不同材料去除模式下激光加热辅助切削氮化硅陶瓷表面粗糙度研究（英文）

激光加热辅助切削因其工艺空间大、经济性高、可得到高质量表面成为工程陶瓷等脆硬材料的高效加工方式。通过改变激光功率和切削深度两组单因素试验,研究了激光加热辅助切削氮化硅陶瓷(Si3N4)不同加工状态下表面粗糙度值的变化规律。结果表明:材料被塑性去除时,Ra和Rq值均小于被脆性去除和产生热损伤时得到的值。未产生热损伤时,Ra和Rq值随工件软化程度增大而减小。在塑性去除模式下,轮廓高度幅值曲线更加趋于对称和正态分布,表面轮廓更加精细。     

用Nd（钕）YAG激光辅助磨削

高性能的激光可以用来辅助磨削、修整和热处理，激光辅助修整优点是它的工作力是自由的，而且不需昂贵的修整装置。在激光辅助磨削过程中，砂轮接触工件之前，工件表面就被直接加热，这种可减少工件表面的温度梯度及热损伤。而且采用此方法磨削时具有较高的切削率，本文阐述了此方法的基本原理，介绍了激光辅助修整树脂结合剂ＣＢＮ砂轮以及激光辅助加工金属和陶瓷零件的结果。     

Al2O3热压陶瓷激光辅助切削温度场分布与切削深度

建立Al2O3热压陶瓷激光辅助切削准稳态传热模型,采用有限差分方法,利用MATLAB软件,结合材料的受热软化特性,计算得到工件的温度场分布,并由此确定不同激光参数（激光功率、光束移动速度和光斑半径1下的切削深度。模拟计算发现工件表面等温线为卵圆形,横截面呈抛物线型,纵截面呈对称分布形式,而计算确定工件横、纵截面1000K等温线所对应的深度值为加工时合适的切削深度;通过对比分析发现：不同参数下温度场计算确定的切削深度值与实验值较吻合,采用较高的激光功率、较低的激光移动速度和工件表面受辐照激光光斑半径有利于切削区域材料的充分软化,从而获得较大的切削深度。     

金属超塑组织形态切削的研究

加热切削已成为能够加工难加工材料的有效方法，本文针对热温度与金属组织变形的内在关系进行研究，提出基于组织形态最佳时切削的新概念，介绍了金属超塑性的机理及满足的条件，并对金属材料实现超塑性状态进行研究，使其在激光（或等离子体弧）加热辅助切削中获得应用。     

SPH方法的单晶硅激光辅助切削仿真与试验

单晶硅加工过程中很容易产生细微裂纹,从而影响表面加工质量。激光辅助加工(laser-assisted machining, LAM)可以软化代加工区域,有效减小切削力,延长刀具寿命,提高表面加工质量。建立热力耦合的SPH模型,来模拟单晶硅激光辅助车削过程,在不同温度条件下,探究裂纹扩展损伤和切削应力以及转速和切深对表面粗糙度的影响,并通过LAM试验,验证仿真结果的准确性。结果表明：提高温度有利于单晶硅的塑性切削,随着切削域温度的增加刀具应力逐渐减小,300℃时的刀具应力较常温下降低了约50%,表面加工质量有明显提升;且600℃时的切屑为塑性流动锯齿线条,其塑性大幅度提高。切削时应选择较小的切削深度,低于4500 r/min的转速,单晶硅表面粗糙度S_a可在1.000 nm以下。     

新型复合式激光水射流切割氧化铝陶瓷实验方法研究

针对陶瓷材料传统加工方式,如激光空冷加工、磨料水射流技术以及金刚石切割等具有加工精度较差、材料去除率低以及刀具磨损严重等问题,研究了一种新型激光水射流切割方式,全新的复合式激光与水射流共同作用下,利用激光加热和水射流快速冷却所产生的大量热应力对硬脆氧化铝陶瓷材料产生热断裂,切开陶瓷。结果表明,激光水射流切割硬脆氧化铝材料相比于激光空气冷却切割和其他传统切割方式具有材料切口小,材料去除量较小以及切割后材料表面精度高。     

