Preparation and characterization of siliconized epoxy/bismaleimide (N,N′‐bismaleimido‐4,4′‐diphenyl methane) intercrosslinked matrices for engineering applications

Novel hybrid intercrosslinked networks of hydroxyl‐terminated polydimethylsiloxane‐modified epoxy and bismaleimide matrix systems have been developed. Epoxy systems modified with 5, 10, and 15 wt % of hydroxyl‐terminated polydimethylsiloxane (HTPDMS) were developed by using epoxy resin and hydroxyl‐terminated polydimethylsiloxane with γ‐aminopropyltriethoxysilane (γ‐APS) as compatibilizer and dibutyltindilaurate as catalyst. The reaction between hydroxyl‐terminated polydimethylsiloxane and epoxy resin was confirmed by IR spectral studies. The siliconized epoxy systems were further modified with 5, 10, and 15 wt % of bismaleimide (BMI). The matrices, in the form of castings, were characterized for their mechanical properties. Differential scanning calorimetry and thermogravimetric analysis of the matrix samples were also performed to determine the glass‐transition temperature and thermal‐degradation temperature of the systems. Data obtained from mechanical studies and thermal characterization indicate that the introduction of siloxane into epoxy improves the toughness and thermal stability of epoxy resin with reduction in strength and modulus values. Similarly the incorporation of bismaleimde into epoxy resin improved both tensile strength and thermal behavior of epoxy resin. However, the introduction of siloxane and bismaleimide into epoxy enhances both the mechanical and thermal properties according to their percentage content. Among the siliconized epoxy/bismaleimide intercrosslinked matrices, the epoxy matrix having 5% siloxane and 15% bismaleimide exhibited better mechanical and thermal properties than did matrices having other combinations. The resulting siliconized (5%) epoxy bismaleimide (15%) matrix can be used in the place of unmodified epoxy for the fabrication of aerospace and engineering composite components for better performance. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 38–46, 2001     

Synthesis and characterization of siliconized epoxy-1,3-bis(maleimido)benzene intercrosslinked matrix materials

Intercrosslinked network of siliconized epoxy-1,3-bis(maleimido)benzene matrix systems have been developed. The siliconization of epoxy resin was carried out by using various percentages of (5-15%) hydroxyl-terminated polydimethylsiloxane (HTPDMS) with γ-aminopropyltriethoxysilane (γ-APS) as crosslinking agent and dibutyltindilaurate as catalyst. The siliconized epoxy systems were further modified with various percentages of (5-15%) 1,3-bis(maleimido)benzene (BMI) and cured by using diaminodiphenylmethane (DDM). The neat resin castings prepared were characterized for their mechanical properties. Mechanical studies indicate that the introduction of siloxane into epoxy resin improves the toughness of epoxy resin with reduction in the values of stress-strain properties whereas, incorporation of bismaleimide into epoxy resin improves stress-strain properties with lowering of toughness. However, the introduction of both siloxane and bismaleimide into epoxy resin influences the mechanical properties according to their percentage content. Differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and measurement of heat distortion temperature were also carried out to assess the thermal behavior of the matrix samples. DSC thermogram of the BMI modified epoxy systems show unimodel reaction exotherms. The glass transition temperature (T_g), thermal degradation temperature and heat distortion temperature of the cured BMI modified epoxy and siliconized epoxy systems increase with increasing BMI content and this may be due to the homopolymerization of BMI rather than Michael addition reaction. The morphology of the BMI modified epoxy and siliconized epoxy systems were also studied by scanning electron microscopy.     

