Monitoring extent of curing and thermal–mechanical property study of printed circuit board substrates

Precise control of curing conversion for epoxy-based printed circuit board (PCB) substrates and clarification of curing–property relationship are critical for the performance and reliability assessment, and for the design optimization of electronic systems. In this article, various epoxy composites for PCB substrates were analyzed by infrared spectroscopy (IR), differential scanning calorimetry (DSC), rheometry, dynamic mechanical analysis (DMA), and scanning electron microscope (SEM). Compared with mid-IR and DSC, near-IR (NIR) is found to be a reliable method for the characterization of curing conversion process by detecting the consumption of epoxy groups. And DMA is a powerful method for measuring the conversion of PCB materials by testing glass transition temperatures (T_g) and viscoelastic properties. The curing behaviors of a variety of epoxy composites show distinct differences in both curing rate and activation energy, and the growth tendency of T_g with curing conversion also changed depending on the material compositions. Correlation of curing conversion versus thermal properties shows that the activation energy of curing at different stage by DSC resembles the tendency of T_g transitions tested by DMA. Mechanical properties of the composites show close relationship with the curing conversions. Peel strength, the indicator of adhesion strength between copper foil and epoxy composites, was tested on all the specimens of different curing conversions, and the results showed a maximum value at curing conversion between ca. 90 and 95%.     

Enhancement of electrical stability of anisotropic conductive film (ACF) interconnections with viscosity-controlled and high Tg ACFs in fine-pitch chip-on-glass applications

This paper describes how anisotropic conductive film (ACF) properties including viscosity affect the electrical stability of ACF interconnections for fine pitch chip-on-glass (COG) applications. In this study, new ACFs for COG applications were designed by combining a high viscosity ACF layer and a low viscosity NCF layer to prevent the electrical shortage between bumps. As expected, the viscosity-controlled ACF showed better electrical insulation stability than a conventional ACF in fine pitch COG assemblies. According to the results of thermo-mechanical analysis (TMA) and dynamic-mechanical analysis (DMA), the viscosity-controlled ACF showed the improved thermo-mechanical properties such as lower coefficient of thermal expansion (CTE), higher storage modulus (E′) at higher temperature region, and higher glass transition temperature (T_g) than the conventional ACF. Furthermore, hot air reliability test and pressure cooker test (PCT) results showed that the viscosity-controlled ACF with higher T_g had better hot air test and PCT reliabilities than the conventional ACF.     

Properties of low temperature Sn–Ag–Bi–In solder systems

The metallurgical and mechanical properties of Sn–3.5 wt%Ag–0.5 wt%Bi–xwt%In (x = 0–16) alloys and of their joints during 85 °C/85% relative humidity (RH) exposure and heat cycle test (−40–125 °C) were evaluated by microstructure observation, high temperature X-ray diffraction analysis, shear and peeling tests. The exposure of Sn–Ag–Bi–In joints to 85 °C/85%RH for up to 1000 h promotes In–O formation along the free surfaces of the solder fillets. The 85°C/85%RH exposure, however, does not influence the joint strength for 1000 h. Comparing with Sn–Zn–Bi solders, Sn–Ag–Bi–In solders are much stable against moisture, i.e. even at 85 °C/85%RH. Sn–Ag–Bi–In alloys with middle In content show severe deformation under a heat cycles between −40 °C and 125 °C after 2500 cycles, due to the phase transformation from β-Sn to β-Sn + γ-InSn₄ or γ-InSn₄ at 125 °C. Even though such deformation, high joint strength can be maintained for 1000 heat cycles.     

