国内微型器件装配技术的现状与应用

微机电系统(MEMS)以飞快的速度发展成为一个集微型机械、微传感器、微能源、微致动器、微控制器、微执行器、信号处理和智能控制于一体的新兴研究领域。微机电系统结构的复杂性促进了微装配技术的蓬勃发展，吸引了大批国内外研究人员对其进行广泛研究。本文首先分析了微器件装配技术对微机电系统的重要性及其产生的深远影响，然后介绍了近年来国内微装配技术的发展现状和参与微装配项目研发的研究单位的一些有应用价值的研究成果，最后阐述了微装配系统的发展趋势。     

微机电系统的研究与展望

微机电系统是面向2l世纪的高新技术。文章对微机电系统产生的背景、组成特征、发展现状及应用前景进行了全面分析。在此基础上，论述了MEMS未来发展的趋势。     

微机电系统实验建模研究

获得精确的微机电系统模型是实现系统高精度控制的有提条件，但微系统某些固有特性给系统理论建模带来一定困难。本文以微加速度传感器为例，提出一种理论分析和实验相结合的建模方法，并给出了相应的实验电路。     

基于免疫微传感器的微流体系统

作为提高免疫微传感器一致性及稳定性方法的关键研究内容之一，在MEMS工艺制备的电极型免疫微传感芯片的基础上，设计和制备微反应室以及微进出样沟道，以期利用微流体系统配合完成敏感膜固定化及免疫检测过程，探索提高生物敏感膜固化的稳定性和一致性，提高免疫微传感器检测一致性的技术和方法。设计了不同结构的微流体结构，并通过软件对不同结构对免疫检测过程所带来的影响进行了分析和比较。该研究对于面向应用的微型免疫生物传感器的研制有着重要的研究意义和实用价值。     

微机械电子学系统

本文简要地评述了微机构、微传感器、微执行器的发展,提出了微机械电子学系统的概念,指出了微机械电子学系统的发展前景。     

微系统技术及其应用

在过去几年里,微系统技术取得了长足发展,主要有两个原因:第一是市场需求对微系统技术发展产生的巨大推动力,第二是微电子微机械加工技术的发展为微系统技术奠定了有力基础。 微系统属于高新技术,它采用不同于传统机械加工的全新工艺,它的出现将在工业界引起深刻的变化。发达国家如美、日、德均投入巨资发展微系统技     

基于4 mm电磁型微马达的管道检测微机器人系统研究

介绍了一种基于4mm微型马达的微小机器人系统的设计及制作。新颖的电磁型微马达的设计使得微机器人具有较强的驱动能力和一定的负载能力；全方位的结构设计使得微机器人具有高机动性；同时，利用视觉实现机器人与外部环境相互感知，并在其基础上对整个机器人系统的控制结构设计进行了探索。     

气象微系统中传感器的温度补偿

气象微系统中微控制器要完成多个传感器的软件温度补偿，同时也要完成通讯、监测、控制等一系列功能，因而微控制器的数据处理量很大，系统中程序、数据需要的存储空间也很大。我们针对这一问题对软件温度补偿的算法进行了改进，减少了微控制器的数据处理量，并减少了系统中程序、数据所占的存储空间。考虑判系统中有多个传感器需要进行温度补偿，因而算法的改进对于气象微系统向灵巧型、便携式、高性能方向发展具有实用意义。     

片上系统与微机电系统

21世纪产品的微型化、个性化、智能化和低功耗已经成为必然的发展趋势，片上系统和微机电系统是这一发展趋势的有力驱动者。本文分别对这两种系统的核心技术和发展动态进行了介绍，并且对片上系统和微机电系统的市场情况进行了调查分析。最后指出在电子信息产业和机电行业，片上系统和微机电系统将引领世界的潮流，成为万众瞩目的焦点。     

微流体系统中微阀的研究现状

依据微流体系统中微阀的驱动机理,将微阀分为有源微阀和无源微阀两大类,然后对这两大类进行细分,将有源微阀分为压电、磁、静电驱动、热驱动、相变、双稳态、外部驱动等类型,将无源微阀分为悬臂梁式、薄膜式、毛细管、扭矩驱动等类型。分别讨论了各种微阀的工作原理和性能,介绍了各类微阀的实验研究进展,指出了这些微阀的特点,突出了微阀作为微流体系统的主要元件之一,起到径流调节、开/关转换、密封生物分子和微/纳粒子等作用。回顾了微阀的发展历程,分析了目前研究过程中存在的问题,提出了微阀今后的研究方向。     

微系统技术创新发展策略研究

简略论述了国际上重要公司微系统重点发展技术和策略,以及成为热点的3D集成技术及其主要开发联盟。初步探讨了我国微系统技术和产业创新发展策略,明确提出了建立以标准开发为目的的联合开发平台建议、重点开发的关键技术和微系统光电技术路线图。     

射频微系统冷却技术综述

雷达、电子战等射频电子装备向高集成度和大功率方向发展,有力牵引了射频微系统技术的进步,同时给冷却设计带来三大挑战:高面热流度、热堆叠和高体热流密度。冷却技术成为制约射频微系统应用的关键瓶颈之一。文中综述了国内外当前射频微系统冷却技术的发展现状,传统的远程散热架构因界面多与传热路径远已难以为继,高集成度的近结冷却技术显著提升芯片散热能力;以有源相控阵雷达为例,提出了射频微系统冷却的三代技术路线,指出了射频微系统热设计的主要发展方向。     