Studies on mechanical,thermal, and morphology of diglycidylether‐terminated polydimethylsiloxane‐modified epoxy–bismaleimide matrices

An epoxy matrix system modified by diglycidylether‐terminated polydimethylsiloxane (DGETPDMS) and bismaleimide (BMI) was developed. Epoxy systems modified with 4, 8, and 12% (by wt) of DGETPDMS were made using epoxy resin and DGETPDMS, with diaminodiphenylmethane as the curing agent. The DGETPDMS‐toughened epoxy systems were further modified with 4, 8, and 12% (by wt) of BMI, namely (N,N′‐bismaleimido‐4,4′‐diphenylmethane). DGETPDMS/BMI/epoxy matrices were characterized using differential scanning calorimetry, thermogravimetric analysis, and heat deflection temperature analysis. The matrices, in the form of castings, were characterized for their mechanical properties, viz. tensile strength, flexural strength, and impact test, as per ASTM methods. Mechanical studies indicate that the introduction of DGETPDMS into epoxy resin improves the impact strength, with reduction in tensile strength, flexural strength, and glass transition temperature, whereas the incorporation of BMI into epoxy resin enhances the mechanical and thermal properties according to its percentage content. However, the introduction of both DGETPDMS and BMI enhances the values of thermomechanical properties according to their percentage content. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 668–674, 2006     

Studies on thermal and morphological behavior of siliconized epoxy bismaleimide matrices

Novel bismaleimide‐modified siliconized epoxy intercrosslinked network systems were developed. Siliconized epoxy systems containing 5, 10, and 15% siloxane units were prepared using epoxy resin and hydroxyl‐terminated polydimethylsiloxane (HTPDMS) with γ‐aminopropyltriethoxysilane (γ‐APS) as a compatibilizer and dibutyltindilaurate as a catalyst. The siliconized epoxy systems were further modified with 5, 10, and 15% (wt %) of bismaleimide [(N,N′‐bismaleimido‐4,4′‐diphenylmethane) (BMI)] and cured by diaminodiphenylmethane (DDM). Differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and heat‐distortion temperature measurement of the matrix samples were carried out to assess their thermal behavior. DSC thermograms of the BMI‐modified epoxy systems show unimodel reaction exotherms. The glass transition temperature (T_g) of the cured BMI‐modified epoxy and siliconized epoxy systems increases with increasing BMI content. Thermogravimetric analysis and heat‐distortion temperature measurements indicate that the thermal degradation temperature and heat‐distortion temperature of the BMI‐modified epoxy and siliconized epoxy systems increase with increasing BMI content. The morphology of the BMI‐modified siliconized epoxy systems was also studied by scanning electron microscopy (SEM). © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 2330–2346, 2001     

Synthesis and characterization of thermoplastic poly(ester–siloxane)s

Two series of thermoplastic poly(ester–siloxane)s, based on poly(dimethylsiloxane) (PDMS) as the soft segment and poly(butylene terephthalate) as the hard segment, were synthesized by two‐step catalyzed transesterification reactions in the melt. Incorporation of soft poly(dimethylsiloxane) segments into the copolyester backbone was accomplished in two different ways. The first series was prepared based on dimethyl terephthalate, 1,4‐butanediol and silanol‐terminated poly(dimethylsiloxane) (PDMS‐OH). For the second series, the PDMS‐OH was replaced by methyl diesters of carboxypropyl‐terminated poly(dimethylsiloxane)s. The syntheses were optimized in terms of both the concentration of catalyst, tetra‐n‐butyl‐titanate (Ti(OBu)₄), and stabilizer, N,N′‐diphenyl‐p‐phenylene‐diamine, as well as the reaction time. The reactions were followed by measuring the inherent viscosities of the reaction mixture. The molecular structures of the synthesized poly(ester–siloxane)s were verified by ¹H NMR spectroscopy, while their thermal properties were investigated using differential scanning calorimetry. © 2001 Society of Chemical Industry     

Modification of bismaleimide resin by poly(ethylene phthalate‐co‐ethylene terephthalate), poly(ethylene phthalate‐co‐ethylene 4,4′‐biphenyl dicarboxylate), and poly(ethylene phthalate‐co‐ethylene 2,6‐naphthalene dicarboxylate)