增韧莫来石陶瓷加工表面的耐磨性分析

本文应用表面粗糙度参数和磨损率，研究增韧莫来石材料磨削，珩磨及平顶珩磨表面的耐磨性能，通过Ra，表面轮廓，支承长度率曲线，轮廓高度幅度分布图，轮廓峰谷比等粗糙度参数评定其加工表面的耐磨性。试验结果表明，增韧莫来石加工表面的磨损率高于原始烧结表面。材料的表面粗糙度影响其耐磨性，材料的磨损率随其表面粗糙度参数Ra值增大而增大，陶瓷表面的耐磨性与加工方式有关，平顶珩磨表面的耐磨性较好。     

高体积分数SiCp/Al复合材料超声辅助划切微观去除机理

目的 揭示高体积分数SiC_p/Al复合材料在超声辅助加工条件下的材料去除机理。方法 采用SiC_p/Al复合材料的超声辅助划切试验,探究划切参数变化对超声振幅、划切力及摩擦因数的影响规律,并通过扫描电子显微镜和激光共聚焦显微镜对划痕表面微观形貌进行观察,分析单点金刚石磨粒工具超声辅助划切材料去除的特点。结果 随着划切深度从0.01 mm增加到0.05 mm,电流值逐渐降低,电流值变化量从12 mA增加到25m A,超声振幅逐渐衰减,金刚石压头的轴向冲击作用减弱。划切深度和划切速度的增加使切向挤压切削作用增强,划切力和摩擦因数增大。在材料去除过程中,碳化硅颗粒存在破碎成小颗粒、剪切断裂破碎和拔出等多种去除形式,铝基体出现明显的塑性流动和涂覆现象,并形成切削沟槽外侧堆积。结论 当切削深度和进给速度较小时,材料去除主要是在轴向的高频振动冲击作用下完成,材料表面加工质量较好;当切削深度和进给速度逐渐增大时,材料去除是在轴向冲击破碎和切向挤压切削共同作用下完成,材料表面加工质量逐渐降低。     

钛酸钡陶瓷基片的双面研抛加工研究

采用氧化铝磨料对钛酸钡(BaTiO3)陶瓷基片进行双面研磨加工,分析磨料粒径、研磨压力、研磨盘转速、磨料浓度以及研磨液流量等研磨工艺参数对基片表面粗糙度和材料去除率的影响。采用双面研磨工艺,依次用W14、W7、W5的氧化铝磨料对钛酸钡陶瓷基片(原始粗糙度Ra0.219μm)在研磨压力3.26kPa、研磨盘转速为37r/min、磨料质量浓度为9%、研磨液流量10mL/min的研磨参数下,进行粗研、半精研、精研,取得了表面粗糙度Ra0.076 6μm的研磨片。对研磨片继续用W0.2SiO2抛光可获得表面粗糙度Ra为6nm的超光滑表面。同时,用激光共聚焦显微镜和扫描电镜观察了不同加工阶段的基片表面形貌,并分析了材料去除机理;采用氧化铝磨料的研磨过程中,材料以脆性断裂去除为主;采用SiO2磨料抛光过程中,工件材料以塑性去除为主。     

陶瓷基复合材料加工技术及其表面亚表面损伤机制研究进展

综述了陶瓷基复合材料的传统机械加工、超声辅助加工、激光加工、多能场复合加工等加工方式的研究进展,并简述了几种加工方式的优缺点.对陶瓷基复合材料的表面及亚表面损伤机制进行了总结和分析,包括材料表面亚表面损伤形式、材料表面亚表面理论及模型研究.提出了传统的陶瓷基复合材料加工技术需要进一步优化刀具材料、开发新的刀具结构、优化工艺参数等,以减少加工缺陷.研究了复合加工中材料去除率最大条件下的损伤容限条件、材料加工后的性能保持性等,同时探究了高效高质量的多能场复合加工新方法及其应用理论,以及研究探索了在复杂载荷及动载荷(如动态切削力、高温切削及超声动态冲击载荷)耦合作用下陶瓷基复合材料的内在损伤机理及演化问题.     

