Synthesis and characterization of siliconized epoxy-1,3-bis(maleimido)benzene intercrosslinked matrix materials

Intercrosslinked network of siliconized epoxy-1,3-bis(maleimido)benzene matrix systems have been developed. The siliconization of epoxy resin was carried out by using various percentages of (5-15%) hydroxyl-terminated polydimethylsiloxane (HTPDMS) with γ-aminopropyltriethoxysilane (γ-APS) as crosslinking agent and dibutyltindilaurate as catalyst. The siliconized epoxy systems were further modified with various percentages of (5-15%) 1,3-bis(maleimido)benzene (BMI) and cured by using diaminodiphenylmethane (DDM). The neat resin castings prepared were characterized for their mechanical properties. Mechanical studies indicate that the introduction of siloxane into epoxy resin improves the toughness of epoxy resin with reduction in the values of stress-strain properties whereas, incorporation of bismaleimide into epoxy resin improves stress-strain properties with lowering of toughness. However, the introduction of both siloxane and bismaleimide into epoxy resin influences the mechanical properties according to their percentage content. Differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and measurement of heat distortion temperature were also carried out to assess the thermal behavior of the matrix samples. DSC thermogram of the BMI modified epoxy systems show unimodel reaction exotherms. The glass transition temperature (T_g), thermal degradation temperature and heat distortion temperature of the cured BMI modified epoxy and siliconized epoxy systems increase with increasing BMI content and this may be due to the homopolymerization of BMI rather than Michael addition reaction. The morphology of the BMI modified epoxy and siliconized epoxy systems were also studied by scanning electron microscopy.     

Studies on thermal and morphological behavior of siliconized epoxy bismaleimide matrices

Novel bismaleimide‐modified siliconized epoxy intercrosslinked network systems were developed. Siliconized epoxy systems containing 5, 10, and 15% siloxane units were prepared using epoxy resin and hydroxyl‐terminated polydimethylsiloxane (HTPDMS) with γ‐aminopropyltriethoxysilane (γ‐APS) as a compatibilizer and dibutyltindilaurate as a catalyst. The siliconized epoxy systems were further modified with 5, 10, and 15% (wt %) of bismaleimide [(N,N′‐bismaleimido‐4,4′‐diphenylmethane) (BMI)] and cured by diaminodiphenylmethane (DDM). Differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and heat‐distortion temperature measurement of the matrix samples were carried out to assess their thermal behavior. DSC thermograms of the BMI‐modified epoxy systems show unimodel reaction exotherms. The glass transition temperature (T_g) of the cured BMI‐modified epoxy and siliconized epoxy systems increases with increasing BMI content. Thermogravimetric analysis and heat‐distortion temperature measurements indicate that the thermal degradation temperature and heat‐distortion temperature of the BMI‐modified epoxy and siliconized epoxy systems increase with increasing BMI content. The morphology of the BMI‐modified siliconized epoxy systems was also studied by scanning electron microscopy (SEM). © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 2330–2346, 2001     

Preparation and characterization of siliconized epoxy/bismaleimide (N,N′‐bismaleimido‐4,4′‐diphenyl methane) intercrosslinked matrices for engineering applications

Novel hybrid intercrosslinked networks of hydroxyl‐terminated polydimethylsiloxane‐modified epoxy and bismaleimide matrix systems have been developed. Epoxy systems modified with 5, 10, and 15 wt % of hydroxyl‐terminated polydimethylsiloxane (HTPDMS) were developed by using epoxy resin and hydroxyl‐terminated polydimethylsiloxane with γ‐aminopropyltriethoxysilane (γ‐APS) as compatibilizer and dibutyltindilaurate as catalyst. The reaction between hydroxyl‐terminated polydimethylsiloxane and epoxy resin was confirmed by IR spectral studies. The siliconized epoxy systems were further modified with 5, 10, and 15 wt % of bismaleimide (BMI). The matrices, in the form of castings, were characterized for their mechanical properties. Differential scanning calorimetry and thermogravimetric analysis of the matrix samples were also performed to determine the glass‐transition temperature and thermal‐degradation temperature of the systems. Data obtained from mechanical studies and thermal characterization indicate that the introduction of siloxane into epoxy improves the toughness and thermal stability of epoxy resin with reduction in strength and modulus values. Similarly the incorporation of bismaleimde into epoxy resin improved both tensile strength and thermal behavior of epoxy resin. However, the introduction of siloxane and bismaleimide into epoxy enhances both the mechanical and thermal properties according to their percentage content. Among the siliconized epoxy/bismaleimide intercrosslinked matrices, the epoxy matrix having 5% siloxane and 15% bismaleimide exhibited better mechanical and thermal properties than did matrices having other combinations. The resulting siliconized (5%) epoxy bismaleimide (15%) matrix can be used in the place of unmodified epoxy for the fabrication of aerospace and engineering composite components for better performance. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 38–46, 2001     