Aromatic polyesters were prepared and used to improve the brittleness of bismaleimide resin, composed of 4,4′‐bismaleimidodiphenyl methane and o,o′‐diallyl bisphenol A (Matrimid 5292 A/B resin). The aromatic polyesters included PEPT [poly(ethylene phthalate‐co‐ethylene terephthalate)], with 50 mol % of terephthalate, PEPB [poly(ethylene phthalate‐co‐ethylene 4,4′‐biphenyl dicarboxylate)], with 50 mol % of 4,4′‐biphenyl dicarboxylate, and PEPN [poly(ethylene phthalate‐co‐ethylene 2,6‐naphthalene dicarboxylate)], with 50 mol % 2,6‐naphthalene dicarboxylate unit. The polyesters were effective modifiers for improving the brittleness of the bismaleimide resin. For example, inclusion of 15 wt % PEPT (MW = 9300) led to a 75% increase in fracture toughness, with retention in flexural properties and a slight loss of the glass‐transition temperature, compared with the mechanical and thermal properties of the unmodified cured bismaleimide resin. Microstructures of the modified resins were examined by scanning electron microscopy and dynamic viscoelastic analysis. The toughening mechanism was assessed as it related to the morphological and dynamic viscoelastic behaviors of the modified bismaleimide resin system. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 2352–2367, 2001     

Reactive blend of epoxy‐novolac resin and epoxide‐terminated low‐molecular‐weight poly(phenylene oxide)

The epoxide‐terminated low‐molecular‐weight poly(phenylene oxide) (PPO), EPPO, was synthesized by modifying the terminal hydroxyl group of PPO and it was reactively blended with epoxy‐novolac resin (EPN). The curing kinetics, phase morphology, thermal stability, dielectric property, and water absorption behavior of the cured EPN/EPPO blends were investigated and compared with the unmodified EPN/PPO blends. As revealed by the FTIR and DSC analysis, EPPO takes part in the curing reaction and forms a reactive blend with EPN. The curing rate of both EPN/PPO and EPN/EPPO blends first increases and then decreases with increasing the PPO or EPPO fraction. The blends have lower degree of curing than neat EPN, due to the steric hindrance effects of PPO or EPPO. Because of the reaction between blend components, EPN/EPPO blends show faster curing rate and higher degree of curing than the corresponding EPN/PPO blends. The reactive blending improves the dispersion of EPPO in EPN matrix and the EPN/EPPO blend forms a co‐continuous morphology even at a low EPPO content, compared to the typical sea‐island morphology of the EPN/PPO blend. The EPN/EPPO blend has remarkable smaller dielectric constant, dissipation factor, and water absorption than neat EPN. © 2012 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Enhanced fracture toughness of epoxy resins with novel amine‐terminated poly(arylene ether sulfone)–carboxylic‐terminated butadiene‐acrylonitrile–poly(arylene ether sulfone) triblock copolymers

Amine‐terminated poly(arylene ether sulfone)–carboxylic‐terminated butadiene‐acrylonitrile–poly(arylene ether sulfone) (PES‐CTBN‐PES) triblock copolymers with controlled molecular weights of 15,000 (15K) or 20,000 (20K) g/mol were synthesized from amine‐terminated PES oligomer and commercial CTBN rubber (CTBN 1300x13). The copolymers were utilized to modify a diglycidyl ether of bisphenol A epoxy resin by varying the loading from 5 to 40 wt %. The epoxy resins were cured with 4,4′‐diaminodiphenylsulfone and subjected to tests for thermal properties, plane strain fracture toughness (K_IC), flexural properties, and solvent resistance measurements. The fracture surfaces were analyzed with SEM to elucidate the toughening mechanism. The properties of copolymer‐toughened epoxy resins were compared to those of samples modified by PES/CTBN blends, PES oligomer, or CTBN. The PES‐CTBN‐PES copolymer (20K) showed a K_IC of 2.33 MPa m^0.5 at 40 wt % loading while maintaining good flexural properties and chemical resistance. However, the epoxy resin modified with a CTBN/8K PES blend (2:1) exhibited lower K_IC (1.82 MPa m^0.5), lower flexural properties, and poorer thermal properties and solvent resistance compared to the 20K PES‐CTBN‐PES copolymer‐toughened samples. The high fracture toughness with the PES‐CTBN‐PES copolymer is believed to be due to the ductile fracture of the continuous PES‐rich phases, as well as the cavitation of the rubber‐rich phases. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 1556–1565, 2002; DOI 10.1002/app.10390     

