浅析开关电源EMI控制技术

文中详细地分析了开关电源EMI的产生机理,提出了一系列的EMI抑制策略,从而有效地提高开关电源的电磁兼容性。     

开关电源输入EMI滤波器设计与仿真

开关电源中常用EMI滤波器抑制共模干扰和差模干扰。三端电容器在抑制开关电源高频干扰方面有良好性能。文中在开关电源一般性能EMI滤波器电路结构基础上,给出了使用三端电容器抑制高频噪声的滤波器结构。并使用PSpice软件对插入损耗进行仿真,给出了仿真结果。     

开关电源传导EMI 抑制技术探讨

主要介绍了开关电源的基本结构框图及它产生电磁干扰机理,阐述了开关电源电磁干扰主要是传导干扰。为了有效抑制传导EMI,首先分析了一般抑制传导干扰的技术---接地和滤波,然后分析讨论了传导电磁干扰测量技术LISN 和集成EMI 滤波器技术。设计了LISN 上加共模和差模分离网络,并提出了集成EMI 滤波器2 级级联的理论。但文中的理论未在工程实验中验证,这是下步我们需要研究的。     

EMI电源滤波器的设计探讨

电源EMI滤波器是一种抑制传导发射和辐射发射非常有效的方法.分析了电源线上的干扰类型,开关电源产生EMI的原理及其拓扑结构.讨论了电源EMI滤波器的设计和器件选取原则,并提出有关安装电源EMI滤波器时应注意的几个问题.     

利用扩频技术抑制开关电源电磁骚扰

通过分析开关电源的骚扰特性,提出一种基于扩频技术的方法降低开关电源的电磁骚扰(EMI),并通过试验证明这种方法非常有效。对开关电源的设计和骚扰抑制具有现实的指导意义。     

开关电源的抗干扰设计

本文列举了开关电源EMC设计的几个问题，简要叙述了抑制开关电源EMI的措施。     

高功率因数反激式开关电源的电磁兼容研究

对带有高PF(功率因数)反激式的开关电源的电磁干扰进行了分析.为实现开关电源的EMC(电磁兼容),在设计过程中采用了EMI滤波器.在探讨EMI滤波器的设计原则基础上,分析了高频分布参数对滤波器频率特性的影响,通过设计和调整滤波器的结构及器件参数,实现了EMI传导干扰的有效抑制,使带有高PF反激式的开关电源达到灯具的EMI标准.     

高功率因素反激式开关电源的电磁兼容研究

摘要：论文对带有高PF（功率因素）反激式的开关电源的电磁干扰进行了分析。为实现开关电源的EMC（电磁兼容）,在设计过程中采用了EMI滤波器。论文在探讨EMI滤波器的设计原则基础上,分析了高频分布参数对滤波器频率特性的影响,通过设计和调整滤波器的结构及器件参数,实现了EMI传导干扰的有效抑制,使带有高PF反激式的开关电源达到灯具的EMI标准。     

智能投饵机开关电源分析与仿真

投饵机的开关电源和主负载电动机产生大量的EMI,使投饵机工作性能下降,故障率高。本文分析投饵机开关电源的EMI,采取多种抑制干扰措施,利用PSPICE仿真软件工具,合理地调整电路元件参数,通过电磁兼容设计使投饵机开关电源能够协调、有效地工作,提高了产品稳定性和抗干扰能力。     

开关电源EMC的分析及设计应用

开关电源因为体积小、功率因数大等优点,在电力电子领域的应用愈发广泛。而由于会产生电磁干扰,使其进一步的应用受到限制。分析了开关电源电磁干扰产生的各种机理,并提出电磁兼容(EMC)的设计方法,主要采用了电路措施、滤波、接地、PCB合理布局等方法进行EMI抑制。为实际应用中开关电源电磁干扰的抑制提供了借鉴,可以大大促进开关电源在生活中的广泛应用。     

Electromagnetic interference (EMI) of system-on-package (SOP)