Preparation and characterization of 3,3′‐bis (maleimidophenyl)phenylphosphine oxide (BMI)/polysulfone modified epoxy intercrosslinked matrices

An intercrosslinked network of polysulfone (PSF)—bismaleimide (BMI) modified epoxy matrix system was made by using diglycidyl ether of bisphenol A (DGEBA) epoxy resin, hydroxyl terminated polysulfone and bismaleimide (3,3′‐bis(maleimidophenyl) phenylphosphine oxide) with diaminodiphenylmethane (DDM) as curing agent. BMI–PSF–epoxy matrices were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and heat deflection temperature (HDT) analysis. The matrices, in the form of castings, were characterized for their mechanical properties such as tensile strength, flexural strength, and unnotched Izod impact test as per ASTM methods. Mechanical studies indicated that the introduction of polysulfone into epoxy resin improves the toughness to an appreciable extent with insignificant increase in stress–strain properties. DSC studies indicated that the introduction of polysulfone decreases the glass transition temperature, whereas the incorporation of bismaleimide into epoxy resin influences the mechanical and thermal properties according to its percentage content. DSC thermograms of polysulfone as well as BMI modified epoxy resin show a unimodal reaction exotherm. The thermal stability and flame retardant properties of cured epoxy resins were improved with the introduction of bismaleimide and polysulfone. Water absorption characteristics were studied as per ASTM method and the morphology of the BMI modified epoxy and PSF‐epoxy systems were studied by scanning electron microscope. POLYM. COMPOS., 2008. © 2008 Society of Plastics Engineers     

Mechanical properties of E‐glass fiber reinforced siliconized epoxy polymer composites

Siliconized epoxy‐matrix systems have been developed by an interpenetrating mechanism using epoxy resins GY 250 and LY 556 (Ciba‐Geigy) and hydroxyl terminated polydimethylsiloxane with γ‐aminopropyltriethoxysilane as crosslinker in the presence of dibutyltindilaurate catalyst. Aliphatic amine (HY 951, Ciba‐Geigy), aromatic amine (HT 972, Ciba‐Geigy) and polyamidoamine (HY 840, Ciba‐Geigy) are used as curing agents for epoxy resins. The tentative level of 10% siloxane introduction into epoxy resin has been ascertained from experimental studies to obtain reasonable improvements in the impact behavior without compromising other mechanical properties. The impact behavior of E‐glass reinforced composites made from the siliconized epoxy resin is enhanced to 2–4 times over that measured on the composites made from a pure epoxy resin. Composites cured with aromatic amine impart better mechanical properties than those cured with aliphatic amine and polyamidoamine.     

Preparation and characterization of bismaleimide (N,N′‐bismaleimido‐4,4′‐diphenyl methane)–unsaturated polyester modified epoxy intercrosslinked matrices

An intercrosslinked network of unsaturated polyester–bismaleimide modified epoxy matrix systems was developed. Epoxy systems modified with 10, 20, and 30% (by weight) of unsaturated polyester were made by using epoxy resin and unsaturated polyester with benzoyl peroxide and diaminodiphenylmethane as curing agents. The reaction between unsaturated polyester and epoxy resin was confirmed by IR spectral studies. The unsaturated polyester toughened epoxy systems were further modified with 5, 10, and 15% (by weightt) of bismaleimide (BMI). The matrices, in the form of castings, were characterized for their mechanical properties. Differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) of the matrix samples were performed to determine the glass transition temperature (T_g) and thermal degradation temperature of the systems, respectively. Mechanical properties, viz: tensile strength, flexural strength, and plain strain fracture toughness of intercrosslinked epoxy systems, were studied by ASTM methods. Data obtained from mechanical and thermal studies indicated that the introduction of unsaturated polyester into epoxy resin improves toughness but with a reduction in glass transition, whereas the incorporation of bismaleimide into epoxy resin improved both mechanical strength and thermal behavior of epoxy resin. The introduction of bismaleimide into unsaturated polyester‐modified epoxy resin altered thermomechanical properties according to their percentage concentration. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 2853–2861, 2002     

