二维编织C/SiC复合材料的热膨胀系数预测

根据二维编织 C/ SiC复合材料的细观结构及其制备工艺特点 , 提出了一种预测该材料面内热膨胀系数的单胞模型。模型充分考虑了编织结构复合材料中的纤维束弯曲和 CVI工艺制备陶瓷基复合材料产生的孔洞对热膨胀系数的影响。利用单胞模型预测了二维编织 C/ SiC的结构参数、 纤维体积含量、 孔洞含量对复合材料热膨胀系数的影响规律 , 结果表明 : 随着纤维束扭结处产生间隙与纱线宽度比值的增大 , 热膨胀系数增大 ; 当其它参数不变时 , 随着纤维体积含量的增大 , 热膨胀系数反而下降; 随着孔洞含量的增加 , 热膨胀系数也出现了下降的趋势。利用 DIL402C热膨胀仪测试了二维编织 C/ SiC复合材料纵向热膨胀系数 , 试验结果与模型预测结果吻合较好。     

二维二轴1×1编织复合材料细观结构模型及力学性能有限元分析

考虑纤维束相互挤压及横截面形状变化, 采用纤维束截面六边形假设, 建立了二维二轴1×1编织复合材料的参数化单胞结构模型。通过引入周期性位移边界条件, 基于细观有限元方法, 对编织材料的弹性性能进行预测, 讨论了编织角及纤维体积含量对面内弹性常数的影响, 并分析了典型载荷下单胞细观应力场分布。研究表明: 单胞结构模型有效反映了纤维束的空间构型和交织特征, 实现了不同编织工艺参数下模型的快速建立; 基于单胞有限元模型的弹性性能预测结果与试验结果较为吻合; 模型给出了单胞合理的应力场分布, 为二维编织复合材料的结构优化和损伤预测奠定基础。      

二维编织陶瓷基复合材料偏轴拉伸力学性能预测

基于二维编织C/SiC复合材料的细观结构,建立了碳纤维丝/热解碳界面/SiC基体和纤维束/表层SiC基体两种尺度下的细观单胞模型,通过有限元方法计算碳纤维丝/热解碳界面/SiC基体模型的等效弹性常数和强度,然后代入纤维束/表层SiC基体模型中计算,并引入Tsai-Wu失效准则,考虑不同失效模式的损伤,建立了二维编织C/SiC复合材料的渐进损伤模型,模拟了其偏轴拉伸应力-应变行为。针对该模型,阐述了二维编织C/SiC复合材料单胞模型在复杂应力状态下其纤维束的损伤过程。数值模拟结果与实验数据吻合较好,验证了模型的有效性,为该种材料的力学性能分析提供了一种有效方法。     

三维四向编织复合材料改进模型的细观分析

三维编织复合材料现有的成型方法将导致编织物单胞模型发生变化,据此提出了一种改进的具有矩形截面的单元内胞模型,假设编织纱线具有平行六边形横截面,分析了不同区域胞体内部纤维束的空间构型,建立了三维四向编织复合材料内部单胞三维实体模型。通过分析编织物内纱线间的空间接触关系,采取合理的假设,推导了编织工艺参数和模型结构参数的关系,并计算了三维四向编织复合材料的纤维体积含量,为该种材料后续力学性能分析奠定了基础。该模型适用于部分不规则成型工艺,并有可能应用于其他形式的编织工艺研究。     

三维全五向编织复合材料的细观结构分析

针对三维全五向编织复合材料,研究了其四步法编织工艺的实现过程,并详细描述了编织复合材料各控制区域内纱线的空间走向及运动规律,在此基础上建立了能反映三维全五向编织复合材料基本结构的几何单胞模型。通过分析编织物内纱线间的空间挤压关系,设定合理的假设,计算了全五向编织复合材料的纤维体积含量,并分析了纤维体积含量与编织工艺参数之间的关系,为进一步研究该材料的力学性能奠定了基础。     

