Microscope images. Film thickness for different samples was measured in the range 820-830 nm by stylus profiler. Log R (Ω) response measurement was taken for all thin films for 10-90% relative humidity (% RH) change at 25 °C. Resistance of the film increased from 5.9 × 10¹⁰ to 3 × 10¹² at 10% RH with increase in annealing temperature from 400 °C to 800 °C. A three-order magnitude, 10¹² Ω to 10⁹ Ω drop in resistance was observed for the change of 10 to 90% RH for 800 °C annealed thin film. A good linear humidity response, negligible humidity hysteresis and minimum response/recovery time of 4 s/6 s have been measured for 800 °C annealed thin film.     

Studying trivalent/bivalent metal ion doped TiO2 as p-TiO2 in bipolar heterojunction devices

Trivalent/bivalent metal ions doped TiO₂ thin films (M_xTi_1−xO₂, M = Cr³⁺, Fe³⁺, Ni²⁺, Co²⁺, Mn²⁺ and x = 0.01, 0.05, 0.1, 0.15, 0.2) were deposited on Indium–tin oxide (ITO) coated glass substrates by spin coating technique. X-ray photoelectron spectroscopy (XPS) showed Ti⁴⁺ oxidation state of the Ti2p band in the doped p-TiO₂. The homogenous M_xTi_1−xO₂ was used to support n-ZnO thin films with thickness ∼40–80 nm and vertically aligned n-ZnO nanorods (NR) with length ∼300 nm and 1.5 μm. Current (I)–voltage (V) characteristics for the Ag/n-ZnO/M_xTi_1−xO₂/ITO/glass assembly showed rectifying behavior with small turn-on voltages (V₀) < 1 V. The ideality factor (η) and the resistances in both forward and reverse bias were calculated. The temperature dependence performance of these bipolar devices was performed and variation of the parameters with temperature was studied.     

Properties of La-substituted Na0.5Bi4.5Ti4O15 ferroelectric thin films

Ferroelectric Na_0.5La_0.5Bi₄Ti₄O₁₅ (NaLaBTi) thin films were prepared by a chemical solution deposition method. The NaLaBTi thin films annealed at 750 °C under oxygen atmosphere were randomly oriented polycrystalline. Electrical properties of the NaLaBTi thin films were compared to Na_0.5Bi_4.5Ti₄O₁₅ thin films and better properties were observed in the NaLaBTi thin films. Remnant polarization (2P_r) and coercive electric field (2E_c) were 43 µC/cm² and 204 kV/cm at an applied electric field of 478 kV/cm, respectively. Leakage current density was 1.95 × 10^− 6 A/cm² at 100 kV/cm. Dielectric constant and dielectric loss were 805 and 0.05 at 1 kHz, respectively. Switchable polarization was suppressed by 15% after 1.44 × 10¹⁰ switching cycles.     

Structure and thermal conductivity of Gd2(TixZr1 − x)2O7 ceramics

The Gd₂(Ti_xZr_1 − x)₂O₇ (x = 0, 0.25, 0.50, 0.75, 1.00) ceramics were synthesized by solid state reaction at 1650 °C for 10 h in air. The relative density and structure of Gd₂(Ti_xZr_1 − x)₂O₇ were analyzed by the Archimedes method and X-ray diffraction. The thermal diffusivity of Gd₂(Ti_xZr_1 − x)₂O₇ from room temperature to 1400 °C was measured by a laser-flash method. The Gd₂Zr₂O₇ has a defect fluorite-type structure; however, Gd₂(Ti_xZr_1 − x)₂O₇ (0.25 ≤ x ≤ 1.00) compositions exhibit an ordered pyrochlore-type structure. Gd₂Zr₂O₇ and Gd₂Ti₂O₇ are infinitely soluable. The thermal conductivity of Gd₂(Ti_xZr_1 − x)₂O₇ increases with increasing Ti content under identical temperature conditions. The thermal conductivity of Gd₂(Ti_xZr_1 − x)₂O₇ first decreases gradually with the increase of temperature below 1000 °C and then increases slightly above 1000 °C. The thermal conductivity of Gd₂(Ti_xZr_1 − x)₂O₇ is within the range of 1.33 to 2.86 W m^− 1 K^− 1 from room temperature to 1400 °C.     