Mechanical and morphological properties of organic–inorganic,hybrid, clay‐filled,and cyanate ester/siloxane toughened epoxy nanocomposites

Organic–inorganic hybrids involving cyanate ester and hydroxyl‐terminated polydimethylsiloxane (HTPDMS) modified diglycidyl ether of bisphenol A (DGEBA; epoxy resin) filled with organomodified clay [montmorillonite (MMT)] nanocomposites were prepared via in situ polymerization and compared with unfilled‐clay macrocomposites. The epoxy‐organomodified MMT clay nanocomposites were prepared by the homogeneous dispersion of various percentages (1–5%), and the resulting homogeneous epoxy/clay hybrids were modified with 10% HTPDMS and γ‐aminopropyltriethoxysilane as a coupling agent in the presence of a tin catalyst. The siliconized epoxy/clay prepolymer was further modified separately with 10% of three different types of cyanate esters, namely, 4,4′‐dicyanato‐2,2′‐diphenylpropane, 1,1′‐bis(3‐methyl‐4‐cyanatophenyl) cyclohexane, and 1,3‐dicyanato benzene, and cured with diaminodiphenylmethane as a curing agent. The reactions during the curing process between the epoxy, siloxane, and cyanate were confirmed by Fourier transform infrared analysis. The results of dynamic mechanical analysis showed that the glass‐transition temperatures of the clay‐filled hybrid epoxy systems were lower than that of neat epoxy. The data obtained from mechanical studies implied that there was a significant improvement in the strength and modulus by the nanoscale reinforcement of organomodified MMT clay with the matrix resin. The morphologies of the siloxane‐containing, hybrid epoxy/clay systems showed heterogeneous character due to the partial incompatibility of HTPDMS. The exfoliation of the organoclay was ascertained from X‐ray diffraction patterns. The increase in the percentage of organomodified MMT clay up to 5 wt % led to a significant improvement in the mechanical properties and an insignificant decrease in the glass‐transition temperature versus the unfilled‐clay systems. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Studies on mechanical,thermal, and morphology of diglycidylether‐terminated polydimethylsiloxane‐modified epoxy–bismaleimide matrices

An epoxy matrix system modified by diglycidylether‐terminated polydimethylsiloxane (DGETPDMS) and bismaleimide (BMI) was developed. Epoxy systems modified with 4, 8, and 12% (by wt) of DGETPDMS were made using epoxy resin and DGETPDMS, with diaminodiphenylmethane as the curing agent. The DGETPDMS‐toughened epoxy systems were further modified with 4, 8, and 12% (by wt) of BMI, namely (N,N′‐bismaleimido‐4,4′‐diphenylmethane). DGETPDMS/BMI/epoxy matrices were characterized using differential scanning calorimetry, thermogravimetric analysis, and heat deflection temperature analysis. The matrices, in the form of castings, were characterized for their mechanical properties, viz. tensile strength, flexural strength, and impact test, as per ASTM methods. Mechanical studies indicate that the introduction of DGETPDMS into epoxy resin improves the impact strength, with reduction in tensile strength, flexural strength, and glass transition temperature, whereas the incorporation of BMI into epoxy resin enhances the mechanical and thermal properties according to its percentage content. However, the introduction of both DGETPDMS and BMI enhances the values of thermomechanical properties according to their percentage content. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 668–674, 2006     

Effect of elastomer modification on the adhesive characteristics of maleimide‐functional phenolic resins