Analytical model to determine the critical conditions for the modes of material removal in the milling process of brittle material

Brittle materials are prone to cleavage-based fracture during machining. In conventional scale machining of brittle material, crack-propagation is the dominant mechanism of material removal which results in a degraded machined surface. The challenge is to perform machining of brittle material such that the material removal occurs predominantly by chip formation rather than the characteristic brittle fracture. In this case, a high quality finish is achieved on the machined surface. Ductile-mode machining has emerged as a promising technique to finish a crack-free machined surface on macroscopically brittle materials. In the past, ductile-mode machining has mostly been performed by single-edge cutting process. This paper outlines an analytical model to determine the critical conditions for finishing a crack-free surface on brittle material by milling process. Four distinct modes of machining have been identified in the milling process of brittle material. In this model, the critical conditions for different modes of machining have been determined with respect to the relationship between the radial depth of cut and the depth of subsurface damage caused by the brittle fracture during machining. Verification tests were performed on tungsten carbide workpiece and the experimental results have validated the proposed machining model. It has been established that if the radial depth of cut is greater than the subsurface-damage depth in the milling process of brittle material, it is possible to finish a crack-free machined surface by removal of material through a combination of plastic deformation and brittle fracture. However, if the radial depth of cut is less than the subsurface damage depth, brittle fracture must be prevented in ductile-mode milling to finish a crack-free machined surface.     

Laser-assisted machining of Inconel 718 with an economic analysis

Superalloys have high strengths at elevated temperatures, which make them attractive toward various applications and also make these materials difficult to machine at room temperature due to excessive tool wear and poor surface finish. Laser-assisted machining (LAM) offers the ability to machine superalloys more efficiently and economically by providing the local heating of the workpiece prior to material removal by a single point cutting tool.An existing transient, three-dimensional heat transfer model is modified for modeling LAM of Inconel 718. Suitable coating conditions are determined for increasing the laser absorptivity in metals and an approximate absorptivity value is determined. The thermal model is validated in axial and circumferential directions by temperature measurement using an infrared camera.The machinability of Inconel 718 under varying conditions is evaluated by examining tool wear, forces, surface roughness, and specific cutting energy. With increasing material removal temperature from room temperature to 620 °C, the benefit of LAM is demonstrated by a 25% decrease in specific cutting energy, a 2–3-fold improvement in surface roughness and a 200–300% increase in ceramic tool life over conventional machining. Moreover, an economic analysis shows significant benefits of LAM of Inconel 718 over conventional machining with carbide and ceramic inserts.     

Variation of microstructure on the fracture surface of dense silicon nitride by laser power in LAM

Ceramics have attractive properties to metals and polymers, and they are consequently useful for specific applications. Silicon nitride has been studied extensively and has been found to possess promising thermal and mechanical properties at high temperatures. However, it has drawbacks such as brittleness and large scatter in its mechanical properties. As a result, it is difficult to fabricate complex shapes using traditional methods because of high cost and difficulties to machine the components. Today, ceramic parts have limited use for production of simple shaped parts and low quantities. This study explores the possibility of employing silicon nitride for more diverse applications using laser-assisted machining (LAM). Because the surface of the workpiece is locally heated by an intense laser source prior to material removal, softening and damage of the workpiece surface make machining of ceramics easy. Among the parameters of LAM, laser power is one of the decisive factors during the process. In this study, fractured cross sections were observed to examine how the microstructure of silicon nitride was changed by laser power. The deformation of microstructure near the surface of the workpiece increases when the laser power increases. It is found that increasing the laser power facilitates cutting of silicon nitride but results in detrimental heat effects on the surface of the workpiece.     