Enhancement on effective piezoelectric coefficient of Bi3.25Eu0.75Ti3O12 ferroelectric thin films under moderate annealing temperature

Bi_3.25Eu_0.75Ti₃O₁₂ (BET) thin films were deposited on Pt/Ti/SiO₂/Si(111) substrates by a metal-organic decomposition method. The effects of annealing temperatures 600-800 °C on microstructure, ferroelectric, dielectric and piezoelectric properties of BET thin films were studied in detail. The spontaneous polarization (87.4 × 10^− 6 C/cm² under 300 kV/cm), remnant polarization (65.7 × 10^− 6 C/cm² under 300 kV/cm), the dielectric constant (992.9 at 100 kHz) and the effective piezoelectric coefficient d₃₃ (67.3 pm/V under 260 kV/cm) of BET thin film annealed at 700 °C are better than those of the others. The mechanisms concerning the dependence of the enhancement d₃₃ are discussed according to the phenomenological equation, and the improved piezoelectric performance could make the BET thin film a promising candidate for piezoelectric thin film devices.     

Synthesis of V-doped TiO2 films by chemical bath deposition and the effect of post-annealing on their properties

Amorphous composite films, composed of a Ti_1 − xV_xO₂ solid-solution phase and a V₂O₅ phase, were produced by chemical bath deposition and subsequently air-annealed at various temperatures up to 550 °C. The microstructure and chemical composition of the as-prepared and annealed films were investigated by a combinatorial experimental approach using Scanning electron microscopy, X-ray powder diffraction and X-ray photoelectron spectroscopy. Ultraviolet-Visible Spectrometry was applied to determine the optical band gap of the as-prepared and annealed films. It followed that the incorporation of vanadium in the as-deposited films reduces the optical band gap of TiO₂ from about 3.8 eV to 3.2 eV. Annealing of the films up to 350 °C leads to slight increase of band gap, as attributed to a reduction of the defect density in the initially amorphous oxide films due to the gradual development of long-range order and a concurrent reduction of the V⁴⁺-dopant concentration in the Ti_1 − xV_xO₂ solid-solution phase. The films crystallized upon annealing in air at 550 °C, which resulted in drastic changes of the phase constitution, optical absorbance and surface morphology. Due to the lower solubility of V⁴⁺ in crystalline TiO₂, V⁴⁺ segregates out of the crystallizing Ti_1 − xV_xO₂ solid-solution phase, forming crystalline V₂O₅ at the film surface.     

Effect of Cu dopant on microstructure and phase transformation of ZnTiO3 thin films prepared by radio frequency magnetron sputtering

Cu doped zinc titanate (ZnTiO₃) films were prepared using radio frequency magnetron sputtering. Subsequent annealing of the as-deposited films was performed at temperatures ranging from 600 to 900 °C. It was found that the as-deposited films were amorphous and contained 0.84 at.% Cu. This was further confirmed by the onset of crystallization that took place at annealing temperatures 600 °C. The phase transformation for the as-deposited films and annealed films was investigated in this study. The results showed that Zn₂Ti₃O₈, ZnTiO₃, and TiO₂ can coexist at 600 °C. When annealed at 700 °C, the results revealed that mainly the hexagonal ZnTiO₃ phase formed, accompanied by minority amounts of TiO₂ and Zn₂Ti₃O₈. Unlike pure zinc titanate films, this result showed that the Zn₂Ti₃O₈ phase can be stable at temperatures above 700 °C. Moreover, Cu addition in zinc titanate thin film could result in the decomposition of hexagonal (Zn,Cu) TiO₃ phase at 800 °C. When the Cu content was increased in zinc titanate thin films from 0.84 at.% to 2.12 at.%, there were only two phases; Zn₂Ti₃O₈ and ZnTiO₃, coexisting at temperatures between 700 and 800 °C. This result indicated that a greater presence of Cu dopants in zinc titanate thin films leads to the existence of the Zn₂Ti₃O₈ phase at higher temperatures.     