射频微系统关键技术进展及展望

文章简单介绍了微波集成电路的发展动态,综述了以美国DARPA为代表的国内外机构在射频微系统方面的重大研究计划及其水平,简述了射频微系统在通信、雷达、相控阵等领域的代表性应用,并总结了射频微系统互连、仿真与优化和集成架构设计等三个关键技术及其进展情况,最后对射频微系统今后的发展趋势做出了展望。     

Review on materials, microsensors, systems and devices forhigh-temperature and harsh-environment applications

The considerable investment in silicon technology has rarely addressed device use in harsh environments such as high temperatures, aggressive media, and radiation exposure. A clear future requirement is to save weight, volume, and reduce costs in “unfriendly” environments like high temperatures. This can be achieved either by cooling systems or by electronic microsystem components suited to withstand high temperatures. The current status of cooling systems, harsh-environment sensors, and microsystems in view of markets, realized devices, material, properties, process maturity, and packaging technologies are reviewed. Possible semiconductor candidates for high-temperature applications are discussed. The main obstacles for the future of high-temperature and harsh-environment microsystems is highlighted     

1-V microsystems-scaling on schedule for personal communications

The authors predict that scaled-down, ultra-low-power ICs and shrinking form-factors will hasten the arrival of on-demand services. Thus in total, advances in the various device and system technologies for conserving energy will deliver enormous system benefits. At the end of this decade and early into the next century, most portable microsystems will operate at around 1 V. The energy will be supplied by a single battery cell or solar cells. Progress in microelectronics and I/O devices will encourage shrinking form factors. At the lower form factors, personal systems will become unobtrusive and truly personal. Highly energy-efficient, ultra-low power 1-V microsystems will make possible the low-cost, battery-operated, portable systems needed to propel personal communication, entertainment, and information services. For these services to gain market acceptance, however, their benefits must be commensurate with cost. In their discussion the authors place emphasis on the developments in integrated circuit technologies     

Moderner Entwurf von Mikrosystemen

Microsystem technologies are the basis for the realization of miniaturized, intelligent embedded systems. Microsystems are characterized by the optimized application of “microtechnologies” and “systems engineering concepts”. Microtechnologies, e. g microelectronics, micromechanics and microoptics are those fabrication technologies which enable miniaturization. Packaging and interconnect technologies enable the configuration of individual components, innovative concepts for system architectures and signal processing enable the integration and optimization of components into systems and finally the concepts of systems engineering allow for the complex design process by attaching methodologies and computer aided tools for planning, specification, modeling, simulation, design, verification and test. Designing, verifying and testing microsystems and microsystem components will not be feasible without the intensive use of design methodologies and supporting computer aided design tools (CAE, CAD, CASE, CAT, ...)     

Applications of LIGA technology to precision manufacturing of high-aspect-ratio micro-components and -systems: a review

The by far leading technology for manufacturing MEMS devices is Si-micromachining with its various derivatives. However, many applications of microsystems have requirements on materials basis, geometry, aspect ratio, dimensions, shape, accuracy of microstructures, and number of parts that cannot be fulfilled easily by mainstream silicon-based micromachining technologies. LIGA, an alternative microfabrication process combining deep X-ray lithography, plating-through-mask and molding, enables the highly precise manufacture of high-aspect-ratio microstructures with large structural height ranging from hundreds to thousands of micrometers thick. These tall microstructures can be produced in a variety of materials with well-defined geometry and dimensions, very straight and smooth sidewalls, and tight tolerances. LIGA technology is also well suited for mass fabrication of parts, particularly in polymer.Many microsystems benefit from unique characteristics and advantages of the LIGA process in terms of product performance. The LIGA technology is briefly reviewed. The strengths of the manufacturing method and its main fields of application are emphasized with examples taken from various groups worldwide, especially in micromechanics and microoptics.     

Recent developments in micromachined silicon

This paper provides a review, directed at scientists and engineers concerned with microsystems technology, of advances in microelectromechanical systems (MEMS). The emphasis is on silicon technology, where the electrical properties of the material are exploited in circuitry and the mechanical properties are used in sensor and microstructure applications. Developments in surface micromachining are discussed, and applications in sensors, microelectronic devices, vacuum microanalysis systems, microfluidics, and optoelectronic subsystems are reviewed. Some emerging technologies are assessed and promising new research directions are identified     

微系统热管理技术的新发展

多功能高度集成的微系统技术对信息系统的通信、传感、处理和执行等方面产生了很大的影响,而热管理问题却一直制约着微系统技术的发展。该文介绍了美国在微系统热管理技术方面的项目研究计划及基于热传导与液冷技术的微系统热管理技术的新进展,提出了一种基于压电驱动的主动微系统高效热管理方法,并通过搭建试验样机完成原理性测试验证。该技术主要针对如微波毫米波大功率“瓦片式”T/R（收发）组件等射频微系统热管理应用。     

Vom IC zum Mikrosystem

Additionally to the very large scale integrated information processing systems, the second Silicon revolution brings non-electrical functions on the same chip. Chips emerge which are able to sense, to think, to act and to communicate. They are beginning to penetrate into all spheres of human life. Low production costs and mature manufacturing technologies are necessary preconditions for the commercial success. Therefore, going back to the well-proven and costefficient microelectronic technologies and production plants was one of the most important ways towards the broad market penetration of microsystems. However, an extension of the microelectronic technologies is inevitable. In the paper, based on the microsystem development activities of Austria Mikro Systeme Int., problems of microsystem development and solutions are presented for a microelectronic compatible manufacturing environment. With it, the paper describes CMOS compatible products like magnetosensor-IC’s based on Hall elements, mechanical systems like acceleration sensors and specific pre-and post-processing process extensions with service possibilities for external organisations.