Novel Diffusion-Regulated Layering Methodology to Improve Blend Miscibility and Thermal Stability of Organic Photovoltaics

Extensive research on bulk-heterojunction (BHJ) optimization has advanced organic photovoltaics (OPVs). However, the need for research addressing the issue of morphological instability and ensuring long-term durability remains a priority. Herein, a diffusion-governed morphological modification methodology via a sequential deposition (SD) process comprising ternary components with low miscibility is demonstrated. Sequential coating of a high glass transition temperature (T_g) material and a host binary blend induces a concentration difference between successively coated layers, allowing for effective blending of immiscible materials during solvent evaporation. The enhanced miscibility of the SD-processed BHJ layer facilitates molecular interactions between the high T_g material and the host materials, thereby increasing the T_g of the BHJ blend. The SD-processed OPVs exhibit superior photovoltaic performance and suppressed glass transition under thermal stress compared to reference OPVs fabricated via a conventional method. After 500 h of thermal aging at 85 °C, the SD-BHJ OPV retains over 80% of its initial efficiency, whereas the reference device shows a drastic drop to below 80% of its initial efficiency after only 80 h. This study provides a step toward efficient, long-term stable OPVs by overcoming the limitations of blend miscibility and poor thermal durability of conventional BHJ systems via a SD process.     

Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application

The effects of bonding temperatures on the composite properties and reliability performances of anisotropic conductive films (ACFs) for flip chip on organic substrates assemblies were studied. As the bonding temperature decreased, the composite properties of ACF, such as water absorption, glass transition temperature (T_g), elastic modulus (E′) and coefficient of thermal expansion (α), were improved. These results were due to the difference in network structures of cured ACFs which were fully cured at different temperatures. From small angle X-ray scattering (SAXS) test result, ACFs cured at lower temperature, had denser network structures. The reliability performances of flip chip on organic substrate assemblies using ACFs were also investigated as a function of bonding temperatures. The results in thermal cycling test (−55 °C/+150 °C, 1000 cycles) and PCT (121 °C, 100% RH, 96 h) showed that the lower bonding temperature resulted in better reliability of the flip chip interconnects using ACFs. Therefore, the composite properties of cured ACF and reliability of flip chip on organic substrate assemblies using ACFs were strongly affected by the bonding temperature.     

Tailoring Ultrahigh Energy Density and Stable Dendrite-Free Flexible Anode with Ti3C2Tx MXene Nanosheets and Hydrated Ammonium Vanadate Nanobelts for Aqueous Rocking-Chair Zinc Ion Batteries

Exploiting Zn metal-free anode materials would be an effective strategy to resolve the problems of Zn metal dendrites that severely hinder the development of Zn ion batteries (ZIBs). However, the study of Zn metal-free anode materials is still in their infancy, and more importantly, the low energy density severely limits their practical implementations. Herein, a novel (NH₄)₂V₁₀O₂₅ · 8H₂O@Ti₃C₂T_x (NHVO@Ti₃C₂T_x) film anode is proposed and investigated for constructing “rocking-chair” ZIBs. The NHVO@Ti₃C₂T_x electrode shows a capacity of 514.7 mAh g⁻¹ and presents low potential which is 0.59 V (vs Zn²⁺/Zn) at 0.1 A g⁻¹. The introduction of Ti₃C₂T_x not only affords an interconnected conductive network, but also stabilizes the NHVO nanobelts structure for a long cycle life (84.2% retention at 5.0 A g⁻¹ over 6000 cycles). As a proof-of-concept, a zinc metal-free full battery is successfully demonstrated, which delivers the highest capacity of 131.7 mAh g⁻¹ (mass containing anodic and cathodic) and energy density of 97.1 Wh kg⁻¹ compared to all reported aqueous “rocking-chair” ZIBs. Furthermore, a long cycling span of 6000 cycles is obtained with capacity retention reaching up to 92.1%, which is impressive. This work is expected to provide new moment toward V-based materials for “rocking-chair” ZIBs.     