Preparation of poly(1,4‐cyclohexylenedimethylene phthalate)s and their use as modifiers for aromatic diamine‐cured epoxy resin

Poly(1,4‐cyclohexylenedimethylene phthalate) s, prepared by the reaction of phthalic anhydride and 1,4‐cyclohexane dimethanol (35/65 or 73/27 mol % cis/trans or trans alone), have been used to improve the toughness of bisphenol‐A diglycidyl ether epoxy resin cured with 4,4′‐diaminodiphenyl sulfone. The aromatic polyesters include poly(cis/trans‐1,4‐cyclohexylenedimethylene phthalate) (PCP) based on a commercial cyclohexanedimethanol, poly(trans‐1,4‐cyclohexylenedimethylene phthalate) (trans‐PCP) and poly(cis/trans‐1,4‐cyclohexylenedimethylene phthalate) (cis‐rich PCP) prepared from a cis‐rich diol. The polyesters used were soluble in the epoxy resin without solvents and were effective as modifiers for toughening the cured epoxy resin. For example, the inclusion of 20 wt% of PCP (MW 6400 g mol⁻¹) led to an 80% increase in the fracture toughness (K_IC) of the cured resin with no loss of mechanical and thermal properties. The toughening mechanism is discussed in terms of morphological and dynamic viscoelastic behaviours of the modified epoxy resin system. © 2000 Society of Chemical Industry     

Studies on isotactic poly(phenyl glycidyl ether)‐modified epoxy resins. II. Toughening of epoxy resins

A semicrystalline polymer, isotactic poly(phenyl glycidyl ether) (i‐PPGE) was used as a modifier for epoxy resin; 1,8‐Diamino‐p‐methane (MNDA) and 4,4′‐Diamino diphenyl sulfone (DDS) were used as curing agents. In the MNDA‐cured resins, the dispersed phase were spherical particles with diameters in the range of 0.5–1.0 μm when the resin was blended with 5 phr i‐PPGE. In the DDS‐cured resins, the particle size distribution of the dispersed phase was much wider. The difference was traced back to the reactivity of the curing agent and the different regimes used for curing. Through dynamic mechanical analysis, it was found that in the MNDA‐cured systems, i‐PPGE had a lower crystallinity than in the DDS‐cured system. In spite of the remarkable difference in the morphology and microstructure of the modified resins cured with these two curing agents, the toughening effects of i‐PPGE were similar for these resins. The critical stress intensity factor (K_IC) was increased by 54% and 53%, respectively, for the resins cured by DDS and by MNDA, blending with 5 phr of the toughner. i‐PPGE was comparable with the classical toughners carboxyl‐terminated butadiene‐acrylonitrile copolymers in effectiveness of toughening the epoxy resin. An advantage of i‐PPGE was that the modulus and the glass‐transition temperature of the resin were less affected. However, this modifier caused the flexural strength to decrease somewhat. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 1223–1232, 2002; DOI 10.1002/app.10445     

Preparation and properties of high performance phthalide‐containing bismaleimide modified epoxy matrices