Electromagnetic interference (EMI) issues are expected to be crucial for next-generation system-on-package (SOP) integrated high-performance digital LSIs and for radio frequency (RF) and analog circuits. Ordinarily in SOPs, high-performance digital LSIs are sources of EMI, while RF and analog circuits are affected by EMI (victims). This paper describes the following aspects of EMI in SOPs: 1) die/package-level EMI; 2) substrate-level EMI; 3) electromagnetic modeling and simulation; and 4) near electromagnetic field measurement. First, LSI designs are discussed with regard to radiated emission. The signal-return path loop and switching current in the power/ground line are inherent sources of EMI. The EMI of substrate, which work as coupling paths or unwanted antennas, is described. Maintaining the return current path is an important aspect of substrate design for suppressing EMI and for maintaining signal integrity (SI). In addition, isolating and suppressing the resonance of the DC power bus in a substrate is another important design aspect for EMI and for power integrity (PI). Various electromagnetic simulation methodologies are introduced as indispensable design tools for achieving high-performance SOPs without EMI problems. Measurement techniques for near electric and magnetic fields are explained, as they are necessary to confirm the appropriateness of designs and to investigate the causes of EMI problems. This paper is expected to be useful in the design and development of SOPs that take EMI into consideration.     

变压器耦合式直流固体继电器传导发射分析与抑制

在采用变压器耦合作为隔离电路的固体继电器中,变压器工作在自激振荡状态,通过磁芯将高频信号传递到变压器次级。这使得变压器成为对外传导发射的主要干扰源,严重时会影响到其他电子设备的正常工作。文中以某型号变压器耦合式直流固体继电器为研究对象,首先根据GJB1515A 中CE102(10kHz-10MHz 电源线传导发射要求)的规定,试验测量得到输入端电源线对外传导发射。首先,将传导发射分为差模干扰和共模干扰两种形式,并分析了传导发射的干扰源和主要传播通道。其次,在建立考虑铁心损耗和绕组铜损的变压器高频模型的基础上,利用ANSOFT Q3D 和Orcad Pspice 仿真软件得到该固体继电器用于传导发射分析的等效电路模型。仿真结果与试验结果相吻合,均表明该继电器输入端电源线对外传导发射超出国军标的要求。为抑制传导发射,文中提出在固体继电器输入端串入EMI 滤波器的优化方案。试验结果显示,优化后输入端电源线对外传导发射低于国军标的规定,提高了变压器耦合式固体继电器的电磁兼容性能。     

EMI滤波器设计

EMI滤波器是电磁兼容设计及抑制电磁干扰的重要技术.电子电路设计人员应掌握EMI滤波器基本原理和各种类型滤波器的基本特性和使用方法,根据实际工作中的具体情况合理选择滤波元件,设计有效的EMI滤波器,从而实现EMC设计或抑制EMI的目的.在本文中主要阐述了EMI滤波器的相关理论,包括公模噪声、差模噪声、阻抗失配原则、滤波...     

Differential-Mode EMI Reduction in a Multiphase DCM Flyback Converter

Switched converters are a source of electromagnetic interference (EMI) due to the hard switching and abrupt edges in the current and voltage waveforms. Multiphase converters can reduce the EMI at the source, minimizing the conducted EMI generation, without changing dramatically the normal operation of the circuit. Input filter can be greatly reduced, radiated EMI is lower, and internal EMI problems are minimized. This paper is focused on exploring multiphase converters as a topological technique to reduce conducted differential-mode EMI generation at the source, considering some nonidealities of the multiphase converter.      

改进EMI滤波器的高频寄生效应方法

针对滤波器小型化、轻型化、薄型化方向发展的趋势,介绍了平面集成滤波器的概念,通过比较分立元器件滤波器与集成滤波器的异同,分析分立元器件的高频寄生效应,介绍了平面PCB如何构建电感和电容及有效去除其高频寄生效应。并用MAXWELL软件对其仿真,得出其高频寄生参数。最后通过ADS软件对其高频寄生参数建模,验证了该方法是有效的。     

电磁屏蔽膜设备的开发及应用

介绍了国内外对电磁屏蔽膜(EMI)研究的现状,比较了制备EMI膜的各种方法,指出采用磁控溅射法制备的EMI膜质量较好,并给出制备EMI膜的工艺流程。     

电磁干扰滤波器的参数及其测试

EMI滤波器作为抑制电磁干扰的最有力的手段,日益为人们所了解和广泛使用。对EMI滤波器的理解、应用及测试技术的掌握就变得十分重要。文章介绍EMC常用组件,讨论常用的滤波器的分类及选择,重点介绍EMI滤波器的测试指标和标准,分析EMI滤波器的测试方法.     