Ultralong Cycle Life for Deep Potassium Storage Enabled by BiOCl/MXene van der Waals Heterostructures

Conversion/alloying-type anodes are drawing attention due to their high theoretical capacities, but inferior reversibility, especially under low current densities, has hampered potential applications. Conventional strategies mainly focus on conversion/alloying processes, whereas the intercalation process is rarely analyzed. Herein, the intercalation process is correlated with conversion/alloying processes by ion dispersion states. BiOCl/Ti₃C₂T_x MXene van der Waals heterostructure is selected as a proof-of-concept system. Multifunctional MXenes not only contribute to atomic dispersion and boosted ion diffusion at the first cycle by constructing a novel heterostructure but serve as supporting frameworks to sustain long-term structural stability. Consequently, a cell with BiOCl/MXene anode delivers an ultralong cycle-life of running over ten months, maintaining a high capacity of 225 mAh g⁻¹ over 1300 cycles at 100 mA g⁻¹ and a retention of 81.3%. These findings verify that enhanced initial intercalation can facilitate higher reversibility and shed light on developing high-performance conversion/alloying-type anodes.     

Room-Temperature Symmetric Giant Positive and Negative Electrocaloric Effect in PbMg0.5W0.5O3 Antiferroelectric Ceramic

As an emerging solid-state refrigeration technology with zero-emission and high energy conversion efficiency, there is a compelling need for ferroelectric materials with giant electrocaloric effects (ECEs) at room temperature suitable for refrigeration applications. The complex perovskite antiferroelectric (AFE), PbMg_0.5W_0.5O₃, containing non-equivalent B-site ions with a symmetric giant positive and negative ECE near room temperature is presented. At the Curie temperature of 36 °C, the first-order AFE–paraelectric phase transition gives rise to a large enthalpy change of 3.92 J g⁻¹, more than four times that of BaTiO₃. This leads to a significant ECE under the influence of an electric field. The direct electrocaloric characterization shows that the adiabatic temperature change, ΔT, exhibits symmetric peaks with a giant positive maximum of 1.79 K (ΔS = 1.68 J kg⁻¹ K⁻¹) at 36 °C and a negative maximum of −2.02 K (ΔS = −1.93 J kg⁻¹ K⁻¹) at 34 °C. The ultrahigh magnitude of ΔT near room temperature makes PbMg_0.5W_0.5O₃ a superior electrocaloric material far beyond traditional PbZrO₃-based AFEs. The coexistence of symmetric giant positive and negative ΔT to further improve cooling efficiency is expected. In addition, the good reversibility and negligible leakage current should pave the way for practical applications.     

Evaluation of SiGe:C HBT intrinsic reliability using conventional and step stress methodologies

The reliability of SiGe:C HBT devices fabricated using the Freescale’s 0.35-μm RF-BICMOS process was evaluated using both conventional and step stress methodologies. This device technology was assessed to determine its capability for various power amplifier applications (e.g., WLAN, Bluetooth, and cellular phone), which are more demanding than conventional circuit designs. The step stress method was developed to allow a rapid evaluation of product reliability, as well as, a quick method to monitor product reliability. For all tests the collector current I_C and collector voltage V_C were kept constant throughout the test, and the current gain β (I_C/I_B) was continuously monitored. The nominal bias condition was V_C = 3.5-V and J_C = 50-kA/cm² (or 0.5-mA/μm²). The “failure criterion” for all reliability evaluations was −10% degradation in β from the initial value at the start of each stress test or interval. The median time to failure (MTTF) at a junction temperature (T_JCN) of 150 °C for the conventional stress test was 1.86E6-h, and the thermal activation energy was 1.33-eV. In contrast for the temperature step stress tests the combined results gave an MTTF at T_JCN = 150 °C of 5.2E6-h and a thermal activation energy of 1.44-eV. Considering the differences in the two test methods, these results are quite close to one another. The intrinsic reliability of this device at the nominal bias condition and T_JCN = 150 °C is more than adequate for a 5-year system life.     