Evaluation of surface roughness in laser-assisted machining of aluminum oxide ceramics with Taguchi method

This paper evaluates laser-assisted machining (LAM) as an economically viable process for manufacturing precision aluminum oxide ceramic parts. Because it is locally heated by an intense laser source prior to material removal, LAM leads to higher material removal rates, as well as improved control of workpiece properties and geometry. To assess the feasibility of the LAM process and better understand its governing physical phenomena, experiments were conducted to obtain different measures of surface roughness for Al₂O₃ workpieces machined by laser-assisted turning using a Nd:YAG laser.The experimental results were analyzed using the Taguchi method, which facilitated identification of optimum machining conditions. The findings indicate that rotational speed, with a contribution percentage as high as 42.68%, had the most dominant effect on LAM system performance, followed by feed, depth of cut, and pulsed frequency. LAM's most important advantage is its ability to produce much better workpiece surface quality than does conventional machining, together with larger material removal rates (MRR) and moderate tool wear.     

计算机控制纳米胶体射流抛光的实验研究

将所设计的纳米颗粒胶体射流加工系统与计算机控制技术结合,实现了计算机控制纳米颗粒胶体射流加工,可将其应用于小曲率半径非球面和自由曲面元件的超光滑表面加工。本试验对一非球曲面高纯石英玻璃元件进行纳米颗粒胶体射流超光滑表面加工,用表面轮廓仪测量了纳米颗粒胶体射流加工前后该高纯石英玻璃元件的表面轮廓曲线。实验结果表明:计算机控制纳米颗粒胶体射流加工,实现了可控的微/纳米材料去除,该非球曲面元件轴向最大去除量为900 nm。原子力显微镜检测结果表明:该元件轮廓截面曲线上的表面粗糙度由Ra2.860 nm降低到Ra0.460 nm。采用纳米颗粒胶体射流技术对小曲率曲面及自由曲面进行超光滑表面加工,是一种确定性超光滑表面的加工方法。     

Investigation on the surface formation mechanism in micro milling of cemented carbide

Cemented carbide is widely applied in optical glass molding process due to its excellent properties. The surface quality of cemented carbide mold is directly related with the glass element quality, mold life and production cost. In this paper, micro milling experiments were conducted on cemented carbide to investigate the surface formation mechanism. The surface morphology characteristics of different material removal modes were compared. Both the surface formation mechanism and damage behavior during micro milling process were analyzed in detail. The machining parameters selection strategy was suggested to obtain the high material removal rate and smooth surface quality. The surface quality was found to be less affected by the machining parameters when cemented carbide is removed with ductile mode than brittle mode.     

Brittle damage and interlaminar decohesion in orthogonal micromachining of pyrolytic carbon

Engineered features on pyrolytic carbon (PyC) have been reported to improve the functional performance of the cardiovascular implants. PyC also finds application in thermonuclear components due to its unique directional thermal properties. Note that PyC comprises of stacked layers of brittle graphite-like material and its machining characteristics differ from plastically deformable isotropic materials due to brittle damage and interlaminar decohesion. Consequently, this study is aimed at understanding the mechanics of material removal in the plane of transverse isotropy (horizontally stacked laminae) of PyC via a finite element model. A damaged plasticity material model has been used to capture the effect of material degradation of a brittle material under machining. Uniaxial tension/compression tests have been carried out to calibrate the damaged plasticity model. A surface based cohesive bonding has been used between the layers to simulate the interlaminar decohesion which results in peeling, slipping and delamination during machining. The model predicts the cutting force and thrust forces under different process conditions. The cutting force predictions from the finite element model have been validated against the experimental data for different cutting conditions. In addition, the model also predicts the chip morphology for different machining conditions. The prediction error in the model lies between 2% and 23%. Parametric studies have also been performed to understand the effect of the machining parameters, such as rake angle, uncut chip thickness on the process response. It is found that use of the positive rake angle decreases the cutting forces up to 72%.     