The properties of transparent semiconductor Zn1 − xTixO thin films prepared by the sol-gel method

Transparent semiconductor thin films of Zn_1 − xTi_xO (0 ≦ x ≦ 0.12) were deposited on alkali-free glass substrates by the sol-gel method. The effects of Ti addition on the crystallization, microstructure, optical properties and resistivity of ZnO thin films were investigated. The as-coated films were preheated at 300 °C, and then annealed at 500 °C in air ambiance. X-ray diffraction results showed all polycrystalline Zn_1 − xTi_xO thin films with preferred orientation along the (002) plane. Ti incorporated within the ZnO thin films not only decreased surface roughness but also increased optical transmittance and electrical resistivity. In the present study, the Zn_0.88Ti_0.12O film exhibited the best properties, namely an average transmittance of 91.0% (an increase of ~ 12% over the pure ZnO film) and an RMS roughness value of 1.04 nm.     

Pechini sol-gel deposition and luminescent properties of SrLa1−xRExGa3O7 (RE = Eu, Tb) phosphor films

SrLa_1−xRE_xGa₃O₇ (RE = Eu³⁺, Tb³⁺) phosphor films were deposited on quartz glass substrates by a simple Pechini sol-gel method. X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FT-IR), atomic force microscopy, field-emission scanning electron microscopy, photoluminescence spectra, and lifetimes were used to characterize the resulting films. The results of XRD indicated that the films began to crystallize at 700 °C and crystallized fully at 900 °C. The results of FT-IR spectra were in agreement with those of XRD. Uniform and crack-free films annealed at 900 °C were obtained with average grain size of 80 nm, root mean square roughness of 46 nm and thickness of 130 nm. The RE ions showed their characteristic emission in crystalline SrLa_1−xRE_xGa₃O₇ films, i.e., Eu³⁺⁵D₀-⁷F_J (J = 0, 1, 2, 3, 4), Tb³⁺⁵D₄-⁷F_J (J = 6, 5, 4, 3) emissions, respectively. The optimum concentrations (x) of Eu³⁺ and Tb³⁺ were determined to be 50, and 80 mol% in SrLa_1−xRE_xGa₃O₇ films, respectively.     

Fabrication of Y2O3-doped BaZrO3 thin films by electrostatic spray deposition

Electrostatic spray deposition (ESD) technique was used to fabricate dense Y₂O₃-doped BaZrO₃ (BYZ) thin films, which have been extensively studied for the protonic ceramic fuel cell electrolyte. Effects of the ESD process parameters (i.e. substrate temperature, type of precursor, flow rate and applied voltage) on the microstructure of as-deposited films were studied. The uniform as-deposited films were obtained using a mixture of zirconium acetylacetonate, barium chloride dihydrate and yttrium chloride hexahydrate precursors in a solvent mixture of butyl carbitol and deionized water at a volume ratio of 50:50. The optimum deposition parameters were obtained at the substrate temperature of 250 °C with the applied voltage and flow rate in a range of 10-12 kV and 1.4-2.8 ml/h, respectively. The as-deposited films were subsequently annealed at 1350 °C for 10 h to ensure the complete chemical reactions of the precursors. X-ray diffraction patterns reveal the perovskite structures of the annealed BYZ films (deposited on yttria stabilized zirconia substrates) with only traces of Y₂O₃ phase, which could arise from the loss of BaO at high annealing temperatures.     