Boosting Zn2+ and NH4+ Storage in Aqueous Media via In-Situ Electrochemical Induced VS2/VOx Heterostructures

Aqueous-ion batteries have received much attention owing to the merits of high safety, low cost, and environmental friendliness. Among potential cathode candidates, transition metal sulfides drew little attention since they suffer from low capacity, low working potential, and fast capacity fading. Here, advantage is taken of the chemical instability of VS₂ in aqueous electrolyte to in situ fabricate a heterostructural VS₂/VO_x material. Benefiting from the internal electric field at heterointerfaces, high conductivity of vanadium sulfide and high chemical stability of vanadium oxides, heterostructural VS₂/VO_x delivers an enhanced working potential by 0.25 V, superior rate capability with specific capacity of 156 mA h g⁻¹ at 10 A g⁻¹, and long-term stability over 3000 cycles as Zn²⁺ storage electrode. In addition, heterostructural VS₂/VO_x is employed as the cathode for aqueous NH₄⁺ ion storage with high reversible capacity over 150 mA h g⁻¹ and long lifespan over 1000 cycles, surpassing the state-of-the-art materials. VS₂/VO_x is proved to demonstrate a (de)intercalation process for Zn²⁺ storage, while a conversion reaction accompanied by insertion is responsible for nonmetal NH₄⁺. The strong insight obtained in this study sheds light on a new methodology of exploring the potential of transition metal sulfides-based cathode materials for aqueous ion batteries.     

Reliability results of HBTs with an InGaP emitter

Accelerated lifetest results are presented on HBTs with InGaP emitters. An Arrhenius plot indicates the existence of a temperature dependent activation energy, E_a. A low E_a mechanism dominates above T_j 380 °C and a high E_a mechanism dominates at lower temperature. The critical transition temperature between regimes is determined using the method of maximum likelihood. The difference in E_a’s between low and high temperature regimes is statistically significant.A comparison is made between lifetimes determined from at temperature vs. 40 °C data. No significant difference is observed indicating that beta degradation can be monitored at temperature only and cooling to low temperature is not necessary. Other comparisons indicate that junction temperatures up to 367 °C can still provide good estimates of lower temperature behavior.By the method of maximum likelihood, the predicted MTTF at T_j = 125 °C is 7.6 × 10⁹ h with 95% CBs of [6.4 × 10⁸, 8.9 × 10¹⁰]. Given the typical industry standard of 1 × 10⁶ h, the reliability requirements are easily met.It is suggested that the standard of 1 × 10⁶ h does not adequately capture failure time variation and that a better specification is in terms of fails in time (FITs). The 10 year average FIT rate at 125 °C is found to be negligible. Assuming a much higher junction temperature of 210 °C, the average failure rate climbs to 5 FITs with an upper 95% confidence bound of 40 FITs.     

Zwitterion Functionalized Graphene Oxide/Polyacrylamide/Polyacrylic Acid Hydrogels with Photothermal Conversion and Antibacterial Properties for Highly Efficient Uranium Extraction from Seawater

In this study, graphene oxide (GO) and polyacrylamide/polyacrylic acid (PAM/PAA) are used to prepare hydrogels with photothermal conversion properties for highly efficient uranium extraction from seawater. Zwitterionic 2-methacryloyloxy ethyl phosphorylcholine (MPC) is introduced in the PAM/PAA/GO hydrogel to obtain PAM/PAA/GO/MPC (PAGM), exhibiting good antibacterial properties. PAGM demonstrates efficient and specific adsorption of uranium (VI) (U(VI)). Under light conditions, the adsorption capacity of PAGM reaches 196.12 mg g⁻¹ (pH = 8, t = 600 min, C₀ = 99.8 mg L⁻¹, m/v = 0.5 g L⁻¹). The adsorption capacity is only 160.29 mg g⁻¹ under dark conditions (pH = 8, t = 600 min, C₀ = 99.8 mg L⁻¹, m/v = 0.5 g L⁻¹). The adsorption capacity of light is 22.5% higher than that of dark. The adsorption process is fitted using the Langmuir and pseudo-second-order models. Furthermore, PAGM exhibits good repeatability and stability after five adsorption–desorption cycles. PAGM exhibits a U(VI) adsorption capacity of 6.1 mg g⁻¹ after storage for one month in natural seawater. The X-ray photoelectron spectroscopy (XPS) results demonstrate that the coordination of the amino, carboxyl, and hydroxyl groups with U(VI) is the primary mechanism of U(VI) adsorption. The mechanism is confirmed through detailed density functional theory calculations. PAGM demonstrates durability, high efficiency, photothermal conversion properties, and antibacterial properties. Thus, it is a promising candidate for uranium extraction from seawater.     