The effect of addition of elastomeric modifiers on the adhesive properties like lap shear strength and T‐peel strength of an addition curable, maleimide functional novolac phenolic resin (PMF), self‐cured and cocured with a novolac epoxy resin, was studied using aluminium adherends. The modifiers used were (1) two grades of carboxyl terminated butadiene acrylonitrile copolymer (CTBN) of different molecular weights, (2) a low molecular weight, epoxidized hydroxyl‐terminated polybutadiene, and (3) a high molecular weight acrylate terpolymer containing pendant epoxy functionality. The adhesive properties, when examined as a function of the varying concentrations of the additives, ranging from 10 to 30 parts per hundred parts (phr) of the resin, were found to depend on the nature of the matrix being modified as well as on the nature and concentration of the elastomer. The adhesive properties at ambient temperature of the self‐cured, highly brittle PMF resin were dramatically improved by the inclusion of all the elastomers, the increase being substantial in the case of high molecular weight CTBN. For the more rigid, less ductile, epoxy‐cured PMF system, the adhesive properties were marginally improved by the high molecular weight CTBN, whereas the other elastomers were practically ineffective. For both self‐cured and epoxy‐cured PMF systems, the inclusion of these elastomers generally decreased the high‐temperature adhesive properties, implying impairment of thermal characteristics, evidenced also from their dynamic mechanical spectra. The presence of phase‐separated elastomer particles in the modified systems has been evidenced from scanning electron micrographs. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 74: 2321–2332, 1999     

Toughening of epoxy resin systems using low‐viscosity additives

This study has evaluated three low‐viscosity epoxy additives as potential tougheners for two epoxy resin systems. The systems used were a lower‐reactive resin based upon the diglycidyl ether of bisphenol A (DGEBA) and the amine hardener diethyltoluene diamine, while the second epoxy resin was based upon tetraglycidyl methylene dianiline (TGDDM) and a cycloaliphatic diamine hardener. The additives evaluated as potential tougheners were an epoxy‐terminated aliphatic polyester hyperbranched polymer, a carboxy‐terminated butadiene rubber and an aminopropyl‐terminated siloxane. This work has shown that epoxy‐terminated hyperbranched polyesters can be used effectively to toughen the lower cross‐linked epoxy resins, i.e. the DGEBA‐based systems, with the main advantage being that they have minimal effect upon processing parameters such as viscosity and the gel time, while improving the fracture properties by about 54 % at a level of 15 wt% of additive and little effect upon the T_g. This result was attributed to the phase‐separation process producing a multi‐phase particulate morphology able to initiate particle cavitation with little residual epoxy resin dissolved in the continuous epoxy matrix remaining after cure. The rubber additive was found to impart similar levels of toughness improvement but was achieved with a 10–20 °C decrease in the T_g and a 30 % increase in initial viscosity. The siloxane additive was found not to improve toughness at all for the DGEBA‐based resin system due to the poor dispersion within the epoxy matrix. The TGDDM‐based resin systems were found not to be toughened by any of the additives due to the lack of plastic deformation of the highly cross‐linked epoxy network Copyright © 2003 Society of Chemical Industry     

Diallyl bisphenol A—novolac epoxy system cocured with bisphenol‐A‐bismaleimide—cure and thermal properties

Novolac epoxy (EPN)—2,2′‐diallyl bisphenol A (DABA) resin system was modified by cocuring it with bisphenol A bismaleimide (BMI). Molar concentration of BMI in the stochiometric blend of EPN and DABA was varied from 0.5 to 2.0. The cure optimization was done using DSC, IR spectroscopy, and rheological studies. The curing proceeded by phenol‐epoxy and Alder‐ene reactions. The performance of the ternary Epoxy‐Allyl phenolic‐Bismaleimide system was evaluated through their thermal and dynamic mechanical characterization. BMI improved the overall thermal stability and the modulus of the resultant composites. The increase in BMI concentration in the system resulted in enhanced glass transition temperature with a consequent improvement in high temperature performance typically estimated by their lap shear strength at high temperatures. The high temperature performance of the epoxy‐phenol‐bismaleimide (EPB) system was found to be far superior to the epoxy‐phenol (EP)system. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Thermal and toughness property studies on a polybenzimidazole‐modified epoxy resin system