基于耦合法的二维三轴编织复合材料热学性能预测及验证

为了改善传统方法建模划分网格繁杂和计算效率低的缺点,利用耦合建模法创建二维三轴编织复合材料的单胞模型,用耦合的思维将增强相单元网格与整体区域单元网格进行耦合处理,协调两者之间的位移场自由度和温度场自由度,通过匹配材料的热学性能,施加温度周期性边界条件,获得单胞模型的等效传热系数和等效热膨胀系数,基于该方法预测并分析编织角和纤维体积含量对各个方向的热传导系数和热膨胀系数的影响程度和规律。     

考虑孔隙和微裂纹缺陷的 C/ C2SiC编织复合材料等效模量计算

通过观察 C/ C2SiC复合材料组元分布的扫描电子显微镜(SEM)照片 , 获得了 C/ C2SiC复合材料化学气相渗透(CVI)制备过程中产生孔隙和微裂纹的几何信息。在此基础上 , 建立了包含孔隙和微裂纹的 C/ C2SiC微结构有限元模型 , 并利用均匀化等效计算方法预测了平纹编织 C/ C2 SiC复合材料的模量。针对 CVI沉积方式制备的 2组不同的 C/ C2SiC复合材料 , 实验测试与等效计算结果表明 : 基于 SEM照片建立的 C/ C2SiC纤维束和复合材料微结构有限元模型 , 能够反映 CVI工艺制备 C/ C2SiC中孔隙和微裂纹的分布状况; 计算结果与实验数据有良好的一致性 , 数值计算可有效预测 C/ C2SiC编织复合材料的模量。     

平纹编织SiC/SiC复合材料多尺度建模及强度预测

连续SiC纤维增强SiC基体复合材料（SiC/SiC）具有优异的高温力学性能、辐照稳定性及较低的氚渗透率,在核工程结构领域具有良好的应用前景,掌握其承载状态下的损伤演化和强度性能,对SiC/SiC复合材料的应用具有重要指导意义。本文基于平纹编织SiC/SiC复合材料的制备过程和组分材料分布的多尺度特性,考虑复合材料微观结构的局部近似周期性,建立了纤维丝尺度和纤维束尺度单胞模型。使用有限元分析软件对纤维丝尺度模型的弹性性能和强度性能进行预测,将这些性能参数代入纤维束尺度模型,引入Tsai-Wu失效准则,根据材料的不同失效模式并对失效单元进行方向性刚度折减,模拟了平纹编织SiC/SiC复合材料在单轴拉伸载荷下的渐进损伤过程。数值模拟曲线与试验曲线吻合较好,实现了对平纹编织SiC/SiC复合材料强度的有效预测。      

三维编织复合材料面内刚度和强度性能研究

以修正的经典层合板理论为基础, 分析三维编织复合材料的力学性能。在单胞的长度方向积分和平均, 预测编织结构复合材料的有效弹性模量; 采用蔡-胡多项式失效准则, 得到三维编织复合材料的强度性能。另外, 进行编织结构复合材料的力学性能实验, 探讨纺织工艺参数, 如纤维编织角、横向编织角、轴向纱数与编织纱数之比、纤维体积含量等对力学性能的影响, 理论预报和试验结果进行对比, 发现该力学模型能较好地预报三维编织复合材料的刚度和强度性能。      

2.5维机织结构复合材料的几何模型

基于经纱矩形截面及纬纱双凸透镜截面假设 , 分析了 2. 5 维机织复合材料的细观几何结构 , 重点考虑了该结构表层经纱与内部经纱密度的不同及相同机织结构合成不同厚度和纤维束截面的情况 , 建立了 2. 5 维机织复合材料的单胞几何模型。该几何模型可以计算各种 2. 5 维机织结构单胞内各纱线系统的形态 , 包括取向角和纤维体积分数。通过对 8种结构 28 个试件纤维体积分数的测定 , 与计算预测结果的对比表明本文中建立的几何模型较好地反映了 2. 5维机织复合材料的内部结构。此外 , 利用本模型计算分析了 3 种不同结构的纤维体积分数和取向角。结果表明 : 单胞内经纬纱交织的次数是决定纤维体积含量的一个关键因素 ; 直联结构相比弯联结构 , 其经纱取向角明显降低。      