Degradation kinetics of ultrathin HfO2 layers on Si(1 0 0) during vacuum annealing monitored with in situ XPS/LEIS and ex situ AFM

The evolution of HfO₂(3–5 nm)/SiO₂(0.5 nm)/Si(1 0 0) stacks during vacuum annealing was monitored in situ with the combination of X-ray photoelectron spectroscopy and low energy ion scattering techniques and supplemented with atomic force microscopy analysis to investigate the mechanism that triggers HfO₂ degradation with Hf silicide formation. The reduction of SiO₂ interfacial layer and the formation of local paths for SiO escape into vacuum are believed to be critical at vacuum annealing above T > 850 °C for the reaction between HfO₂ and Si to start and eventually lead to the degradation of the former.     

A Gd-Film Thermomagnetic Generator in Resonant Self-Actuation Mode

Thermomagnetic generation is a promising technology for conversion of low-grade waste heat into electricity. Key requirements for the development of efficient thermomagnetic generators (TMGs) are tailored thermomagnetic materials as well as innovative designs enabling fast heat transfer. Recently, film-based thermomagnetic generators are developed that operate in the mode of resonant self-actuation enabling high frequency and stroke of a movable cantilever and, thus, efficient conversion of thermal energy into electrical energy. Here, the performance of a Gadolinium (Gd)-film-based TMG that is optimized for resonant self-actuation near room temperature is reported. The Gd-film TMG exhibits large oscillation frequencies up to 106 Hz and large strokes up to 2 mm corresponding to 38% of the oscillating cantilever's length. This performance occurs in a sharply bound range of ambient temperatures with an upper limit near the film's ferromagnetic to paramagnetic transition temperature T_c of 20 °C and of heat source temperatures ranging between 40 and 75 °C. The maximum power per footprint is 23.8 µWcm⁻², at which the Gd film undergoes a temperature change of only 0.9 °C at ≈10 °C above T_c.     

A General Route for Encapsulating Monodispersed Transition Metal Phosphides into Carbon Multi-Chambers toward High-Efficient Lithium-Ion Storage with Underlying Mechanism Exploration

Transition metal phosphides (MP_x) with high theoretical capacities and low cost are regarded as the most promising anodes for lithium-ion batteries (LIBs), but the large volume variations and sluggish kinetics largely restrict their development. To solve the above challenges, herein a generic but effective method is proposed to encapsulate various monodispersed MP_x into flexible carbon multi-chambers (MP_x@NC, MNi, Fe, Co, and Cu, etc.) with pre-reserved voids, working as anodes for LIBs and markedly boosting the Li⁺ storage performance. Ni₂P@NC, one representative example of MP_x@NC anode, shows high reversible capacity (613 mAh g⁻¹, 200 cycles at 0.2 A g⁻¹), and superior cycle stability (475 mAh g⁻¹, 800 cycles at 2 A g⁻¹). Full cell coupled with LiFePO₄ displays a high reversible capacity (150.1 mAh g⁻¹ at 0.1 A g⁻¹) with stable cycling performance. In situ X-ray diffraction and transmission electron microscope techniques confirm the reversible conversion reaction mechanism and robust structural integrity, accounting for enhanced rate and cycling performance. Theoretical calculations reveal the synergistic effect between MP_x and carbon shells, which can significantly promote electron transfer and reduce diffusion energy barriers, paving ways to design high-energy-density materials for energy storage systems.     