Ti2Al(O,N) formation by solid-state reaction between substoichiometric TiN thin films and Al2O3 (0001) substrates

Titanium nitride TiN_x (0.1 ≤ x ≤ 1) thin films were deposited onto Al₂O₃(0001) substrates using reactive magnetron sputtering at substrate temperatures (T_s) ranging from 800 to 1000 °C and N₂ partial pressures (pN₂) between 13.3 and 133 mPa. It is found that Al and O from the substrates diffuse into the substoichiometric TiN_x films during deposition. Solid-state reactions between the film and substrate result in the formation of Ti₂O and Ti₃Al domains at low N₂ partial pressures, while for increasing pN₂, the Ti₂AlN MAX phase nucleates and grows together with TiN_x. Depositions at increasingly stoichiometric conditions result in a decreasing incorporation of substrate species into the growing film. Eventually, a stoichiometric deposition gives a stable TiN(111) || Al₂O₃(0001) structure without the incorporation of substrate species. Growth at T_s 1000 °C yields Ti₂AlN(0001), leading to a reduced incorporation of substrate species compared to films grown at 900 °C, which contain also Ti₂AlN(101?3) grains. Finally, the Ti₂AlN domains incorporate O, likely on the N site, such that a MAX phase oxynitride Ti₂Al(O,N) is formed. The results were obtained by a combination of structural methods, including X-ray diffraction and (scanning) transmission electron microscopy, together with spectroscopy methods, which comprise elastic recoil detection analysis, energy dispersive X-ray spectroscopy, and electron energy loss spectroscopy.     

Sol-gel preparation of near-infrared broadband emitting Er-doped SiO2-Ta2O5 nanocomposite films

This article reports a study on the preparation, densification process, and structural and optical properties of SiO₂-Ta₂O₅ nanocomposite films obtained by the sol-gel process. The films were doped with Er³⁺, and the Si:Ta molar ratio was 90:10. Values of refractive index, thickness and vibrational modes in terms of the number of layers and thermal annealing time are described for the films. The densification process is accompanied by OH group elimination, increase in the refractive index, and changes in film thickness. Full densification of the film is acquired after 90 min of annealing at 900 °C. The onset of crystallization and devitrification, with the growth of Ta₂O₅ nanocrystals occurs with film densification, evidenced by high-resolution transmission electron microscopy. The Er³⁺-doped nanocomposite annealed at 900 °C consists of Ta₂O₅ nanoparticles, with sizes around 2 nm, dispersed in the SiO₂ amorphous phase. The main emission peak of the film is detected at around 1532 nm, which can be assigned to the ⁴I_13/2 → ⁴I_15/2 transition of the Er³⁺ ions present in the nanocomposites. This band has a full width at half medium of 64 nm, and the lifetime measured for the ⁴I_13/2 levels is 5.4 ms, which is broader compared to those of other silicate systems. In conclusion, the films obtained in this work are excellent candidates for use as active planar waveguide.     

Synthesis, structure and dielectric characterization of Ln2Ti2−2xM2xO7(Ln=Gd, Er; M=Zr, Sn, Si)

The progress in wireless communications and information access has demanded the use of electronic ceramics exhibiting desired properties. To further our understanding of these properties, compounds in the Ln₂Ti_2-2xM_2xO₇ (Ln=Gd, Er; M=Zr, Sn, Si) systems were synthesized by ceramic methods and characterized by powder X-ray diffraction. The ZrO₂-doped Gd₂Ti_2−2xZr_2xO₇ compounds adopt the pyrochlore structure type and form a complete solid solution. Er₂Ti_2−2xZr_2xO₇ forms a pyrochlore solid solution for x<0.1. However, stoichiometric Er₂Zr₂O₇ does not form; instead Er₄Zr₃O₁₂ forms a with defect fluorite structure. The Sn-doped Ln₂Ti_2−2xSn_2xO₇ (Ln=Gd, Er) compounds form complete solid solutions, and the Si compounds adopt the pyrochlore structure up to x=0.05. At ambient temperature, dielectric constants range from 10 to 61 for Er₂Ti_2−2xZr_2xO₇ and 16-31 for Gd₂Ti_2−2xZr_2xO₇ with low dielectric loss (1×10⁻³) at 1 GHz.