氮化硅陶瓷磨削表面质量的建模与预测

目的提升氮化硅陶瓷加工质量和效率,提高粗糙度模型预测精度。方法提出塑性与塑-脆性去除转变临界切深hc1和塑-脆性与脆性转变临界切深hc2,然后对原有模型进行修正,并引入塑性去除粗糙度修正系数φ1、τ1和塑-脆性去除粗糙度修正系数φ2、τ2,建立基于不同去除方式的粗糙度Ra预测模型,后通过磨削实验对系数进行求解,并得出磨削参数对粗糙度和表面形貌的影响。结果塑性去除粗糙度修正系数φ1=5.872×10^-6、τ1=0.1094,塑-脆性去除粗糙度修正系数φ2=1.299×10^-5、τ^2=0.1582。砂轮线速度vs由30 m/s增大到50 m/s,粗糙度Ra由0.366μm减小到0.266μm,去除方式由脆性断裂向塑性变形转变,表面质量变好。磨削深度ap由5μm增大到45μm,粗糙度Ra由0.252μm增大到0.345μm,去除方式由塑性变形向脆性断裂转变,表面质量变差。工件进给速度vw由1000 mm/min增大到9000 mm/min,粗糙度Ra由0.227μm增大到0.572μm,去除方式由塑性变形向脆性断裂转变,表面质量变差。模型预测值与实验值的相对误差δ在2.1%~8%之间。结论在加工中应控制磨削深度和工件进给速度,适当提高砂轮线速度,以保证加工精度和效率。基于不同去除方式的粗糙度预测模型,可较为精准地预测实际加工情况。     

Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding

The difficulty and cost involved in the abrasive machining of hard and brittle ceramics are among the major impediments to the widespread use of advanced ceramics in industries these days. It is often desired to increase the machining rate while maintaining the desired surface integrity. The success of this approach, however, relies in the understanding of mechanism of material removal on the microstructural scale and the relationship between the grinding characteristics and formation of surface/subsurface machining-induced damage. In this paper, grinding characteristics, surface integrity and material removal mechanisms of SiC ground with diamond wheel on surface grinding machine have been investigated. The surface and subsurface damages have been studied with scanning electron microscope (SEM). The effects of grinding conditions on surface/subsurface damage have been discussed. This research links the surface roughness, surface and subsurface damages to grinding parameters and provides valuable insights into the material removal mechanism and the dependence of grinding-induced damage on grinding conditions.     

脆性材料磨粒加工的纳米尺度去除机理

以共价键或离子键结合的脆性单晶、多晶和光学玻璃是能源、通信、交通和医疗领域新兴微电子和光电器件的核心材料。为满足高性能器件的制造需求,脆性材料通常需要经过磨削、研磨、抛光等超精密磨粒加工,获得具有原子级光滑的表面、近无损伤的亚表面和微米甚至纳米级的加工精度。优化磨粒加工工艺不仅可以有效地提高加工效率,降低制造成本,还能够延长脆性材料元器件的服役寿命,但开发高效率、低损伤超精密磨粒加工技术需深入理解脆性材料纳米尺度的去除机理。本文基于划擦力学原理,揭示脆性材料纳米尺度磨粒加工去除的本质,阐明磨粒加工过程中脆性材料脆性–塑性转变去除的基本原理,概述单磨粒纳米划擦脆性材料的形变和去除机制,以及磨粒加工过程中脆性材料的去除机理及材料微观结构对其局部变形及后续去除的影响规律,提出实现脆性材料高效延性加工的控制策略,有助于推动脆性材料超精密磨粒加工技术的进一步发展。