Multilayer power printed structures suitable for controlling EMI noises generated in power converters

Electromagnetic interference (EMI) noises generated in power converters are diffused on the surface of conductors. This means influences occur from radiated EMI noises emitted from power transmission lines as well as conducted EMI noises transmitted from them. EMI noises diffusing on the surface of conductors are generally difficult to control using conventional concentrated constant theory. Thus, a new approach based on distributed constant circuit theory is needed in order to control EMI noises. A power converter structure to control EMI noises using multilayer power printed circuit technology is studied in this paper. A structure which can control EMI noises should simultaneously satisfy two conditions, i.e., one to shut down and one to attenuate EMI noises. The structure satisfying these conditions is studied through simulations using the Transmission-Line Modeling Method. The simulations show that the diffusion of EMI noises is controlled by dividing the flow of currents produced by EMI noises into the horizontal and perpendicular directions. That is, the horizontal current flow is controlled inside using the differences in the resistance produced from differences between inner and outer diameter of power transmission lines and the perpendicular current flow can be controlled by properly designing the thickness of the dielectric layer sandwiched between P-and N-power transmission lines with the symmetrical structure. Moreover, it is confirmed by simulations and experiments that the attenuation of EMI noises is affected by the width of the power transmission lines. It is expected that the results obtained in this paper can provide important rules when designing power converters with EMI noise control functions which use the multilayer power printed circuit technology.     

A low-noise multiresolution high-dynamic ultra-broad-band time-domain EMI measurement system

A time-domain electromagnetic interference (EMI) measurement system allows to reduce measurement time by several orders of magnitude in comparison with conventional systems. This will considerably reduce the costs of compliance tests. In this paper, a novel multiresolution time-domain EMI measurement system is presented. The multiresolution time-domain EMI measurement system exhibits several channels with limiters, amplifiers, and analog-to-digital converters. The amplitude range of the signal is subdivided into several intervals. In each interval the analog-to-digital conversion is performed with an amplitude discretization proportional to the width of the amplitude interval. The signal-to-noise ratio of the multiresolution time-domain EMI measurement system compared with a conventional time-domain measurement system for transient signals is enhanced by at least 50 dB. It is shown that the multiresolution time-domain EMI measurement system has a higher overload factor than conventional systems working frequency domain. The noise floor is 5 dB lower than the noise floor of a conventional EMI receiver. The multiresolution time-domain EMI measurement system shows a higher 1-dB compression point than conventional EMI receivers. Measurements were performed in the frequency range from 30 MHz to 1 GHz and compared with results obtained by an EMI receiver.     

FDTD and experimental investigation of EMI from stacked-card PCBconfigurations

Stacked-card and modules-on-backplane printed circuit-board geometries are advantageous for conserving real-estate in many designs. Unfortunately, at high frequencies, electromagnetic magnetic interference (EMI) resulting from the nonnegligible impedance of the signal return at the connector may occur. This effective EMI coupling path results in the daughtercard being driven against the motherboard and attached cables, resulting in common-mode radiation. The connector geometry can be modified to minimize the EMI coupling path when high frequencies are routed between the motherboard and daughtercard. Current speeds and printed circuit board (PCB) sizes result in geometries that are of significant dimensions in terms of a wavelength at the upper frequency end of the signal spectrum. The PCB geometries are then of sufficient electrical extent to be effective EMI antennas. The resonant lengths of the EMI antennas may, however, be quite removed from the typical half-wavelength dipole resonances. The finite difference time-domain method can be used to numerically analyze the printed circuit board geometries, determine antenna resonances, and investigate EMI coupling paths. EMI resulting from the stacked-card configuration has been investigated experimentally and numerically to ascertain the EMI coupling path at the bus connector, and EMI antennas