三维全五向编织复合材料弹性性能及热物理性能的有限元分析

在三维全五向(Q5D)编织复合材料细观结构模型的基础上, 建立了其单胞参数化有限元模型。通过施加合理的边界条件, 计算得到了Q5D编织复合材料的弹性常数、 热传导系数和热膨胀系数, 所得结果与现有的实验数据吻合较好。在此基础上, 深入研究了纤维体积分数、 编织角等工艺参数对材料弹性性能和热物理性能的影响规律, 并将计算结果与三维四向(4D)和三维五向(5D)编织复合材料的相应结果进行了对比。结果表明, Q5D编织复合材料具有较好的力学性能和纵向导热性能, 其零膨胀结构的可设计性更强, 为进一步研究此种结构材料的强度问题和热力耦合问题奠定了基础。     

考虑界面层和孔隙的SiCf/SiCm复合材料热膨胀性能研究

以三维四向编织SiCf/SiCm复合材料为对象,建立基于周期性边界条件、包含界面层和孔隙的复合材料单胞有限元模型,模型细观结构与工业CT扫描结果一致。计算了材料各个方向的热膨胀系数,发现界面层对纤维束热膨胀系数的影响不可忽略,基体孔隙位置的随机分布对热膨胀系数计算结果没有影响,孔隙率的增加会引起系数的显著减小,对胞元的热应力分析表明纤维束上的热应力水平大于基体。通过自由膨胀加温试验对材料纵向热膨胀系数进行了测定,在室温至1100℃区间内热膨胀性能稳定,试验结果与预测值符合较好。可为含界面层和基体孔隙的三维编织复合材料及其他多孔复合材料热膨胀性能研究提供理论基础。     

Transverse Tensile Properties of 3 Dimension-4 Directional Braided C<Subscript>f</Subscript>/SiC Composite Based on Double-Scale Model

In this thesis, a double-scale model for 3 Dimension-4 directional(3D-4d) braided C/SiC composites(CMCs) has been proposed to investigate mechanical properties of it. The double-scale model involves micro-scale which takes fiber/matrix/porosity in fibers tows into consideration and the unit cell scale which considers the 3D-4d braiding structure. Basing on the Micro-optical photographs of composite, we can build a parameterized finite element model that reflects structure of 3D-4d braided composites. The mechanical properties of fiber tows in transverse direction are studied by combining the crack band theory for matrix cracking and cohesive zone model for interface debonding. Transverse tensile process of 3D-4d CMCs can be simulated by introducing mechanical properties of fiber tows into finite element of 3D-4d braided CMCs. Quasi-static tensile tests of 3D-4d braided CMCs have been performed with PWS-100 test system. The predicted tensile stress-strain curve by the double scale model finds good agreement with the experimental results.     

Fatigue Hysteresis Behavior of 2.5D Woven C/SiC Composites: Theory and Experiments

This paper presents an intriguing fatigue hysteresis behavior of 2.5 dimensional woven C/SiC composites via the integration tool of advanced experimental techniques with a multiscale theoretical model. Tension-tension fatigue experiment has been carried out to predict the fatigue hysteresis properties of 2.5D woven C/SiC composite at room temperature, accompanied with the fracture of specimens to investigate the mechanism of fatigue damage. Meanwhile, a multiscale fatigue model of 2.5D woven C/SiC composites, which encompasses a micro-scale model of fiber/matrix/porosity in fiber tows and a macro-scale model of unit-cell, has been proposed to provide a reliable validation of the experimental results based on fiber damages resulting from relative slip motion with respect to matrix at interfaces and the architecture of 2.5D woven C/SiC composites. The predicted hysteresis loop from theoretical model at room temperature holds great agreement with that from tension-tension fatigue experiments. Also, effects of fatigue load, braided structural parameters and material properties at micro scale on fatigue hysteresis behavior have been investigated.     