A series of intercrosslinked networks formed by diglycidyl ether of bisphenol A epoxy resin (DGEBA) and novel bismaleimide containing phthalide cardo structure (BMIPP), with 4,4′‐diamino diphenyl sulfone (DDS) as hardener, have been investigated in detail. The curing behavior, thermal, mechanical and physical properties and compatibility of the blends were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), notched Izod impact test, scanning electron microscopy (SEM) and water absorption test. DSC investigations showed that the exothermic transition temperature (T_p) of the blend systems shifted slightly to the higher temperature with increasing BMIPP content and there appeared a shoulder on the high‐temperature side of the exothermic peak when BMIPP content was above 15 wt %. TGA and DMA results indicated that the introduction of BMIPP into epoxy resin improved the thermal stability and the storage modulus (G′) in the glassy region while glass transition temperature (T_g) decreased. Compared with the unmodified epoxy resin, there was a moderate increase in the fracture toughness for modified resins and the blend containing 5 wt % of BMIPP had the maximum of impact strength. SEM suggested the formation of homogeneous networks and rougher fracture surface with an increase in BMIPP content. In addition, the equilibrium water uptake of the modified resins was reduced as BMIPP content increased. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Mechanical properties of poly(styrene‐co‐acrylonitrile)‐modified epoxy resin/glass fiber composites

Poly(styrene‐co‐acylonitrile) was used to modify diglycedyl ether of bisphenol‐A type epoxy resin cured with diamino diphenyl sulfone and the modified epoxy resin was used as the matrix for fiber‐reinforced composites (FRPs) to get improved mechanical properties. E‐glass fiber was used as fiber reinforcement. The tensile, flexural, and impact properties of the blends and composites were investigated. The blends exhibited considerable improvement in mechanical properties. The scanning electron micrographs of the fractured surfaces of the blends and tensile fractured surfaces of the composites were also analyzed. The micrographs showed the influence of morphology on the properties of blends. Results showed that the mechanical properties of glass FRPs increased gradually upon fiber loading. Predictive models were applied using various equations to compare the mechanical data obtained theoretically and experimentally. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Miscibility and crystallization behavior of poly(3‐hydroxybutyrate‐co‐3‐hydroxyvalerate)/poly(vinyl acetate) blends

The miscibility and crystallization behavior of poly(3‐hydroxybutyrate‐co‐3‐hydroxyvalerate) (P(HB‐co‐HV))/poly(vinyl acetate) (PVAc) blends have been investigated by differential scanning calorimetry (DSC) and polarized optical microscopy (POM). It was found that P(HB‐co‐HV)/PVAc blends were miscible in the melt over the whole compositions. Thus the blend exhibited a single glass transition temperature (T_g), which increased with increasing PVAc composition. The spherulitic morphologies of P(HB‐co‐HV)/PVAc blends indicated that the PVAc was predominantly segregated into P(HB‐co‐HV) interlamellar or interfibrillar regions during P(HB‐co‐HV) crystallization because of the volume‐filled spherulites. As to the crystallization kinetics study, it was found that the overall crystallization and crystal growth rates decreased with the addition of PVAc. The kinetics retardation was primarily attributed to the reduction of chain mobility and dilution of P(HB‐co‐HV) upon mixing with higher T_g PVAc. The overall crystallization rate was predominantly governed by the spherulitic growth rate and promoted by the samples treated with the quenched state because of the higher nucleation density. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 980–988, 2006     

Novel dibutyltin oxide‐tributyl phosphate condensate as accelerator for the curing of the epoxy resin/4,4′‐diamino diphenyl sulfone system. II. Toughening of the resin with hydroxyl‐terminated poly(tetramethylene) glycols

When a crystalline Bu₂SnO‐Bu₃PO₄ condensate was used as a catalyst for the curing of the Epon 828/DDS system, the addition of hydroxyl group to epoxy group took place. On the basis of this reaction, direct employment of poly(tetramethylene) glycols (PTMG) as toughener for the epoxy resin system was successful. Morphology of the modified resin depended on the molecular weight and the concentration of PTMG. With the incorporation of a small amount of PTMG, the critical fracture energy of the cured resin was improved greatly, while the flexural strength and the modulus were less influenced. A slight enhancement in glass transition temperature (T_g) of the modified resin was found up to the PTMG concentration of 5 phr; further increase of the PTMG concentration caused a significant lowering of T_g. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 80: 1237–1242, 2001     

