共查询到19条相似文献,搜索用时 265 毫秒
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添加微量稀土元素的SnAgCu无铅钎料的研究 总被引:7,自引:0,他引:7
介绍目前国际上较为公认的SnAgCu系无铅钎料的特点,并汇总了国际上相关专利的情况.同时,结合本实验室的专利技术,介绍了添加微量稀土对SnAgCu系无铅钎料性能的影响,并着重研究了稀土对显微组织,特别是金属间化合物的影响规律.研究结果表明:从综合性能角度考虑,添加稀土的作用明显,特别是显著改善了钎料的抗蠕变性能,稀土添加量的最佳范围在w(0.05~0.25)%之间.适量的稀土添加,可有效抑制金属间化合物的生长,细化组织. 相似文献
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JimMorris Dr.Matthew J.O’Keefe 《电子工业专用设备》2004,33(12):1-5
目前,无铅钎料应用的日益推广使得波峰焊设备问题更加突出.其中主要的问题是设备的腐蚀及材料的寿命.为此,许多设备制造商提出了不同的方案来解决此类问题.这些方案涉及范围从不对元件进行改进到使用昂贵的金替代整个钎料锅及喷嘴.本文对制造波峰焊设备"钎料元件"的所用材料进行评估. 相似文献
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微电子组装中Sn-Zn系无铅钎料的研究与开发 总被引:3,自引:3,他引:3
无铅钎料的研究开发是我国电子材料行业目前面临的紧迫课题.其中Sn-Zn系无铅钎料具有低的熔点,优良的力学性能,能获得可靠的钎焊接头,且其原材料丰富、价格便宜,有望替代Sn-Pb钎料.但该系钎料易氧化,抗腐蚀性较差,目前还未得到广泛的采用.介绍了开发新型无铅钎料应满足的要求,及几种有潜力的Sn-Zn系无铅钎料. 相似文献
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利用正交试验法,对SnAgCuRE系钎料合金的拉伸性能进行了检验。结果表明:SnAgCuRE系钎料合金的拉伸性能与Ag和RE的添加量密切相关,即拉伸强度会随Ag含量增大而提高;延伸率受RE影响最大,并在w(RE)为0.1%时延伸率和拉伸强度都达到最佳。当w(RE)达到0.5%时,会导致延伸率的下降。 相似文献
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稀土改性的Sn-58Bi低温无铅钎料 总被引:1,自引:0,他引:1
研究了微量稀土对Sn-58Bi低温钎料的改性作用.试验添加质量分数为0.1 ?组混合稀土的无铅材料,并对比Sn-58Bi和Sn-58Bi0.5Ag合金.观察了钎料显微组织的变化并做了定量分析,采用DSC测试了钎料的熔化温度,同时测量了钎料的润湿性能、接头强度与硬度.结果表明,微量稀土添加细化了Sn-58Bi钎料合金的显微组织,对钎料的熔化温度几乎没有影响,能显著改善Sn-58Bi钎料的润湿性能和接头剪切强度,而且改善的程度优于添加微量Ag对Sn-58Bi钎料的作用. 相似文献
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颗粒增强Sn-Ag基无铅复合钎料显微组织与性能 总被引:2,自引:0,他引:2
通过外加法向Sn-3.5Ag焊料中加入体积分数为10%的微米级Cu、Ni颗粒制备了无铅复合钎料,对钎料的显微组织、拉剪及润湿性能进行了研究。结果表明,颗粒周围以及基板界面处的显微组织中生成了金属间化合物,其形态及大小因加入颗粒而不同。颗粒的加入提高了钎料钎焊接头的剪切强度,其中Cu颗粒增强的接头的剪切强度提高了33%,Ni颗粒的提高了20%。两种复合钎料的铺展面积均下降了约15%,其中Cu颗粒增强复合钎料润湿角由11°增加到18°。 相似文献
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Solder joints used in electronic applications undergo reflow operations. Such operations can affect the solderability, interface
intermetallic layer formation and the resultant solder joint microstructure. These in turn can affect the overall mechanical
behavior of such joints. In this study the effects of reflow on solderability and mechanical properties were studied. Nanoindentation
testing (NIT) was used to obtain mechanical properties from the non-reflow (as-melted) and multiple reflowed solder materials.
These studies were carried out with eutectic Sn-3.5Ag solders, with or without mechanically added Cu or Ag reinforcements,
using Cu substrates. Microstructural analysis was carried out on solder joints made with the same solders using copper substrate. 相似文献
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This study investigated the resonant vibration-fatigue characteristics of some potential lead-free solders, including Sn-Zn,
Sn-Ag Sn-Cu, and Sn-Bi alloys. Results show that, under a fixed vibration force, the damping capacity and vibration-fracture
resistance of Sn-Cu and Sn-Ag eutectic alloys with an off-eutectic structure are higher than Sn-Pb and are also higher than
Sn-Bi and Sn-Zn. This is closely related to the vibration-deformed structure and crack-propagation morphology associated with
the microstructural features of the materials. Also, the striated deformation in the Sn-rich phase can be regarded as an effective
mechanism in absorbing vibration energy. Moreover, microstructural modification of the Sn-Zn eutectic alloy can be achieved
through Ag addition, and thus, the damping capacity and vibration-fracture resistance can be significantly improved. 相似文献
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The characteristics of vibration fracture of Pb-Sn and lead-free Sn-Zn eutectic solders 总被引:1,自引:0,他引:1
This work investigated the fatigue fracture characteristics of Sn-7∼11wt.%Zn and Sn-30∼50wt.%PPb solder alloys under resonant
vibration. For the alloys containing proeutectic Sn-rich grains, the results show stratum appearance on the deformation of
coarse proeutectic grains. This stratum-type deformation will reduce the vibration resistance of Pb-Sn solder by inducing
cracks. For the Sn-Zn system, fine eutectic structure will cause cracks to form and coalesce easily in the regions concentrated
with small fibrous deformation grains, whereas hypereutectic structure shows coarse proeutectic Zn-rich particles as the crack
initiation sites. Sn-t-Zn solders have better damping capacity than Pb-Sn solders. With hypoeutectic composition to induce
stratum-type deformation and under lower vibration strain, these lead-free solders tend to exhibit superior crack propagation
resistance, and, in that respect, are possible to replace Pb-Sn solders. 相似文献