Microstructures and thermal properties of A356/SiCp composites fabricated by liquid pressing method

A356/45vol.%SiCp composites with a uniform distribution of SiC particles have been fabricated by a liquid pressing method. Increasing the melt temperature, holding time and pre-treatment of SiCp by thermal oxidation improves the soundness of composites for the liquid pressing method. The sound composites exhibited low coefficient of thermal expansion (8 ppm/K) and high thermal conductivity (155 W/m K). The measured values for coefficient of thermal expansion agree well with the predicted values based on Turner’s model irrespective of porosity. The measured values for thermal conductivity decrease with porosity, and the effect of pore on the thermal conductivity has been evaluated based on the modified Hasselman–Johnson model.     

Fabrication process and thermal properties of SiCp/Al metal matrix composites for electronic packaging applications

The fabrication process and thermal properties of 50–71 vol% SiC_p/Al metal matrix composites (MMCs) for electronic packaging applications have been investigated. The preforms consisted with 50–71 vol% SiC particles were fabricated by the ball milling and pressing method. The SiC particles were mixed with SiO₂ as an inorganic binder, and cationic starch as a organic binder in distilled water. The mixtures were consolidated in a mold by pressing and dried in two step process, followed by calcination at 1100 °C. The SiC_p/Al composites were fabricated by the infiltration of Al melt into SiC preforms using squeeze casting process. The thermal conductivity ranged 120–177 W/mK and coefficient of thermal expansion ranged 6–10 × 10^–6/K were obtained in 50–71 vol% SiC_p/Al MMCs. The thermal conductivity of SiC_p/Al composite decreased with increasing volume fraction of SiC_p and with increasing the amount of inorganic binder. The coefficient of thermal expansion of SiC_p/Al composite decreased with increasing volume fraction of SiC_p, while thermal conductivity was insensitive to the amount of inorganic binder. The experimental values of the coefficient of thermal expansion and thermal conductivity were in good agreement with the calculated coefficient of thermal expansion based on Turner's model and the calculated thermal conductivity based on Maxwell's model.     

Comparison of Fatigue Life Between C/SiC and SiC/SiC Ceramic-Matrix Composites at Room and Elevated Temperatures

In this paper, the comparison of fatigue life between C/SiC and SiC/SiC ceramic-matrix composites (CMCs) at room and elevated temperatures has been investigated. An effective coefficient of the fiber volume fraction along the loading direction (ECFL) was introduced to describe the fiber architecture of preforms. Under cyclic fatigue loading, the fibers broken fraction was determined by combining the interface wear model and fibers statistical failure model at room temperature, and interface/fibers oxidation model, interface wear model and fibers statistical failure model at elevated temperatures in the oxidative environments. When the broken fibers fraction approaches to the critical value, the composites fatigue fracture. The fatigue life S–N curves and fatigue limits of cross-ply, 2D and 3D C/SiC and SiC/SiC composites at room temperature, 550 °C in air, 750 °C in dry and humid condition, 800 °C in air, 1000 °C in argon and air, 1100 °C, 1300 °C and 1500 °C in vacuum, have been predicted. At room temperature, the fatigue limit of 2D C/SiC composite with ECFL of 20 % lies between 0.78 and 0.8 tensile strength; and the fatigue limit of 2D SiC/SiC composite with ECFL of 20 % lies between 0.75 and 0.85 tensile strength. The fatigue limit of 2D C/SiC composite increases to 0.83 tensile strength with ECFL increasing from 20 to 22.5 %, and the fatigue limit of 3D C/SiC composite is 0.85 tensile strength with ECFL of 37 %. The fatigue performance of 2D SiC/SiC composite is better than that of 2D C/SiC composite at elevated temperatures in oxidative environment.