Characterization of the viscoelastic properties of an epoxy molding compound during cure

In the electronics industry epoxy molding compounds, underfills and adhesives are used for the packaging of electronic components. These materials are applied in liquid form, cured at elevated temperatures and then cooled down to room temperature. During these processing steps residual stresses are built up resulting from both cure and thermal shrinkage. These residual stresses add up to the stresses generated during thermal cycling and mechanical loading and may eventually lead to product failure.The viscoelastic properties of the encapsulation material depend highly on temperature and degree of cure. This paper investigates the increase of elastic modulus and the changes in the viscoelastic behavior of an epoxy molding compound, during the curing process. This is done using the shear setup of a Dynamic Mechanical Analyzer DMA-Q800. The cure dependent viscoelastic behavior is determined during heating scans of an intermittent cure experiment. In such an experiment the material is partially cured and then followed by a heating scan at 2 °C/min. During this heating scan continuous frequency sweeps are performed and the shear modulus is extracted. The Time–Temperature superposition principle is applied and the viscoelastic shear mastercurve is extracted. Analyzing the shear modulus, the cure dependent viscoelastic material behavior was modeled using the cure dependent glass transition temperature as a reference and a cure dependent rubbery modulus. It is shown that partial curing would increase the glass transition temperature and rubbery shear modulus. It also shifts the viscoelastic mastercurve to the higher time domain. Taking T_g as the reference temperature for different heating scans, the mastercurves collapse to one graph.In addition, using a Differential Scanning Calorimeter (DSC), the growth of the glass transition temperature, $T_g^{\mathit{DSC}}$, with respect to the conversion level is obtained. These values are coupled to the values of glass transition temperature in DMA apparatus, $T_g^{\mathit{DMA}}$, for calculating the conversion level at each step of curing process in shear mode test.     

Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

Copper wires are increasingly used in place of gold wires for making bonded interconnections in microelectronics. There are many potential benefits for use of copper in these applications, including better electrical and mechanical properties, and lower cost. Usually, wires are bonded to aluminum contact pads. However, the growth of Cu/Al intermetallic compounds (IMC) at the wire/pad interfaces is poorly understood, and if excessive would increase the contact resistance and degrade the bond reliability.To study the Cu/Al IMC growth in Cu ball bonds, high temperature aging at 250 °C for up to 196 h has been used to accelerate the aging process of the bonds. The Cu/Al IMCs growth behavior was then recorded and the IMC formation rate of 6.2 ± 1.7 × 10⁻¹⁴ cm²/s was obtained. In addition to the conventional yz-plane cross-section perpendicular to the bonding interface, a xy-plane cross-section parallel through the interfacial layers is reported. Three IMC layers were distinguished at the Cu/Al interfaces by their different colors under optical microscopy on the xy-plane cross-sections of ball bonds. The results of micro-XRD analysis confirmed that Cu₉Al₄, and CuAl₂ were the main IMC products, while a third phase is found which possibly is CuAl. During the aging process, IMC film growth starts from the periphery of the bond and propagates inward towards the centre area. Subsequently, with increased aging time, cavities are observed to develop between the IMC layer and the Cu ball surface, also starting at the bond periphery. The cavitation eventually links up and progresses toward the centre area leading to a nearly complete fracture between the ball and the intermetallic layer, as observed after 81 h.     

Low Volume-Expansion,Insertion-Type Layered Silicate Hierarchical Structure For Superior Storage Of Li,Na, K