The effect of polybenzimidazole (PBI) on a silica‐filled epoxy resin matrix has been investigated. Polybenzimidazole (PBI) was incorporated into a difunctional epoxy resin matrix to the extent of 10 %, before being cured with an anhydride hardener. The effects of PBI on the curing reaction and glass transition temperature (T_g) and on the toughness of the cured epoxy matrix have been studied using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and a universal testing machine (Instron). The results indicate that the PBI modifier enhanced not only the glass transition temperature of the difunctional epoxy matrix but also its toughness, by its catalytic action. Further investigations have been carried out on the fractured specimens, using scanning electron microscopy (SEM) to support the enhanced toughness property of the epoxy matrix. © 2000 Society of Chemical Industry     

Preparation and properties of TiO2‐filled poly(acrylonitrile‐butadiene‐styrene)/epoxy hybrid composites

Poly (acrylonitrile‐butadiene‐styrene) (ABS) was used to modify diglycidyl ether of bisphenol‐A type of epoxy resin, and the modified epoxy resin was used as the matrix for making TiO₂ reinforced nanocomposites and were cured with diaminodiphenyl sulfone for superior mechanical and thermal properties. The hybrid nanocomposites were characterized by using thermogravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), universal testing machine (UTM), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). The bulk morphology was carefully analyzed by SEM and TEM and was supported by other techniques. DMA studies revealed that the DDS‐cured epoxy/ABS/TiO₂ hybrid composites systems have two T_gs corresponding to epoxy and ABS rich phases and have better load bearing capacity with the addition of TiO₂ particles. The addition of TiO₂ induces a significant increase in tensile properties, impact strength, and fracture toughness with respect to neat blend matrix. Tensile toughness reveals a twofold increase with the addition of 0.7 wt % TiO₂ filler in the blend matrix with respect to neat blend. SEM micrographs of fractured surfaces establish a synergetic effect of both ABS and TiO₂ components in the epoxy matrix. The phenomenon such us cavitation, crack path deflection, crack pinning, ductile tearing of the thermoplastic, and local plastic deformation of the matrix with some minor agglomerates of TiO₂ are observed. However, between these agglomerates, the particles are separated well and are distributed homogeneously within the polymer matrix. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Synthesis,formulation, and characterization of siloxane‐modified epoxy‐based anticorrosive paints

Diglycidyl ether of bisphenol A epoxy (E) was modified with hydroxyl‐terminated polydimethylsiloxane through a ring‐opening addition polymerization reaction. The structural elucidation of the siloxane‐modified epoxy resin (ES) was carried out with Fourier transform infrared, ¹H‐NMR, and ¹³C‐NMR spectroscopy techniques. The physicochemical characterization of the synthesized resin (ES) was performed with standard methods. E and ES were subjected to paint formulation with the help of a rutile (TiO₂) pigment. The formulated paint systems were cured at room temperature with 1,6‐diaminohexane (AH) and 1,3‐diaminopropane (AP), which were used as curatives. The E–AH, E–AP, ES–AH, and ES–AP paint systems were applied to mild steel strips. The physicomechanical and anticorrosive performance of the coated panels was evaluated with standard methods. The thermal analysis of these E–amine and ES–amine systems was carried out via thermogravimetric analysis. The effects of siloxane incorporation and amine curatives on the coating properties of the paint systems were also investigated. The ES–AP system exhibited good thermal and corrosion stability performance among all the E and ES paint systems. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 4981–4991, 2006     

Toughened cycloaliphatic epoxy resin for demanding thermal applications and surface coatings