Shape memory effect of poly(L‐lactide)‐ based polyurethanes with different hard segments

A series of biodegradable polylactide‐based polyurethanes (PLAUs) were synthesized using PLA diol (M_n = 3200) as soft segment, 4,4′‐diphenylmethane diisocyanate (MDI), 2,4‐toluene diisocyanate (TDI), and isophorone diisocyanate (IPDI) as hard segment, and 1,4‐butanediol as chain extender. The structures and properties of these PLAUs were studied using infrared spectroscopy, differential scanning calorimetry, tensile testing, and thermomechanical analysis. Among them, the MDI‐based PLAU has the highest T_g, maximum tensile strength, and restoration force, the TDI‐based PLAU has the lowest T_g, and the IPDI‐based PLAU has the highest tensile modulus and elongation at break. They are all amorphous. The shape recovery of the three PLAUs is almost complete in a tensile elongation of 150% or a twofold compression. They can keep their temporary shape easily at room temperature (20 °C). More importantly, they can deform and recover at a temperature below their T_g values. Therefore, by selecting the appropriate hard segment and adjusting the ratio of hard to soft segments, they can meet different practical demands for shape memory medical devices. Copyright © 2007 Society of Chemical Industry     

Toughening of bismaleimide resin by modification with poly(ethylene phthalate) and poly(ethylene phthalate-co-ethylene isophthalate)

Aromatic polyesters were prepared and used to improve the brittleness of the bismaleimide resin composed of 4,4′-bismaleimidediphenyl methane and o,o′-diallyl bisphenol A. The aromatic polyesters contain poly(ethylene phthalate) (PEP) and poly(ethylene phthalate-co-ethylene isophthalate) (10 mol % isophthalate unit) (PEPI). PEP and PEPI were effective modifiers for improving the brittleness of the bismaleimide resin. The most suitable composition for the modification of the bismaleimide was inclusion of 20 wt % PEP (MW 18,200), which led to an 80% increase in the fracture toughness with retention of flexural properties and a slight decrease in the glass transition temperature, compared with the mechanical and thermal properties of the unmodified cured bismaleimide resin (Matrimid resin). Microstructures of the modified resins were examined by scanning electron microscopy and dynamic viscoelastic analysis. The thermal stability of the modified resin was slightly lower than that of the unmodified resin by thermogravimetric analysis. The toughening mechanism is discussed in terms of the morphological and dynamic viscoelastic behavior of the modified bismaleimide resin system. © 1997 John Wiley & Sons, Inc. J Appl Polym Sci 65: 1349–1357, 1997     

Mechanical properties and morphology of poly(ethylene glycol)‐side‐chain‐modified bismaleimide polymer

Two maleimido‐end‐capped poly(ethylene glycol) (m‐PEG)‐modified bismaleimide (BMI) resins [4,4′‐bismaleimido diphenylmethane (BDM)] were synthesized from poly(ethylene glycol) (PEG) of two different molecular weights. A series of m‐PEGs and unmodified BDM were blended and thermally cured. The effect of incorporating m‐PEG side chains on the morphology and mechanical behaviors of BMI polymer were evaluated. The mechanical properties of these m‐PEG‐modified BMIs that were evaluated included flexural modulus, flexural strength, strain at break, fracture toughness, and fracture energy. The morphology of these blends was studied with scanning electron microscopy. All the m‐PEG‐modified BMI polymers showed various degrees of phase separation depending on the molecular weights and concentrations of the m‐PEG used. The effects of these morphological changes in the m‐PEG‐modified BMI polymers were reflected by the improved fracture toughness and strain at break. However, there was a reduction in the flexural moduli in all m‐PEG‐modified BMI polymers. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 715–724, 2002     