A hierarchical structure is successfully synthesized by coating polypyrrole (PPy) on the surface of carbon/saponite superlattice (denoted as PPy@C/SAP), and applied as low volume-expansion insertion-type anode for Li, Na, K storage.The synergistic effect of metal Ni, Fe doping, carbon/silicate superlattice, abundant oxygen vacancies and PPy coating leads to a good electronic conductivity and large current discharging capability. As a Si-based material, PPy@C/SAP has excellent storage capability for Li (659 mAh g⁻¹ after 1000 cycles at 2 A g⁻¹ and 550 mAh g⁻¹ after 1000 cycles at 5 A g⁻¹), Na (maximum specific capacity of 533 and 327 mAh g⁻¹ after 50 cycles) as well as K (236 mAh g⁻¹ after 100 cycles). XPS, XANES, XRD, FTIR, HRTEM, SEM are used to detect the hybrid mechanism (bulk insertion and surface conversion) with a volume expansion as low as 9%. Insertion reaction driven by valence state change of Ni, Fe, Si (Ni⁰⇔Ni²⁺, Fe0⇔Fe³⁺, Si²⁺⇔Si⁴⁺) in laminates and conversion reactions between LiOH/Li₂CO₃ and LiH/Li₂C₂ catalyzed by Ni° contribute to the high performance. In the whole electrochemical process, layered structure is retained while the conversion reactions of LiOH (prodeced by laminates dehydroxylation) and Li₂CO₃ (electrolyte decomposition) cause the dynamic evolution of solid ectrolyte interphase. This study develops a promising Si-based anode material for lithium ion batteries, sodium ion batteries and potassium ion batteries, which is significant for designing long cycle life rechargeable batteries.     

High temperature reliability and interfacial reaction of eutectic Sn–0.7Cu/Ni solder joints during isothermal aging

The interfacial reactions and growth kinetics of intermetallic compound (IMC) layers formed between Sn–0.7Cu (wt.%) solder and Au/Ni/Cu substrate were investigated at aging temperatures of 185 and 200 °C for aging times of up to 60 days. After reflow, the IMC formed at the interface was (Cu, Ni)₆Sn₅. After aging at 185 °C for 3 days and at 200 °C for 1 day, two IMCs of (Cu, Ni)₆Sn₅ and (Ni, Cu)₃Sn₄ were observed. The growth of the (Ni, Cu)₃Sn₄ IMC consumed the (Cu, Ni)₆Sn₅ IMC at an aging temperature of 200 °C due to the restriction of supply of Cu atoms from the solder to interface. After aging at 200 °C for 60 days, the Ni layer of the substrate was completely consumed in many parts of the sample, at which point a Cu₃Sn IMC was formed. In the ball shear test, the shear strength decreased with increasing aging temperature and time. Until the aging at 185 °C for 15 days and at 200 °C for 3 days, fractures occurred in the bulk solder. After prolonged aging treatment, fractures partially occurred at the (Cu, Ni)₆Sn₅ + Au/solder interface for aging at 185 °C and at the (Ni, Cu)₃Sn₄/Ni interface for aging at 200 °C, respectively. Consequently, thick IMC layer and thermal loading history significantly affected the integrity of the Sn–0.7Cu/Ni BGA joints.     

Construction of VS2/VOx Heterostructure via Hydrolysis-Oxidation Coupling Reaction with Superior Sodium Storage Properties

Heterostructure engineering is one of the most promising modification strategies for reinforcing Na⁺ storage of transition metal sulfides. Herein, based on the spontaneous hydrolysis-oxidation coupling reaction of transition metal sulfides in aqueous media, a VO_x layer is induced and formed on the surface of VS₂, realizing tight combination of VS₂ and VO_x at the nanoscale and constructing homologous VS₂/VO_x heterostructure. Benefiting from the built-in electric field at the heterointerfaces, high chemical stability of VO_x, and high electrical conductivity of VS₂, the obtained VS₂/VO_x electrode exhibits superior cycling stability and rate properties. In particular, the VS₂/VO_x anode shows a high capacity of 878.2 mAh g⁻¹ after 200 cycles at 0.2 A g⁻¹. It also exhibits long cycling life (721.6 mAh g⁻¹ capacity retained after 1000 cycles at 2 A g⁻¹) and ultrahigh rate property (up to 654.8 mAh g⁻¹ at 10 A g⁻¹). Density functional theory calculations show that the formation of heterostructures reduces the activation energy for Na⁺ migration and increases the electrical conductivity of the material, which accelerates the ion/electron transfer and improves the reaction kinetics of the VS₂/VO_x electrode.