An epoxy resin based on nonglycidyl ether and varying content of carboxyl‐terminated (poly)butadiene acrylonitrile copolymer was cured using an aromatic amine hardener. The ultimate aim of the study was to modify the brittle epoxy matrix by the liquid rubber to improve toughness characteristics. Fourier transform infrared spectroscopic analysis of the modified was performed to understand the structural transformations taking place during the uncured and cured stage of the modified systems. The decreasing trend in exothermal heat of reaction with increasing rubber content in the epoxy resin can be explained by the fact that the increase of carboxyl‐terminated butadiene acrylonitrile copolymer (CTBN) modifier might induce a high reactivity of the end groups with the epoxide ring and resulting shorter curing times and, hence, the faster curing process than the unmodified resin. Tensile strength, impact strength, and elongation‐at‐break behaviors of neat as well as modified networks have been studied to observe the effect of rubber modification. Blends sample exhibits better properties as compared to pure epoxy resin in terms of increase in impact strength and elongation‐at‐break of the casting and gloss, scratch hardness, adhesion, and flexibility of the film. The improvement in these properties indicate that the rubber‐modified resin would be more durable than the epoxy based on di glycidyl ether of bis‐phenol‐A and other epoxies. The films of coating based on epoxy with 15 wt % CTBN offered the maximum resistance toward different concentrations of acids, alkalies, and solvents as compared to the cured films of other blend samples. The thermal stability of the cycloaliphatic‐based epoxy resin was increased with the addition of 15 wt % CTBN in epoxy matrix. Cycloaliphatic‐based epoxy network modified with CTBN displayed two phase separated morphology with dispersed rubber globules in the matrix resin, i.e., they revealed the presence of two phase morphological features. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Sepiolite‐reinforced epoxy nanocomposites: Thermal,mechanical, and morphological behavior

A bisphenol A‐based epoxy resin was modified with pristine sepiolite and an organically surface‐modified sepiolite and thermally cured using two different curing agents: an aliphatic and a cycloaromatic diamine. The nanocomposites were characterized by dynamic mechanical analysis (DMA), rheology, thermogravimetric analysis (TGA), and electron microscopy. The initial sepiolite–epoxy mixtures show a better dispersion for the sepiolite‐modified system that forms a percolation network structure. Mechanical properties have also been determined. The flexural modulus of the epoxy matrix slightly increases by the incorporation of the organophilic sepiolite. The flexural strength of the sepiolite‐modified resin cured with the aliphatic diamine increased by 10%, while the sepiolite‐modified resin cured with the cycloaromatic diamine resulted in a lower flexural strength, as compared with the unmodified resin. Electron micrographs revealed a better nanodispersion of the sepiolite in the epoxy matrix for the organophilic modified sepiolite nanocomposite. The initial thermal decomposition temperature did not change significantly with the addition of sepiolite, whereas mechanical properties were affected. The reduced flexural strength was attributed to the stress concentrations caused by the sepiolite modifier. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Phosphorus‐containing epoxy resin for an electronic application

A phosphorus‐containing epoxy resin, 6‐H‐dibenz[c,e][1,2] oxaphosphorin‐6‐[2,5‐bis(oxiranylmethoxy)phenyl]‐6‐oxide (DOPO epoxy resin), was synthesized and cured with phenolic novolac (Ph Nov), 4,4′‐diaminodiphenylsulfone (DDS), or dicyandiamide (DICY). The reactivity of these three curing agents toward DOPO epoxy resin was found in the order of DICY > DDS > Ph Nov. Thermal stability and the weight loss behavior of the cured polymers were studied by TGA. The phosphorus‐containing epoxy resin showed lower weight loss temperature and higher char yield than that of bisphenol‐A based epoxy resin. The high char yields and limiting oxygen index (LOI) values as well as excellent UL‐94 vertical burn test results of DOPO epoxy resin indicated the flame‐retardant effectiveness of phosphorus‐containing epoxy resins. The DOPO epoxy resin was investigated as a reactive flame‐retardant additive in an electronic encapsulation application. Owing to the rigid structure of DOPO and the pendant P group, the resulting phosphorus‐containing encapsulant exhibited better flame retardancy, higher glass transition temperature, and thermal stability than the regular encapsulant containing a brominated epoxy resin. High LOI value and UL‐94 V‐0 rating could be achieved with a phosphorus content of as low as 1.03% (comparable to bromine content of 7.24%) in the cured epoxy, and no fume and toxic gas emission were observed. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 353–361, 1999     

Synthesis of novel phosphorous‐containing biphenol, 2‐(5, 5‐dimethyl‐4‐phenyl‐2‐oxy‐1,3,2‐dioxaphosphorin‐6‐yl)‐1,4‐benzenediol and its application as flame‐retardant in epoxy resin