Studies of cyclic and linear poly(dimethylsiloxanes): 19. Glass transition temperatures and crystallization behaviour

Differential scanning calorimetry (d.s.c.) was used to investigate the thermal behaviour of cyclic and linear poly(dimethylsiloxanes) over the temperature range 103–298 K. Fractions of the polymers studied had number-average molar masses in the range 160 < M_n < 25 500 g mol^?1 and heterogeneity indices $\text{M}{}_{\mathrm{<mtext>w</mtext>}}\text{M}{}_{\mathrm{<mtext>n</mtext>}}\text{< 1.1}$ in most cases. D.s.c. was applied to measure the glass transition temperatures T_g cold crystallization temperatures T_c and polymer crystalline melting temperatures T_m of the oligomer and polymer fractions. Cyclic siloxanes [(CH₃)₂SiO]_x with number-average numbers of skeletal bonds n_n in the range 24 ≦ n_n ≦ 79 and linear siloxanes (CH₃)SiO[(CH₃)₂SiO]_ySi(CH₃)₃ with n_n in the range 10 ≦ n_n ≦ 40 were found not to crystallize. The T_g values of the linear siloxanes were found to be in agreement with values in the literature and they increased with increasing M_n. By contrast, the T_g values of the cyclics were found to decrease with increasing M_n.     

Modification of three‐component bismaleimide resin by poly(phthaloyl diphenyl ether) and related copolymers

A three‐component bismaleimide resin, composed of 4,4′‐bismaleimidodiphenyl methane (BDM), o,o′‐diallyl bisphenol A (DBA), and o,o′‐dimethallyl bisphenol A (1.0/0.3/0.7 eq ratio) was used as a parent bismaleimide resin. Modification of the three‐component bismaleimide resin was examined by blending it with poly(ether ketone ketone)s. Poly(ether ketone ketone)s include poly(phthaloyl diphenyl ether) (PPDE), poly(phthaloyl diphenyl ether‐co‐isophthaloyl diphenyl ether) (PPIDE), and poly(phthaloyl diphenyl ether‐co‐terephthaloyl diphenyl ether) (PPTDE). The PPIDE (51 mol % isophthaloyl) and PPTDE (44 mol % terephthaloyl) were more effective as modifiers for the bismaleimide resin than was PPDE. For example, the fracture toughness (K_IC) for the modified resin increased 30% with no deterioration in the flexural strength and modulus with a 15 wt % inclusion of PPTDE (MW 23,400) compared to the parent three‐component bismaleimide resin: the K_IC increased 95% compared to the value for the Matrimid 5292 resin composed of BDM and DBA. The morphologies of the modified resins changed from particulate to cocontinuous phase structures, depending on the modifier structure and concentration. Toughening of the cured bismaleimide resin could be achieved because of the cocontinuous phase structure. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 2991–3000, 2001     

Synthesis and thermal characterization of random poly(butylene terephthalate‐co‐2‐methyl‐ethylene terephthalate) copolyesters

Poly(butylene terephthalate‐co‐2‐methyl‐ethylene terephthalate) (PBT/MET) was synthesized by incorporating 1,2‐propandiol(1,2‐PDO) into PBT chains. The molar composition and chemical structure of PBT/MET copolyesters were confirmed by means of FT‐IR and ¹H‐NMR. To investigate the effect of 1,2‐PDO on the thermal properties of PBT/MET copolyesters, the copolymerizations were carried out by varying various contents of MET units, and the prepared materials were evaluated by differential scanning calorimetry and thermogravimetric analysis. Results suggested that with the increase of the content of 1,2‐PDO, the amount of crystallinity and the melting temperature decline, while the glass transition temperature increases and the copolyesters become more transparent and brittle with respect to PBT homopolymer. In addition, the T_g‐composition and T_m‐composition data are well subjected to the Wood equation and Flory's equation, respectively. All these copolyesters are found to consist of the general trend displayed by copolymers reported elsewhere. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010