A novel phosphorous‐containing biphenol, 2‐(5,5‐dimethyl‐4‐phenyl‐2‐oxy‐1,3,2‐dioxaphosphorin‐6‐yl)‐ 1,4‐benzenediol (DPODB), was prepared by the addition reaction between 5,5‐dimethyl‐4‐phenyl‐2‐oxy‐1,3,2‐dioxaphosphorinane phosphonate (DPODP) and p‐benzoquinone (BQ). The compound (DPODB) was used as a reactive flame retardant in o‐cresol formaldehyde novolac epoxy resin (CNE) for electronic application. The structure of DPODB was confirmed by FTIR and NMR spectra. Thermal properties of cured epoxy resin were studied using differential scanning calorimetry (DSC) and thermal gravimetric analysis (TGA). The flame retardancy of cured epoxy resins was tested by UL‐94 vertical test and achieved UL‐94 vertical tests of V‐0 grade (nonflammable). © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 3842–3847, 2006     

Preparation and properties of dynamically cured PP/MAH‐g‐EVA/epoxy blends

A method concerning with the simultaneous reinforcing and toughening of polypropylene (PP) was reported. Dynamical cure of the epoxy resin with 2‐ethylene‐4‐methane‐imidazole (EMI‐2,4) was successfully applied in the PP/maleic anhydride‐grafted ethylene‐vinyl acetate copolymer (MAH‐g‐EVA), and the obtained blends named as dynamically cured PP/MAH‐g‐EVA/epoxy blends. The stiffness and toughness of the blends are in a good balance, and the smaller size of epoxy particle in the PP/MAH‐g‐EVA/epoxy blends shows that MAH‐g‐EVA was also used as a compatibilizer. The structure of the dynamically cured PP/MAH‐g‐EVA/epoxy blends is the embedding of the epoxy particles by the MAH‐g‐EVA. The cured epoxy particles as organic filler increases the stiffness of the PP/MAH‐g‐EVA blends, and the improvement in the toughness is attributed to the embedded structure. The tensile strength and flexural modulus of the blends increase with increasing the epoxy resin content, and the impact strength reaches a maximum of 258 J/m at the epoxy resin content of 10 wt %. DSC analysis shows that the epoxy particles in the dynamically cured PP/MAH‐g‐EVA/epoxy blends could have contained embedded MAH‐g‐EVA, decreasing the nucleating effect of the epoxy resin. Thermogravimetric results show the addition of epoxy resin could improve the thermal stability of PP, the dynamically cured PP/MAH‐g‐EVA/epoxy stability compared with the pure PP. Wide‐angle x‐ray diffraction analysis shows that the dynamical cure and compatibilization do not disturb the crystalline structure of PP in the blends. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

A comparative study on the preparation and characterization of aromatic and aliphatic bismaleimides‐modified polyurethane–epoxy interpenetrating polymer network matrices

Interpenetrating polymer networks of bismaleimide‐modified polyurethane–epoxy systems were prepared using the aliphatic and aromatic bismaleimides‐ and polyurethane‐modified epoxy and cured in the presence of 4,4′‐diaminodiphenylmethane. Infrared spectral analysis was used to confirm the polyurethane‐crosslinked epoxy (PU–EP). The matrices developed were characterized by mechanical, thermal, electrical, and morphological studies. The results obtained from the mechanical studies indicate that the incorporation of polyurethane and bismaleimides into epoxy increased the tensile strength, flexural strength, and impact strength, according to their nature and percentage concentration. The results obtained from the thermal and electrical studies indicate that the incorporation of polyurethane into epoxy decreased the thermal properties (glass transition temperature, heat distortion temperature (HDT), thermal stability) and electrical properties (dielectric strength, volume and surface resistivity, and arc resistance). The incorporation of aromatic bismaleimide into the polyurethane‐modified epoxy system increased the glass transition temperature, thermal stability, and electrical properties. Decreased values of glass transition and HDT were obtained in the case of aliphatic bismaleimide‐modified polyurethane–epoxy system. Surface morphology of modified epoxy systems was studied using scanning electron microscopy, and it was found that the polyurethane‐modified epoxy systems exhibited heterogeneous morphology and bismaleimides‐modified epoxy systems showed a homogeneous morphology. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 99: 3592–3602, 2006